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PI6CDBL401BZHIE

PI6CDBL401BZHIE

  • 厂商:

    BCDSEMI(美台)

  • 封装:

    VFQFN-32

  • 描述:

    IC CLOCK 100MHZ 1CIR 32TQFN

  • 数据手册
  • 价格&库存
PI6CDBL401BZHIE 数据手册
A product Line of Diodes Incorporated PI6CDBL401B 4-Output Low Power PCIE GEN1-2-3 Buffer Features Description ÎÎ4x 100MHz low power HCSL or LVDS compatible outputs The PI6CDBL401B is a 4-output low power buffer for 100MHz PCIe Gen1, Gen2 and Gen3 applications with integrated output terminations providing Zo=100Ω. The device has 4 output enables for clock management, and 3 selectable SMBus addresses. ÎÎPCIe 3.0, 2.0 and 1.0 compliant ÎÎProgrammable output amplitude and slew rate ÎÎCore supply voltage of 3.3V +/-10% ÎÎOutput supply voltage of 1.8V, 2.5V and 3.3V Applications ÎÎIndustrial ambient operation temperature ÎÎPCIe 3.0/2.0/1.0 clock distribution ÎÎAvailable in lead-free package: 32-TQFN Block Diagram OE(3:0)# 4 CLK(3:0) CLK_IN ZDB PLL CLK_IN# SADR_tri HIBW_BYPM_LOBW# CONTROL LOGIC CKPWRGD_PD# SDATA_3.3 SCLK_3.3 PI6CDBL401B Document Number DS40392 Rev 4-2 1 www.diodes.com October 2017 © Diodes Incorporated A product Line of Diodes Incorporated PI6CDBL401B VDDO1.8 GND CLK3 CLK3# OE3# GND CKPWRGD_PD# SADR_tri Pin Configuration 32 31 30 29 28 27 26 25 HIBW_BYPM_LOBW# 1 24 OE2# FB_DNC 2 23 CLK2# FB_DNC# 3 22 CLK2 VDDR3.3 4 CLK_IN 5 CLK_IN# 6 19 CLK1# GNDR 7 18 CLK1 GNDDIG 8 21 VDDA3.3 PI6CDBL401B 20 GNDA 17 OE1# VDDO1.8 GND CLK0# CLK0 OE0# SDATA_3.3 SCLK_3.3 VDDDIG3.3 9 10 11 12 13 14 15 16 SMBus Address Selection Table State of SADR on first application of CKPWRGD_PD# SADR Address + Read / Write bit 0 1101011 1/0 M 1101100 1/0 1 1101101 1/0 Power Management Table CLKx CKPWRGD_PD# CLK_IN SMBus OEx bit OEx# Pin True O/P Comp. O/P PLL 0 x x x Low Low Off 1 Running 0 x Low Low On1 1 Running 1 0 Running Running On1 1 Running x 1 Low Low On1 1. If bypass mode is selected, the PLL will be off, and outputs will be running Power Connections PLL Operating Mode Pin Number VDD GND Description 4 7 Input receiver analog 9 8 Digital Power 16, 25 15, 26, 30 DIF outputs 21 20 PLL Analog PI6CDBL401B Document Number DS40392 Rev 4-2 HiBW_BypM_LoBW# MODE Byte1 [7:6] Byte1 [4:3] Readback Control 0 PLL Lo BW 00, 10 00, 10 M Bypass 01 01 1 PLL Hi BW 11 11 2 www.diodes.com October 2017 © Diodes Incorporated A product Line of Diodes Incorporated PI6CDBL401B Pin Descriptions Pin# Pin Name Type Description 1 HIBW_BYPM_ LOBW# Input Trilevel input to select High BW, Bypass or Low BW mode. See PLL Operating Mode Table for Details. 2 FB_DNC Output True clock of differential feedback. The feedback output and feedback input are connected internally on this pin. Do not connect anything to this pin. 3 FB_DNC# Output Complement clock of differential feedback. The feedback output and feedback input are connected internally on this pin. Do not connect anything to this pin. 4 VDDR3.3 Power 3.3V power for differential input clock (receiver). This VDD should be treated as an Analog power rail and filtered appropriately. 5 CLK_IN Input True Input for differential reference clock. 6 CLK_IN# Input Complementary Input for differential reference clock. 