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ADC08D1000
High Performance, Low Power, Dual 8-Bit, 1 GSPS A/D
Converter
General Description
Features
The ADC08D1000 is a dual, low power, high performance
CMOS analog-to-digital converter that digitizes signals to 8
bits resolution at sampling rates up to 1.3 GSPS. Consuming
a typical 1.6 Watts at 1 GSPS from a single 1.9 Volt supply,
this device is guaranteed to have no missing codes over the
full operating temperature range. The unique folding and interpolating architecture, the fully differential comparator design, the innovative design of the internal sample-and-hold
amplifier and the self-calibration scheme enable a very flat
response of all dynamic parameters beyond Nyquist, producing a high 7.4 ENOB with a 500 MHz input signal and a 1 GHz
sample rate while providing a 10-18 B.E.R. Output formatting
is offset binary and the LVDS digital outputs are compatible
with IEEE 1596.3-1996, with the exception of an adjustable
common mode voltage between 0.8V and 1.2V.
Each converter has a 1:2 demultiplexer that feeds two LVDS
buses and reduces the output data rate on each bus to half
the sampling rate. The two converters can be interleaved and
used as a single 2 GSPS ADC.
The converter typically consumes less than 3.5 mW in the
Power Down Mode and is available in a 128-lead, thermally
enhanced exposed pad LQFP and operates over the Industrial (-40°C ≤ TA ≤ +85°C) temperature range.
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Internal Sample-and-Hold
Single +1.9V ±0.1V Operation
Choice of SDR or DDR output clocking
Interleave Mode for 2x Sampling Rate
Multiple ADC Synchronization Capability
Guaranteed No Missing Codes
Serial Interface for Extended Control
Fine Adjustment of Input Full-Scale Range and Offset
Duty Cycle Corrected Sample Clock
Key Specifications
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Resolution
Max Conversion Rate
Bit Error Rate
ENOB @ 500 MHz Input
DNL
Power Consumption
— Operating
— Power Down Mode
8 Bits
1 GSPS (min)
10-18 (typ)
7.4 Bits (typ)
±0.15 LSB (typ)
1.6 W (typ)
3.5 mW (typ)
Applications
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Direct RF Down Conversion
Digital Oscilloscopes
Satellite Set-top boxes
Communications Systems
Test Instrumentation
Block Diagram
20097453
© 2009 National Semiconductor Corporation
200974
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ADC08D1000 High Performance, Low Power, Dual 8-Bit, 1 GSPS A/D Converter
April 16, 2009
ADC08D1000
Ordering Information
Industrial Temperature Range (-40°C < TA < +85°C)
NS Package
ADC08D1000CIYB
128-Pin Exposed Pad LQFP
ADC08D1000DEV
Development Board
Pin Configuration
20097401
* Exposed pad on back of package must be soldered to ground plane to ensure rated performance.
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2
ADC08D1000
Pin Descriptions and Equivalent Circuits
Pin Functions
Pin No.
Symbol
Equivalent Circuit
Description
OutV / SCLK
Output Voltage Amplitude and Serial Interface Clock. Tie this pin
high for normal differential DCLK and data amplitude. Ground this
pin for a reduced differential output amplitude and reduced power
consumption. See1.1.6 The LVDS Outputs. When the extended
control mode is enabled, this pin functions as the SCLK input which
clocks in the serial data. See 1.2 NORMAL/EXTENDED
CONTROL for details on the extended control mode. See 1.3 THE
SERIAL INTERFACE for description of the serial interface.
4
OutEdge / DDR /
SDATA
DCLK Edge Select, Double Data Rate Enable and Serial Data
Input. This input sets the output edge of DCLK+ at which the output
data transitions. (See 1.1.5.2 OutEdge Setting). When this pin is
floating or connected to 1/2 the supply voltage, DDR clocking is
enabled. When the extended control mode is enabled, this pin
functions as the SDATA input. See 1.2 NORMAL/EXTENDED
CONTROL for details on the extended control mode. See 1.3 THE
SERIAL INTERFACE for description of the serial interface.
15
DCLK_RST/
DCLK_RST-
26
PD
Power Down Pins. A logic high on the PD pin puts the entire device
into the Power Down Mode.
