Agilent HSMx-A4xx-xxxxx SMT LED
Surface Mount LED Indicator
Data Sheet
Features
• Industry standard PLCC-4
• High reliability LED package
• High brightness using AlInGaP and
InGaN dice technologies
• High optical efficiency
• Higher ambient temperature at the
same current possible compared to
PLCC-2
• Available in full selection of colors
Description
Agilent Power PLCC-4 is an
extension of our PLCC-2 SMT
LEDs. The package can be driven
at higher current due to its
superior package design. The
product is able to dissipate heat
more efficiently compared to the
conventional PLCC-2 SMT LEDs.
In proportion to the increase in
driving current, this family of
LEDs is able to produce higher
light output compared to the
conventional PLCC-2 SMT LEDs.
These SMT LEDs have higher
reliability and better performance
and are designed to work under a
wide range of environmental
conditions. This higher reliability
makes them suitable for use
under harsh environment and
conditions like automotive. In
addition, they are also suitable to
be used in electronic signs and
signals.
• Super wide viewing angle at 120˚
To facilitate easy pick and place
assembly, the LEDs are packed in
EIA-compliant tape and reel.
Every reel will be shipped in
single intensity and color bin
(except for red color), to provide
close uniformity.
These LEDs are compatible with
IR solder reflow process. Due to
the high reliability feature of
these products, they also can be
mounted using through-the-wave
soldering process.
There are a variety of colors and
various viewing angles (30°, 60°
and 120°) available in these SMT
LEDs. Ideally, the 30° parts are
suitable for light piping where
focused intensities are required.
As for the 60° and 120°, they are
most suitable for automotive
interior and exterior lighting and
electronic signs applications.
• Available in 8mm carrier tape on
7-inch reel
• Compatible with both IR and TTW
soldering process
Applications
• Interior automotive
– Instrument panel backlighting
– Central console backlighting
– Cabin backlighting
– Navigation and audio system
– Dome lighting
– Push button backlighting
• Exterior automotive
– Turn signals
– CHMSL
– Rear combination lamp
– Puddle light
• Electronic signs and signals
– Interior full color sign
– Variable message sign
• Office automation, home appliances, industrial equipment
– Front panel backlighting
– Push button backlighting
– Display backlighting
CAUTION: HSMN-, HSMK-, HSMM-A40x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate
precautions during handling and processing. Refer to Agilent Application Note AN-1142 for additional details.
Package Dimensions
2.8 ± 0.2
1.9 ± 0.2
2.2 ± 0.2
A
0.1 TYP.
0.8 ± 0.1
C
3.2 ± 0.2
3.5 ± 0.2
0.8 ± 0.3
C
C
0.5 ± 0.1
0.7 ± 0.1
CATHODE MARKING
NOTE: ALL DIMENSIONS IN mm.
Device Selection Guide
Color
Part Number
Red
HSMC-A400-S30M1
HSMC-A401-T40M1
HSMC-A401-T80M1
HSMZ-A400-U80M1
Red Orange
HSMJ-A401-T40M1
HSMJ-A401-U40M1
HSMV-A400-U80M1
Orange
HSML-A401-U40M1
Amber
HSMA-A400-T35M1
HSMA-A401-U45M1
HSMU-A400-U85M1
Emerald Green HSME-A401-P4PM1
Green
HSMM-A401-R7YM2
HSMM-A401-S4YM2
HSMM-A401-S7YM2
HSMM-A400-T8YM2
Cyan
HSMK-A401-R40M2
HSMK-A400-T80M2
Blue
HSMN-A401-P4QM2
HSMN-A401-P7QM2
HSMN-A400-Q8QM2
Min. Iv (mcd)
160.0
250.0
310.0
500.0
250.0
400.0
500.0
400.0
250.0
400.0
500.0
40.0
120.0
160.0
200.0
310.0
100.0
310.0
40.0
50.0
80.0
Max. Iv (mcd)
400.0
800.0
1000.0
1600.0
800.0
1260.0
1600.0
1260.0
630.0
1260.0
1600.0
130.0
320.0
500.0
500.0
1000.0
320.0
1000.0
130.0
130.0
250.0
Test Current (mA)
50
50
50
50
50
50
50
50
50
50
50
50
30
30
30
30
30
30
30
30
30
Dice Technology
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
AlInGaP
InGaN
InGaN
InGaN
InGaN
InGaN
InGaN
InGaN
InGaN
InGaN
Note:
1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned.