7 GNDR Power Analog Ground pin for the differential input (receiver) 8 GNDDIG Power Ground pin for digital circuitry 9 VDDDIG3.3 Power 3.3V digital power (dirty power) 10 SCLK_3.3 Input Clock pin of SMBus circuitry, 3.3V tolerant. 11 SDATA_3.3 Input/Output Data pin for SMBus circuitry, 3.3V tolerant. 12 OE0# Input Active low input for enabling DIF pair 0. This pin has an internal pull-down. 1 =disable outputs, 0 = enable outputs 13 CLK0 Output Differential true clock output 14 CLK0# Output Differential Complementary clock output 15 GND Power Ground pin. 16 VDDO1.8 Power Power supply for outputs, range from 1.8V~3.3V. 17 OE1# Input Active low input for enabling DIF pair 1. This pin has an internal pull-down. 1 =disable outputs, 0 = enable outputs 18 CLK1 Output Differential true clock output 19 CLK1# Output Differential Complementary clock output 20 GNDA Power Ground pin for the PLL core. 21 VDDA3.3 Power 3.3Vpower for the PLL core. 22 CLK2 Output Differential true clock output 23 CLK2# Output Differential Complementary clock output 24 OE2# Input Active low input for enabling DIF pair 2. This pin has an internal pull-down. 1 =disable outputs, 0 = enable outputs 25 VDDO1.8 Power Power supply for outputs, range from 1.8V~3.3V. 26 GND Power Ground pin. 27 CLK3 Output Differential true clock output 28 CLK3# Output Differential Complementary clock output 29 OE3# Input Active low input for enabling DIF pair 3. This pin has an internal pull-down. 1 =disable outputs, 0 = enable outputs 30 GND Power Ground pin. PI6CDBL401B Document Number DS40392 Rev 4-2 3 www.diodes.com October 2017 © Diodes Incorporated A product Line of Diodes Incorporated PI6CDBL401B Pin Descriptions Cont... Pin# Pin Name Type Description 31 CKPWRGD_PD# Input Input notifies device to sample latched inputs and start up on first high assertion. Low enters Power Down Mode, subsequent high assertions exit Power Down Mode. This pin has internal pull-up resistor. 32 SADR_tri Input Tri-level latch to select SMBus Address. See SMBus Address Selection Table. PI6CDBL401B Document Number DS40392 Rev 4-2 4 www.diodes.com October 2017 © Diodes Incorporated A product Line of Diodes Incorporated PI6CDBL401B Maximum Ratings (Above which useful life may be impaired. For user guidelines, not tested.) Supply Voltage to Ground Potential.......................................................4.6V All Inputs and Output......................................................-0.5V toVDD+0.5V Ambient Operating Temperature............................................ -40 to +85°C Storage Temperature........................................................... –65°C to +150°C Junction Temperature........................................................................... 125°C Note: Stresses greater than those listed under MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Soldering Temperature.......................................................................... 