30
CAL
Calibration Cycle Initiate. A minimum tCAL_L input clock cycles logic
low followed by a minimum of tCAL_H input clock cycles high on this
pin initiates the self calibration sequence. See 2.4.2 Self
Calibration for an overview of self-calibration and 2.4.2.2 OnCommand Calibration for a description of on-command
calibration.
29
PDQ
A logic high on the PDQ pin puts only the "Q" ADC into the Power
Down mode.
FSR/ECE
Full Scale Range Select and Extended Control Enable. In nonextended control mode, a logic low on this pin sets the full-scale
differential input range to a reduced VIN input level . A logic high
on this pin sets the full-scale differential input range to a higher
VIN input level. See Converter Electrical Characteristics. To enable
the extended control mode, whereby the serial interface and
control registers are employed, allow this pin to float or connect it
to a voltage equal to VA/2. See 1.2 NORMAL/EXTENDED
CONTROL for information on the extended control mode.
3
14
DCLK Reset. A positive pulse on this pin is used to reset and
synchronize the DCLK outs of multiple converters. See 1.5
MULTIPLE ADC SYNCHRONIZATION for detailed description.
3
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ADC08D1000
Pin Functions
Pin No.
Symbol
Equivalent Circuit
Description
CalDly / DES /
SCS
Calibration Delay, Dual Edge Sampling and Serial Interface Chip
Select. With a logic high or low on pin 14, this pin functions as
Calibration Delay and sets the number of input clock cycles after
power up before calibration begins (See 1.1.1 Self-Calibration).
With pin 14 floating, this pin acts as the enable pin for the serial
interface input and the CalDly value becomes "0" (short delay with
no provision for a long power-up calibration delay). When this pin
is floating or connected to a voltage equal to VA/2, DES (Dual Edge
Sampling) mode is selected where the "I" input is sampled at twice
the input clock rate and the "Q" input is ignored. See 1.1.5.1 DualEdge Sampling.
18
19
CLK+
CLK-
LVDS Clock input pins for the ADC. The differential clock signal
must be a.c. coupled to these pins. The input signal is sampled on
the falling edge of CLK+. See 1.1.2 Acquiring the Input for a
description of acquiring the input and Section 2.3 for an overview
of the clock inputs.
11
10
22
23
VINI+
VINI−
127
VINQ+
VINQ−
7
VCMO
31
VBG
126
CalRun
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Analog signal inputs to the ADC. The differential full-scale input
range of this input is programmable using the FSR pin 14 in normal
mode and the Input Full-Scale Voltage Adjust register in the
extended control mode. Refer to the VIN specification in the
Converter Electrical Characteristics for the full-scale input range
in the normal mode. Refer to 1.4 REGISTER DESCRIPTION for
the full-scale input range in the extended control mode.
Common Mode Voltage. The voltage output at this pin is required
to be the common mode input voltage at VIN+ and VIN− when d.c.
coupling is used. This pin should be grounded when a.c. coupling
is used at the analog inputs. This pin is capable of sourcing or
sinking 100μA. See 2.2 THE ANALOG INPUT.
Bandgap output voltage capable of 100 μA source/sink.
Calibration Running indication. This pin is at a logic high when
calibration is running.
4
ADC08D1000
Pin Functions
Pin No.
Symbol
32
REXT
External bias resistor connection. Nominal value is 3.3k-Ohms
(±0.1%) to ground. See Section 1.1.1.
Tdiode_P
Tdiode_N
Temperature Diode Positive (Anode) and Negative (Cathode).
These pins may be used for die temperature measurements,
however no specified accuracy is implied or guaranteed. Noise
coupling from adjacent output data signals has been shown to
affect temperature measurements using this feature. See 2.6.2
Thermal Management.
34
35
Equivalent Circuit
Description
5
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ADC08D1000
Pin Functions
Pin No.
