AFBR-5803ATQZ

AFBR-5803AQZ and AFBR-5803ATQZ FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers in Low-Cost 1 × 9 Package Style Data Sheet Description Features The AFBR-5800Z family of transceivers from Broadcom provides the system designer with products to implement a range of Fast Ethernet, FDDI, and Asynchronous Transfer Mode (ATM) designs at the 100 Mb/s-125MBd rate.  The transceivers are all supplied in the industry standard 1 × 9 SIP package style with either a duplex SC or a duplex ST®1 connector interface.     FDDI PMD, ATM, and Fast Ethernet 2-km Backbone Links   The AFBR-5803AQZ and -ATQZ are 1300-nm products with optical performance compliant with the FDDI PMD standard. The FDDI PMD standard is ISO/IEC 9314-3: 1990 and ANSI X3.166 – 1990.   Applications These transceivers for 2-km multimode fiber backbones are supplied in the small 1 × 9 duplex SC or ST package style.  The AFBR-5803AQZ/ATQZ is useful for both ATM 100-Mb/s interfaces and Fast Ethernet 100BASE-FX interfaces. The ATM Forum User-Network Interface (UNI) Standard, Version 3.0, defines the Physical Layer for 100-Mb/s Multimode Fiber Interface for ATM in Section 2.3 to be the FDDI PMD Standard. Likewise, the Fast Ethernet Alliance defines the Physical Layer for 100BASE-FX for Fast Ethernet to be the FDDI PMD Standard.    ATM applications for physical layers other than 100-Mb/s Multimode Fiber Interface are supported by Broadcom. Products are available for both the single mode and the multi-mode fiber SONET OC-3c (STS-3c) ATM interfaces and the 155 Mb/s-194 MBd multi-mode fiber ATM interface as specified in the ATM Forum UNI. Contact your Broadcom sales representative for information on these alternative Fast Ethernet, FDDI, and ATM products. 1. Full compatibility with the optical performance requirements of the FDDI PMD standard Full compatibility with the FDDI LCF-PMD standard Full compatibility with the optical performance requirements of the ATM 100-Mb/s physical layer Full compatibility with the optical performance requirements of 100BASE-FX version of IEEE802.3u Multisourced 1 × 9 package style with choice of duplex SC or duplex ST1 receptacle Wave solder and aqueous wash process compatible Single +3.3V or +5V power supply RoHS compliance Industrial range –40°C to 85°C ST is a registered trademark of AT&T Lightguide Cable Connectors. Broadcom -1- Multimode fiber backbone links Multimode fiber wiring closet to desktop links Very low cost multimode fiber links from wiring closet to desktop Multimode fiber media converters AFBR-5803AQZ and AFBR-5803ATQZ Data Sheet Transmitter Sections The transmitter sections of the AFBR-5803AQZ and AFBR-5805Z series use 1300-nm surface-emitting InGaAsP LEDs. These LEDs are packaged in the optical subassembly portion of the transmitter section. They are driven by a custom silicon IC, which converts differential PECL logic signals, ECL referenced (shifted) to a +3.3V or +5V supply, into an analog LED drive current. Receiver Sections The receiver sections of the AFBR-5803AQZ and AFBR-5805Z series use InGaAs PIN photodiodes coupled to a custom silicon transimpedance preamplifier IC. These are packaged in the optical subassembly portion of the receiver. These PIN/preamplifier combinations are coupled to a custom quantizer IC, which provides the final pulse shaping for the logic output and the Signal Detect function. The data output is differential. The signal detect output is single-ended. Both data and signal detect outputs are PECL compatible, ECL referenced (shifted) to a +3.3V or +5V power supply. Package The overall package concept for the