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F1206A1R00FWTR

F1206A1R00FWTR

  • 厂商:

    AVX(艾维克斯)

  • 封装:

    1206

  • 描述:

    FUSE BOARD MOUNT 1A 32VDC 1206

  • 数据手册
  • 价格&库存
F1206A1R00FWTR 数据手册
Accu-Guard® SMD Thin-Film Fuse ACCU-GUARD® TECHNOLOGY APPLICATIONS ® The Accu-Guard series of fuses is based on thin-film techniques. This technology provides a level of control on the component electrical and physical characteristics that is generally not possible with standard fuse technologies. This has allowed AVX to offer a series of devices which are designed for modern surface mount circuit boards which require protection. • • • • • • • • • • • FEATURES • Accurate current rating • Fast acting • Small-standard 0402, 0603, 0805, 1206 and 0612 chip sizes • Taped and reeled • Completely compatible with all soldering systems used for SMT • Lead Free Series (F0402E, F0402G, F0603E, F0805B, F1206B) DIMENSIONS Cellular Telephones Two-Way Radios Computers Battery Chargers Rechargeable Battery Packs Hard Disk Drives PDA’s LCD Screens SCSI Interface Digital Cameras Video Cameras APPROVAL FILE NUMBERS • UL, cUL: RCD#E143842 • UL (F0402G): RCD#E141069 millimeters (inches) F0603C, F0805B, F1206A and F1206B F0402E and F0603E B1 F0402G S B A B H W T T W T L B2 L W L L W T B F0402G F0402E F0603E F0603C F0805B F1206A/B F0612D 1.00±0.05 (0.039±0.002) 0.58±0.04 (0.023±0.002) 0.35±0.05 (0.014±0.002) 0.48±0.05 (0.019±0.002) 1.00±0.10 (0.039±0.004) 0.55±0.07 (0.022±0.003) 0.40±0.10 (0.016±0.004) 0.20±0.10 (0.008±0.004) 1.60±0.10 (0.063±0.004) 0.81±0.10 (0.032±0.004) 0.63±0.10 (0.025±0.004) 0.35±0.15 (0.014±0.006) 1.65±0.25 (0.065±0.010) 0.80±0.15 (0.031±0.006) 0.90±0.2 (0.035±0.008) 0.35±0.15 (0.014±0.006) 2.1±0.2 (0.083±0.008) 1.27±0.1 (0.050±0.004) 0.90±0.2 (0.035±0.008) 0.30±0.15 (0.012±0.006) 3.1±0.2 (0.122±0.008) 1.6±0.1 (0.063±0.004) 1.2±0.2 (0.047±0.008) 0.43±0.25 (0.017±0.010) 1.65±0.25 (0.065±0.010) 3.1±0.2 (0.122±0.008) 0.90±0.2 (0.036±0.008) 0.35±0.15 (0.014±0.006) 0.20±0.05 (0.008±0.002) 0.05±0.05 (0.002±0.002) A S, H HOW TO ORDER F 2 1206 Product Size Fuse See table for standard sizes A Fuse Version A=Accu-Guard® B=Accu-Guard® II C=Accu-Guard® II 0603 D=Accu-Guard® II 0612 E=Accu-Guard® II 0402, 0603 G=Accu-Guard® II 0402 Low Current 0R20 F W TR Rated Current Fuse Speed Termination Packaging Current expressed in Amps. Letter R denotes decimal point. e.g. 0.20A=0R20 1.75A=1R75 F=Fast S=Nickel/LeadFree Solder =coated (Sn 100) W=Nickel/solder =coated (Sn 63, Pb 37) TR=Tape and reel Accu-Guard® II SMD Thin-Film Fuse Accu-Guard® II is a version of Accu-Guard® fuses for a wider range of current and voltage ratings. Constructed on alumina substrates, Accu-Guard® II fuses display superior electrical, mechanical and environmental properties. Accu-Guard® II dimensions are standard 0402, 0603, 0805, 1206 and 0612 chip sizes, see page 2. ELECTRICAL SPECIFICATIONS Operating temperature: -55°C to +125°C Current carrying capacity: For F0402E and F0603E at -55°C 107% of rating, at -25°C 100% of rating, at +125°C 80% of rating. For F0603C at -55°C is 107% of rating, at +25°C 100% of rating, at +85°C 90% of rating, at +125°C 75% of rating. Type F0402E F0603E F0603C F0805B F1206B F0612D Part Number F0402E0R25FSTR F0402E0R50FSTR F0402E0R75FSTR F0402E1R00FSTR F0402E1R50FSTR F0402E2R00FSTR F0603E0R25FSTR F0603E0R37FSTR F0603E0R50FSTR