Symbol
83 / 78
84 / 77
85 / 76
86 / 75
89 / 72
90 / 71
91 / 70
92 / 69
93 / 68
94 / 67
95 / 66
96 / 65
100 / 61
101 / 60
102 / 59
103 / 58
DI7− / DQ7−
DI7+ / DQ7+
DI6− / DQ6−
DI6+ / DQ6+
DI5− / DQ5−
DI5+ / DQ5+
DI4− / DQ4−
DI4+ / DQ4+
DI3− / DQ3−
DI3+ / DQ3+
DI2− / DQ2−
DI2+ / DQ2+
DI1− / DQ1−
DI1+ / DQ1+
DI0− / DQ0−
DI0+ / DQ0+
104 / 57
105 / 56
106 / 55
107 / 54
111 / 50
112 / 49
113 / 48
114 / 47
115 / 46
116 / 45
117 / 44
118 / 43
122 / 39
123 / 38
124 / 37
125 / 36
DId7− / DQd7−
DId7+ / DQd7+
DId6− / DQd6−
DId6+ / DQd6+
DId5− / DQd5−
DId5+ / DQd5+
DId4− / DQd4−
DId4+ / DQd4+
DId3− / DQd3−
DId3+ / DQd3+
DId2− / DQd2−
DId2+ / DQd2+
DId1− / DQd1−
DId1+ / DQd1+
DId0− / DQd0−
DId0+ / DQd0+
I and Q channel LVDS Data Outputs that are delayed by one CLK
cycle in the output demultiplexer. Compared with the DI/DQ
outputs, these outputs represent the earlier time sample. These
outputs should always be terminated with a 100Ω differential
resistor.
OR+
OR-
Out Of Range output. A differential high at these pins indicates that
the differential input is out of range (outside the range ±VIN/2 as
programmed by the FSR pin in non-extended control mode or the
Input Full-Scale Voltage Adjust register setting in the extended
control mode).
82
81
DCLK+
DCLK-
Differential Clock outputs used to latch the output data. Delayed
and non-delayed data outputs are supplied synchronous to this
signal. This signal is at 1/2 the input clock rate in SDR mode and
at 1/4 the input clock rate in the DDR mode. The DCLK outputs
are not active during a calibration cycle, therefore this is not
recommended as a system clock.
2, 5, 8, 13,
16, 17, 20,
25, 28, 33,
128
VA
Analog power supply pins. Bypass these pins to ground.
40, 51 ,62,
73, 88, 99,
110, 121
VDR
Output Driver power supply pins. Bypass these pins to DR GND.
1, 6, 9, 12,
21, 24, 27,
41
GND
Ground return for VA.
79
80
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Equivalent Circuit
Description
I and Q channel LVDS Data Outputs that are not delayed in the
output demultiplexer. Compared with the DId and DQd outputs,
these outputs represent the later time samples. These outputs
should always be terminated with a 100Ω differential resistor.
6
ADC08D1000
Pin Functions
Pin No.
Symbol
42, 53, 64,
74, 87, 97,
108, 119
DR GND
52, 63, 98,
109, 120
NC
Equivalent Circuit
Description
Ground return for VDR.
No Connection. Make no connection to these pins.
7
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ADC08D1000
Operating Ratings
Absolute Maximum Ratings
(Notes 1, 2)
−40°C ≤ TA ≤ +85°C
(Notes 1, 2)
Ambient Temperature Range
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (VA)
Driver Supply Voltage (VDR)
Analog Input Common Mode Voltage
VIN+, VIN- Voltage Range
(Maintaining Common Mode)
Supply Voltage (VA, VDR)
Supply Difference
VDR - VA
Voltage on Any Input Pin
(Except VIN+, VIN- )
Voltage on VIN+, VIN(Maintaining Common Mode)
Ground Difference
|GND - DR GND|
Input Current at Any Pin (Note 3)
Package Input Current (Note 3)
2.2V
+1.8V to +2.0V
+1.8V to VA
VCMO ±50mV
0V to 2.15V
(100% duty cycle)
0V to 2.5V
(10% duty cycle)
0V to 100 mV
Ground Difference
(|GND - DR GND|)
CLK Pins Voltage Range
Differential CLK Amplitude
−0.15V to (VA +0.15V)
-0.15V to 2.5V
0V to 100 mV
±25 mA
±50 mA
Power Dissipation at TA ≤ 85°C
ESD Susceptibility (Note 4)
Human Body Model
Machine Model
Soldering Temperature, Infrared,
10 seconds, (Note 5), (Applies
to standard plated package only)
Storage Temperature
0V
0V to VA
0.4VP-P to 2.0VP-P
Package Thermal Resistance
Package
2.0 W
128-Lead
Exposed Pad
LQFP
2500V
250V
θJA
25°C / W
θJC(Top of
θJ-PAD
Package)
(Thermal Pad)
10°C / W
2.8°C / W
Soldering
process
must
comply
with
National
Semiconductor’s Reflow Temperature Profile specifications.
