SN74CBT3305C
DUAL FET BUS SWITCH
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
www.ti.com
SCDS125B – SEPTEMBER 2003 – REVISED AUGUST 2005
FEATURES
•
•
•
•
•
•
•
•
Undershoot Protection for OFF Isolation on A
and B Ports up to –2 V
Bidirectional Data Flow With Near-Zero
Propagation Delay
Low ON-State Resistance (ron) Characteristics
(ron = 3 Ω Typ)
Low Input/Output Capacitance Minimizes
Loading and Signal Distortion
(Cio(OFF) = 5 pF Typ)
Data and Control Inputs Provide Undershoot
Clamp Diodes
Low Power Consumption
(ICC = 3 µA Max)
VCC Operating Range From 4 V to 5.5 V
Data I/Os Support 0- to 5-V Signaling Levels
(0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
•
•
•
•
•
Control Inputs Can Be Driven by TTL or
5-V/3.3-V CMOS Outputs
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, ClassII
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
Supports Both Digital and Analog
Applications: USB Interface, Bus Isolation,
Low-Distortion Signal Gating
xxx
xxx
D, DGK, OR PW PACKAGE
(TOP VIEW)
1OE
1A
1B
GND
1
8
2
7
3
6
4
5
VCC
2OE
2B
2A
DESCRIPTION/ORDERING INFORMATION
The SN74CBT3305C is a high-speed TTL-compatible FET bus switch with low ON-state resistance (ron), allowing
for minimal propagation delay. Active undershoot-protection circuitry on the A and B ports of the device provides
protection for undershoot up to –2 V by sensing an undershoot event and ensuring that the switch remains in the
proper OFF state.
The SN74CBT3305C is organized as two 1-bit bus switches with separate output-enable (1OE, 2OE) inputs. It
can be used as two 1-bit bus switches or as one 2-bit bus switch. When OE is high, the associated 1-bit bus
switch is ON, and the A port is conncected to the B port, allowing bidirectional data flow between ports. When
OE is low, the associated 1-bit bus switch is OFF, and the high-impedance state exists between the A and B
ports.
ORDERING INFORMATION
PACKAGE (1)
TA
SOIC – D
–40°C to 85°C
VSSOP – DGK
TSSOP – PW
(1)
ORDERABLE PART NUMBER
Tube
SN74CBT3305CD
Tape and reel
SN74CBT3305CDR
Tape and reel
SN74CBT3305CDGKR
Tube
SN74CBT3305CPW
Tape and reel
SN74CBT3305CPWR
TOP-SIDE MARKING
CU305C
SNR
CU305C
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2005, Texas Instruments Incorporated
SN74CBT3305C
DUAL FET BUS SWITCH
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
www.ti.com
SCDS125B – SEPTEMBER 2003 – REVISED AUGUST 2005
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
This device is fully specified for partial-power-down application using Ioff. The Ioff feature ensures that damaging
current will not backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
FUNCTION TABLE
(EACH BUS SWITCH)
INPUT
OE
INPUT/OUTPUT
A
FUNCTION
H
B
A port = B port
L
Z
Disconnect
LOGIC DIAGRAM (POSITIVE LOGIC)
2
1A
1OE
3
1B
SW
1
5
2A
6
SW
2B
7
2OE
SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW)
A
B
UndershootProtection Circuit
EN(1)
(1)
2
EN is the internal enable signal applied to the switch.
SN74CBT3305C
DUAL FET BUS SWITCH
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
www.ti.com
SCDS125B – SEPTEMBER 2003 – REVISED AUGUST 2005
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage
–0.5
7
V
VIN
Control input voltage range (2) (3)
–0.5
7
V
VI/O
Switch I/O voltage
range (2) (3) (4)
IIK
Control input clamp current
VIN < 0
–50
mA
II/OK
I/O port clamp current
VI/O < 0
–50
mA
±128
mA
±100
mA
II/O
ON-state switch
–0.5
current (5)
Continuous current through VCC or GND
D package
θJA
Tstg
(1)
(2)
(3)
(4)
(5)
(6)
Package thermal impedance (6)
Storage temperature range
7
UNIT
V
97
DGK package
179
PW package
149
–65
150
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to ground unless otherwise specified.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
VI and VO are used to denote specific conditions for VI/O.
