ZXM66N03N8
30V N-CHANNEL ENHANCEMENT MODE MOSFET
SUMMARY
(BR)DSS=30V; RDS(ON)=0.015
D=9A
DESCRIPTION
This new generation of high density MOSFETs from Zetex utilises a unique
structure that combines the benefits of low on-resistance with fast switching
speed. This makes them ideal for high efficiency, low voltage, power
management applications.
SO8
FEATURES
•
Low on-resistance
•
Fast switching speed
•
Low threshold
•
Low gate drive
•
Low profile SOIC package
•
Motor control
ZXM66N03N8TA
REEL SIZE
(inches)
13
DEVICE MARKING
•
ZXM6
6N03
DRAFT ISSUE A - AUGUST 2000
ADVANCED INFORMATION
D
S
D
S
D
S
ORDERING INFORMATION
DEVICE
8
Disconnect switches
7
•
6
Power Management Functions
5
•
2 1
DC - DC Converters
3
•
4
APPLICATIONS
TAPE WIDTH (mm)
QUANTITY
PER REEL
12mm embossed
1000 units
Top View
ZXM66N03N8
ABSOLUTE MAXIMUM RATINGS.
PARAMETER
SYMBOL
Drain-Source Voltage
V DSS
30
V
Gate- Source Voltage
V GS
±20
V
Continuous Drain Current (V GS =10V; T A =25°C)(b)(d)
(V GS =10V; T A =70°C)(b)(d)
ID
9.0
8.0
A
Pulsed Drain Current (c)(d)
I DM
35
A
Continuous Source Current (Body Diode)(b)(d)
IS
3.1
A
I SM
35
A
Power Dissipation at T A =25°C (a)(d)
Linear Derating Factor
PD
-
W
mW/°C
Power Dissipation at T A =25°C (a)(e)
Linear Derating Factor
PD
-
W
mW/°C
Power Dissipation at T A =25°C (b)(d)
Linear Derating Factor
PD
2.5
20
W
mW/°C
Operating and Storage Temperature Range
T j :T stg
-55 to +150
°C
Pulsed Source Current (Body Diode)(c)(d)
LIMIT
UNIT
THERMAL RESISTANCE
PARAMETER
SYMBOL
VALUE
UNIT
Junction to Ambient (a)
R θJA
-
°C/W
Junction to Ambient (b)
R θJA
50
°C/W
NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper,
in still air conditions
(b) For a device surface mounted on FR4 PCB measured at t⭐10 secs.
(c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal
Impedance graph.
DRAFT ISSUE A - AUGUST 2000
ADVANCED INFORMATION
ZXM66N03N8
ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated).
PARAMETER
SYMBOL MIN.
TYP.
MAX.
UNI CONDITIONS.
T
STATIC
Drain-Source Breakdown Voltage
V (BR)DSS
Zero Gate Voltage Drain Current
I DSS
Gate-Body Leakage
I GSS
Gate-Source Threshold Voltage
V GS(th)
Static Drain-Source On-State Resistance
(1)
R DS(on)
Forward Transconductance (3)
g fs
30
V
I D =250µA, V GS =0V
1
µA
V DS =24V, V GS =0V
100
nA
1.0
0.015
0.020
12
V GS =±20V, V DS =0V
V
I =250µA, V DS = V GS
Ω
Ω
V GS =10V, I D =7.3A
V GS =4.5V, I D =3.7A
S
V DS =15V,I D =3.7A
D
DYNAMIC (3)
Input Capacitance
C iss
-
pF
Output Capacitance
C oss
-
pF
Reverse Transfer Capacitance
C rss
-
pF
Turn-On Delay Time
t d(on)
-
ns
Rise Time
tr
-
ns
Turn-Off Delay Time
t d(off)
-
ns
Fall Time
tf
-
ns
Total Gate Charge
Qg
-
nC
Gate-Source Charge
Q gs
-
nC
Gate Drain Charge
Q gd
-
nC
Diode Forward Voltage (1)
V SD
0.95
V
T j =25°C, I S =7.3A,
V GS =0V
Reverse Recovery Time (3)
t rr
-
ns
T j =25°C, I F =7.3A,
di/dt= 100A/µs
Reverse Recovery Charge(3)
Q rr
-
nC
V DS =15 V, V GS =0V,
f=1MHz
SWITCHING(2) (3)
V DD =15V, I D =7.3A
R G =6.0Ω, R D =2.0Ω
(Refer to test circuit)
V DS =15V,V GS =10V
I D =7.3A
(Refer to test circuit)
SOURCE-DRAIN DIODE
(1) Measured under pulsed conditions. Width=300µs. Duty cycle ≤2% .
(2) Switching characteristics are independent of operating junction temperature.
(3) For design aid only, not subject to production testing.
DRAFT ISSUE A - AUGUST 2000
ADVANCED INFORMATION
ZXM66N03N8
Zetex plc.
Fields New Road, Chadderton, Oldham, OL9-8NP, United Kingdom.
Telephone: (44)161 622 4422 (Sales), (44)161 622 4444 (General Enquiries)
Fax: (44)161 622 4420
Zetex GmbH
Streitfeldstraße 19
D-81673 München
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
Zetex Inc.
47 Mall Drive, Unit 4
Commack NY 11725
USA
Telephone: (631) 543-7100
Fax: (631) 864-7630
Zetex (Asia) Ltd.
3701-04 Metroplaza, Tower 1
Hing Fong Road,
Kwai Fong, Hong Kong
Telephone:(852) 26100 611
Fax: (852) 24250 494
These are supported by
agents and distributors in
major countries world-wide
Zetex plc 2000
Internet:http://www.zetex.com
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for
any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves
the right to alter without notice the specification, design, price or conditions of supply of any product or service.
DRAFT ISSUE A - AUGUST 2000
ADVANCED INFORMATION
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