Refer to www.national.com/packaging.
235°C
−65°C to +150°C
Converter Electrical Characteristics
The following specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential
870mVP-P, CL = 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 1 GHz at 0.5VP-P with 50% duty cycle, VBG = Floating,
Non-Extended Control Mode, SDR Mode, REXT = 3300Ω ±0.1%, Analog Signal Source Impedance = 100Ω Differential. Boldface
limits apply for TA = TMIN to TMAX. All other limits TA = 25°C, unless otherwise noted. (Notes 6, 7)
Symbol
Parameter
Conditions
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
STATIC CONVERTER CHARACTERISTICS
INL
Integral Non-Linearity (Best fit)
DC Coupled, 1MHz Sine Wave Over
ranged
±0.3
±0.9
LSB (max)
DNL
Differential Non-Linearity
DC Coupled, 1MHz Sine Wave Over
ranged
±0.15
±0.6
LSB (max)
8
Bits
−1.5
0.5
LSB (min)
LSB (max)
Resolution with No Missing
Codes
VOFF
Offset Error
VOFF_ADJ
Input Offset Adjustment Range
PFSE
Positive Full-Scale Error (Note 9)
−0.6
±25
mV (max)
NFSE
Negative Full-Scale Error (Note
9)
−1.31
±25
mV (max)
FS_ADJ
Full-Scale Adjustment Range
±20
±15
%FS
-0.45
Extended Control Mode
Extended Control Mode
±45
mV
NORMAL MODE (Non DES) DYNAMIC CONVERTER CHARACTERISTICS
FPBW
B.E.R.
Full Power Bandwidth
1.7
GHz
10-18
Error/Sample
d.c. to 500 MHz
±0.5
dBFS
d.c. to 1 GHz
±1.0
dBFS
fIN = 100 MHz, VIN = FSR − 0.5 dB
7.5
fIN = 248 MHz, VIN = FSR − 0.5 dB
7.4
7.0
Bits (min)
fIN = 498 MHz, VIN = FSR − 0.5 dB
7.4
7.0
Bits (min)
Bit Error Rate
Gain Flatness
ENOB
Normal Mode (non DES)
Effective Number of Bits
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8
Bits
SINAD
SNR
THD
2nd Harm
3rd Harm
SFDR
IMD
Parameter
Signal-to-Noise Plus Distortion
Ratio
Signal-to-Noise Ratio
Total Harmonic Distortion
Second Harmonic Distortion
Third Harmonic Distortion
Spurious-Free dynamic Range
Intermodulation Distortion
Out of Range Output Code
(In addition to OR Output high)
Conditions
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
fIN = 100 MHz, VIN = FSR − 0.5 dB
47
fIN = 248 MHz, VIN = FSR − 0.5 dB
46.3
43.9
dB (min)
fIN = 498 MHz, VIN = FSR − 0.5 dB
46.3
43.9
dB (min)
dB
fIN = 100 MHz, VIN = FSR − 0.5 dB
48
fIN = 248 MHz, VIN = FSR − 0.5 dB
47.1
44.0
dB (min)
fIN = 498 MHz, VIN = FSR − 0.5 dB
47.1
44.0
dB (min)
fIN = 100 MHz, VIN = FSR − 0.5 dB
-55
fIN = 248 MHz, VIN = FSR − 0.5 dB
-55
-47.5
dB (max)
fIN = 498 MHz, VIN = FSR − 0.5 dB
-55
-47.5
dB (max)
fIN = 100 MHz, VIN = FSR − 0.5 dB
−60
dB
fIN = 248 MHz, VIN = FSR − 0.5 dB
−60
dB
fIN = 498 MHz, VIN = FSR − 0.5 dB
−60
dB
fIN = 100 MHz, VIN = FSR − 0.5 dB
−65
dB
fIN = 248 MHz, VIN = FSR − 0.5 dB
−65
dB
fIN = 498 MHz, VIN = FSR − 0.5 dB
−65
dB
fIN = 100 MHz, VIN = FSR − 0.5 dB
55
fIN = 248 MHz, VIN = FSR − 0.5 dB
55
47.5
dB (min)
fIN = 498 MHz, VIN = FSR − 0.5 dB
55
47.5
dB (min)
fIN1 = 321 MHz, VIN = FSR − 7 dB
fIN2 = 326 MHz, VIN = FSR − 7 dB
