QCPL-325J-500E

HCPL-316J, ACPL-331J/332J, ACPL-330J/333J, QCPL-325J/329J Smart Gate Drive Optocoupler Reliability Data Sheet Description Definition of Failure This document's reliability data shown includes Broadcom Ltd. reliability test data from the tests done on this product family. All of these products use the similar wafer technology. The data in Table 1 and Table 2 reflect actual test data for devices on a per-channel basis. Before stress, all devices are preconditioned at MSL 1 using a solder reflow process (260°C peak temperature) and 20 temperature cycles (–55°C to +125°C, 15 mins dwell, 1 min transfer). These data are taken from testing on Broadcom devices using internal Broadcom processes, material specifications, design standards, and statistical process controls. They are not transferable to other manufacturers' similar part types. Inability to switch, i.e., functional failure, is the definition of failure in this data sheet. Specifically, failure occurs when the device fails to switch ON with twice the minimum recommended drive current (but not exceeding the maximum rating) or fails to switch off when there is no input current. Failure Rate Projections The demonstrated point mean time to failure (MTTF) is measured at the absolute maximum stress condition. The failure rate projections in Table 2 uses the Arrhenius acceleration relationship, where a 0.43 eV activation energy is used as in the hybrid section of MIL-HDBK-217. Operating Life Test For valid system reliability calculations, it is necessary to adjust for the time when the system is not in operation. Note that if you are using MIL-HDBK-217 for predicting component reliability, the results may not be comparable to those given in Table 2 due to different conditions and factors that have been accounted for in MIL-HDBK-217. For example, it is unlikely that your application will exercise all available channels at full rated power with the IC always ON as Broadcom testing does. Thus, your application total power and duty cycle must be carefully considered when comparing Table 2 to predictions using MIL-HDBK-217. Application Information The data of Table 1 and Table 2 were obtained on devices with high temperature operating life duration. An exponential (random) failure distribution is assumed, expressed in units of FIT (failures per billion device hours) are only defined in the random failure portion of the reliability curve. Broadcom -1- HCPL-316J, ACPL-331J/332J, ACPL-330J/333J, QCPL-325J/329J Reliability Data Sheet Test Results Table 1 Demonstrated Operating Life Test Performance Stress Test Condition Total Device Tested Total Device Hours TA = 125°C VCC Bias (Based on DS) 984 Number of Failed Units Demonstrated MTTF(hr) at TA = +125°C Demonstrated FITs at TA = +125°C 0 984,000 1,016 984,000 Table 2 Reliability Projection for Devices Listed in Title Typical (60% Confidence) 90% Confidence Ambient Temperature (°C) Junction Temperature (°C) MTTF (Hr/Fail) FITs (Fail/109h) MTTF (Hr/Fail) FITs (Fail/109h) 125 140 1,073,895 931 427,346 2,340 120 135 1,245,007 803 495,438 2,018 110 125 1,692,121 591 673,363 1,485 100 115 2,336,469 428 929,775 1,076 90 105 3,281,731 305 1,305,932 766 80 95 4,695,313 213 1,868,453 535 70 85 6,853,569 146 2,727,309 367 60 75 10,223,715 98 4,068,425 246 50 65 15,616,306 64 6,214,353 161 40 55 24,477,415 41 9,740,543 103 30 45 39,466,509 25 15,705,303 64 25 40 50,691,071 20 20,172,005 50 Broadcom -2- For product information and a complete list of distributors, please go to our web site: www.broadcom.com. Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom in the United States, certain other countries and/or the EU. Copyright © 2017 Broadcom. All Rights Reserved. The term "Broadcom" refers to Broadcom Limited and/or its subsidiaries. For more information, please visit www.broadcom.com. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. HCPL-ACPL-QCPL-SGDO-RDS100 – January 18, 2017