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ADC1001CCJ-1

ADC1001CCJ-1

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    CDIP20

  • 描述:

    IC ADC 10BIT SAR 20CDIP

  • 数据手册
  • 价格&库存
ADC1001CCJ-1 数据手册
ADC1001 ADC1001 10-Bit µP Compatible A/D Converter Literature Number: SNAS536 ADC1001 10-Bit µP Compatible A/D Converter General Description Features The ADC1001 is a CMOS, 10-bit successive approximation A/D converter. The 20-pin ADC1001 is pin compatible with the ADC0801 8-bit A/D family. The 10-bit data word is read in two 8-bit bytes, formatted left justified and high byte first. The six least significant bits of the second byte are set to zero, as is proper for a 16-bit word. Differential inputs provide low frequency input common mode rejection and allow offsetting the analog range of the converter. In addition, the reference input can be adjusted enabling the conversion of reduced analog ranges with 10-bit resolution. n ADC1001 is pin compatible with ADC0801 series 8-bit A/D converters n Compatible with NSC800 and 8080 µP derivatives — no interfacing logic needed n Easily interfaced to 6800 µP derivatives n Differential analog voltage inputs n Logic inputs and outputs meet both MOS and TTL voltage level specifications n Works with 2.5V (LM336) voltage reference n On-chip clock generator n 0V to 5V analog input voltage range with single 5V supply n Operates ratiometrically or with 5 VDC, 2.5 VDC, or analog span adjusted voltage reference n 0.3" standard width 20-pin DIP package Key Specifications n Resolution n Linearity error n Conversion time 10 bits ± 1 LSB 200µS Connection Diagram ADC1001 Dual-In-Line Package DS005675-11 Top View Ordering Information Temperature Range Order Number Package Outline 0˚C to +70˚C −40˚C to +85˚C ADC1001CCJ-1 ADC1001CCJ J20A J20A TRI-STATE ® is a registered trademark of National Semiconductor Corp. © 1999 National Semiconductor Corporation DS005675 www.national.com ADC1001 10-Bit µP Compatible A/D Converter June 1999 Absolute Maximum Ratings (Notes 1, 2) Lead Temp. (Soldering, 10 seconds) ESD Susceptibility (Note 10) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (VCC) (Note 3) Logic Control Inputs Voltage at Other Inputs and Outputs Storage Temperature Range Package Dissipation at TA = 25˚C Operating Conditions 6.5V −0.3V to +18V −0.3V to (VCC+0.3V) −65˚C to +150˚C 875 mW 300˚C 800V (Notes 1, 2) TMIN ≤TA≤TMAX −40˚C≤TA≤+85˚C 0˚C≤TA≤+70˚C 4.5 VDC to 6.3 VDC Temperature Range ADC1001CCJ ADC1001CCJ-1 Range of VCC Converter Characteristics Converter Specifications: VCC = 5 VDC, VREF/2 = 2.500 VDC, TMIN≤TA≤TMAX and fCLK = 410 kHz unless otherwise specified. Parameter Conditions MIn Typ Linearity Error Zero Error Full-Scale Error Total Ladder Resistance (Note 9) Input Resistance at Pin 9 Analog Input Voltage Range (Note 4) V(+) or V(−) 2.2 DC Common-Mode Error Over Analog Input Voltage Range VCC = 5 VDC ± 5% Over Units ±1 ±2 ±2 LSB VCC+0.05 VDC 4.8 GND−0.05 Power Supply Sensitivity Max LSB LSB KΩ ± 1⁄8 ± 1⁄8 LSB LSB Allowed VIN(+) and VIN(−) Voltage Range (Note 4) AC Electrical Characteristics Timing Specifications: VCC = 5 VDCand TA = 25˚C unless otherwise specified. Symbol Parameter Conditions MIn Typ Units 90 1/fCLK Conversion Time (Note 5) fCLK = 410 kHz 195 220 µs fCLK Clock Frequency (Note 8) 100 1260 kHz Clock Duty Cycle CR Conversion Rate In Free-Running Mode tW(WR)L Width of WR Input (Start Pulse 80 Max Tc 40 INTR tied to WR with CS = 0 VDC, fCLK = 410 kHz CS = 0 VDC (Note 6) 60 % 4600 conv/s 150 ns Width) tACC Access Time (Delay from CL = 100 pF 170 300 ns 125 200 ns 300 450 ns 5 7.5 pF 5 7.5 pF Falling Edge of RD to Output Data Valid) t1H, t0H tWI, tRI TRI-STATE ® Control (Delay CL = 10 pF, RL = 10k from Rising Edge of RD to (See TRI-STATE Test Hi-Z State) Circuits) Delay from Falling Edge of WR or RD to Reset of INTR t1rs INTR to 1st Read Set-Up Time CIN Input Capacitance of Logic 550 400 ns Control Inputs COUT TRI-STATE Output Capacitance (Data Buffers) www.national.com 2 DC Electrical Characteristics The following specifications apply for VCC = 5 VDC and TMIN≤TA≤ TMAX, unless otherwise specified. Symbol Parameter Conditions MIn Typ Max Units CONTROL INPUTS [Note: CLK IN is the input of a Schmitt trigger circuit and is therefore specified separately] VIN (1) Logical “1” Input Voltage VCC = 5.25 VDC 2.0 15 VDC (Except CLK IN) VIN (0) Logical “0” Input Voltage VCC = 4.75 VDC 0.8 VDC 1 µADC (Except