Broadcom transceivers consists of the following basic elements: two optical subassemblies, an electrical subassembly, and the housing as illustrated in Figure 1 and Figure 2. The package outline drawings and pin out are shown in Figure 3, Figure 4, and Figure 5. The details of this package outline and pin out are compliant with the multi-source definition of the 1 × 9 SIP. The low profile of the Broadcom transceiver design complies with the maximum height allowed for the duplex SC connector over the entire length of the package. The optical subassemblies use a high-volume assembly process together with low-cost lens elements, which result in a cost effective building block. The electrical subassembly consists of a high-volume multilayer printed circuit board on which the IC chips and various surface-mounted passive circuit elements are attached. The package includes internal shields for the electrical and optical subassemblies to ensure low EMI emissions and high immunity to external EMI fields. The outer housing, including the duplex SC connector receptacle or the duplex ST ports, is molded of filled nonconductive plastic to provide mechanical strength and electrical isolation. The solder posts of the Broadcom design are isolated from the circuit design of the transceiver and do not require connection to a ground plane on the circuit board. The transceiver is attached to a printed circuit board with the nine signal pins and the two solder posts, which exit the bottom of the housing. The two solder posts provide the primary mechanical strength to withstand the loads imposed on the transceiver by mating with duplex or simplex SC or ST connectored fiber cables. Figure 1 SC Connector Block Diagram ELECTRICAL SUBASSEMBLY DUPLEX SC RECEPTACLE DIFFERENTIAL DATA OUT PIN PHOTODIODE SINGLE-ENDED SIGNAL DETECT OUT QUANTIZER IC PREAMP IC OPTICAL SUBASSEMBLIES DIFFERENTIAL LED DATA IN DRIVER IC TOP VIEW Broadcom -2- AFBR-5803AQZ and AFBR-5803ATQZ Data Sheet Figure 2 ST Connector Block Diagram ELECTRICAL SUBASSEMBLY DUPLEX ST RECEPTACLE DIFFERENTIAL DATA OUT PIN PHOTODIODE SINGLE-ENDED SIGNAL DETECT OUT QUANTIZER IC PREAMP IC OPTICAL SUBASSEMBLIES DIFFERENTIAL LED DATA IN DRIVER IC TOP VIEW Broadcom -3- AFBR-5803AQZ and AFBR-5803ATQZ Data Sheet Figure 3 SC Connector Package Outline Drawing with Standard Height AREA FOR LABEL 39.12 MAX. (1.540) 12.70 (0.500) 6.35 (0.250) AREA RESERVED FOR PROCESS PLUG 25.40 MAX. (1.000) AVAGO AFBR-5803AQZ PHILIPPINES DATE CODE (YYWW) 12.70 (0.500) 5.93 ± 0.1 (0.233 ± 0.004) Case Temperature Measurement Point + 0.08 – 0.05 (0.030 + 0.003 ) – 0.002 0.75 3.3 ± 0.4 (0.130 ± 0.016) 3.30 ± 0.38 (0.130 ± 0.015) 10.35 MAX. (0.407) 2.92 (0.115) Ø 23.55 (0.927) 0.46 (9x) (0.018) NOTE 1 20.32 [8x(2.54/.100)] (0.800) 4.14 (0.163) 1.27 + 0.25 – 0.05 (0.050 + 0.010 ) – 0.002 NOTE 1 17.32 20.32 (0.682) (0.800) 16.70 (0.657) 0.87 (0.034) Note 1: 18.52 (0.729) 23.24 (0.915) 15.88 (0.625) Phosphor bronze is the base material for the posts & pins. For lead-free soldering, the solder posts have Tin Copper over Nickel plating, and the electrical pins have pure Tin over Nickel plating. DIMENSIONS ARE IN MILLIMETERS (INCHES). Broadcom -4- 23.32 (0.918) AFBR-5803AQZ and AFBR-5803ATQZ Data Sheet Figure 4 ST Connector Package Outline Drawing with Standard Height 20.32 ± 0.4 [0.80 ± 0.02] O 6 2. 