260°C ESD Protection (Input)............................................................2000V(HBM) Electrical Characteristics–Clock Input Parameters (TA = -40~85oC; VDD = 3.3V+/-10%; VDDO = 3.3V+/-10%; VDDO = 2.5V+/-10%; VDDO = 1.8V+/-10%, See Test Loads for Loading Conditions) Symbol Parameters Condition Min. Type Max. Units VIHDIF Input High Voltage - CLK_IN1 600 800 1150 mV VILDIF Input Low Voltage - CLK_IN1,3 (single-ended measurement) VSS 300 0 300 mV VCOM Input Common Mode Voltage CLK_IN1 Common Mode Input Voltage 300 725 mV VSWING Input Amplitude - CLK_IN1 Peak to Peak value (VIHDIF - VILDIF) 300 1450 mV dv/dt Input Slew Rate - CLK_IN Measured differentially 0.4 IIN Input Leakage Current VIN = VDD , VIN = GND -5 5 uA dtin Input Duty Cycle Measurement from differential wavefrom 45 55 % JDIFIn Input Jitter - Cycle to Cycle Differential Measurement 0 150 ps 1,2 1 1 1 Differential inputs (single-ended measurement) Differential inputs V/ns Note: 1. Guaranteed by design and characterization, not 100% tested in production. 2. Slew rate measured through +/-75mV window centered around differential zero 3. The device can be driven from a single ended clock by driving the true clock and biasing the complement clock input to the VBIAS, where VBIAS is (VIHHIGH - VIHLOW)/2 Electrical Characteristics–Input/Supply/Common Parameters–Normal Operating Conditions (TA = -40~85oC; VDD = 3.3V+/-10%; VDDO = 3.3V+/-10%; VDDO = 2.5V+/-10%; VDDO = 1.8V+/-10%, See Test Loads for Loading Conditions) Symbol Parameters Condition Min. Type Max. Units VDDX Supply Voltage1 Supply voltage for core, analog 3.0 3.3 3.6 V 2.97 3.3 3.63 VDDO Supply Voltage 2.25 2.5 2.75 1.62 1.8 1.98 -40 25 85 TA PI6CDBL401B Supply voltage outputs 1 Ambient Operating Temperature1 Document Number DS40392 Rev 4-2 5 www.diodes.com V °C October 2017 © Diodes Incorporated A product Line of Diodes Incorporated PI6CDBL401B Electrical Characteristics–Input/Supply/Common Parameters–Normal Operating Conditions Cont... Symbol Parameters Condition Min. VIH Input High Voltage1 Single-ended inputs, except SMBus, SADR_tri VIM Input Mid Voltage1 VIL 1 1 Max. Units 0.65 VDD VDD +0.3 V SADR_tri 0.4 VDD 0.6 VDD V Input Low Voltage Single-ended inputs, except SMBus, SADR_tri -0.3 0.35 VDD V VH Hysteresis Voltage VT+ - VT- 0.05 VDD 0.2 VDD V VOH Output High Voltage1 Single-ended outputs, except SMBus. IOH = -2mA VDD -0.45 VOL Outputt Low Voltage1 Single-ended outputs, except SMBus. IOL = -2mA IIN Single-ended inputs, VIN = GND, VIN = VDD Type V 0.45 V -5 5 uA -200 200 uA Single-ended inputs IINP Input Current 1 VIN = 0 V; Inputs with internal pull-up resistors VIN = VDD; Inputs with internal pull-down resistors fin Input Frequency1 Lpin Pin Inductance CIN Cout Bypass mode 1 100MHz PLL mode 95 100 Control Inputs 105 MHz nH 5 pF 6 pF 0.6 1 ms 31.500 33 kHz 3 clocks 300 us 1.5 Output pin capacitance From VDD Power-Up and after input clock MHz 7 1 Capacitance1 400 tSTAB Clock output Stabilization1, 2 f MODIN Input SS Modulation Frequency1 tLATOE# OE# Latency1, 3 tDRVPD Tdrive_PD#1, 3 tF Fall time1, 2 Control inputs 5 ns tR Rise time1, 2 Control inputs 5 ns VILSMB SMBus Input Low Voltage1 0.8 V VIHSMB SMBus Input High Voltage1 3.6 V PI6CDBL401B Document Number DS40392 Rev 4-2 stabilization or de-assertion of CKPWRGD_ PD# to 1st clock Allowable Frequency (Triangular Modulation) CLK