HLMP-EG37-WX0DD

HLMP-EGxx, HLMP-ELxx and HLMP-EHxx T-1¾ (5mm) Extra High Brightness AlInGaP LED Lamps Data Sheet Description Features These Precision Optical Performance AlInGaP LEDs provide superior light output for excellent readability in sunlight and are extremely reliable. AlInGaP LED technology provides extremely stable light output over long periods of time. Precision Optical Performance lamps utilize the aluminum indium gallium phosphide (AlInGaP) technology. • Viewing angle: 15°, 23°, 30° • High luminous output • Colors: 590nm Amber 615nm Red-Orange 626nm Red • Package options: With or without lead standoff These LED lamps are untinted, T-1¾ packages incorporating second generation optics producing well defined spatial radiation patterns at specific viewing cone angles. These lamps are made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance performance in outdoor signal and sign application. The maximum LED junction temperature limit of +130°C enables high temperature operation in bright sunlight conditions. The epoxy contains both uv-a and uv-b inhibitors to reduce the effects of long term exposure to direct sunlight. Benefits • Superior performance for outdoor environments • Suitable for auto-insertion onto PC board  • Superior resistance to moisture • Untinted non-diffused for 15° and 30° lamps • Untinted diffused for 23° lamps Applications • Traffic management: - Traffic signals - Pedestrian signals - Work zone warning lights - Variable message signs • Commercial outdoor advertising - Signs - Marquees Package Dimension A B 5.00 ± 0.20 (0.197 ±� 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 1.14 ± 0.20 (0.045 ±� 0.008) 8.71 ± 0.20 (0.343 ± 0.008) 0.70 (0.028) MAX. 8.71 ± 0.20 (0.343 ± 0.008) d 1.14 ± 0.20 (0.045 ± 0.008) 2.35 (0.093) MAX. 31.60 MIN. (1.244) 1.50 ± 0.15 (0.059 ± 0.006) 31.60 MIN. (1.244) 0.70 (0.028) MAX. CATHODE LEAD CATHODE LEAD 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 1.00 MIN. (0.039) 5.80 ± 0.20 (0.228 ± 0.008) CATHODE FLAT 0.50 ± 0.10 SQ. TYP. (0.020 ± 0.004) 1.00 MIN. (0.039) CATHODE FLAT 2.54 ± 0.38 (0.100 ± 0.015) 5.80 ± 0.20 (0.228 ± 0.008) 2.54 ± 0.38 (0.100 ± 0.015) NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS. 3. RECOMMENDED PC BOARD HOLE DIAMETERS: - LAMP PACKAGE A WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF LAMP PACKAGE = 1.143/1.067 (0.044/0.042). - LAMP PACKAGE B WITH STAND-OFFS: MOUNTING AT LEAD STAND-OFFS = 0.965/0.889 (0.038/0.035). 4. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE B, SEE TABLE. PART NO. d HLMP-XX13 12.42 ± 0.25 (0.489 ± 0.010) 11.59 ± 0.25 (0.446 ± 0.010) HLMP-XX23 HLMP-XX37 5. FOR IDENTIFICATION OF POLARITY AFTER THE LEADS ARE TRIMMED OFF, PLEASE REFER TO THE ILLUSTRATION BELOW: CATHODE ANODE 7. MAJOR HEAT PATH IS THROUGH THE ANODE LEAD  11.96 ± 0.25 (0.471 ± 0.010) Device Selection Guide Typical Viewing Angle 2θ½ (Deg) [4] Color and Dominant Wavelength (nm), Typ. [3] Lamps without Standoffs on Leads (Outline Drawing A) 15° Amber 590 HLMP-EL12-VY0DD Lamps with Standoffs on Leads (Outline Drawing B) Luminous Intensity Iv (mcd) [1,2,5] @ 20mA Min. Max. HLMP-EL13-VY0DD 4200 12000 7200 12000 HLMP-EL12-XYKDD Red-Orange 615 HLMP-EH12-VY0DD HLMP-EH13-VY0DD 4200 12000 Red 626 HLMP-EG12-VY0DD