CLK IN) IIN (1) Logical “1” Input Current VIN = 5 VDC 0.005 (All Inputs) IIN (0) Logical “0” input Current VIN = 0 VDC −1 −0.005 µADC 2.7 3.1 3.5 VDC 1.5 1.8 2.1 VDC 0.6 1.3 2.0 VDC 0.4 VDC (All Inputs) CLOCK IN VT+ CLK IN Positive Going Threshold Voltage VT− CLK IN Negative Going Threshold Voltage VH CLK IN Hysteresis (VT+)−(VT−) OUTPUTS AND INTR VOUT(0) Logical “0” Output Voltage VOUT(1) Logical “1” Output Voltage IOUT = 1.6 mA, VCC = 4.75 VDC IO = −360 µA, VCC = 4.75 VDC TRI-STATE Disabled Output IO = −10 µA, VCC = 4.75 VDC VOUT = 0.4 VDC Leakage (All Data Buffers) VOUT = 5 VDC IOUT VOUT Short to GND, TA = 25˚C VOUT Short to VCC, TA = 25˚C ISOURCE ISINK 2.4 VDC 4.5 VDC 0.1 −100 0.1 3 µADC µADC 4.5 6 mADC 9.0 16 mADC POWER SUPPLY ICC Supply Current (Includes fCLK = 410 kHz, Ladder Current) VREF/2 = NC, TA = 25˚C and CS = 1 2.5 5.0 mA Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its specified operating conditions. Note 2: All voltages are measured with respect to GND, unless otherwise specified. The separate A GND point should always be wired to the D GND. Note 3: A zener diode exists, internally, from VCC to GND and has a typical breakdown voltage of 7 VDC. Note 4: For VIN(−)≥ VIN(+) the digital output code will be all zeros. Two on-chip diodes are tied to each analog input (see Block Diagram) which will forward conduct for analog input voltages one diode drop below ground or one diode drop greater than the VCC supply. Be careful, during testing at low VCC levels (4.5V), as high level analog inputs (5V) can cause this input diode to conduct — especially at elevated temperatures, and cause errors for analog inputs near fullscale. The spec allows 50 mV forward bias of either diode. This means that as long as the analog VIN does not exceed the supply voltage by more than 50 mV, the output code will be correct. To achieve an absolute 0 VDC to 5 VDC input voltage range will therefore require a minimum supply voltage of 4.950 VDC over temperature variations, initial tolerance and loading. Note 5: With an asynchronous start pulse, up to 8 clock periods may be required before the internal clock phases are proper to start the conversion process. The start request is internally latched, see Figure 3 . Note 6: The CS input is assumed to bracket the WR strobe input and therefore timing is dependent on the WR pulse width. An arbitrarily wide pulse width will hold the converter in a reset mode and the start of conversion is initiated by the low to high transition of the WR pulse (see Timing Diagrams). Note 7: All typical values are for TA = 25˚C. Note 8: Accuracy is guaranteed at fCLK = 410 kHz. At higher clock frequencies accuracy can degrade. Note 9: The VREF/2 pin is the center point of a two resistor divider (each resistor is 2.4kΩ) connected from VCC to ground. Total ladder input resistance is the sum of these two equal resistors. Note 10: Human body model, 100 pF discharged through a 1.5 kΩ resistor. 3 www.national.com Typical Performance Characteristics Logic Input Threshold Voltage vs Supply Voltage Delay From Falling Edge of RD to Output Data Valid vs Load Capacitance CLK IN Schmitt Trip Levels vs Supply Voltage DS005675-14 DS005675-16 DS005675-15 Output Current vs Temperature DS005675-17 TRI-STATE Test Circuits and Waveforms t1H, CL = 10 pF DS005675-3 DS005675-4 tr = 20 ns t0H, CL = 10 pF DS005675-6 DS005675-5 www.national.com tr = 20 ns 4 TRI-STATE Test Circuits and Waveforms (Continued) Timing Diagrams DS005675-7 Output Enable and Reset INTR DS005675-8 *All timing is measured from the 50% voltage points. 5 www.national.com Timing Diagrams (Continued) Byte Sequencing For The 20-Pin ADC1001 Byte Order 8-Bit Data Bus Connection DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 0 0 0 0 0 0 MSB 1st Bit 9 LSB 2nd Bit 1 Bit 0 Functional Description because the SET input can control the Q output of the INTR F/F even though the RESET input is constantly at a “1” level. This INTR output will therefore stay low for the duration of the SET signal. When data is to be read, the combination of both CS and RD being low will cause the INTR F/F to be reset and the TRI-STATE output latches will be enabled. The ADC1001 uses an advanced potentiometric resistive ladder network. The analog inputs, as well as the taps of this ladder network, are switched into a weighted capacitor array. The output of this capacitor array is the input to a sampled data comparator. This comparator allows the successive approximation logic to match the analog difference input voltage [VIN(+)−VIN(−)] to taps on the R network. The most significant bit is tested first and after 10 comparisons (80 clock cycles) a digital 10-bit binary code (all “1”s = full-scale) is transferred to an output latch and then an interrupt is asserted (INTR makes a high-to-low transition). The device may be operated in the free-running mode by connecting INTR to the WR input with CS = 0. To ensure start-up under all possible conditions, an external WR pulse is required during the first power-up cycle. A conversion in process can be interrupted by issuing a second start command. On the high-to-low transition of the WR input the internal SAR latches and the shift register stages are reset. As long as the CS input and WR input remain low, the A/D will remain in a reset state. Conversion will start from 1 to 8 clock periods after at least one of these inputs makes a low-to-high transition. Zero and Full-Scale Adjustment Zero error can be adjusted as shown in Figure 1. VIN(+) is forced to +2.5 mV (+1⁄2 LSB) and the potentiometer is adjusted until the digital output code changes from 00 0000 0000 to 00 0000 0001. Full-scale is adjusted as shown in Figure 2, with the VREF/2 input. With VIN (+) forced to the desired full-scale voltage less 11⁄2 LSBs (VFS−11⁄2 LSBs), VREF/2 is adjusted until the digital output code changes from 11 1111 1110 to 11 1111 1111. A functional diagram of the A/D converter is shown in Figure 3. All of the inputs and outputs are shown and the major logic control paths are drawn in heavier weight lines. The conversion is initialized by taking CS and WR simultaneously low. This sets the start flip-flop (F/F) and the resulting “1” level resets the 8-bit shift register, resets the Interrupt (INTR) F/F and inputs a “1” to the D flop, F/F1, which is at the input end of the 10-bit shift register. Internal clock signals then transfer this “1” to the Q output of F/F1. The AND gate, G1, combines this “1” output with a clock signal to provide a reset signal to the start F/F. If the set signal is no longer present (either WR or CS is a “1”) the start F/F is reset and the 10-bit shift register then can have the “1” clocked in, which allows the conversion process to continue. If the set signal were to still be present, this reset pulse would have no effect and the 10-bit shift register would continue to be held in the reset mode. This logic therefore allows for wide CS and WR signals and the converter will start after at least one of these signals returns high and the internal clocks again provide a reset signal for the start F/F. After the “1” is clocked through the 10-bit shift register (which completes the SAR search) it causes the new digital word to transfer to the TRI-STATE output latches. When this XFER signal makes a high-to-low transition the one shot fires, setting the INTR F/F. An inverting buffer then supplies the INTR output signal. Note that this SET control of the INTR F/F remains low for aproximately 400 ns. If the data output is continuously enabled (CS and RD both held low), the INTR output will still signal the end of the conversion (by a high-to-low transition), www.national.com 6 Functional Description (Continued) DS005675-9 DS005675-10 Note 11: VIN(−) should be biased so that VIN(−)≥ −0.05V when potentiometer wiper is set at most negative voltage position. FIGURE 2. Full-Scale Adjust FIGURE 1. Zero Adjust Circuit Typical Application DS005675-1 7 www.national.com Block Diagram DS005675-13 Note 12: CS shown twice for clarity. Note 13: SAR = Successive Approximation Register. FIGURE 3. www.national.com 8 ADC1001 10-Bit µP Compatible A/D Converter Physical Dimensions inches (millimeters) unless otherwise noted Cavity Dual-In-Line Package (J) (Side Brazed) Order Number ADC1001CCJ or ADC1001CCJ-1 NS Package Number J20A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: support@nsc.com www.national.com National Semiconductor Europe Fax: +49 (0) 1 80-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 1 80-530 85 85 English Tel: +49 (0) 1 80-532 78 32 Français Tel: +49 (0) 1 80-532 93 58 Italiano Tel: +49 (0) 1 80-534 16 80 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: sea.support@nsc.com National Semiconductor Japan Ltd. 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ADC1001CCJ-1

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