2
Part Numbering System
HSM x1 – A x2 x3x4 – x5x6 x7 x8x9
Packaging Option
Color Bin Selection
Intensity Bin Select
Device Specific Configuration
Package Type
LED Chip Color
Absolute Maximum Ratings (TA = 25°C)
Parameters
HSMC/J/L/A/E
HSMZ/V/U
HSMM/K/N
DC Forward Current[1]
70 mA[3,4]
70 mA[3,4]
30 mA
Peak Forward Current [2]
200 mA
200 mA
90 mA
Power Dissipation
180 mW
240 mW
114 mW
Reverse Voltage
5V
Junction Temperature
110°C
Operating Temperature
–40°C to +100°C
Storage Temperature
–40°C to +100°C
Notes:
1. Derate linearly as shown in figure 5.
2. Duty factor = 10%, Frequency = 1 kHz.
3. Drive current between 10 mA and 70 mA is recommended for best long-term performance.
4. Operation at currents below 5 mA is not recommended.
3
Optical Characteristics (TA = 25°C)
Color
Red
Red Orange
Orange
Amber
Yellow Green
Emerald Green
Green
Cyan
Blue
Part
Number
HSMC
Peak
Wavelength
λPEAK (nm)
Typ.
635
Dominant
Wavelength
λD[1] (nm)
Typ.
626
Viewing Angle
2θ1/2[2] (Degrees)
Typ.
120
Luminous
Efficacy ηv[3]
(lm/W)
Typ.
150
Luminous Intensity/
Total Flux
Iv (mcd)/Φv (mlm)
Typ.
0.45
HSMZ
HSMJ
HSMV
HSML
HSMA
HSMU
HSME
HSME
HSMM
HSMK
HSMN
639
621
623
609
592
594
576
568
518
502
468
630
615
617
605
590
592
575
567
525
505
470
120
120
120
120
120
120
120
120
120
120
120
155
240
263
320
480
500
560
610
500
300
75
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
Notes:
1. The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is
the luminous efficacy in lumens/watt.
Electrical Characteristics (TA = 25°C)
Part Number
Forward Voltage
VF (Volts) @ IF = 50 mA
Typ.
Max.
Reverse Voltage
VR @ 100 µA
Min.
HSMC/J/L/A/E
2.2
2.5
5
HSMZ/V/U
2.8
3.4
5
Part Number
Forward Voltage
VF (Volts) @ IF = 30 mA
Typ.
Max.
Reverse Voltage
VR @ 10 µA
Min.
HSMM/K/N
3.8
5
4.6
1.0
RELATIVE INTENSITY
0.9
BLUE
EMERALD GREEN
CYAN
YELLOW GREEN
0.8
0.7
GREEN
AMBER
0.6
0.5
ORANGE
0.4
RED ORANGE
0.3
RED
0.2
0.1
0
380
430
480
530
580
630
WAVELENGTH – nm
Figure 1. Relative Intensity Vs. Wavelength.
4
680
730
780
70
1.2
60
HSMC/J/L/A/E
HSMZ/V/U
50
40
30
20
10
1.2
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 30 mA)
1.4
RELATIVE INTENSITY
(NORMALIZED AT 50 mA)
FORWARD CURRENT – mA
80
1.0
0.8
0.6
0.4
0.2
HSMM/K/N
0
0
1
2
3
4
5
80
70
50
300°C/W
40
470°C/W
30
20
10
0
0
20
40
60
80
20
30
40
50
100
120
300°C/W
350°C/W
20
470°C/W
15
10
5
0
0
20
60
40
80
RELATIVE INTENSITY
0.7
0.6
0.5
0.4
0.3
0.2
-10
100
120
Figure 5b. Maximum Forward Current Vs.