II and IO are used to denote specific conditions for II/O.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
MIN
MAX
VCC
Supply voltage
4
5.5
V
VIH
High-level control input voltage
2
5.5
V
VIL
Low-level control input voltage
0
0.8
V
VI/O
Data input/output voltage
0
5.5
V
TA
Operating free-air temperature
–40
85
°C
(1)
UNIT
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
SN74CBT3305C
DUAL FET BUS SWITCH
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
www.ti.com
SCDS125B – SEPTEMBER 2003 – REVISED AUGUST 2005
Electrical Characteristics (1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VIK
MIN TYP (2)
TEST CONDITIONS
Control inputs
VCC = 4.5 V,
IIN = –18 mA
VIKU
Data inputs
VCC = 5 V,
0 mA > II ≥ –50 mA,
VIN = VCC or GND,
IIN
Control inputs
VCC = 5.5 V,
VIN = VCC or GND
IOZ (3)
VCC = 5.5 V,
VO = 0 to 5.5 V,
VI = 0,
Switch OFF,
VIN = VCC or GND
Ioff
VCC = 0,
VO = 0 to 5.5 V,
VI = 0
VCC = 5.5 V,
II/O = 0,
VIN = VCC or GND,
Switch ON or OFF
One input at 3.4 V,
Other inputs at VCC or GND
ICC
∆ICC (4)
Control inputs
VCC = 5.5 V,
Cin
Control inputs
VIN = 3 V or 0
Switch OFF
MAX
UNIT
–1.8
V
–2
V
±1
µA
±10
µA
10
µA
3
µA
2.5
mA
3
pF
Cio(OFF)
VI/O = 3 V or 0,
Switch OFF,
VIN = VCC or GND
5
pF
Cio(ON)
VI/O = 3 V or 0,
Switch ON,
VIN = VCC or GND
12.5
pF
VCC = 4 V,
TYP at VCC = 4 V
VI = 2.4 V,
IO = –15 mA
8
12
IO = 64 mA
3
6
IO = 30 mA
3
6
IO = –15 mA
5
10
ron (5)
VI = 0
VCC = 4.5 V
VI = 2.4 V,
(1)
(2)
(3)
(4)
(5)
Ω
VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
This is the increase in supply current for each input that is at the specified voltage level, rather than VCC or GND
Measured by the voltage drop between the A and B terminals at the indicate current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
(1)
VCC = 4 V
VCC = 5 V
± 0.5 V
MIN
MIN
FROM
(INPUT)
TO
(OUTPUT)
tpd (1)
A or B
B or A
0.24
ten
OE
A or B
4.4
tdis
OE
A or B
5.1
PARAMETER
MAX
UNIT
MAX
0.15
ns
1.5
4.1
ns
1.5
4.8
ns
The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load
capacitance, when driven by an ideal voltage source (zero output impedance).
Undershoot Characteristics
See Figure 1 and Figure 2
PARAMETER
VOUTU
(1)
4
TEST CONDITIONS
VCC = 5.5 V,
Switch OFF,
VIN = VCC or GND
All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
MIN
TYP (1)
2
VOH – 0.3
MAX
UNIT
V
SN74CBT3305C
DUAL FET BUS SWITCH
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
www.ti.com
SCDS125B – SEPTEMBER 2003 – REVISED AUGUST 2005
VCC
Input
Generator
11 V
100 kΩ
50 Ω
Ax
DUT
Bx
100 kΩ
VS
10 pF
Figure 1. Device Test Setup
Input
(Open
Socket)
90 %
90 %
2 ns
5.5 V
2 ns
10 %
10 %
−2 V
20 ns
Output
(VOUTU)
VOH
VOH − 0.3
Figure 2. Transient Input Voltage (VI) and Output Voltage (VOUTU) Waveforms (Switch OFF)
5
SN74CBT3305C
DUAL FET BUS SWITCH
5-V BUS SWITCH WITH –2-V UNDERSHOOT PROTECTION
www.ti.com
SCDS125B – SEPTEMBER 2003 – REVISED AUGUST 2005
PARAMETER MEASUREMENT INFORMATION
VCC
Input Generator
VIN
50 Ω
50 Ω
VG1
TEST CIRCUIT
DUT
7V
Input Generator
S1
RL
VO
VI
50 Ω
50 Ω
VG2
CL
(see Note A)
RL
TEST
VCC
S1
RL
VI
CL
tpd(s)
5 V ± 0.5 V
4V
Open
Open
500 Ω
500 Ω
VCC or GND
VCC or GND
50 pF
50 pF
tPLZ/tPZL
5 V ± 0.5 V
4V
7V
7V
500 Ω
500 Ω
GND
GND
50 pF
50 pF
0.3 V
0.3 V
tPHZ/tPZH
5 V ± 0.5 V
4V
Open
Open
500 Ω
500 Ω
VCC
VCC
50 pF
50 pF
0.3 V
0.3 V
V∆
3V
Output
Control
(VIN)
1.5 V
3V
1.5 V
1.5 V
0V
tPLH
VOH
Output
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (tpd(s))
Output
Waveform 1
S1 at 7 V
(see Note B)
tPLZ
3.5 V
1.5 V
VOL + V∆
VOL
tPZH
tPHL
1.5 V
0V
tPZL
Output
Control
(VIN)
Open
GND
Output
Waveform 2
S1 at Open
(see Note B)
tPHZ
VOH
1.5 V
VOH − V∆
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance
of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
H. All parameters and waveforms are not applicable to all devices.
Figure 3. Test Circuit and Voltage Waveforms
6
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jul-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
74CBT3305CDGKRG4
ACTIVE
MSOP
DGK
8
SN74CBT3305CD
ACTIVE
SOIC
D
8
75
SN74CBT3305CDE4
ACTIVE
SOIC
D
8
SN74CBT3305CDG4
ACTIVE
SOIC
D
8
SN74CBT3305CDGKR
ACTIVE
MSOP
DGK
8
SN74CBT3305CDR
ACTIVE
SOIC
D
SN74CBT3305CDRE4
ACTIVE
SOIC
SN74CBT3305CDRG4
ACTIVE
SN74CBT3305CPW
Eco Plan
(2)
TBD
Lead/
Ball Finish
(3)
Samples
(Requires Login)
Call TI
Purchase Samples
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
Call TI
Purchase Samples
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74CBT3305CPWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74CBT3305CPWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74CBT3305CPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74CBT3305CPWRE4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74CBT3305CPWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
TBD
(1)
Call TI
MSL Peak Temp
Call TI
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jul-2010
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74CBT3305CDR
Package Package Pins
Type Drawing
SOIC
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN74CBT3305CDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN74CBT3305CPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74CBT3305CDR
SOIC
D
8
2500
340.5
338.1
20.6
SN74CBT3305CDR
SOIC
D
8
2500
346.0
346.0
29.0
SN74CBT3305CPWR
TSSOP
PW
8
2000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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