AMMP-6130-BLKG

AMMP-6130 30 GHz Power Amplifier with Frequency Multiplier (x2) in SMT Package Data Sheet Description Avago Technologies AMMP-6130 is a high gain, narrowband doubler and output power amplifier designed for DBS applications and other commercial communication systems. The MMIC takes an input 15 GHz signal and passes it through a harmonic frequency multiplier (x2) and then three stages of power amplification. Integrated matching structures filter and match input/output to 50 Ω. It has integrated input and output DC blocking capacitors and bias structures to all stages. The MMIC is fabricated using PHEMT technology. The backside of this package part is both RF and DC ground. This helps simply the assembly process and reduces assembly related performance variations and costs. The surface mount package allows elimination of “chip & wire” assembly for lower cost. This MMIC is a cost effective alternative to hybrid (discrete-FET) amplifiers that require complex tuning and assembly process. Features • • • • • • • • • • 5x5 mm Surface Mount Package Integrated DC Block and Choke 50 Ω Input and Output Match Single Positive Supply Pin No Negative Gate Bias Specifications (Vd=4.5V, Idd=200mA) Frequency Range 15GHz in, 30GHz out Output Power: 21 dBm Harmonic Suppression: 60dBc Single Positive Supply DC Requirements: 4.5V, 200mA Applications • Microwave Radio systems • Satellite VSAT, DBS Up/Down Link • Broadband Wireless Access) Surface Mount Package, 5.0 x 5.0 x 1.25 mm Pin Connections (Top View) 1 2 3 8 X2 4 Pin 1 2 3 4 5 6 7 8 Function Vd RF Out RF In 7 6 5 PACKAGE BASE GND Note: These devices are ESD sensitive. The following precautions are strongly recommended. Ensure that an ESD approved carrier is used when units are transported from one destination to another. Personal grounding is to be worn at all times when handling these devices. The manufacturer assumes no responsibilities for ESD damage due to improper storage and handling of these devices. Absolute Maximum Ratings (1) Sym Parameters/Condition Vdd Idd Pin Tch Tstg Drain to Ground Voltage Drain Current RF CW Input Power Max Max channel temperature Storage temperature Unit V mA dBm C C C Max 5 300 15 +150 -65 +150 260 for 20s DC Specifications/ Physical Properties (2) Parameter and Sym Test Condition Idd Drain Supply Current under any RF power drive and temp. (Vd=4.5 V) Drain Supply Voltage Thermal Resistance(3) Unit mA Min Typ 200 Max 250 Vd θjc V C/W 3.5 4.5 45 5 Tmax Maximum Assembly Temp Notes. 1. Operation in excess of any of these conditions may result in permanent damage to this device. The absolute maximum ratings for Vdd, Idd and Pin were determined at an ambient temperature of 25°C unless noted otherwise. 2. Ambient operational temperature TA=25°C unless noted 3. Channel-to-backside Thermal Resistance (Tchannel = 34°C) as measured using infrared microscopy. Thermal Resistance at backside temp. (Tb) = 25°C calculated from measured data. AMMP-6130 RF Specifications (4,5) Symbol Freq Gain Pout FS 3H Sup TA= 25°C, Vdd = 4.5 V, Idd = 200mA, Zo=50 Ω, Pin=5dBm Parameters and Test Conditions Operational Frequency Conversion Gain Output Power (5) (4,5) Frequency Units GHz Minimum Maximum Typical 30 30 30 30 dB dBm dBc dBc 14 19 18.5 23.5 16 21 60 50 Fundamental Suppression 3rd Harmonic Suppression Notes. 4. Small/Large -signal data measured in a fully de-embedded test fixture form TA = 25°C. 5. All tested parameters guaranteed with measurement accuracy +/-1dB/dBm/dBc. Typical Distribution of Conversion Gain and Output Power based on 1000 parts StDev = 0.46 StDev = 0.39 Conversion Gain at 30GHz Output Power at 30GHz 2 AMMP-6130 Typical Performance 20 18 16 14 C.G.[dB] (TA = 25°C, Vdd=4.5V, Idd=200 mA, Zin = Zout = 50Ω, Pin=3dBm unless otherwise stated) 65 60 55 2H-1H [dBm] 2H [dBm] 24 22 20 18 16 14 29 29.5 30 30.5 31 Output Frequency [GHz] 3dBm 5dBm 4dBm 50 45 C.G. 2H-1H 40 35 30 25 14 14.5 15 15.5 Input Frequency [GHz] 16 12 10 8 6 4 2 Figure 1. Conversion Gain & Fundamental Sup vs. Input Freq 24 22 Figure 2. Output Power vs. Output Frequency vs. Input Power 25 20 2H [dBm] 20 2H [dBm] 15 10 5 0 2H 1H 3H 29 29.5 30 30.5 Frequency [GHz] 31 18 16 14 12 29 29.5 30 Frequency [GHz] 30.5 31 4V 3.5V 5V 4.5V -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 Figure 3. Output Power vs. Output Frequency @ 4 bias levels Figure 4. Fundamental, 2H & 3H Output Power vs. Output Freq 0 -5 Return Loss [dB] -10 -15 -20 -25 -30 13 18 23 Frequency [GHz] 28 33 S11[dB] S22[dB] 24 20 2H [dBm] 16 12 8 4 0 -6 -4 -2 0 Pin [dBm] 2 4 6 14GHz 16GHz 15GHz Figure 5. Output Power vs. Input Power vs. Input Freq 24 22 20 2H [dBm] 18 16 14 12 29 29.5 30 Frequency [GHz] Figure 7. Output Power vs. Output Freq @ Temp = 25C, -40C & 85C 30.5 31 -40C 25C 85C Figure 6. Input and Output Return Loss vs. Freq 3 1H [dBm], 3H [dBm] Typical Scattering Parameters [1] Freq GHz dB 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 -2.166 -2.531 -3.497 -4.889 -4.747 -4.158 -3.851 -3.490 -2.858 -2.405 -2.455 -3.151 -4.322 -4.834 -8.532 -17.084 -4.491 -3.044 -3.366 -3.044 -2.867 -3.422 -4.695 -4.668 -3.628 -3.951 -6.246 -4.878 -2.704 -2.261 -2.438 -4.679 -3.935 -2.625 -2.781 -1.933 -2.389 -3.601 -3.147 -2.535 S11 Mag 0.779 0.747 0.669 0.570 0.579 0.620 0.642 0.669 0.720 0.758 0.754 0.696 0.608 0.573 0.471 0.140 0.596 0.704 0.679 0.704 0.719 0.674 0.582 0.584 0.659 0.635 0.487 0.570 0.732 0.771 0.755 0.584 0.636 0.739 0.726 0.800 0.760 0.661 0.696 0.747 Phase 73.909 -33.368 -148.095 81.765 -58.704 177.213 65.073 -47.052 -152.082 115.491 30.433 -60.545 -169.451 73.490 -34.070 178.992 -53.423 -155.503 102.797 -9.051 -108.593 162.205 63.767 -51.945 -154.450 115.995 5.230 -139.262 123.438 55.231 -17.264 -129.407 87.568 -0.364 -54.324 -110.128 -179.000 76.661 -52.739 -142.354 (TA = 25°C, Vdd =4.5 V, IDD = 200 mA, Zin = Zout = 50 Ω) S21 dB -80.000 -55.139 -47.131 -35.890 -39.659 -42.499 -40.491 -38.202 -36.449 -39.453 -36.924 -31.920 -25.739 -21.180 -18.548 -17.566 -17.635 -23.293 -18.655 -9.450 -5.991 -4.028 -3.379 -2.061 -0.831 1.569 5.448 8.677 8.718 7.537 4.931 2.021 -2.173 -3.950 -5.113 -14.647 -20.114 -23.728 -29.776 -37.109 Mag 0.000 0.002 0.004 0.016 0.010 0.008 0.009 0.012 0.015 0.011 0.014 0.025 0.052 0.087 0.118 0.132 0.131 0.068 0.117 0.337 0.502 0.629 0.678 0.789 0.909 1.198 1.872 2.716 2.728 2.381 1.764 1.262 0.779 0.635 0.555 0.185 0.099 0.065 0.032 0.014 Phase 32.383 131.860 4.147 14.517 -90.973 125.799 6.552 127.728 -65.533 107.046 3.617 110.391 6.543 136.100 95.071 -14.777 82.328 -39.850 69.328 -59.027 160.771 0.554 45.858 -99.661 124.211 -7.487 74.844 -47.149 119.631 19.317 -63.508 dB -76.478 -64.437 -60.915 -76.478 -60.000 -52.217 -50.903 -51.213 -50.752 -51.701 -53.351 -58.416 -55.139 -55.918 -55.650 -50.604 -48.291 -47.033 -54.425 -63.098 -54.425 -52.956 -44.883 -40.677 -45.352 -47.639 -51.213 -50.314 -45.514 -48.995 -48.636 S12 Mag 0.000 0.001 0.001 0.001 0.000 0.001 0.002 0.003 0.003 0.003 0.003 0.003 0.002 0.001 0.001 0.002 0.002 0.002 0.002 0.003 0.004 0.004 0.004 0.004 0.002 0.001 0.002 0.002 0.003 0.006 0.009 0.005 0.004 0.002 0.003 0.003 0.004 0.005 0.004 0.004 Phase 96.570 14.797 -81.506 -43.361 179.115 90.638 -0.484 -66.346 143.963 70.767 -5.502 -76.081 176.951 114.486 53.047 10.720 -48.544 150.079 77.624 -14.763 -91.783 dB -0.425 -1.765 -3.270 -5.259 -5.923 -6.641 -7.851 -8.101 -6.848 -7.764 -9.863 -9.730 -6.539 -7.803 -10.664 -9.247 -6.265 -13.966 -10.858 -13.856 -26.366 S22 Mag 0.952 0.816 0.686 0.452 0.546 0.506 0.466 0.405 0.394 0.435 0.455 0.409 0.321 0.326 0.429 0.471 0.407 0.293 0.345 0.486 0.257 0.200 0.287 0.203 0.048 0.094 0.179 0.209 0.110 0.324 0.144 0.225 0.405 0.448 0.402 0.250 0.056 0.266 0.380 0.363 Phase -101.410 159.979 61.101 -23.500 -102.375 170.014 79.202 -19.043 -114.956 158.758 78.557 -2.902 -100.642 143.433 47.561 -30.885 -107.509 152.353 7.160 -113.148 132.293 -67.065 -171.437 116.377 37.539 -161.333 150.560 94.577 112.029 60.389 -33.753 93.604 28.172 -23.046 -70.880 -120.006 -83.063 -78.816 -129.674 175.556 -149.666 -61.938 -167.459 -6.891 -143.716 -7.230 -163.279 -51.057 -117.593 -56.773 -115.604 -7.355 -135.344 -54.895 -145.395 -48.068 -132.798 -11.811 -163.461 -49.119 -133.605 -20.510 -121.717 -14.933 154.890 104.130 33.927 -92.384 171.824 82.835 29.124 24.686 -44.356 170.138 109.913 59.709 -13.580 -19.160 -10.134 -16.812 -12.958 -7.855 -6.979 -7.925 -12.031 -11.511 -8.394 -8.793 -161.843 -51.535 -121.959 -54.425 -142.199 -47.432 -103.624 -24.967 Note: Data obtained off of a connectorized module 4 Biasing and Operation The AMMP-6130 frequency doubler has been designed with a fully integrated self bias network; thus, requiring only a single 4.5v bias input with a typical current draw of 200mA. The one-stage frequency doubler relies on the nonlinear behavior of the FET to produce the doubled signal at the output. A high-pass filter at the input shorts any reflected 2nd harmonic signal to ground. The input also consists of matching components tuned to 15GHz. An additional LC-filter is included at the input for stability. The doubler is operated at pinchoff to create a half-wave conduction angle ideal for generation of the 2nd harmonic. The AMMP-6130 is also designed for stability over temperature. Figure 8. Evaluation / Test Board (Available to qualified customer requests) C C3 Port Vd1 MLIN TL10 Port Vd2 MLIN TL11 MLIN TL12 MLIN TL13 MLOC TL8 C HP_FET C5 HPFET2 MLIN TL21 MLIN TL15 MLIN TL18 C HP_FET C6 HPFET3 MLIN TL22 MLIN TL16 MLIN TL19 C HP_FET C7 HPFET4 Port Output_30G C C2 MLIN TL3 Port Input_15G MLIN TL4 MLIN HP_FET TL7 HPFET1 C C4 MLIN TL20 MLIN MLIN TL14 TL17 MLIN TL2 MLOC TL9 C C9 C C10 R R1 R R2 C C C11 C12 R R5 R R3 CC C CR C15C13 C14 C16 R6 R R4 Figure 9. Simplified Doubler-Amplifier Schematic 5 Recommended SMT Attachment for 5x5 Package The AMMP Packaged Devices are compatible with high