OBSOLETE - PLEASE USE ZXTPS717MC
ZX3CD1S1M832
MPPS™ Miniature Package Power Solutions
12V PNP LOW SATURATION TRANSISTOR AND 40V, 1A SCHOTTKY
DIODE COMBINATION DUAL
SUMMARY
PNP Transistor
Schottky Diode
VCEO =-12V; RSAT = 65m ; C = -4A
VR = 40V; VF = 500mV (@1A); IC=1A
DESCRIPTION
Packaged in the new innovative 3mm x 2mm MLP this combination dual
comprises an ultra low saturation PNP transistor and a 1A Schottky barrier
diode. This excellent combination provides users with highly efficient
performance in applications including DC-DC and charging circuits.
Users will also gain several other key benefits:
Performance capability equivalent to much larger packages
3mm x 2mm Dual Die MLP
Improved circuit efficiency & power levels
PCB area and device placement savings
Lower package height (0.9mm nom)
Cathode
C
Reduced component count
FEATURES
B
• Extremely Low Saturation Voltage (-140mV @1A)
• HFE characterised up to -10A
• IC = -4A Continuous Collector Current
E
Anode
• Extremely Low VF, fast switching Schottky
• 3mm x 2mm MLP
APPLICATIONS
• DC - DC Converters
PINOUT
• Mobile Phones
• Charging Circuits
• Motor control
ORDERING INFORMATION
DEVICE
REEL
TAPE
WIDTH
QUANTITY
PER REEL
ZX3CD1S1M832TA
7 ⴕⴕ
8mm
3000
ZX3CD1S1M832TC
13ⴕ ⴕ
8mm
10000
3mm x 2mm Dual MLP
underside view
DEVICE MARKING
1S1
ISSUE 2 - OCTOBER 2007
1
OBSOLETE - PLEASE USE ZXTPS717MC
ZX3CD1S1M832
ABSOLUTE MAXIMUM RATINGS.
PARAMETER
SYMBOL
VALUE
UNIT
Transistor
Collector-Base Voltage
V CBO
-20
V
Collector-Emitter Voltage
V CEO
-12
V
Emitter-Base Voltage
V EBO
-7.5
V
Peak Pulse Current
I CM
-12
A
Continuous Collector Current (a)(f)
IC
-4
A
Continuous Collector Current (b)(f)
IC
-4.4
A
Base Current
IB
1000
mA
Power Dissipation at TA=25°C (a)(f)
Linear Derating Factor
PD
1.5
12
W
mW/°C
Power Dissipation at TA=25°C (b)(f)
Linear Derating Factor
PD
2.45
19.6
W
mW/°C
Power Dissipation at TA=25°C (c)(f)
Linear Derating Factor
PD
1
8
W
mW/°C
Power Dissipation at TA=25°C (d)(f)
Linear Derating Factor
PD
1.13
9
W
mW/°C
Power Dissipation at TA=25°C (d)(g)
Linear Derating Factor
PD
1.7
13.6
W
mW/°C
Power Dissipation at TA=25°C (e)(g)
Linear Derating Factor
PD
3
24
W
mW/°C
Storage Temperature Range
T stg
Junction Temperature
Tj
-55 to +150
°C
150
°C
THERMAL RESISTANCE
PARAMETER
SYMBOL
Junction to Ambient (a)(f)
R θJA
VALUE
UNIT
83
°C/W
Junction to Ambient (b)(f)
R θJA
51
°C/W
Junction to Ambient (c)(f)
R θJA
125
°C/W
Junction to Ambient (d)(f)
R θJA
111
°C/W
Junction to Ambient (d)(g)
R θJA
73.5
°C/W
Junction to Ambient (e)(g)
R θJA
41.7
°C/W
Notes
(a) For a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed pads attached. The
copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.
(b) Measured at t
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