AP2822GKETR-G1-01

0.5A to 2.0A High-side Power Distribution Switches General Description Features The AP2822 is an integrated high-side power switch that consists of N-Channel MOSFET, charge pump, over current & temperature and other related protection circuits. The switch’s low RDS(ON), 85mΩ, is designed to meet USB voltage drop requirements. The IC includes soft-start to limit inrush current, over-current protection, load short protection with fold-back, and thermal shutdown to avoid switch failure during hot plug-in. Under voltage lockout (UVLO) function is used to ensure the device remain off unless there is a valid input voltage present. A FLAG output is available to indicate fault conditions to the local USB controller. • • • • • • • • • • • • • • • The AP2822 is available in the standard package of SOT-23-5. AP2822 Low MOSFET On Resistance: 85mΩ Compliant to USB Specifications Available 4 Versions of Continuous Load: 0.5A/1.0A/1.5A/2.0A Logic Level Enable Pin: Available with Active-high or Active-low Version Operating Voltage Range: 2.7V to 5.5V Low Supply Current: 68µA (Typ.) Low Shutdown Current: 1.0µA (Max) Under-voltage Lockout Soft Start-up Over-current Protection Over Temperature Protection Load Short Protection with Fold-back No Reverse Current When Power Off Deglitched FLAG Output with Open Drain With Output Shutdown Pull-low Resistor Applications • • • • • USB Power Management USB Bus/Self Powered Hubs Hot-plug Power Supplies Battery-charger Circuits Notebooks, Motherboard PCs SOT-23-5 Figure 1. Package Type of AP2822 Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited 1 0.5A to 2.0A High-side Power Distribution Switches AP2822 Pin Configuration K/KA/KB/KE Package （SOT-23-5） K FLAG 1 GND 2 EN 3 KA 5 4 VOUT VIN EN 1 GND 2 FLAG 3 KB VOUT 1 GND 2 VIN 3 5 VOUT 4 VIN 5 VIN 4 EN KE 5 4 VOUT EN VOUT 1 GND 2 FLAG 3 Figure 2. Pin Configuration of AP2822 (Top View) Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited 2 0.5A to 2.0A High-side Power Distribution Switches AP2822 Pin Descriptions Pin Number 1(K) 3(KA/KE) 2 Pin Name Function FLAG Fault flag pin, output with open drain, need a pull-up resistor in application, active low to indicate OCP or OTP GND Ground 3(K) 1(KA) EN Chip enable control input, active low or high VIN Supply input pin 4(KB/KE) 4(K/KA) 3(KB) 5(KE) 5(K/KA) 1,5(KB) VOUT Switch output voltage 1(KE) Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited 3 0.5A to 2.0A High-side Power Distribution Switches AP2822 Functional Block Diagram VIN 3(1){4}[4] EN 4(4){3}[5] Clock Gate Control Band Gap Reference Over Current Limiting CMP Current Sense 5(5){1,5}[1] VOUT Shutdown Signal 1(3)[3] UVLO GND FLAG FLAG Deglitch Logic Thermal Sense 2(2){2}[2] A(B){C}[D] A: SOT-23-5(K Package) B: SOT-23-5(KA Package) C: SOT-23-5(KB Package) D: SOT-23-5(KE Package) Figure 3. Functional Block Diagram of AP2822 Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited 4 0.5A to 2.0A High-side Power Distribution Switches AP2822 Ordering Information AP2822 - Circuit Type G1: Green TR: Tape & Reel Condition A: Active High (Continuous 