S
CO
LO & MP
LI
GE
AN
N
T
FR
EE
oH
HA
*R
Applications
n Power rating up to 1.5 watts @ 70 °C
n Digital meters
n High power surge withstanding
n Consumer electronics
n RoHS compliant*
n LED lighting
n Halogen free**
n Industry control boards
n Thick film technology
301
n Power supplies
PL
IA
NT
**
Features
*R
oH
S
CO
M
CMP Series High Power Anti-Surge Chip Resistors
Electrical Characteristics
Power Rating @ 70 °C
FR
EE
Model
CMP0805
CMP1206
CMP2010
CMP2512
0.25 W
0.5 W
0.75 W
1W
1.5 W
AD
CMP0603
LE
Characteristic
Operating Temperature Range
-55 °C to +155 °C
Derated to Zero Load at
+155 °C
75 V
200 V
250 V
200 V
300 V
Maximum Overload Voltage
125 V
300 V
500 V
400 V
600 V
Resistance Tolerance
Temperature Coefficient
10 Ω to 1 MΩ
(±1 %, E24 & E96 Series)
10 Ω to 1 MΩ
(±5 %, E24 Series
Ro VER LEA
HS SI D F
CO ON RE
M SA E
PL R
IA E
NT
*
Maximum Working Voltage
±1 %, ±5 %
±100 ppm/°C
±100 ppm/°C
±100 ppm/°C
±100 ppm/°C
±100 ppm/°C
±200 ppm/°C
±200 ppm/°C
±200 ppm/°C
±200 ppm/°C
±200 ppm/°C
Note: Solder pad and trace size should be evaluated and board surface temperature should not exceed +105 °C when applying
full rated power.
Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com
The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov
* RoHS Directive 2015/863, Mar 31, 2015 and Annex.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br)
and Chlorine (Cl) content is 1500 ppm or less.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
CMP Series High Power Anti-Surge Chip Resistors
Product Dimensions
Model
L
W
C
D
T
CMP0603
1.60 ± 0.10
(.063 ± .004)
0.80 ± 0.10
(.031 ± .004)
0.30 ± 0.20
(.012 ± .008)
0.30 ± 0.20
(.012 ± .008)
0.45 ± 0.10
(.018 ± .004)
CMP0805
2.00 ± 0.10
(.079 ± .004)
1.25 ± 0.10
(.049 ± .004)
0.40 ± 0.20
(.016 ± .008)
0.40 ± 0.20
(.016 ± .008)
0.50 ± 0.10
(.020 ± .004)
CMP1206
3.10 ± 0.10
(.122 ± .004)
1.60 ± 0.10
(.063 ± .004)
0.50 ± 0.25
(.020 ± .010)
0.50 ± 0.25
(.020 ± .010)
0.55 ± 0.10
(.022 ± .004)
CMP2010
5.00 ± 0.20
(.197 ± .008)
2.50 ± 0.20
(.098 ± .008)
0.65 ± 0.25
(.026 ± .010)
0.60 ± 0.25
(.023 ± .010)
0.60 ± 0.10
(.024 ± .004)
CMP2512
6.40 ± 0.20
(.252 ± .008)
3.10 ± 0.20
(.122 ± .008)
0.60 ± 0.25
(.024 ± .010)
1.80 ± 0.25
(.071 ± .010)
0.60 ± 0.15
(.024 ± .006)
DIMENSIONS:
L
W
L
MM
(INCHES)
C
C
C
C
D
D
D
W
T
T
D
L
Recommended Solder Pad Layout
Model
A
B
L
CMP0603
0.90
(.035)
1.00
(.039)
3.00
(.118)
CMP0805
1.30
(.051)
1.15
(.045)
3.50
(.138)
CMP1206
1.80
(.071)
1.30
(.051)
4.70
(.185)
CMP2010
3.00
(.118)
1.50
(.059)
6.80
(.268)
CMP2512
3.70
(.146)
2.45
(.096)
7.60
(.299)
L
A
A
B
B
DIMENSIONS:
MM
(INCHES)
Surge Performance
Peak Power (Watts)
1000
100
10
CMP2512
CMP2010
CMP1206
CMP0805
CMP0603
1
0.1
0.0001
0.001
0.01
0.1
1
Pulse Duration (Seconds)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
CMP Series High Power Anti-Surge Chip Resistors
Construction
Environmental Characteristics
OVERCOAT
(BLACK)