0] 1 0. [O 3.6 [0.14] Dimensions in Millimeters [Inches] 20.9 [0.82] 20.32 [0.800] 2.54 8x [0.100] 17.4 [0.69] 20.32 [0.800] 21.4 [0.84] 1.3 [0.05] 18.62 [0.733] 23.48 [0.924] O 0.46 [0.018] O 1.27 [0.050] 2.6 ± 0.4 [0.10 ± 0.02] 0.5 [0.02] 3.3 ± 0.4 [0.13 ± 0.02] 24.9 [0.98] e Ar 25.4 [1.00] 6.0 [0.24] 12.0 [0.47] 12.7 [0.50] or af be La l Case Temperature Measurement Point 42.0 [1.653] Broadcom -5- AFBR-5803AQZ and AFBR-5803ATQZ Data Sheet Figure 5 Pin Out Diagram 1 = V EE N/C 2 = RD Rx 3 = RD 4 = SD 5 = V CC 6 = V CC 7 = TD Tx 8 = TD 9=V N/C EE TOP VIEW Application Information The Applications Engineering group in the Broadcom Fiber Optics Communication Division is available to assist you with the technical understanding and design trade-offs associated with these transceivers. You can contact them through your Broadcom sales representative. The following information is provided to answer some of the most common questions about the use of these parts. Transceiver Optical Power Budget versus Link Length Optical Power Budget (OPB) is the available optical power for a fiber optic link to accommodate fiber cable losses plus losses due to inline connectors, splices, optical switches, and to provide margin for link aging and unplanned losses due to cable plant reconfiguration or repair. Figure 6 illustrates the predicted OPB associated with the transceiver series specified in this data sheet at the Beginning of Life (BOL). These curves represent the attenuation and chromatic plus modal dispersion losses associated with the 62.5/125-μm and 50/125-μm fiber cables only. The area under the curves represents the remaining OPB at any link length, which is available for overcoming non-fiber cable-related losses. Broadcom LED technology has produced 1300-nm LED devices with lower aging characteristics than normally associated with these technologies in the industry. The industry convention is 1.5-dB aging for 1300-nm LEDs. The Broadcom 1300-nm LEDs will experience less than 1 dB of aging over normal commercial equipment mission life periods. Contact your Broadcom sales representative for additional details. Figure 6 was generated with a Broadcom fiber-optic link model containing the current industry conventions for fiber cable specifications and the FDDI PMD and LCF-PMD optical parameters. These parameters are reflected in the guaranteed performance of the transceiver specifications in this data sheet.This same model has been used extensively in the ANSI and IEEE committees, including the ANSI X3T9.5 committee, to establish the optical performance requirements for various fiber-optic interface standards. The cable parameters used come from the ISO/IEC JTC1/SC 25/WG3 Generic Cabling for Customer Premises per DIS 11801 document and the EIA/TIA-568-A Commercial Building Telecommunications Cabling Standard per SP-2840. Transceiver Signaling Operating Rate Range and BER Performance For purposes of definition, the symbol (Baud) rate, also called signaling rate, is the reciprocal of the shortest symbol time. Data rate (bits/s) is the symbol rate divided by the encoding factor used to encode the data (symbols/bit). When used in Fast Ethernet, FDDI, and ATM 100-Mb/s applications, the performance of the 1300-nm transceivers is guaranteed over the signaling rate of 10 MBd to 125 MBd to the full conditions listed in individual product specification tables. The transceivers may be used for other applications at signaling rates outside of the 10-MBd to 125-MBd range with some penalty in the link optical power budget primarily caused by a reduction of receiver sensitivity. Figure 7 gives an indication of the typical performance of these 1300-nm products at different rates. These transceivers can also be used for applications that require different Bit Error Rate (BER) performance. Figure 8 illustrates the typical trade-off between link BER and the