HLMP-EG13-VY0DD 4200 12000 5500 9300 HLMP-EG12-WX0DD 23° Amber 590 HLMP-EL22-UXKDD HLMP-EL23-UXKDD 3200 9300 HLMP-EL22-UX0DD HLMP-EL23-UX0DD 3200 9300 4200 7200 HLMP-EL22-VWKDD Red-Orange 615 HLMP-EH22-TW0DD HLMP-EH23-TW0DD 2500 7200 Red 626 HLMP-EG22-UX0DD HLMP-EG23-UX0DD 3200 9300 4200 7200 HLMP-EG22-VW0DD 30° Amber 590 HLMP-EL35-TW0DD HLMP-EL37-TW0DD 2500 7200 HLMP-EL35-TWKDD HLMP-EL37-TWKDD 2500 7200 3200 5500 HLMP-EL35-UVKDD Red-Orange 615 HLMP-EH35-SV0DD HLMP-EH37-SV0DD 1900 5500 Red 626 HLMP-EG35-TW0DD HLMP-EG37-TW0DD 2500 7200 3200 5500 HLMP-EG35-UV0DD Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. 5. Tolerance for each intensity bin limit is ± 15%.  Part Numbering System HLMP – E x x x - x x x x x Mechanical Options 00 : Bulk Packaging DD : Ammo Pack YY : Flexi-Bin; Bulk Packaging ZZ : Flexi-Bin; Ammo Pack Color Bin Selections 0 : Full color distribution 2 : Amber color bin 2 only 4 : Amber color bin 4 only K : Amber color bin 2 and 4 only Z : Special Vf Bin Range Maximum Intensity Bin 0 : No maximum intensity bin limitation Minimum Intensity Bin Viewing Angle and Lead Standoffs 12 : 15 deg without lead standoffs 13 : 15 deg with lead standoffs 22 : 23 deg without lead standoffs 23 : 23 deg with lead standoffs 35 : 30 deg without lead standoffs 37 : 30 deg with lead standoffs Color G : 626nm Red H : 615nm Red-Orange L : 590nm Amber Note: Please refer to AB 5337 for complete information on part numbering system. Absolute Maximum Ratings at TA = 25°C DC Forward Current [1] 50 mA Peak Pulsed Forward Current 100 mA Average Forward Current 30 mA Reverse Voltage (Ir = 100 µA) 5V Operating Temperature –40°C to +100°C Storage Temperature –40°C to +100°C Notes: 1. Derate linearly as shown in Figure 4.  Electrical/ Optical Characteristics at TA = 25ºC Parameter Forward Voltage Amber Red Red-Orange Peak Wavelength Amber Red Red-Orange Dominant Wavelength [1] Amber Red Red-Orange Symbol VF Minimum Average 1.80 2.20 2.10 2.00 Maximum Units IF = 20mA 2.40 V IF = 20mA 590 626 615 λPEAK Test Condition nm λd Reverse Voltage VR 5 V IR = 100μA Spectral Halfwidth Dλ½ 17 nm IF = 20 mA Capacitance C 40 pF VF = 0, f = 1 MHz Thermal Resistance RθJ-PIN 240 ºC/W LED Junction-to-Anode Lead hV 480 150 260 lm/W Luminous Flux jV 1300 mlm IF = 20mA Luminous Efficiency [3] he 30 lm/W Emitted Luminous Flux/ Electrical Power Luminous Efficacy [2] Amber Red Red-Orange 594.5 630.0 621.7 IF = 20mA 584.5 620.0 612.0 nm Emitted Luminous Flux/Emitted Radiant Flux Notes: 1. The dominant wavelength, λd is derived from the CIE Chromaticity Diagram referenced to Illuminant E. Tolerance for each color of dominant wavelength is +/- 0.5nm. 2. The radiant intensity, Ie in watts per steradian, maybe found from the equation Ie = Iv / ηV where Iv is the luminous intensity in candela and ηV is the luminous efficacy in lumens/watt. 3. he = jV / IF x VF, where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage. Figure 1. Relative intensity vs. peak wavelength  60 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 50 FORWARD CURRENT - mA 2.5 Red Red-Orange 40 Amber 30 20 10 0 0 0.5 1 1.5 2 2.5 2 1.5 1 0.5 0 3 FORWARD VOLTAGE - V 0.9 45 0.8 NORMALIZED INTENSITY I F - FORWARD CURRENT - mA 1 50 40 35 30 25 20 15 100 0.3 0 -90 120 