volume surface mount PCB assembly processes. The PCB material and mounting pattern, as defined in the data sheet, optimizes RF performance and is strongly recommended. An electronic drawing of the land pattern is available upon request from Avago Sales & Application Engineering. Manual Assembly • Follow ESD precautions while handling packages. • Handling should be along the edges with tweezers. • Recommended attachment is conductive solder paste. Please see recommended solder reflow profile. Neither Conductive epoxy or hand soldering is recommended. • Apply solder paste using a stencil printer or dot placement. The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical and electrical performance. • Follow solder paste and vendor’s recommendations when developing a solder reflow profile. A standard profile will have a steady ramp up from room temperature to the pre-heat temp. to avoid damage due to thermal shock. • Packages have been qualified to withstand a peak temperature of 260°C for 20 seconds. Verify that the profile will not expose device beyond these limits. A properly designed solder screen or stencil is required to ensure optimum amount of solder paste is deposited onto the PCB pads. The recommended stencil layout is shown in Figure 8. The stencil has a solder paste deposition opening approximately 70% to 90% of the PCB pad. Reducing stencil opening can potentially generate more voids underneath. On the other hand, stencil openings larger than 100% will lead to excessive solder paste smear or bridging across the I/O pads. Considering the fact that solder paste thickness will directly affect the quality of the solder joint, a good choice is to use a laser cut stencil composed of 0.127mm (5 mils) thick stainless steel which is capable of producing the required fine stencil outline. The most commonly used solder reflow method is accomplished in a belt furnace using convection heat transfer. The suggested reflow profile for automated reflow processes is shown in Figure 9. This profile is designed to ensure reliable finished joints. However, the profile indicated in Figure 1 will vary among different solder pastes from different manufacturers and is shown here for reference only. NOTES: DIMENSIONS ARE IN INCHES [MILIMETERS] ALL GROUNDS MUST BE SOLDERED TO PCB RF Material is Rogers RO4350, 0.010" thick Figure 10. PCB Land Pattern and Stencil Layouts 300 Peak = 250 ± 5˚C 250 Melting point = 218˚C Temp (C) 200 150 100 50 0 Ramp 1 0 50 Preheat Ramp 2 100 150 Seconds Reflow 200 Cooling 250 300 Figure 11. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste Package, Tape & Reel, and Ordering Information .011 Dimensional Tolerances: 0.002" [0.05mm] Back View Carrier Tape and Pocket Dimensions AMMP-6130 Part Number Ordering Information Part Number AMMP-6130-BLKG AMMP-6130-TR1G AMMP-6130-TR2G Devices Per Container 10 100 500 Container Antistatic bag 7" Reel 7" Reel Note: No RF performance degradation is seen due to ESD upto 250 V HBM and 80 V MM. The DC characteristics in general show increased leakage at lower ESD discharge voltages. The user is reminded that this device is ESD sensitive and needs to be handled with all necessary ESD protocols. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. AV01-0287EN - August 2, 2006