74ACT11139DRG4

           SCAS175A − SEPTEMBER 1991 − REVISED APRIL 1996 D Inputs Are TTL-Voltage Compatible D Designed Specifically for High-Speed D D D D D D D, N, OR PW PACKAGE (TOP VIEW) Memory Decoders and Data Transmission Systems Incorporates Two Enable Inputs to Simplify Cascading and/or Data Reception Fully Synchronous Operation for Counting Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPIC  (Enhanced-Performance Implanted CMOS) 1-µm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Thin Shrink Small-Outline (PW) Packages, and Standard Plastic 300-mil DIPs (N) 1Y1 1Y2 1Y3 GND 2Y0 2Y1 2Y2 2Y3 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 1Y0 1A 1B 1G VCC 2G 2A 2B description The 74ACT11139 is designed for use in high-performance memory-decoding or data-routing applications that require very short propagation delay times. In high-performance memory systems, this decoder is used to minimize the effects of system decoding. The 74ACT11139 is composed of two individual 2-line to 4-line decoders in a single package. The active-low enables (1G or 2G) can be used as data lines in demultiplexing applications. This decoder/demultiplexer features fully buffered inputs, each of which represents only one normalized load to its driving circuit. The 74ACT11139 is characterized for operation from −40°C to 85°C. FUNCTION TABLE INPUTS OUTPUTS G B A Y0 Y1 Y2 Y3 H X X H H H H L L L L H H H L L H H L H H L H L H H L H L H H H H H L Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC is a trademark of Texas Instruments Incorporated. Copyright  1996, Texas Instruments Incorporated      !"#   $"%&! '#( '"! !  $#!! $# )# #  #* "# '' +,( '"! $!#- '#  #!#&, !&"'# #-  && $##( • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 1 
           SCAS175A − SEPTEMBER 1991 − REVISED APRIL 1996 logic symbol† 1A 1B 15 14 DMUX 1 2 0 G 3 2B 1 2 13 1G 2A 0 3 16 1Y0 1 1Y1 2 1Y2 3 1Y3 5 10 2Y0 6 2Y1 9 7 11 2Y2 8 2G 2Y3 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) 16 1G 13 1 1Y0 1Y1 2 1A 1B 1Y2 15 3 14 5 2G 11 6 1Y3 2Y0 2Y1 7 2A 2B 2 2Y2 10 8 9 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 2Y3 
           SCAS175A − SEPTEMBER 1991 − REVISED APRIL 1996 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA Maximum power dissipation at TA = 55°C (in still air) (see Note 2): D package . . . . . . . . . . . . . . . . . . . . 1.3 W N package . . . . . . . . . . . . . . . . . . . . 1.1 W PW package . . . . . . . . . . . . . . . . . . . 0.5 W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils, except for the N package, which has a trace length of zero. recommended operating conditions (see Note 3) MIN NOM MAX 4.5 5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO IOH Output voltage 0 IOL ∆t/∆v High-level input voltage 2 UNIT V V 0.8 V VCC VCC V High-level output current −24 mA Low-level output current 24 mA 0 10 ns/V −40 85 °C Input transition rise or fall rate TA Operating free-air temperature NOTE 3: Unused or floating inputs must be held high or low. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • V 3 
           SCAS175A − SEPTEMBER 1991 − REVISED APRIL 1996 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN 4.5 V 4.4 4.4 5.5 V 5.4 5.4 4.5 V 3.94 3.8 IOH = −24 mA 5.5 V 4.94 4.8 IOH = −75 mA† 5.5 V IOH = −50 mA A VOH IOL = 24 mA IOL = 75 mA† VI = VCC or GND II ICC ∆ICC‡ Ci MIN 0.1 V 5.5 V 0.1 0.1 4.5 V 0.36 0.44 5.5 V 0.36 0.44 V 1.65 ±0.1 ±1 5.5 V 8 80 mA 5.5 V 0.9 1 mA 5.5 V IO = 0 Other inputs at VCC or GND UNIT 0.1 5.5 V VI = VCC or GND, One input at 3.4 V, MAX 3.85 4.5 V IOL = 50 mA A VOL TA = 25°C TYP MAX VCC VI = VCC or GND 5V 3.5 † Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms. ‡ This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or VCC. mA pF switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B Y tPLH tPHL G Y TA = 25°C MIN TYP MAX MIN MAX 1.7 5.7 7.8 1.7 8.5 2.1 5.5 7.4 2.1 8.5 2.7 5.3 7.2 2.7 7.9 1.8 4.3 6.7 1.8 7.5 UNIT ns ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd 4 TEST CONDITIONS Power dissipation capacitance CL = 50 pF, • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • f = 1 MHz TYP UNIT 47 pF 
           SCAS175A − SEPTEMBER 1991 − REVISED APRIL 1996 PARAMETER MEASUREMENT INFORMATION 3V Input (see Note B) From Output Under Test CL = 50 pF (see Note A) 1.5 V 1.5 V 0V tPHL 500 Ω tPLH 50% VCC Output VOH 50% VCC VOL VOLTAGE WAVEFORMS LOAD CIRCUIT NOTES: A. CL includes probe and jig capacitance. B. Input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns. C. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 5 PACKAGE OPTION ADDENDUM www.ti.com 31-Jul-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty 74ACT11139D ACTIVE SOIC D 16 40 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (4/5) 74ACT11139DR OBSOLETE SOIC D 16 TBD Call TI Call TI -40 to 85 74ACT11139DRE4 OBSOLETE SOIC D 16 TBD Call TI Call TI -40 to 85 74ACT11139DRG4 OBSOLETE SOIC D 16 TBD Call TI Call TI -40 to 85 74ACT11139N OBSOLETE PDIP N 16 TBD Call TI Call TI -40 to 85 74ACT11139PWLE OBSOLETE TSSOP PW 16 TBD Call TI Call TI -40 to 85 74ACT11139PWR ACTIVE TSSOP PW 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 2000 Device Marking ACT11139 AT139 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 31-Jul-2014 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device 74ACT11139PWR Package Package Pins Type Drawing TSSOP PW 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 12.4 Pack Materials-Page 1 6.9 B0 (mm) K0 (mm) P1 (mm) 5.6 1.6 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74ACT11139PWR TSSOP PW 16 2000 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated