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SN74LVC2G157
SCES207M – APRIL 1999 – REVISED JUNE 2015
SN74LVC2G157 Single 2-Line to 1-Line Data Selector Multiplexer
1 Features
3 Description
•
This single 2-line to 1-line data selector multiplexer is
designed for 1.65-V to 5.5-V VCC operation.
1
•
•
•
•
•
•
•
•
•
•
•
Available in the Texas Instruments
NanoFree™ Package
Supports 5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 6 ns at 3.3 V
Low Power Consumption, 10-µA Maximum ICC
±24-mA Output Drive at 3.3 V
Typical VOLP (Output Ground Bounce)
2 V at VCC = 3.3 V, TA = 25°C
Ioff Supports Live Insertion, Partial-Power-Down
Mode, and Back-Drive Protection
Can Be Used as a Down Translator to Translate
Inputs From a Maximum of 5.5 V Down
to the VCC Level
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
The SN74LVC2G157 device features a common
strobe (G) input. When the strobe is high, Y is low
and Y is high. When the strobe is low, a single bit is
selected from one of two sources and is routed to the
outputs. The device provides true and complementary
data.
NanoFree™ package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.
Device Information(1)
PART NUMBER
SN74LVC2G157DCT
•
•
•
•
•
•
•
•
Barcode Scanner
Cable Solutions
E-Books
Embedded PC
Field Transmitter: Temperature or Pressure
Sensors
Fingerprint Biometrics
HVAC: Heating, Ventilating, and Air Conditioning
Network-Attached Storage (NAS)
Server Motherboard and PSU
Software Defined Radio (SDR)
TV: High Definition (HDTV), LCD, and Digital
Video Communications Systems
Wireless Data Access Cards, Headsets,
Keyboards, Mice, and LAN Cards
BODY SIZE (NOM)
2.95 mm × 2.80 mm
SN74LVC2G157DCU VSSOP (8)
2.30 mm × 2.00 mm
SN74LVC2G157YZP
1.91 mm × 0.91 mm
DSBGA (8)
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram (Positive Logic)
2 Applications
•
•
•
•
•
PACKAGE
SSOP (8)
A
1
5
B
G
A/B
2
3
Y
Y
7
6
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74LVC2G157
SCES207M – APRIL 1999 – REVISED JUNE 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
4
4
4
5
5
6
6
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions ......................
Thermal Information ..................................................
Electrical Characteristics ..........................................
Switching Characteristics .........................................
Operating Characteristics..........................................
Typical Characteristics ..............................................
Parameter Measurement Information .................. 7
Detailed Description .............................................. 8
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 8
8.3 Feature Description................................................... 8
8.4 Device Functional Modes.......................................... 8
9
Application and Implementation .......................... 9
9.1 Application Information.............................................. 9
9.2 Typical Application ................................................... 9
10 Power Supply Recommendations ..................... 10
11 Layout................................................................... 10
11.1 Layout Guidelines ................................................. 10
11.2 Layout Example .................................................... 11
12 Device and Documentation Support ................. 12
12.1
12.2
12.3
12.4
12.5
Documentation Support ........................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
12
12
12
12
12
13 Mechanical, Packaging, and Orderable
Information ........................................................... 12
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision L (January 2014) to Revision M
Page
•
Added ESD Ratings table....................................................................................................................................................... 4
•
Added Thermal Information table. .......................................................................................................................................... 5
•
Added Typical Characteristics ................................................................................................................................................ 6
•
Added Mechanical, Packaging, and Orderable Information section..................................................................................... 12
Changes from Revision K (January 2007) to Revision L
Page
•
Updated document to new TI data sheet format. ................................................................................................................... 1
•
Removed Ordering Information table ..................................................................................................................................... 1
•
Updated Features ................................................................................................................................................................... 1
•
Added Device Information table ............................................................................................................................................. 1
2
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5 Pin Configuration and Functions
DCT Package
8-Pin SSOP
Top View
DCU Package
8-Pin VSSOP
Top View
A
1
8
VCC
B
2
7
G
Y
3
6
A/B
GND
4
5
Y
A
B
Y
GND
1
2
3
8
7
6
4
5
VCC
G
A/B
Y
YZP Package
8-Pin DSBGA
Bottom View
GND
Y
B
A
4 5
3 6
2 7
1 8
Y
A/B
G
VCC
See mechanical drawings for dimensions
Pin Functions
PIN
I/O
DESCRIPTION
SSOP,
VSSOP
DSBGA
A
1
1
I
Data Input
A/B
6
6
I
Input Selector
B
2
2
I
Data Input
G
7
7
I
Common Strobe Input
GND
4
4
—
Ground
VCC
8
8
—
Power
Y
5
5
O
Output
Y
3
3
O
Inverted Output
NAME
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VCC
MIN
MAX
UNIT
Supply voltage
–0.5
6.5
V
(2)
VI
Input voltage
–0.5
6.5
V
VO
Voltage applied to any output in the high-impedance or power-off state (2)
–0.5
6.5
V
VO
Voltage applied to any output in the high or low state (2) (3)
–0.5
VCC + 0.5
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
150
°C
Continuous current through VCC or GND
Tstg
(1)
(2)
(3)
Storage temperature
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
The value of VCC is provided in the Recommended Operating Conditions table.
6.2 ESD Ratings
VALUE
Electrostatic
discharge
V(ESD)
(1)
(2)
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
See
VCC
(1)
.
Supply voltage
Operating
Data retention only
VCC = 1.65 V to 1.95 V
VIH
High-level input voltage
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
MIN
MAX
1.65
5.5
1.5
UNIT
V
0.65 × VCC
1.7
V
2
0.7 × VCC
VCC = 1.65 V to 1.95 V
0.35 × VCC
VCC = 2.3 V to 2.7 V
0.7
VCC = 3 V to 3.6 V
0.8
VIL
Low-level input voltage
VI
Input voltage
0
5.5
V
VO
Output voltage
0
VCC
V
VCC = 4.5 V to 5.5 V
VCC = 1.65 V
VCC = 2.3 V
IOH
High-level output current
VCC = 3 V
VCC = 4.5 V
(1)
4
V
0.3 × VCC
–4
–8
–16
mA
–24
–32
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, SCBA004.
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Recommended Operating Conditions (continued)
See (1).
MIN
MAX
VCC = 1.65 V
4
VCC = 2.3 V
IOL
Low-level output current
Δt/Δv
Input transition rise or fall rate
TA
Operating free-air temperature
UNIT
8
16
VCC = 3 V
mA
24
VCC = 4.5 V
32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V
20
VCC = 3.3 V ± 0.3 V
10
VCC = 5 V ± 0.5 V
ns/V
5
–40
85
°C
6.4 Thermal Information
SN74LVC2G157
THERMAL METRIC (1)
RθJA
(1)
DCT (SSOP)
Junction-to-ambient thermal resistance
DCU (VSSOP) YZP (DSBGA)
8 PINS
8 PINS
8 PINS
220
227
102
UNIT
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –100 µA
VOH
1.65 V to 5.5 V
1.65 V
1.2
IOH = –8 mA
2.3 V
1.9
4.5 V
IOL = 100 µA
1.65 V to 5.5 V
0.1
IOL = 4 mA
1.65 V
0.45
IOL = 8 mA
2.3 V
0.3
IOL = 32 mA
0.4
VI = 5.5 V or GND
VI or VO = 5.5 V
ICC
VI = 5.5 V or GND,
IO = 0
ΔICC
One input at VCC – 0.6 V,
Other inputs at VCC or GND
Ci
VI = VCC or GND
V
0.55
4.5 V
Ioff
(1)
3.8
3V
IOL = 24 mA
II
2.3
IOH = –32 mA
IOL = 16 mA
A, B, or
control inputs
V
2.4
3V
IOH = –24 mA
UNIT
VCC – 0.1
IOH = –4 mA
IOH = –16 mA
VOL
MIN TYP (1) MAX
VCC
0.55
0 to 5.5 V
±5
µA
0
±10
µA
1.65 V to 5.5 V
10
µA
3 V to 5.5 V
500
µA
3.3 V
5
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
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6.6 Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A or B
tpd
A/B
Y or Y
G
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
MIN
MAX
MIN
MAX
4.4
14
2.1
4.9
16
2.5
4.2
14
2
VCC = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
8
2
6
1.4
4
9
2.1
6
1.6
4
8
1.6
6
1.3
4
ns
6.7 Operating Characteristics
TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
VCC = 1.8 V
f = 10 MHz
VCC = 2.5 V
VCC = 3.3 V
VCC = 5 V
TYP
TYP
TYP
TYP
35
35
37
40
UNIT
pF
6.8 Typical Characteristics
41
Power Dissipation Capacitance (CPD)
40
39
38
37
36
35
Typ. Char.
34
0
1
2
3
4
5
6
Supply Voltage [VCC] (V)
C001
Figure 1. Voltage vs Capacitance
6
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7 Parameter Measurement Information
VLOAD
S1
RL
From Output
Under Test
Open
TEST
GND
CL
(see Note A)
S1
Open
VLOAD
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
RL
GND
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
VI
tr/tf
VCC
VCC
3V
VCC
£2 ns
£2 ns
£2.5 ns
£2.5 ns
VM
VLOAD
CL
RL
VD
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6V
2 × VCC
30 pF
30 pF
50 pF
50 pF
1 kW
500 W
500 W
500 W
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tW
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPLH
VOH
Output
VM
VOL
tPHL
VM
VM
0V
tPLZ
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
VLOAD/2
VM
tPZH
VOH
Output
VM
tPZL
tPHL
VM
VI
Output
Control
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + VD
VOL
tPHZ
VM
VOH – VD
VOH
»0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
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8 Detailed Description
8.1 Overview
This single 2-line to 1-line data selector multiplexer is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G157 device features a common strobe (G) input. When the strobe is high, Y is low and Y is
high. When the strobe is low, a single bit is selected from one of two sources and is routed to the outputs. The
device provides true and complementary data.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
8.2 Functional Block Diagram
A
1
5
B
G
A/B
2
3
Y
Y
7
6
8.3 Feature Description
The SN74LVC2G157 device has a wide operating VCC range of 1.65 V to 5.5 V, which allows it to be used in a
broad range of systems. The 5.5 V I/Os allow down translation and also allow voltages at the inputs when VCC =
0.
8.4 Device Functional Modes
Table 1 lists the functional modes for SN74LVC2G157.
Table 1. Function Table
INPUTS
8
OUTPUTS
G
A/B
A
B
Y
Y
H
X
X
X
L
H
L
L
L
X
L
H
L
L
H
X
H
L
L
H
X
L
L
H
L
H
X
H
H
L
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The LVC family is TI's premier solution to the industry’s high-drive needs in logic devices. The LVC family
ensures a symmetric drive of 24 mA across the range 3.3 V < VCC < 5.5 V. The SN74LVC2G157 device also
maintains excellent response time. The increased drive produces faster edges and improved response
performance.
9.2 Typical Application
VCC = 5 V
_
A/B
VCC
A
MCU
(MSP43x)
Temp.
Sensor
Y
B
GND
Photo
Sensor
Figure 3. Multiplexer Controlled by Processor
9.2.1 Design Requirements
The SN74LVC2G157 device uses CMOS technology and has balanced output drive. Take care to avoid bus
contention because it can drive currents that would exceed maximum limits.
The SN74LVC2G157 allows switching control of analog and digital signals with a digital control signal. All input
signals should remain as close to either 0 V or VCC for optimal operation.
9.2.2 Detailed Design Procedure
1. Recommended input conditions:
– For rise time and fall time specifications, see Δt/Δv in the table.
– For specified high and low levels, see VIH and VIL in the table.
– Inputs and outputs are overvoltage tolerant and can therefore go as high as 5.5 V at any valid VCC.
2. Recommended output conditions:
– Load currents should not exceed ±50 mA.
3. Frequency selection criterion:
– The effects of frequency upon the output current should be studied in Figure 5.
– Added trace resistance and capacitance can reduce maximum frequency capability; follow the layout
practices listed in the Layout section.
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Typical Application (continued)
9.2.3 Application Curve
20.00
Max tpd (ns)
15.00
10.00
5.00
0.00
0.00
1.00
2.00
3.00
4.00
5.00
Voltage (V)
6.00
7.00
C001
Figure 4. Max tpd vs Voltage of LVC Family
10 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating listed in the
table.
Each VCC terminal should have a good bypass capacitor to prevent power disturbance. For devices with a single
supply, a 0.1-μF bypass capacitor is recommended. If multiple pins are labeled VCC, then a 0.01-μF or 0.022-μF
capacitor is recommended for each VCC because the VCC pins are tied together internally. For devices with dual
supply pins operating at different voltages, for example VCC and VDD, a 0.1-µF bypass capacitor is recommended
for each supply pin. To reject different frequencies of noise, use multiple bypass capacitors in parallel. Capacitors
with values of 0.1 μF and 1 μF are commonly used in parallel. The bypass capacitor should be installed as close
to the power terminal as possible for best results.
11 Layout
11.1 Layout Guidelines
Reflections and matching are closely related to the loop antenna theory but are different enough to be discussed
separately from the theory. When a PCB trace turns a corner at a 90° angle, a reflection can occur. A reflection
occurs primarily because of the change of width of the trace. At the apex of the turn, the trace width increases to
1.414 times the width. This increase upsets the transmission-line characteristics, especially the distributed
capacitance and self–inductance of the trace which results in the reflection. Not all PCB traces can be straight
and therefore some traces must turn corners. Figure 5 shows progressively better techniques of rounding
corners. Only the last example (BEST) maintains constant trace width and minimizes reflections.
10
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11.2 Layout Example
BETTER
BEST
2W
WORST
1W min.
W
Figure 5. Trace Example
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
• Implications of Slow or Floating CMOS Inputs, SCBA004
• Selecting the Right Texas Instruments Signal Switch, SZZA030
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
NanoFree, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser based versions of this data sheet, refer to the left hand navigation.