Moisture Sensitivity Level�����������������������������������������������������������1
CONDUCTOR
Derating Curve
RESISTIVE
ELEMENT
Power Ratio (%)
Sn PLATING
Ni PLATING
CERAMIC SUBSTRATE
Rated Voltage
The rated voltage is calculated by the following formula:
V= P X R
100
-55
70
155
Ambient Temperature (°C)
V: Rated Voltage (V)
P: Rated Power (W)
R: Resistance Value (W)
Soldering Profile
275
Maximum of 20 seconds between
+255 °C and +260 °C
260 °C peak
255 °C
225
Temperature (°C)
220 °C
190 °C
90 - 150
seconds
175
Ramp Down
6 °C/second
150 °C
125
60 - 120 seconds
10 seconds minimum
75
Ramp Up
3 °C/second maximum
25
0
50
100
150
200
250
300
Time (seconds)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
CMP Series High Power Anti-Surge Chip Resistors
How to Order
CMP 0603 - F X - 1002 E LF
Model
CMP = High Power Anti-Surge Resistor
Size
0603 = 0603 Size
0805 = 0805 Size
1206 = 1206 Size
2010 = 2010 Size
2512 = 2512 Size
Resistance Tolerance
F = ±1 %
J = ±5 %
TCR (See Electrical Characteristics chart)
W = ±200 PPM/°C
X = ±100 PPM/°C
Resistance Value
1 % Tolerance:
25 °C (2-3 min.)--> 155 °C (30 min.)
--> 25 °C (2~3 min.)
1 % Tolerance ≤ ± (0.5 % + 0.05 Ω)
5 % Tolerance ≤ ± (1 % + 0.05 Ω)
Load Life
1.5 hours at rated voltage followed by a pause of 0.5 hour at 70 ± 2 °C;
Cycle repeated for 1000 hours
1 % Tolerance ≤ ± (1 % + 0.05 Ω)
5 % Tolerance ≤ ± (3 % + 0.05 Ω)
Load Life with Humidity
40 ±2 °C with 90~95 % relative humidity;
DC rated voltage for 1.5 hours “ON”, 0.5 hour “OFF”;
Cycle repeated for 1000 hours
1 % Tolerance ≤ ± (1 % + 0.05 Ω)
5 % Tolerance ≤ ± (3 % + 0.05 Ω)
Resistance to Solder
Heat
260 ±5 °C for 10 ±1 seconds
1 % Tolerance ≤ ± (0.5 % + 0.05 Ω)
5 % Tolerance ≤ ± (1 %) + 0.05 Ω
Solderability
After immersing flux, dip in 245 ±2 °C molten solder bath for 3 ± 0.5
seconds
At least 95 % of termination must be
covered with solder..
Board Flex
Bending 2 mm
1 % Tolerance ≤ ± (0.5 % + 0.05 Ω)
5 % Tolerance ≤ ± (1 % + 0.05 Ω)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
CMP Series High Power Anti-Surge Chip Resistors
Typical Part Marking
±5 % (E24):
301
301
301
301
CMP0603, CMP0805, CMP1206, CMP2010, CMP2512
Resistance value is expressed by 3 digits. The first two digits represent the significant figures of the nominal
resistance value in ohms; the third digit represents the exponent for a base of 10.
Example: 301 = 30 x 101 = 300 ohms
±1 % (E24/E96): CMP0805, CMP1206, CMP2010, CMP2512
1542
1542
1542
1542
Resistance value is expressed by 4 digits. The first three digits represent the significant figures of the nominal
resistance value in ohms; the third digit represents the exponent for a base of 10.
Example: 1542 = 154 x 102 = 15.4K ohms
±1 % (E24):
CMP0603
Example: 222 = 22 x 102 = 2.2K ohms
222
222
222
222
Resistance value is expressed by 3 digits. The first two digits represent the significant figures of the nominal
resistance value in ohms; the third digit represents the exponent for a base of 10.