start after OE# assertion CLK stop after OE# deassertion 30 1 CLK output enable after CKPWRGD_PD# de-assertion 2.1 6 www.diodes.com October 2017 © Diodes Incorporated A product Line of Diodes Incorporated PI6CDBL401B Electrical Characteristics–Input/Supply/Common Parameters–Normal Operating Conditions Cont... Symbol Parameters Condition VOLSMB SMBus Output Low Voltage1 @ IPULLUP IPULLUP SMBus Sink Current @ VOL 4 VDDSMB Nominal Bus Voltage 3.3V bus voltage 2.7 tRSMB SCLK/SDATA Rise Time tFSMB SCLK/SDATA Fall Time f MAXSMB SMBus Operating Frequency 1 1 1 1 1, 5 Min. Type Max. Units 0.4 V mA 3.6 V (Max VIL - 0.15) to (Min VIH + 0.15) 1000 ns (Min VIH + 0.15) to (Max VIL - 0.15) 300 ns Maximum SMBus operating frequency 400 kHz Note: 1. Guaranteed by design and characterization, not 100% tested in production. 2. Control input must be monotonic from 20% to 80% of input swing. Input Frequency Capacitance 3. Time from deassertion until outputs are >200 mV 4. The differential input clock must be running for the SMBus to be active Electrical Characteristics–CLK 0.7V Low Power HCSL Outputs (TA = -40~85oC; VDD = 3.3V+/-10%; VDDO = 3.3V+/-10%; VDDO = 2.5V+/-10%; VDDO = 1.8V+/-10%, See Test Loads for Loading Conditions) Symbol Trf Parameters Slew rate 1,2,3 Condition Min. Type Max. Units Scope averaging on 2.0V/ns setting @100MHz output 1 2 3 V/ns Scope averaging on 3.0V/ns setting @100MHz output 2 3 4.5 V/ns 7 20 % 660 880 mV -150 150 mV 1150 mV ΔTrf Slew rate matching1,2,4 Slew rate matching, Scope averaging on VHIGH Voltage High1,7 VLOW Voltage Low1,7 Statistical measurement on single-ended signal using oscilloscope math function. (Scope averaging on) Vmax Max Voltage1 Measurement on single ended signal using Vmin Min Voltage absolute value. (Scope averaging off) -300 mV Vswing Vswing Scope averaging off 300 mV Vcross_abs Crossing Voltage (abs) Scope averaging off 250 Δ-Vcross Crossing Voltage (var) Scope averaging off 1 1,2,7 1,5,7 1,6 550 mV 140 mV Note: 1. Guaranteed by design and characterization, not 100% tested in production. 2. Measured from differential waveform 3. Slew rate is measured through the Vswing voltage range centered around differential 0V. This results in a +/-150mV window around differential 0V. 4. Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is measured using a +/-75mV window centered on the average cross point where Clock rising meets Clock# falling. The median cross point is used to calculate the voltage thresholds the oscilloscope is to use for the edge rate calculations. 5. Vcross is defined as voltage where Clock = Clock# measured on a component test board and only applies to the differential rising edge (i.e. Clock rising and Clock# falling). 6. The total variation of all Vcross measurements in any particular system. Note that this is a subset of Vcross_min/max (Vcross absolute) allowed. The intent is to limit Vcross induced modulation by setting Δ-Vcross to be smaller than Vcross absolute. 