0.5A) B: Active Low (Continuous 0.5A) C: Active High (Continuous 1.0A) D: Active Low (Continuous 1.0A) E: Active High (Continuous 1.5A) F: Active Low (Continuous 1.5A) G: Active High (Continuous 2.0A) H: Active Low (Continuous 2.0A) Package SOT-23-5 Dec. 2012 Temperature Range Condition -40 to 85°C Active High (Continuous 0.5A) Active Low (Continuous 0.5A) Active High (Continuous 1.0A) Active Low (Continuous 1.0A) Active High (Continuous 1.5A) Active Low (Continuous 1.5A) Active High (Continuous 2.0A) Active Low (Continuous 2.0A) Package K/KA/KB/KE: SOT-23-5 Part Number Marking ID Packing Type AP2822AKTR-G1 GCQ Tape & Reel AP2822BKTR-G1 GCR Tape & Reel AP2822CKTR-G1 GCS Tape & Reel AP2822DKTR-G1 GCT Tape & Reel AP2822EKTR-G1 GCU Tape & Reel AP2822FKTR-G1 GCV Tape & Reel AP2822GKTR-G1 GCW Tape & Reel AP2822HKTR-G1 GCZ Tape & Reel Rev 1. 1 BCD Semiconductor Manufacturing Limited 5 0.5A to 2.0A High-side Power Distribution Switches AP2822 Ordering Information (Continued) Package SOT-23-5 SOT-23-5 Dec. 2012 Temperature Range -40 to 85°C -40 to 85°C Condition Active High (Continuous 0.5A) Active Low (Continuous 0.5A) Active High (Continuous 1.0A) Active Low (Continuous 1.0A) Active High (Continuous 1.5A) Active Low (Continuous 1.5A) Active High (Continuous 2.0A) Active Low (Continuous 2.0A) Active High (Continuous 0.5A) Active Low (Continuous 0.5A) Active High (Continuous 1.0A) Active Low (Continuous 1.0A) Active High (Continuous 1.5A) Active Low (Continuous 1.5A) Active High (Continuous 2.0A) Active Low (Continuous 2.0A) Part Number Marking ID Packing Type AP2822AKATR-G1 GDQ Tape & Reel AP2822BKATR-G1 GDR Tape & Reel AP2822CKATR-G1 GDS Tape & Reel AP2822DKATR-G1 GDT Tape & Reel AP2822EKATR-G1 GDU Tape & Reel AP2822FKATR-G1 GDV Tape & Reel AP2822GKATR-G1 GDW Tape & Reel AP2822HKATR-G1 GDZ Tape & Reel AP2822AKBTR-G1 GLA Tape & Reel AP2822BKBTR-G1 GLB Tape & Reel AP2822CKBTR-G1 GLC Tape & Reel AP2822DKBTR-G1 GLD Tape & Reel AP2822EKBTR-G1 GLE Tape & Reel AP2822FKBTR-G1 GLF Tape & Reel AP2822GKBTR-G1 GLG Tape & Reel AP2822HKBTR-G1 GLH Tape & Reel Rev 1. 1 BCD Semiconductor Manufacturing Limited 6 0.5A to 2.0A High-side Power Distribution Switches AP2822 Ordering Information (Continued) Package SOT-23-5 Temperature Range Condition -40 to 85°C Active High (Continuous 0.5A) Active Low (Continuous 0.5A) Active High (Continuous 1.0A) Active Low (Continuous 1.0A) Active High (Continuous 1.5A) Active Low (Continuous 1.5A) Active High (Continuous 2.0A) Active Low (Continuous 2.0A) Part Number Marking ID Packing Type AP2822AKETR-G1 GLI Tape & Reel AP2822BKETR-G1 GLJ Tape & Reel AP2822CKETR-G1 GLK Tape & Reel AP2822DKETR-G1 GLL Tape & Reel AP2822EKETR-G1 GLM Tape & Reel AP2822FKETR-G1 GLN Tape & Reel AP2822GKETR-G1 GLO Tape & Reel AP2822HKETR-G1 GLP Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green. Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited 7 0.5A to 2.0A High-side Power Distribution Switches AP2822 Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit VIN 6.0 V TJ 150 ºC Storage Temperature Range TSTG -65 to 150 ºC Lead Temperature (Soldering, 10sec) TLEAD 260 ºC θJA TBD Power Supply Voltage Operating Range Junction Temperature Thermal Resistance (Junction to Ambient) o C/W ESD (Machine Model) 200 V ESD (Human Body Model) 2000 V Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Recommended Operating Conditions Parameter Supply Voltage Operating Ambient Range Dec. 2012 Temperature Symbol Min Max Unit VIN 2.7 5.5 V TA -40 85 °C Rev 1. 1 BCD Semiconductor Manufacturing Limited 8 0.5A to 2.0A High-side Power Distribution Switches AP2822 Electrical Characteristics (VIN=5.0V, CIN=2.2µF, COUT=1.0µF, Typical TA=25°C, unless otherwise specified) Parameter Symbol Supply Voltage VIN Switch On Resistance RDS(ON) Current Limit ILIMIT Supply Current ISUPPLY Fold-back Short Current ISHORT Shutdown Supply Current ISHUTDOWN Condition Min Typ Max Unit 2.7 VIN=5.0V, IOUT=2.0A 5.5 V 85 110 mΩ AP2822A/B(0.5A) , VOUT=4.0V 0.7 1.0 1.4 AP2822C/D(1.0A), VOUT=4.0V 1.1 1.5 2.1 AP2822E/F(1.5A), VOUT=4.0V 1.65 2.2 2.8 AP2822G/H(2.0A), VOUT=4.0V 2.2 2.7 3.2 VIN=5.0V, No Load 68 95 AP2822 A/B/C/D, VOUT=0V 0.7 AP2822 E/F/G/H, VOUT=0V 1.1 Chip Disable, Shutdown Mode 0.1 A µA A 1.0 µA Enable High Input Threshold VENH 1.6 5.5 V Enable Low Input Threshold VENL 0 1.0 V Force 0V to 5.0V at EN Pin -1.0 1.0 µA VIN Increasing from 0V 2.2 3.0 V Enable Pin Input Current Under Voltage Threshold Voltage Lockout IEN VUVLO Under Voltage Hysteresis VUVLOHY Reverse Current IREVERSE Output Pull Low Resistance after Shutdown tON FLAG Pin Delay Time tDFLG FLAG Pin Low Voltage VFLG FLAG Pin Leakage Current Thermal Temperature Shutdown Thermal Shutdown Hysteresis Dec. 2012 0.2 Chip Disable, VOUT>VIN RDISCHARGE Output Turn-on Time ILEAKAGE 2.5 From Enable Active to 90% of Output From Over Current Fault Condition to Flag Active ISINK=5.0mA 0.1 1.0 µA 100 200 Ω 500 5 µs 10 15 ms 35 70 mV 1.0 µA FLAG Disable, Force 5.0V TOTSD 150 THYOTSD 30 Rev 1. 1 V o C BCD Semiconductor Manufacturing Limited 9 0.5A to 2.0A High-side Power Distribution Switches AP2822 Typical Performance Characteristics 100 100 VIN=5V Enable Active No Load 90 80 Supply Current (μA) Supply Current (μA) 80 Enable Active 90 70 60 50 40 30 70 60 O TA=-40 C 50 O TA=25 C 40 O TA=85 C 30 20 20 10 10 0 0 -40.0 -10 -20.0 0.0 20.0 40.0 60.0 80.0 1.0 1.5 2.0 2.5 O Ambient Temperature ( C) Figure 4. Supply Current vs. Ambient Temperature 3.5 4.0 4.5 5.0 5.5 Figure 5. Supply Current vs. Supply Voltage 200 180 IOUT=1.0A 170 IOUT=1.0A 180 160 150 160 140 140 130 120 RDS(ON) (mΩ) RDS(ON) (mΩ) 3.0 Supply Voltage (V) VIN=5.0V VIN=3.3V 100 80 O TA=-40 C 120 O TA=25 C 110 O TA=85 C 100 90 80 60 70 60 40 50 20 40 0 -40 -20 0 20 40 60 30 80 3.0 O 3.5 4.0 4.5 5.0 Ambient Temperature ( C) Supply Voltage (V) Figure 6. RDS(ON) vs. Ambient Temperature Figure 7. RDS(ON) vs. Supply Voltage Dec. 2012 Rev 1. 