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT - DEGREES Figure 5. Representative spatial radiation pattern for 15° viewing angle lamps 1 1 0.9 0.9 0.8 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY 0.4 0.1 Figure 4. Maximum forward current vs. ambient temperature 0.7 0.6 0.5 0.4 0.3 0.2 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.1 -60 -30 0 30 60 ANGULAR DISPLACEMENT -DEGREES Figure 6. Representative spatial radiation pattern for 23° viewing angle lamps  50 0.5 5 0 -90 40 0.6 0.2 40 60 80 TA - AMBIENT TEMPERATURE - ºC 30 0.7 10 20 20 Figure 3. Relative luminous intensity vs. forward current 55 0 10 DC FORWARD CURRENT - mA Figure 2. Forward current vs. forward voltage 0 0 90 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure 7. Representative spatial radiation pattern for 30° viewing angle lamps 90 RELATIVE LOP (NORMALIZE AT 25 °C ) 10 Amber Red-Orange Red 1 0.1 -50 -25 0 25 50 75 100 125 150 JUNCTION TEMPERATURE - °C Figure 8. Relative light output vs. junction temperature Intensity Bin Limits (mcd at 20mA) Bin Name Minimum Maximum Bin Name Minimum Maximum R 1500 1900 VD 1.8 2.0 S 1900 2500 VA 2.0 2.2 T 2500 3200 VB 2.2 2.4 U 3200 4200 V 4200 5500 W 5500 7200 X 7200 9300 Bin Name Minimum Maximum 584.5 587.0 Tolerance for each bin limit is ± 0.05V Amber Color Bin Limits (nm at 20mA) Y 9300 12000 1 Z 12000 16000 2 587.0 589.5 1 16000 21000 4 589.5 592.0 27000 6 592.0 594.5 2 21000 Tolerance for each bin limit is ± 15%  Forward Voltage Bin Limits (V at 20mA) Tolerance for each bin limit is ± 0.5nm Note: Bin categories are established for classification of products. Products may not available in all bin categories. Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105 °C Max. - Preheat time 60 sec Max - Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max Anode InGaN connection Device between bottom surface of LED die and Note: Electrical the lead frame is achieved through conductive paste. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. Note: In order to further assist customer in designing jig accurately that fit Avago Technologies’ product, 3D model of the product is available upon request. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch)  • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED Recommended Wave Soldering Profile Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) TEMPERATURE (°C) 200 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 100 50 PREHEAT 0 10 20 30 Figure 9. Recommended Wave Soldering Profile 40 60 50 TIME (MINUTES) 70 80 90 100 Ammo Packs Drawing Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff Figure 10. Dimension for ammo pack  Packaging Box for Ammo Packs Note: The dimension for ammo pack is applicable for the device with standoff and without standoff. Figure 11. The arrangement of unit in ammo pack Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin 10 Lamps Baby Label RoHS Compliant e3 max temp 250C DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) (i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) OR (ii) Color bin incorporate with VF Bin (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) BIN: 2VB VB: VF bin “VB” 2: Color bin 2 only DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. AV02-0086EN - January 15, 2009