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SF-1206F400-2

SF-1206F400-2

  • 厂商:

    BOURNS(伯恩斯)

  • 封装:

    1206

  • 描述:

    FUSE BOARD MOUNT 4A 24VDC 1206

  • 数据手册
  • 价格&库存
SF-1206F400-2 数据手册
PL IA N T SinglFuse™ SF-1206F Series Features OM n Fast acting thin film chip fuse for overcurrent protection *R oH S C n 3216 (EIA 1206) miniature footprint n Surface mount packaging for automated assembly n UL listed (UL 248-14) LE AD F RE E n RoHS compliant* and halogen free** SF-1206F Series - Fast Acting Surface Mount Fuses SF-1206F050 SF-1206F080 SF-1206F100 SF-1206F125 SF-1206F150 Rated Current (Amps) 0.50 0.80 1.00 1.25 1.50 SF-1206F250 SF-1206F300 SF-1206F400 SF-1206F500 2.50 3.00 4.00 5.00 Model SF-1206F200 SF-1206F700 2.00 7.00 Ro VE LEA HS RS D C ION FRE OM S E PL AR IA E NT * Electrical Characteristics Fusing Time Open within 1 min. at 200 % rated current Resistance (mΩ) Typ.*** 590 225 130 88 65 Rated Voltage Breaking Capacity DC 63 V DC 63 V 50 A DC 32 V DC 32 V 50 A DC 24 V DC 24 V 50 A 38 32 23 15 11 7 Typical I2t (A2s)**** 0.011 0.031 0.034 0.062 0.144 0.181 *** Resistance value was measured with less than 10 % of rated current. ****Typical I2t value is measured at 10x rated current. 0.351 0.501 0.954 0.966 3.25 Reliability Testing Parameter Requirement Test Method Carrying Capacity...................................... No fusing.....................................................Rated current, 4 hours Fusing Time............................................... Within 1 minute...........................................200 % of its rated current Interrupting Ability...................................... No mechanical damages............................After the fuse is interrupted, rated voltage applied for 30 seconds again Bending Test.............................................. No mechanical damages............................Distance between holding points: 90 mm, Bending: 3 mm,1time, 30 seconds Resistance to Solder Heat......................... ±20 %..........................................................260 °C ±5 °C,10 seconds ±1 second Solderability............................................... 95 % coverage minimum............................235 °C ±5 °C, 2 ±0.5 second 245 °C ±5 °C, 2 ±0.5 second (lead free) Temperature Rise......................................
SF-1206F400-2 价格&库存

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SF-1206F400-2
    •  国内价格
    • 10+3.33468
    • 50+3.29395

    库存:90