7. At default SMBus settings. PI6CDBL401B Document Number DS40392 Rev 4-2 7 www.diodes.com October 2017 © Diodes Incorporated A product Line of Diodes Incorporated PI6CDBL401B Electrical Characteristics–Current Consumption (TA = -40~85oC; See Test Loads for Loading Conditions) Symbol IDDAOP Parameters Condition Operating Supply Current1 IDDOP IDDAPD IDDPD Powerdown Current1,2 Min. Type Max. Units VDDA+VDDR, PLL Mode, @100MHz, typical value under VDDO = 1.8V 37 45 mA VDD1.8, All outputs active @100MHz, typical value under VDDO = 1.8V 52 60 mA VDDA+VDDR, PLL Mode, @100MHz 1 mA VDD1.8, Outputs Low 1.8 mA Note: 1. Guaranteed by design and characterization, not 100% tested in production. 2. Input clock stopped. Electrical Characteristics–Output Duty Cycle, Jitter, Skew and PLL Characterisitics (TA = -40~85oC; VDD = 3.3V+/-10%; VDDO = 3.3V+/-10%; VDDO = 2.5V+/-10%; VDDO = 1.8V+/-10%, See Test Loads for Loading Conditions) Symbol Parameters tDC Duty Cycle1 tDCD Duty Cycle Distortion tpdBYP tpdPLL 1,3 Skew, Input to Output1,4 tskew Skew, Output to Output tjcyc-cyc Jitter, Cycle to cycle 1,2 Condition Min. Measured differentially, PLL Mode 45 Measured differentially, Bypass Mode@100MHz -1 Bypass Mode, VT = 50% PLL Mode VT = 50% VT = 50% Type Max. Units 55 % 1 % 2500 4500 ps -250 250 ps 50 ps 50 ps 25 ps 0 25 PLL mode @100MHz output 1,2 Additive Jitter in Bypass Mode @100MHz output 0.1 Note: 1. Guaranteed by design and characterization, not 100% tested in production. 2. Measured from differential waveform 3. Duty cycle distortion is the difference in duty cycle between the output and the input clock when the device is operated in bypass mode. 4. All outputs at default slew rate 5. The MIN/TYP/MAX values of each BW setting track each other, i.e., Low BW MAX will never occur with Hi BW MIN. PI6CDBL401B Document Number DS40392 Rev 4-2 8 www.diodes.com October 2017 © Diodes Incorporated A product Line of Diodes Incorporated PI6CDBL401B Electrical Characteristics–Phase Jitter Parameters (TA = -40~85oC; VDD = 3.3V+/-10%; VDDO = 3.3V+/-10%; VDDO = 2.5V+/-10%; VDDO = 1.8V+/-10%, See Test Loads for Loading Conditions) Type INDUSTRY LIMIT Units PCIe Gen 11,2,3 34 86 PCIe Gen 2 Low Band 10kHz < f < 1.5MHz1,2 0.9 3 PCIe Gen 2 High Band 1.5MHz < f < Nyquist (50MHz)1,2 2.2 3.1 tjphPCIeG3 PCIe Gen 3 (PLL BW of 2-4MHz, CDR = 10MHz)1,2,4 0.5 1 tjphSGMII 125MHz, 1.5MHz to 20MHz, -20dB/decade rollover < 1.5MHz, -40db/decade rolloff > 10MHz1,6 1.9 NA tjphPCIeG1 PCIe Gen 11,2,3 0.6 N/A PCIe Gen 2 Low Band 10kHz < f < 1.5MHz1,2,5 0.1 N/A PCIe Gen 2 High Band 1.5MHz < f < Nyquist (50MHz)1,2,5 0.05 N/A tjphPCIeG3 PCIe Gen 3 (PLL BW of 2-4MHz, CDR = 10MHz)1,2,4,5 0.05 N/A tjphSGMII 125MHz, 1.5MHz to 10MHz, -20dB/decade rollover < 1.5MHz, -40db/decade rolloff > 10MHz1,6 0.15 N/A Symbol Parameters Condition tjphPCIeG1 tjphPCIeG2 tjphPCIeG2 Phase Jitter, PLL Mode Additive Phase Jitter, Bypass Mode Min. ps (p-p) ps (rms) ps (rms) ps (rms) ps (rms) ps (p-p) ps (rms) ps (rms) ps (rms) ps (rms) Note: 1. Applies to all outputs, with device driven by a clean clock source. 2. See http://www.pcisig.com for complete specs 3. Sample size of at least 100K cycles. This figures extrapolates to 108ps pk-pk @ 1M cycles for a BER of 1-12. 