F0603E0R75FSTR F0603E1R00FSTR F0603E1R25FSTR F0603E1R50FSTR F0603E1R75FSTR F0603E2R00FSTR F0603E2R50FSTR F0603E3R00FSTR F0603C0R25FWTR F0603C0R37FWTR F0603C0R50FWTR F0603C0R75FWTR F0603C1R00FWTR F0603C1R25FWTR F0603C1R50FWTR F0603C1R75FWTR F0603C2R00FWTR F0603C2R50FWTR F0603C3R00FWTR F0805B0R25FW/STR F0805B0R50FW/STR F0805B0R75FW/STR F0805B1R00FW/STR F0805B1R25FW/STR F0805B1R50FW/STR F0805B2R00FW/STR F0805B2R50FW/STR F0805B3R00FW/STR F1206B0R25FW/STR F1206B0R50FW/STR F1206B1R00FW/STR F1206B1R50FW/STR F1206B2R00FW/STR F1206B3R00FW/STR F0612D4R00FWTR F0612D5R00FWTR Current Resistance Rating 10% x I rated, 25°C A Ω (max.) 0.25 0.650 0.50 0.250 0.75 0.200 1.00 0.130 1.50 0.060 2.00 0.040 0.25 0.650 0.375 0.450 0.50 0.250 0.75 0.200 1.00 0.130 1.25 0.090 1.50 0.060 1.75 0.050 2.00 0.040 2.50 0.035 3.00 0.030 0.25 0.800 0.375 0.500 0.50 0.320 0.75 0.300 1.00 0.200 1.25 0.170 1.50 0.110 1.75 0.090 2.00 0.075 2.50 0.055 3.00 0.045 0.25 0.750 0.50 0.350 0.75 0.270 1.00 0.220 1.25 0.170 1.50 0.120 2.00 0.080 2.50 0.060 3.00 0.050 0.25 0.750 0.50 0.350 1.00 0.180 1.50 0.120 2.00 0.080 3.00 0.050 4.00 0.040 5.00 0.025 For F1206B and F0805B at -55°C is 107% of rating, at +25°C 100% of rating, at +85°C 93% of rating, at +125°C 90% of rating. For F0805B 2.50A and 3.00A at +85°C 90% of rating, at +125°C 90% of rating. Interrupting rating: 50A. Insulation resistance: >20MΩ guaranteed (after fusing at rated voltage). For F0612D at -55°C 107% of rating, at +25°C 100% of rating, at +85°C 80% of rating, at +125°C 75% of rating. Voltage Drop @1 x I rated, 25°C mV (max.) 220 180 180 160 140 120 220 220 180 180 160 140 140 120 120 100 100 280 280 280 280 240 240 240 240 240 200 200 280 280 280 280 280 240 220 220 220 280 280 240 240 220 220 260 200 Fusing Current (within 5 sec), 25°C A 0.625 1.25 1.875 2.50 3.75 5.00 0.625 0.940 1.25 1.875 2.50 3.125 3.75 4.375 5.00 6.25 7.50 0.50 0.75 1.00 1.50 2.00 2.50 3.00 3.50 4.00 5.00 6.00 0.50 1.00 1.50 2.00 2.50 3.00 4.00 5.00 6.00 0.50 1.00 2.00 3.00 4.00 6.00 10 12.5 Pre-Arc I2t @ 50A A2-sec 0.00005* 0.0003 0.003 0.008 0.03 0.06 0.00005* 0.0001 0.0003 0.003 0.008 0.01 0.03 0.04 0.06 0.12 0.25 0.00003* 0.0001 0.0002 0.0015 0.004 0.007 0.012 0.02 0.03 0.05 0.1 0.00003* 0.0002 0.001 0.003 0.007 0.010 0.030 0.050 0.10 0.00003 0.0002 0.003 0.010 0.030 0.10 0.10 0.25 Rated Voltage V 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 24 24 16 16 63 63 63 63 63 63 63 63 63 63 63 63 63 63 63 32 32 *Current is limited to less than 50A at 32V due to internal fuse resistance. 7 Accu-Guard® II SMD Thin-Film Fuse ENVIRONMENTAL CHARACTERISTICS Test Solderability Leach Resistance Storage Shear Rapid Change of Temperature Vibration Bend Conditions Components completely immersed in a solder bath at 235 ±5°C for 2 secs. Completely immersed in a solder bath at 260 ±5°C for 60 secs. 12 months minimum with components stored in “as received” packaging. Components mounted to a substrate. A force of 5N applied normal to the line joining the terminations and in a line parallel to the substrate. Components mounted to a substrate. 50 cycles -55°C to +125°C. Per Mil-Std-202F Method 201A and Method 204D Condition D. Tested as shown in diagram Requirement Terminations to be well tinned No visible damage Dissolution of termination ≤ 25% of area ΔR/R
F1206A1R00FWTR 价格&库存

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