±1 %01B
(E96):
01B
CMP0603
Resistance value is expressed by 2 digits followed by an alpha character multiplier. (Refer to marking table below.)
Example: 01B = 100 x 101 = 1K ohms
01B
01B
This table shows the first two digits
for the three-digit E96 part marking
scheme. The third character is a letter
multiplier:
A=100
B=101
C=102
D=103
E=104
F=105
G=106
H=107
X=10-1
Y=10-2
Z=10-3
Code
R Value
Code
R Value
Code
R Value
Code
R Value
Code
R Value
01
100
21
162
41
261
61
422
81
681
02
102
22
165
42
267
62
432
82
698
03
105
23
169
43
274
63
442
83
715
04
107
24
174
44
280
64
453
84
732
05
110
25
178
45
287
65
464
85
750
06
113
26
182
46
294
66
475
86
768
07
115
27
187
47
301
67
487
87
787
08
118
28
191
48
309
68
499
88
806
09
121
29
196
49
316
69
511
89
825
10
124
30
200
50
324
70
523
90
845
11
127
31
205
51
332
71
536
91
866
12
130
32
210
52
340
72
549
92
887
13
133
33
215
53
348
73
562
93
909
14
137
34
221
54
357
74
576
94
931
15
140
35
226
55
365
75
590
95
953
16
143
36
232
56
374
76
604
96
976
17
147
37
237
57
383
77
619
18
150
38
243
58
392
78
634
19
154
39
249
59
402
79
649
20
158
40
255
60
412
80
665
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
CMP Series High Power Anti-Surge Chip Resistors
Packaging Dimensions (Conforms to EIA RS-481A)
14.9
(.587)
MAX.
16.7
CMP2010, CMP2512:
(.657)
MAX.
CMP0603, CMP0805, CMP1206:
2.00 ± 0.05
(.079 ± .002)
4.00 ± 0.10
(.157 ± .004)
1.50 +0.10/-0
DIA.
(.059 +.004/-0)
2.0 ± 0.5
(.079 ± .020)
1.75 ± 0.10
(.069 ± .004)
13.0 ± 0.5
(.512 ± .020)
W
60.0 ± 0.5
(2.36 ± .020)
F
B
4.00 ± 0.10
(.157 ± .004)
A
Model
Tape Type
MIN.
Pieces per
Reel
20
(.787)
CMP0603, CMP0805, CMP1206:
10.0 ± 1.5
(.394 ± .059)
CMP2010, CMP2512:
13.8 ± 1.5
(.543 ± .059)
A
B
1.10 ± 0.20
(.043 ± .008)
1.90 ± 0.20
(.075 ± .008)
1.65 ± 0.20
(.065 ± .008)
2.40 ± 0.20
(.094 ± .008)
CMP1206
2.00 ± 0.20
(.079 ± .008)
3.60 ± 0.20
(.142 ± .008)
CMP2010
2.80 ± 0.20
(.110 ± .008)
5.50 ± 0.20
(.216 ± .008)
3.50 ± 0.20
(.138 ± .008)
6.70 ± 0.20
(.264 ± .008)
CMP0603
CMP0805
Paper
Plastic
CMP2512
5,000
4,000
DIMENSIONS:
178.0 ± 2.0
(7.008 ± .080)
W
F
8.00 ± 0.30
(.315 ± .012)
3.50 ± 0.05
(.138 ± .020)
12.00 ± 0.30
(.472 ± .012)
5.50 ± 0.05
(.217 ± .020)
MM
(INCHES)
REV. 05/26/20
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Legal Disclaimer Notice
This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and its
affiliates (collectively, “Bourns”).
Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change
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The characteristics and parameters of a Bourns® product set forth in its data sheet are based on laboratory conditions, and
statements regarding the suitability of products for certain types of applications are based on Bourns’ knowledge of typical
requirements in generic applications. The characteristics and parameters of a Bourns® product in a user application may vary
from the data sheet characteristics and parameters due to (i) the combination of the Bourns® product with other components
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product also can and do vary in different applications and actual performance may vary over time. Users should always verify
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