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DMN2027LK3
20V N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
V(BR)DSS
20V
Features and Benefits
ID
RDS(on)
TA = 25°C
21mΩ @ VGS= 10V
17.0A
27mΩ @ VGS= 4.5V
15.0A
40mΩ @ VGS= 2.5V
12.3A
•
Low on-resistance
•
Fast switching speed
•
Low gate drive
•
“Green” component and RoHS compliant (Note 1)
Mechanical Data
Description and Applications
This new generation MOSFET has been designed to minimize the onstate resistance (RDS(on)) and yet maintain superior switching
performance, making it ideal for high efficiency power management
applications.
•
Case: TO252-3L
•
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0 (Note 1)
•
Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminals Connections: See Diagram
•
Terminals: Matte Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
•
Backlighting
•
Marking Information: See Below
•
DC-DC Converters
•
Ordering Information: See Below
•
Power management functions
•
Weight: 0.33 grams (approximate)
D
D
G
D
G
TOP VIEW
Ordering Information
Note:
S
S
Equivalent Circuit
PIN OUT -TOP VIEW
(Note 1)
Product
Marking
Reel size (inches)
Tape width (mm)
Quantity per reel
DMN2027LK3-13
N2027L
13
16
2,500
1. Diodes, Inc. defines “Green” products as those which are Eu RoHS compliant and contain no halogens or antimony compounds; further information
about Diodes Inc.’s “Green” Policy can be found on our website. For packaging details, go to our website.
Marking Information
YYWW
N2027L
DMN2027LK3
Document Revision: 1
= Manufacturer’s Marking
N2027L = Product Type Marking Code
YYWW = Date Code Marking
YY = Year (ex: 09 = 2009)
WW = Week (01-52)
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DMN2027LK3
Maximum Ratings
@TA = 25°C unless otherwise specified
Characteristic
Symbol
VDSS
VGS
Drain-Source voltage
Gate-Source voltage
Continuous Drain current
VGS = 10V
Pulsed Drain current
VGS = 10V
Continuous Source current (Body diode)
Pulsed Source current (Body diode)
(Note 3)
TA = 70°C (Note 3)
(Note 2)
(Note 4)
(Note 3)
(Note 4)
ID
IDM
IS
ISM
Value
20
±12
17.0
13.6
11.6
46.8
11.9
46.8
Unit
V
V
Value
4.18
33.44
8.9
71.4
2.14
17.1
29.9
14.0
58.4
2.46
-55 to 150
Unit
A
A
A
A
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Symbol
(Note 2)
Power dissipation
Linear derating factor
(Note 3)
PD
(Note 5)
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead
Operating and storage temperature range
Notes:
(Note 2)
(Note 3)
(Note 5)
(Note 6)
RθJA
RθJL
TJ, TSTG
W
mW/°C
°C/W
°C
2. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
3. Same as note 2, except the device is measured at t ≤ 10 sec.
4. Same as note 2, except the device is pulsed with D = 0.02 and pulse width 300 µs. The pulse current is limited by the maximum junction temperature.
5. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
6. Thermal resistance from junction to solder-point (at the end of the drain lead).
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Thermal Characteristics
100
RDS(on)
Limit
ID Drain Current (A)
ID Drain Current (A)
100
10
DC
1
1s
100ms
10ms
Tamb=25°C
25mm x 25mm
100m
1oz FR4
100µs
1
10
DC 1s
1
10
35
40
D=0.5
20
D=0.1
D=0.2
D=0.05
10
Single Pulse
0
100µ 1m
10m 100m
1
10
100
1k
Pulse Width (s)
Thermal Resistance (°C/W)
Thermal Resistance (°C/W)
Tamb=25°C
25mm x 25mm
1oz FR4
Single Pulse
Tamb=25°C
100
50mm x 50mm
2oz FR4
10
25mm x 25mm
1oz FR4
1
100µ 1m
10m 100m
1
10
100
Pulse Width (s)
Tamb=25°C
50mm x 50mm
2oz FR4
30
25
20
D=0.5
15
D=0.1
10 D=0.2
5
0
100µ 1m
D=0.05
Single Pulse
10m 100m
1
10
100
1k
Pulse Width (s)
Transient Thermal Impedance
1k
Max Power Dissipation (W)
Max Power Dissipation (W)
Transient Thermal Impedance
4
50mm x 50mm
2oz FR4
3
25mm x 25mm
1oz FR4
2
1
0
0
Pulse Power Dissipation
Document Revision: 1
10
Safe Operating Area
60
DMN2027LK3
1
VDS Drain-Source Voltage (V)
Safe Operating Area
30
10ms
1ms
100µs
100m
VDS Drain-Source Voltage (V)
50
100ms
Tamb=25°C
50mm x 50mm
100m
2oz FR4
1ms
100m
RDS(on)
Limit
20
40
60
80 100 120 140 160
Temperature (°C)
Derating Curve
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DMN2027LK3
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS
Symbol
Min
Typ
Max
Unit
Test Condition
Drain-Source Breakdown Voltage
BVDSS
20
V
Zero Gate Voltage Drain Current
IDSS
0.5
µA
VDS= 20V, VGS= 0V
Gate-Source Leakage
IGSS
±100
nA
VGS= ±12V, VDS= 0V
VGS(th)
0.6
2.0
V
ID= 250µA, VDS= VGS
•
VGS= 4.5V, ID= 10A
ID = 250µA, VGS= 0V
ON CHARACTERISTICS
Gate Threshold Voltage
0.021
Static Drain-Source On-Resistance (Note 7)
RDS (ON)
0.027
VGS= 10V, ID= 20A
0.040
VGS= 2.5V, ID= 4A
Forward Transconductance (Notes 7 & 8)
gfs
31.7
S
VDS= 15V, ID= 10A
Diode Forward Voltage (Note 7)
VSD
0.89
1.0
V
IS= 10A, VGS= 0V
Reverse recovery time (Note 8)
trr
121
ns
Reverse recovery charge (Note 8)
Qrr
583
nC
IS= 10A, di/dt= 100A/µs
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Ciss
857
pF
Output Capacitance
Coss
177
pF
Reverse Transfer Capacitance
Crss
102
pF
Total Gate Charge
Qg
5.2
nC
Total Gate Charge
Qg
9.1
nC
Gate-Source Charge
Qgs
1.9
nC
Gate-Drain Charge
Qgd
3.2
nC
Turn-On Delay Time (Note 9)
tD(on)
5.4
ns
Turn-On Rise Time (Note 9)
tr
22.3
ns
tD(off)
18.7
ns
tf
12.6
ns
Turn-Off Delay Time (Note 9)
Turn-Off Fall Time (Note 9)
Notes:
VDS= 10V, VGS= 0V
f= 1MHz
VGS= 2.5V, ID= 4A
VGS= 4.5V
ID= 10A
VDS= 10V
VDD= 10V, VGS= 10V
ID= 10A, RG ≅ 6.0Ω
7. Measured under pulsed conditions. Pulse width ≤ 300µs; duty cycle ≤ 2%
8. For design aid only, not subject to production testing.
9. Switching characteristics are independent of operating junction temperatures.
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DMN2027LK3
Typical Characteristics
ID Drain Current (A)
3V
T = 150°C
2.5V
10
2V
1
1.5V
0.1
VGS
0.01
0.1
1
0.1
Normalised RDS(on) and VGS(th)
T = 150°C
0.1
T = 25°C
0.01
1
2
Typical Transfer Characteristics
RDS(on) Drain-Source On-Resistance (Ω)
0.1
1
10
Output Characteristics
10
VGS
1.5V
2V
1
T = 25°C
2.5V
0.1
3V
4.5V
10V
1
10
ID Drain Current (A)
On-Resistance v Drain Current
VGS = 10V
ID = 20A
1.4
RDS(on)
1.2
1.0
0.8
0.4
-50
VGS(th)
VGS = VDS
ID = 250uA
0.6
0
50
100
Tj Junction Temperature (°C)
150
Normalised Curves v Temperature
ISD Reverse Drain Current (A)
ID Drain Current (A)
1
VGS Gate-Source Voltage (V)
Document Revision: 1
VGS
1.6
VDS = 10V
1E-3
DMN2027LK3
1V
VDS Drain-Source Voltage (V)
Output Characteristics
0.01
0.1
2V
1.5V
VDS Drain-Source Voltage (V)
10
2.5V
1
0.01
10
10V
10
ID Drain Current (A)
10V
T = 25°C
10
1
T = 150°C
0.1
T = 25°C
0.01
Vgs = 0V
1E-3
0.2
0.4
0.6
0.8
VSD Source-Drain Voltage (V)
Source-Drain Diode Forward Voltage
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Typical Characteristics - continued
VGS = 0V
f = 1MHz
C Capacitance (pF)
1000
800
CISS
COSS
600
CRSS
400
200
0
0.1
1
10
VDS - Drain - Source Voltage (V)
Capacitance v Drain-Source Voltage
VGS Gate-Source Voltage (V)
1200
4
3
2
VDS = 10V
ID = 10A
1
0
0
2
4
6
8
10
Q - Charge (nC)
Gate-Source Voltage v Gate Charge
Test Circuits
Current
regulator
QG
50k
12V
VG
Q GS
Same as
D.U.T
Q GD
V DS
IG
D.U.T
ID
V GS
Charge
Basic gate charge waveform
Gate charge test circuit
V DS
90%
RD
V GS
V DS
RG
VDD
10%
V GS
td(on)
tr
t(on)
td(off)
tr
t(on)
Switching time waveforms
DMN2027LK3
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Switching time test circuit
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DMN2027LK3
Package Outline Dimensions
DIM
Inches
Millimeters
DIM
Inches
Min
Millimeters
Min
Max
Min
Max
Max
Min
A
0.086
0.094
2.18
2.39
e
A1
-
0.005
-
0.127
H
0.370
0.410
9.40
10.41
b
0.020
0.035
0.508
0.89
L
0.055
0.070
1.40
1.78
b2
0.030
0.045
0.762
1.14
L1
0.108 REF
2.74 REF
b3
0.205
0.215
5.21
5.46
L2
0.020 BSC
0.508 BSC
0.090 BSC
Max
2.29 BSC
c
0.018
0.024
0.457
0.61
L3
0.035
0.065
0.89
1.65
c2
0.018
0.023
0.457
0.584
L4
0.025
0.040
0.635
1.016
D
0.213
0.245
5.41
6.22
L5
0.045
0.060
1.14
1.52
D1
0.205
-
5.21
-
• 1°
0°
10°
0°
10°
E
0.250
0.265
6.35
6.73
•°
0°
15°
0°
15°
E1
0.170
-
4.32
-
-
-
-
-
-
DMN2027LK3
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DMN2027LK3
Suggested Pad Layout
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A.
B.
Life support devices or systems are devices or systems which:
1.
are intended to implant into the body, or
2.
support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
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