4. Subject to final ratification by PCI SIG. 5. For RMS figures, additive jitter is calculated by solving the following equation: Additive jitter = SQRT[(total jitter)^2 - (input jitter)^2] 6. Applies to all differential outputs PI6CDBL401B Document Number DS40392 Rev 4-2 9 www.diodes.com October 2017 © Diodes Incorporated A product Line of Diodes Incorporated PI6CDBL401B Test Loads Low-Power HCSL Differential Output Test Load 5 inches Rs Zo=100Ω Rs 2pF 2pF Device Driving LVDS RO 3.3V Driving LVDS R7a R7b R8a R8b Cc Rs Zo Cc Rs Device LVDS Clock input R Driving LVDS inputs with the PI6CDBL401B Value Component Receiver has termination Receiver does not have termination R7a, R7b 10K Ω 140 Ω R8a, R8b 5.6K Ω 75 Ω Cc 0.1 uF 0.1 uF 1.2 volts 1.2 volts Vcm PI6CDBL401B Document Number DS40392 Rev 4-2 10 www.diodes.com October 2017 © Diodes Incorporated A product Line of Diodes Incorporated PI6CDBL401B Serial Data Interface (SMBus) This part is a slave only device that supports blocks read and block write protocol using a single 7-bit address and read/write bit as shown below. Read and write block transfers can be stopped after any complete byte transfer by issuing STOP. Address Assignment Refer to SMBus Address Selection Table. Data Protocol (Write) 1 bit 8 bits 1 8 bits 1 8 bits 1 8 bits 1 Start bit Slave Addr: D4 Ack Register offset Ack Byte Count=N Ack Data Byte 0 Ack … 8 bits 1 1 bit Data Byte N-1 Ack Stop bit (Read) 1 bit Start bit 8 bits 1 8 bits 1 1 8 bits 1 8 bits 1 Slave Register Repeat Slave Byte Ack Ack Ack Ack Addr: D4 offset start Addr: D5 Count=N 8 bits 1 8 bits 1 Data Data Byte NOT Ack … Byte 0 N-1 Ack 1 bit Stop bit Note: 1. Register offset for indicating the starting register for indexed block write and indexed block read. Byte Count in write mode cannot be 0. PI6CDBL401B Document Number DS40392 Rev 4-2 11 www.diodes.com October 2017 © Diodes Incorporated A product Line of Diodes Incorporated PI6CDBL401B SMBus Table: Output Enable Register 1 Byte 0 Name Control Function Type 7 Reserved 6 OE3 Output Enable RW Low Enabled 1 5 OE2 Output Enable RW Low Enabled 1 4 Reserved 3 OE1 2 Reserved 1 OE0 0 Reserved 0 1 Default 1 1 Output Enable RW Low Enabled 1 1 Output Enable RW Low Enabled 1 1 1. A low on these bits will overide the OE# pin and force the differential output Low. SMBus Table: PLL Operating Mode and Output Amplitude Control Register Byte 1 Name Control Function Type 7 PLLMODERB1 PLL Mode Readback Bit 1 R 6 PLLMODERB0 PLL Mode Readback Bit 0 5 PLLMODE_ SWCNTRL Enable SW control of PLL Mode 4 PLLMODE1 PLL Mode Control Bit 1 RW1 3 PLLMODE0 PLL Mode Control Bit 0 RW1 2 Reserved 1 AMPLITUDE 1 0 AMPLITUDE 0 0 1 Default Latch See PLL Operating Mode Table R RW Latch Values in B1[7:6] set PLL Mode Values in B1[4:3] set PLL Mode See PLL Operating Mode Table 0 0 0 1 RW 00 = 0.6V 01 = 0.7V 1 RW 10= 0.8V 11 = 0.9V 0 0 1 Default Controls Output Amplitude 1. B1[5] must be set to a 1 for these bits to have any effect on the part. SMBus Table: DIF Slew Rate Control Register Byte 2 Name 7 Reserved 6 SLEWRATESEL DIF3 Slew Rate Selection RW 2 V/ns 3 V/ns 1 5 SLEWRATESEL DIF2 Slew Rate Selection RW 2 V/ns 3 V/ns 1 4 Reserved 3 SLEWRATESEL DIF1 2 Reserved PI6CDBL401B Document Number DS40392 Rev 4-2 Control Function Type 1 1 Slew