Ambient Temperature, Derated Based On
TJmax = 110°C (InGaN).
0.1
10
ANGLE – DEGREES
5
0
5
0
30
10
15
20
30
25
35
Figure 4. Relative Intensity Vs. Forward
Current (InGaN).
25
0.9
Figure 7. Radiation Pattern.
0.2
80
30
0.8
-30
0.4
540
1.0
-50
0.6
FORWARD CURRENT – mA
AMBIENT TEMPERATURE – °C
Figure 5a. Maximum Forward Current Vs.
Ambient Temperature, Derated Based On
TJmax = 110°C (AlInGaP).
-70
70
35
AMBIENT TEMPERATURE – °C
0
-90
60
Figure 3. Relative Intensity Vs. Forward
Current (AlInGaP).
MAXIMUM FORWARD CURRENT – mA
MAXIMUM FORWARD CURRENT – mA
Figure 2. Forward Current Vs. Forward Voltage.
350°C/W
10
0.8
FORWARD CURRENT – mA
FORWARD VOLTAGE – V
60
0
DOMINANT WAVELENGTH – nm
0
1.0
50
70
90
530
InGaN GREEN
520
510
500
InGaN CYAN
490
480
InGaN BLUE
470
460
0
5
10
15
20
25
30
35
CURRENT – mA
Figure 6. Dominant Wavelength Vs. Forward
Current – InGaN Devices.
X
X
2.60
(0.103)
0.40 (0.016)
1.10
(0.043)
0.50
(0.020)
Y
4.50 (0.178)
1.50 (0.059)
Y
DIMENSIONS IN mm (INCHES).
SOLDER RESIST
Figure 8a. Recommended Soldering Pad Pattern.
X
X
0.5 (0.020)
6.1 (0.240)
2.8 (0.110)
Y
2.0 (0.079)
6.0 (0.236)
1.0 (0.039)
2.0 (0.079)
3.0 (0.118)
Y
Thermal Resistance
300°C/W
350°C/W
470°C/W
Solder Pad Area (xy)
>16 mm2
>12 mm2
>8 mm2
DIMENSIONS IN mm (INCHES).
10 to 20 SEC.
Figure 8b. Recommended Soldering Pad Pattern (TTW).
255 °C
TEMPERATURE
217 °C
TEMPERATURE
20 SEC. MAX.
240°C MAX.
3°C/SEC. MAX.
100-150°C
183°C
3 °C/SEC. MAX.
125 °C ± 25 °C
60 to 150 SEC.
–6°C/SEC.
MAX.
3°C/SEC.
MAX.
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
TIME
Figure 9a. Recommended SnPb Reflow Soldering Profile.
Figure 9b. Recommended Pb-free Reflow Soldering Profile.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
TEMPERATURE – °C
6 °C/SEC. MAX.
MAX. 120 SEC.
120 SEC. MAX. 60-150 SEC.
BOTTOM SIDE
OF PC BOARD
200
TOP SIDE OF
PC BOARD
150
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
FLUXING
100
50
30
0
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
PREHEAT
10
20
30
40
50
60
70
80
TIME – SECONDS
Figure 10. Recommended Wave Soldering Profile.
6
+5 °C
-0 °C
90
100
TRAILER
COMPONENT
LEADER
480 mm MIN. FOR ∅180 REEL.
960 mm MIN. FOR ∅330 REEL.
200 mm MIN. FOR ∅180 REEL.
200 mm MIN. FOR ∅330 REEL.
C
A
USER FEED DIRECTION
Figure 11. Tape Leader and Trailer Dimensions.
+0.1
∅1.5 –0
4 ± 0.1
2 ± 0.05
3.6 ± 0.1
B
1.75 ± 0.1
C
C
C
A
5.5 ± 0.05
A
A
3.8 ± 0.1
+0.3
12–0.1
∅1 +0.1
–0
B
8 ± 0.1
0.229 ± 0.01
3.45 ± 0.1
VIEW B-B
VIEW A-A
ALL DIMENSIONS IN mm.