receivers’ input optical power level. Broadcom -6- AFBR-5803AQZ and AFBR-5803ATQZ Data Sheet Figure 6 Optical Power Budget at BOL vs. Fiber-Optic Cable Length TRANSCEIVER RELATIVE OPTICAL POWER BUDGET AT CONSTANT BER (dB) 12 AFBR-5803, 62.5/125 μm OPTICAL POWER BUDGET (dB) 10 8 AFBR-5803 50/125 μm 6 4 2 0 0.3 0.5 1.0 1.5 2.0 2.5 FIBER OPTIC CABLE LENGTH (km) Figure 8 Bit Error Rate vs. Relative Receiver Input Optical Power 1 x 10 1 x 10 Figure 7 Transceiver Relative Optical Power Budget at Constant BER vs. Signaling Rate 2.5 2.0 CONDITIONS: 1. PRBS 2 7-1 2. DATA SAMPLED AT CENTER OF DATA SYMBOL. 3. BER = 10 -6 4. T A = +25° C 5. V CC = 3.3 V to 5 V dc 6. INPUT OPTICAL RISE/ FALL TIMES = 1.0/2.1 ns. 1.5 1.0 0.5 0 0.5 25 0 50 75 100 125 150 SIGNAL RATE (MBd) 175 200 Figure 9 Recommended Decoupling and Termination Circuits -2 -3 Rx BIT ERROR RATE 1 x 10 1 x 10 Tx -4 AFBR-5803 SERIES -5 NO INTERNAL CONNECTION NO INTERNAL CONNECTION -6 1 x 10 -7 1 x 10 -8 1 x 10 -9 1 x 10 1 x 10 -10 1 x 10 -11 1 x 10 -12 CENTER OF SYMBOL AFBR-5803Z TOP VIEW -6 -4 -2 0 2 RELATIVE INPUT OPTICAL POWER - dB Rx V EE 1 4 CONDITIONS: 1. 155 MBd 2. PRBS 2 7-1 3. CENTER OF SYMBOL SAMPLING 4. T A = +25°C 5. V CC = 3.3 V to 5 V dc 6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns. RD 2 RD 3 Rx V CC 5 SD 4 Tx V CC 6 C1 TD 7 Tx V EE 9 TD 8 C2 V CC L1 TERMINATION AT PHY DEVICE INPUTS V CC R5 R8 RD SD V CC TERMINATION AT TRANSCEIVER INPUTS TD NOTES: THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED. R1 = R4 = R6 = R8 = R10 = 130 OHMS FOR +5.0 V OPERATION, 82 OHMS FOR +3.3 V OPERATION. R2 = R3 = R5 = R7 = R9 = 82 OHMS FOR +5.0 V OPERATION, 130 OHMS FOR +3.3 V OPERATION. C1 = C2 = C3 = C5 = C6 = 0.1 μF. C4 = 10 μF. L1 = L2 = 1 μH COIL OR FERRITE INDUCTOR. Broadcom -7- R4 C5 R10 RD R3 R1 C3 C4 V CC FILTER AT V CC PINS TRANSCEIVER R9 R7 C6 R6 R2 L2 TD AFBR-5803AQZ and AFBR-5803ATQZ Data Sheet Transceiver Jitter Performance The Broadcom 1300-nm transceivers are designed to operate per the system jitter allocations stated in Tables E1 of Annexes E of the FDDI PMD and LCF-PMD standards. The Broadcom 1300-nm transmitters will tolerate the worst-case input electrical jitter allowed in these tables without violating the worst case output jitter requirements of Sections 8.1 Active Output Interface of the FDDI PMD and LCF-PMD standards. The Broadcom 1300-nm receivers will tolerate the worst-case input optical jitter allowed in Sections 8.2 Active Input Interface of the FDDI PMD and LCF-PMD standards without violating the worst case output electrical jitter allowed in the Tables E1 of the Annexes E. The jitter specifications stated in the following 1300-nm transceiver specification tables are derived from the values in Tables E1 of Annexes E. They represent the worst-case jitter contribution that the transceivers are allowed to make to the overall system jitter without violating the Annex E allocation example. In practice, the typical contribution of the Broadcom transceivers is well below these maximum allowed amounts. Board Layout – Decoupling Circuit and Ground Planes It is important to take care in the layout of your circuit board to achieve optimum performance from these transceivers. Figure 9 provides a good example of a schematic for a power supply decoupling circuit that works well with these parts. It is further recommended that a contiguous ground plane be provided in the circuit board directly under the transceiver to provide a low inductance ground for signal return current. This recommendation is in keeping with good high-frequency board layout practices. Board Layout – Hole Pattern