Rate Selection RW 2 V/ns 3 V/ns 1 1 12 www.diodes.com October 2017 © Diodes Incorporated A product Line of Diodes Incorporated PI6CDBL401B SMBus Table: DIF Slew Rate Control Register Cont... Byte 2 Name Control Function Type 0 1 Default 1 SLEWRATESEL DIF0 Slew Rate Selection RW 2 V/ns 3 V/ns 1 0 Reserved 1 SMBus Table: Frequency Select Control Register Byte 3 Name Control Function Type 7 Reserved 1 6 Reserved 1 5 Reserved 0 4 Reserved 0 3 Reserved 0 2 Reserved 1 1 Reserved 1 0 Reserved 1 0 1 Default Byte 4 is Reserved and reads back 'hFF SMBus Table: Revision and Vendor ID Register Byte 5 Name 7 RID3 6 RID2 5 RID1 4 RID0 R 0 3 VID3 R 0 2 VID2 R 0 1 VID1 R 0 0 VID0 R 0 PI6CDBL401B Document Number DS40392 Rev 4-2 Control Function Type 0 1 R Revision ID VENDOR ID R R 13 Default 0 0 A rev = 0000 0 www.diodes.com October 2017 © Diodes Incorporated A product Line of Diodes Incorporated PI6CDBL401B SMBus Table: Device Type/Device ID Byte 6 Name Control Function 7 Device Type1 6 Device Type0 5 Device ID5 R 0 4 Device ID4 R 0 3 Device ID3 2 Device ID2 1 Device ID1 R 0 0 Device ID0 R 0 Device Type Device ID Type 0 R 00 = FGV, 01 = DBV, 0 R 10 = DMV, 11= Reserved 1 R R 1 000100 binary or 04 hex Default 0 1 SMBus Table: Byte Count Register Byte 7 Name 7 Reserved 0 6 Reserved 0 5 Reserved 0 4 Reserved 0 3 Reserved 0 2 Reserved 0 1 Reserved 0 0 Reserved 0 PI6CDBL401B Document Number DS40392 Rev 4-2 Control Function Type 14 0 1 www.diodes.com Default October 2017 © Diodes Incorporated A product Line of Diodes Incorporated PI6CDBL401B Thermal Characteristics Symbol Parameter Condition θJA Thermal Resistance Junction to Ambient Still air θJA Thermal Resistance Junction to Case PI6CDBL401B Document Number DS40392 Rev 4-2 15 Min. Type Max. Units 44.7 °C/W 21.7 °C/W www.diodes.com October 2017 © Diodes Incorporated A product Line of Diodes Incorporated PI6CDBL401B Packaging Mechanical : TQFN (ZH32) Notes: 1. All dimensions are in mm. Angles in degrees. 2. Coplanarity applies to the exposed pad as well as the terminals. 3. Refer JEDEC MO-220 4. Recommended land pattern is for reference only. 5. Thermal pad soldering area (mesh stencile design is recommended) DATE: 06/30/11 DESCRIPTION: 32-contact, Thin Quad Flat No-Lead (TQFN) PACKAGE CODE: ZH32 DOCUMENT CONTROL #: PD-2070 REVISION: B 11-0147 Note: For latest package info, please check: https://www.diodes.com/design/support/packaging/pericom-packaging/ Ordering Information(1-3) Ordering Code Package Code PI6CDBL401BZHIEX ZH Package Description 32-contact, Thin Quad Flat No-Lead (TQFN), Tape & Reel Notes: 1. Thermal characteristics can be found on the company web site at https://www.diodes.com/design/support/packaging/pericom-packaging/ 2. E = Pb-free and Green 3. Adding an X suffix = Tape/Reel PI6CDBL401B Document Number DS40392 Rev 4-2 16 www.diodes.com October 2017 © Diodes Incorporated A product Line of Diodes Incorporated PI6CDBL401B IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2016, Diodes Incorporated www.diodes.com PI6CDBL401B Document Number DS40392 Rev 4-2 17 www.diodes.com October 2017 © Diodes Incorporated
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