Figure 12. Tape Dimensions.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 13. Reeling Orientation.
7
Storage Condition: 5 to 30°C @
60% relative humidity max.
Baking is required under the
condition:
a) the humidity indicator card
color becoming pink
b) the pack has been opened for
more than 4 weeks
Baking recommended condition:
60 ± 5°C for 20 hours.
Intensity Bin Select (X5X6)
Individual reel will contain parts from
one half bin only.
Color Bin Select (X7)
Individual reel will contain parts from
one full bin only.
X5
X7
Min. Iv Bin
X6
0
Full Distribution
Z
A and B only
0
Full Distribution
Y
B and C only
3
3 half bins starting from X51
W
C and D only
4
4 half bins starting from X51
V
D and E only
5
5 half bins starting from X51
U
E and F only
7
3 half bins starting from X52
T
F and G only
8
4 half bins starting from X52
S
G and H only
9
5 half bins starting from X52
Q
A, B and C only
P
B, C and D only
N
C, D and E only
M
D, E and F only
L
E, F and G only
K
F, G and H only
1
A, B, C and D only
2
E, F, G and H only
3
B, C, D and E only
4
C, D, E and F only
5
A, B, C, D and E only
6
B, C, D, E and F only
Intensity Bin Limits
Bin ID
Min. (mcd)
Max. (mcd)
N1
28.50
35.50
N2
35.50
45.00
P1
45.00
56.00
P2
56.00
71.50
Q1
71.50
90.00
Q2
90.00
112.50
R1
112.50
140.00
R2
140.00
180.00
S1
180.00
224.00
S2
224.00
285.00
T1
285.00
355.00
T2
355.00
450.00
U1
450.00
560.00
U2
560.00
715.00
V1
715.00
900.00
V2
900.00
1125.00
W1
1125.00
1400.00
W2
1400.00
1800.00
Tolerance of each bin limit = ± 12%
8
Color Bin Limits
Blue
Min. (nm)
A
460.0
B
465.0
C
470.0
D
475.0
Max. (nm)
465.0
470.0
475.0
480.0
Cyan
A
B
C
D
Min. (nm)
490.0
495.0
500.0
505.0
Max. (nm)
495.0
500.0
505.0
510.0
Green
A
B
C
D
Min. (nm)
515.0
520.0
525.0
530.0
Max. (nm)
520.0
525.0
530.0
535.0
Color Bin Limits
Emerald
Green
Min. (nm)
A
552.5
B
555.5
C
558.5
D
561.5
Max. (nm)
555.5
558.5
561.5
564.5
Yellow
Green
E
F
G
H
Min. (nm)
564.5
567.5
570.5
573.5
Max. (nm)
567.5
570.5
573.5
576.5
Amber/
Yellow
A
B
C
D
E
F
Min. (nm)
582.0
584.5
587.0
589.5
592.0
594.5
Max. (nm)
584.5
587.0
589.5
592.0
594.5
597.0
Orange
A
B
C
D
E
Min. (nm)
597.0
600.0
603.0
606.0
609.0
Max. (nm)
600.0
603.0
606.0
609.0
612.0
Red
Orange
A
B
Min. (nm)
611.0
616.0
Max. (nm)
616.0
620.0
Red
Min. (nm)
Full Distribution
Max. (nm)
Tolerance of each bin limit = ± 1 nm
Packaging Option (X8X9)
Test
Package
Option Current Type
M1
50 mA Top Mount
M2
30 mA Top Mount
Reel
Size
7 inch
7 inch
Forward Voltage Bin Table
For HSMZ/V/U – A4xx-xxxxx only
BIN
VA
VB
VC
VD
VE
MIN.
1.9
2.2
2.5
2.8
3.1
MAX.
2.2
2.5
2.8
3.1
3.4
Tolerance of each bin limit = ± 0.05
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5989-0663EN
October 12, 2004
5989-1211EN