1 5.5 BCD Semiconductor Manufacturing Limited 10 0.5A to 2.0A High-side Power Distribution Switches AP2822 Typical Performance Characteristics (Continued) 1.4 For AP2822A/B 1.2 1.2 1.0 1.0 Current Limit (A) Current Limit (A) 1.4 0.8 O TA= -40 C 0.6 O TA= 25 C 0.4 O TA= 85 C 0.2 For AP2822A/B 0.8 VIN=5.0V VIN=3.3V 0.6 0.4 0.2 0.0 3.0 3.5 4.0 4.5 5.0 0.0 -40 5.5 -20 Supply Voltage (V) 0 20 40 60 80 O Ambient Temperature ( C) Figure 8. Current Limit vs. Supply Voltage Figure 9. Current Limit vs. Ambient Temperature 2.0 2.0 For AP2822C/D 1.9 For AP2822C/D 1.9 1.8 1.8 Current Limit (A) Current Limit (A) 1.7 1.6 1.5 1.4 TA=-40 C 1.3 TA=25 C 1.2 TA=85 C o 0 VIN=5.0V VIN=3.3V 1.7 1.6 1.5 1.4 0 1.3 1.1 1.0 3.0 3.5 4.0 4.5 5.0 1.2 -40 5.5 Supply Voltage (V) 0 20 40 60 80 O Ambient Temperature ( C) Figure 10. Current Limit vs. Supply Voltage Dec. 2012 -20 Figure 11. Current Limit vs. Ambient Temperature Rev 1. 1 BCD Semiconductor Manufacturing Limited 11 0.5A to 2.0A High-side Power Distribution Switches AP2822 Typical Performance Characteristics (Continued) 3.0 3.0 For AP2822E/F 2.6 2.6 2.4 2.4 2.2 2.0 O TA=-40 C 1.8 O TA=25 C O TA=85 C 1.6 For AP2822E/F 2.8 Current Limit (A) Current Limit (A) 2.8 2.2 2.0 VIN=5.0V VIN=3.3V 1.8 1.6 1.4 1.4 1.2 3.0 3.5 4.0 4.5 5.0 1.2 -40 5.5 -20 Supply Voltage (V) 20 40 60 80 O Figure 12. Current Limit vs. Supply Voltage Figure 13. Current Limit vs. Ambient Temperature 3.6 3.6 For AP2822G/H 3.4 3.2 3.0 3.0 2.8 2.6 2.4 o TA=-40 C o 2.2 TA=25 C 2.0 TA=85 C For AP2822G/H 3.4 3.2 Current Limit (A) Current Limit (A) 0 Ambient Temperature ( C) 2.8 2.6 VIN=5.0V VIN=3.3V 2.4 2.2 o 2.0 1.8 1.8 1.6 -40 1.6 3.0 3.5 4.0 4.5 5.0 5.5 Supply Voltage (V) 0 20 40 60 80 O Ambient Temperature ( C) Figure 14. Current Limit vs. Supply Voltage Dec. 2012 -20 Figure 15. Current Limit vs. Ambient Temperature Rev 1. 1 BCD Semiconductor Manufacturing Limited 12 0.5A to 2.0A High-side Power Distribution Switches AP2822 15 2.70 Enable Active 2.65 Flag Delay Time during Over Current (ms) Under Voltage Lockout Threshold Voltage (V) Typical Performance Characteristics (Continued) 2.60 2.55 VIN Rising VIN Falling 2.50 2.45 2.40 2.35 2.30 2.25 2.20 -40.0 -20.0 0.0 20.0 40.0 60.0 80.0 VIN=5V Enable Active 14 13 12 11 10 9 8 7 6 5 -40.0 -20.0 0.0 40.0 60.0 80.0 Ambient Temperature ( C) Ambient Temperature ( C) Figure 16. UVLO Voltage vs. Ambient Temperature Figure 17. Flag Delay Time during Over Current vs. Ambient Temperature 1.30 TA=25 C VIN=5V Enable Active 12 10 8 6 1.26 1.24 1.22 1.20 1.18 1.16 1.14 1.12 1.10 1.08 1.06 1.04 For AP2822 E/F/G/H 1.02 1.00 3.0 3.5 4.0 4.5 5.0 5.5 Supply Voltage (V) 3.0 3.5 4.0 4.5 5.0 Supply Voltage (V) Figure 18. Flag Delay Time during Over Current vs. Supply Voltage Dec. 2012 VIN=5V Enable Active 1.28 O 14 Output Short to GND Current (A) Flag Delay Time during Over Current (ms) 20.0 O O Figure 19. Output Short to GND Current vs. Supply Voltage Rev 1. 1 BCD Semiconductor Manufacturing Limited 13 0.5A to 2.0A High-side Power Distribution Switches AP2822 Typical Performance Characteristics (Continued) 1.6 VIN=5V VIN=5V Enable Active 1.5 1.4 Enable Threshold Voltage (V) Output Short to GND Current (A) 1.5 1.3 1.2 1.1 1.4 VENH VENL 1.3 1.2 1.1 For AP2822 E/F/G/H 1.0 -40.0 -20.0 0.0 20.0 40.0 60.0 1.0 -40.0 80.0 -20.0 0.0 20.0 40.0 60.0 80.0 O O Ambient Temperature ( C) Ambient Temperature ( C) Figure 20. Output Short to GND Current vs. Ambient Temperature Figure 21. Enable Threshold Voltage vs. Ambient Temperature 1.7 O TA=25 C Enable Threshold Voltage (V) 1.6 VEN 5V/div 1.5 1.4 VENH VENL 1.3 1.2 IINRUSH 20mA/div 1.1 1.0 VOUT 1V/div 0.9 0.8 0.7 3.0 3.5 4.0 4.5 5.0 Time 500μs/div 5.5 Supply Voltage (V) Figure 22. Enable Threshold Voltage vs. Supply Voltage Dec. 2012 Figure 23. Output Turn On and Rise Time (CIN=1.0μF, COUT=1.0μF, No Load) Rev 1. 