The Broadcom transceiver complies with the circuit board “Common Transceiver Footprint” hole pattern defined in the original multisource announcement that defined the 1 × 9 package style. This drawing is reproduced in Figure 10 with the addition of ANSI Y14.5M compliant dimensioning to be used as a guide in the mechanical layout of your circuit board. Board Layout – Mechanical For applications providing a choice of either a duplex SC or a duplex ST connector interface, while using the same pinout on the printed circuit board, the ST port needs to protrude from the chassis panel a minimum of 9.53 mm for sufficient clearance to install the ST connector. Recommended Handling Precautions Broadcom recommends that normal static precautions be taken in the handling and assembly of these transceivers to prevent damage that may be induced by electrostatic discharge (ESD). The AFBR-5800 series of transceivers meet MIL-STD-883C Method 3015.4 Class 2 products. See Figure 11 for a mechanical layout detailing the recommended location of the duplex SC and duplex ST transceiver packages in relation to the chassis panel. Care should be used to avoid shorting the receiver data or signal detect outputs directly to ground without proper current limiting impedance. Solder and Wash Process Compatibility The transceivers are delivered with protective process plugs inserted into the duplex SC or duplex ST connector receptacle. This process plug protects the optical subassemblies during wave solder and aqueous wash processing and acts as a dust cover during shipping. These transceivers are compatible with either industry standard wave or hand solder processes. Shipping Container The transceiver is packaged in a shipping container designed to protect it from mechanical and ESD damage during shipment or storage. Broadcom -8- AFBR-5803AQZ and AFBR-5803ATQZ Data Sheet Figure 10 Recommended Board Layout Hole Pattern 20.32 (0.800) 2 x Ø 1.9 ± 0.1 (0.075 ± 0.004) 20.32 (0.800) 2.54 (0.100) 9 x Ø 0.8 ± 0.1 (0.032 ± 0.004) TOP VIEW DIMENSIONS ARE IN MILLIMETERS (INCHES) Broadcom -9- AFBR-5803AQZ and AFBR-5803ATQZ Data Sheet Figure 11 Recommended Common Mechanical Layout for SC and ST 1 × 9 Connectored Transceivers 42.0 12.0 24.9 9.53 (NOTE 1) 0.51 12.09 25.4 39.12 11.1 6.79 0.75 25.4 NOTE 1: MINIMUM DISTANCE FROM FRONT OF CONNECTOR TO THE PANEL FACE. Regulatory Compliance Electrostatic Discharge (ESD) These transceiver products are intended to enable commercial system designers to develop equipment that complies with the various international regulations governing certification of Information Technology Equipment. See Regulatory Compliance Table for details. Additional information is available from your Broadcom sales representative. Immunity to ESD damage is important in two cases. The first case is during handling of the transceiver prior to mounting it on the circuit board. It is important to use normal ESD-handling precautions for ESD-sensitive devices. These precautions include using grounded wrist straps, work benches, and floor mats in ESD-controlled areas. The second case to consider is static discharges to the exterior of the equipment chassis containing the transceiver parts. To the extent that the duplex SC connector is exposed to the outside of the equipment chassis, it may be subject to whatever ESD system level test criteria that the equipment is intended to meet. Broadcom - 10 - AFBR-5803AQZ and AFBR-5803ATQZ Data Sheet Regulatory Compliance Table Feature Test Method Performance Electrostatic Discharge (ESD) to the Electrical Pins MIL-STD-883 Method 3015.4 Meets Class 1 (