-50
dB
dB
dB
dB
(VIN+) − (VIN−) > + Full Scale
255
(VIN+) − (VIN−) < − Full Scale
0
INTERLEAVE MODE (DES Pin 127=Float) - DYNAMIC CONVERTER CHARACTERISTICS
FPBW
(DES)
Full Power Bandwidth
ENOB
Effective Number of Bits
SINAD
Signal to Noise Plus Distortion
Ratio
SNR
Signal to Noise Ratio
THD
2nd Harm
Total Harmonic Distortion
Second Harmonic Distortion
3rd Harm
Third Harmonic Distortion
SFDR
Spurious Free Dynamic Range
Dual Edge Sampling Mode
900
MHz
fIN = 248 MHz, VIN = FSR − 0.5 dB
7.3
6.8
Bits (min)
fIN = 498 MHz, VIN = FSR − 0.5 dB
7.3
6.8
Bits (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
46
42.5
dB (min)
fIN = 498 MHz, VIN = FSR − 0.5 dB
46
42.5
dB (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
46.4
43
dB (min)
fIN = 498 MHz, VIN = FSR − 0.5 dB
46.4
43
dB (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
-58
-49
dB (min)
fIN = 498 MHz, VIN = FSR − 0.5 dB
-58
-49
dB (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
-64
dB
fIN = 498 MHz, VIN = FSR − 0.5 dB
-64
dB
fIN = 248 MHz, VIN = FSR − 0.5 dB
-69
dB
fIN = 498 MHz, VIN = FSR − 0.5 dB
-69
dB
fIN = 248 MHz, VIN = FSR − 0.5 dB
57
47
dB (min)
fIN = 498 MHz, VIN = FSR − 0.5 dB
57
47
dB (min)
ANALOG INPUT AND REFERENCE CHARACTERISTICS
VIN
VCMI
FSR pin 14 Low
650
FSR pin 14 High
870
Full Scale Analog Differential
Input Range
Analog Input Common Mode
Voltage
VCMO
9
570
mVP-P (min)
730
mVP-P (max)
790
mVP-P (min)
950
mVP-P (max)
VCMO − 50
VCMO + 50
mV (min)
mV (max)
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ADC08D1000
Symbol
ADC08D1000
Symbol
CIN
RIN
Parameter
Conditions
Differential
Analog Input Capacitance,
Normal operation (Notes 10, 11) Each input pin to ground
Analog Input Capacitance, DES
Mode (Notes 10, 11)
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
0.02
pF
1.6
pF
Differential
0.08
pF
Each input pin to ground
2.2
pF
Differential Input Resistance
100
94
Ω (min)
106
Ω (max)
0.95
1.45
V (min)
V (max)
ANALOG OUTPUT CHARACTERISTICS
VCMO
Common Mode Output Voltage
ICMO = ±100 µA
1.26
VCMO_LVL
VCMO input threshold to set DC
Coupling mode
VA = 1.8V
0.60
V
VA = 2.0V
0.66
V
TC VCMO
Common Mode Output Voltage
Temperature Coefficient
TA = −40°C to +85°C
118
ppm/°C
CLOAD VCMO
Maximum VCMO load
Capacitance
VBG
Bandgap Reference Output
Voltage
IBG = ±100 µA
TC VBG
Bandgap Reference Voltage
Temperature Coefficient
TA = −40°C to +85°C,
IBG = ±100 µA
CLOAD VBG
Maximum Bandgap Reference
load Capacitance
1.26
80
pF
1.20
1.33
V (min)
V (max)
28
ppm/°C
80
pF
TEMPERATURE DIODE CHARACTERISTICS
ΔVBE
Temperature Diode Voltage
192 µA vs. 12 µA,
TJ = 25°C
71.23
mV
192 µA vs. 12 µA,
TJ = 85°C
85.54
mV
1
LSB
1
LSB
CHANNEL-TO-CHANNEL CHARACTERISTICS
Offset Match
Positive Full-Scale Match
Zero offset selected in Control Register
Negative Full-Scale Match
Zero offset selected in Control Register
Phase Matching (I, Q)
FIN = 1.0 GHz
1
LSB