1 BCD Semiconductor Manufacturing Limited 14 0.5A to 2.0A High-side Power Distribution Switches AP2822 Typical Performance Characteristics (Continued) VEN 5V/div VEN 5V/div IINRUSH 1A/div IINRUSH 1A/div VOUT 1V/div VOUT 1V/div Time 500μs/div Time 500μs/div Figure 24. Output Turn On and Rise Time (CIN=1.0μF, COUT=1.0μF, RL=3.3Ω) Figure 25. Output Turn On and Rise Time (CIN=1.0μF, COUT=100μF, No Load) VEN 5V/div VEN 5V/div COUT=100μF COUT=22μF VOUT 1V/div COUT=470μF COUT=220μF VOUT 1V/div IOUT 1A/div COUT=1μF Time 500μs/div Time 5ms/div Figure 26. Output Turn Off and Fall Time (VIN=5V, CIN=1.0μF, No Load) Dec. 2012 Figure 27. Output Turn Off and Fall Time (VIN=5V, CIN=1.0μF, COUT=470μF, RL=3.3Ω) Rev 1. 1 BCD Semiconductor Manufacturing Limited 15 0.5A to 2.0A High-side Power Distribution Switches AP2822 Typical Performance Characteristics (Continued) VFLAG 1V/div VEN 5V/div IOUT 1A/div IOUT 1A/div VOUT 1V/div VOUT 1V/div Time 5ms/div Time 20ms/div Figure 28. Output Short to GND Current (VIN=5V, CIN=1.0μF) Figure 29. FLAG Response during Over Current VFLAG 1V/div IOUT 1A/div VOUT 1V/div Time 5ms/div Figure 30. FLAG Response during Over Temperature (TA=125 ºC) Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited 16 0.5A to 2.0A High-side Power Distribution Switches AP2822 Typical Application R 10kΩ VIN =5V 4(4){3}[5] VIN C IN (Note2) 2.2µF 1(3)[3] USB Controller AP2822 3(1){4}[4] Enable FLAG EN VOUT GND 5(5){1,5}[1] COUT 1µF 2(2){2}[2] VBUS D+ DGND A(B){C}[D] A: SOT-23-5(K Package) B: SOT-23-5(KA Package) C: SOT-23-5(KB Package) D: SOT-23-5(KE Package) Note 2: 2.2µF input capacitor is enough in most application cases. If the VOUT is short to ground frequently during usage, large size input capacitor is necessary, recommend 22µF. Figure 31. Typical Application of AP2822 Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited 17 0.5A to 2.0A High-side Power Distribution Switches AP2822 Mechanical Dimensions SOT-23-5 Unit: mm(inch) 2.820(0.111) 3.020(0.119) 0.100(0.004) 0.200(0.008) 0.200(0.008) 0.700(0.028) REF 0.950(0.037) TYP 0.300(0.012) 0.400(0.016) 0° 8° 1.800(0.071) 2.000(0.079) 0.000(0.000) 0.150(0.006) 0.900(0.035) 1.300(0.051) Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited 18 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com IMPORTANT NOTICE IMPORTANT NOTICE BCD Semiconductor BCD Semiconductor Manufacturing Manufacturing Limited Limited reserves reserves the the right right to to make make changes changes without without further further notice notice to to any any products products or or specifispecifications herein. cations herein. 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