12
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
3000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TBD
Call TI
Call TI
-40 to 85
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TBD
Call TI
Call TI
-40 to 85
Device Marking
(4/5)
74LVC2G157DCTRE4
ACTIVE
SM8
DCT
8
74LVC2G157DCURE4
ACTIVE
VSSOP
DCU
8
74LVC2G157DCURG4
ACTIVE
VSSOP
DCU
8
74LVC2G157DCUTE4
ACTIVE
VSSOP
DCU
8
74LVC2G157DCUTG4
ACTIVE
VSSOP
DCU
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C57R
SN74LVC2G157DCTR
ACTIVE
SM8
DCT
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C57
Z
SN74LVC2G157DCTRG4
ACTIVE
SM8
DCT
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
C57
Z
SN74LVC2G157DCUR
ACTIVE
VSSOP
DCU
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 85
(C57Q ~ C57R)
SN74LVC2G157DCUT
ACTIVE
VSSOP
DCU
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 85
(C57Q ~ C57R)
SN74LVC2G157YZPR
ACTIVE
DSBGA
YZP
8
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
(C37 ~ C3N)
3000
C57
Z
C57R
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2015
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Feb-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
74LVC2G157DCURG4
VSSOP
DCU
8
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
180.0
B0
(mm)
K0
(mm)
P1
(mm)
8.4
2.25
3.35
1.05
4.0
W
Pin1
(mm) Quadrant
8.0
Q3
74LVC2G157DCUTG4
VSSOP
DCU
8
250
180.0
8.4
2.25
3.35
1.05
4.0
8.0
Q3
SN74LVC2G157DCTR
SM8
DCT
8
3000
180.0
13.0
3.35
4.5
1.55
4.0
12.0
Q3
SN74LVC2G157DCUR
VSSOP
DCU
8
3000
178.0
9.5
2.25
3.35
1.05
4.0
8.0
Q3
SN74LVC2G157DCUR
VSSOP
DCU
8
3000
180.0
8.4
2.25
3.35
1.05
4.0
8.0
Q3
SN74LVC2G157DCUT
VSSOP
DCU
8
250
178.0
9.5
2.25
3.35
1.05
4.0
8.0
Q3
SN74LVC2G157YZPR
DSBGA
YZP
8
3000
178.0
9.2
1.02
2.02
0.63
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Feb-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
74LVC2G157DCURG4
VSSOP
DCU
8
3000
202.0
201.0
28.0
74LVC2G157DCUTG4
VSSOP
DCU
8
250
202.0
201.0
28.0
SN74LVC2G157DCTR
SM8
DCT
8
3000
182.0
182.0
20.0
SN74LVC2G157DCUR
VSSOP
DCU
8
3000
202.0
201.0
28.0
SN74LVC2G157DCUR
VSSOP
DCU
8
3000
202.0
201.0
28.0
SN74LVC2G157DCUT
VSSOP
DCU
8
250
202.0
201.0
28.0
SN74LVC2G157YZPR
DSBGA
YZP
8
3000
220.0
220.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
DCT (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
0,65
8
0,13 M
5
0,15 NOM
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
2,90
2,70
4,25
3,75
Gage Plane
PIN 1
INDEX AREA
1
0,25
4
0° – 8°
3,15
2,75
0,60
0,20
1,30 MAX
Seating Plane
0,10
0,10
0,00
NOTES: A.
B.
C.
D.
4188781/C 09/02
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion
Falls within JEDEC MO-187 variation DA.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
D: Max = 1.918 mm, Min =1.858 mm
E: Max = 0.918 mm, Min =0.858 mm
PACKAGE OUTLINE
YZP0008
DSBGA - 0.5 mm max height
SCALE 8.000
DIE SIZE BALL GRID ARRAY
B
A
E
BALL A1
CORNER
D
C
0.5 MAX
SEATING PLANE
0.19
0.15
0.05 C
BALL TYP
0.5 TYP
D
C
SYMM
1.5
TYP
B
0.5
TYP
8X
0.015
0.25
0.21
C A B
A
1
2
SYMM
4223082/A 07/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YZP0008
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
8X ( 0.23)
2
1
A
(0.5) TYP
B
SYMM
C
D
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
SOLDER MASK
OPENING
0.05 MAX
( 0.23)
SOLDER MASK
OPENING
0.05 MIN
( 0.23)
METAL
METAL UNDER
SOLDER MASK
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4223082/A 07/2016
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YZP0008
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
8X ( 0.25)
(R0.05) TYP
1
2
A
(0.5)
TYP
B
SYMM
C
METAL
TYP
D
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
4223082/A 07/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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