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ADC10D1500CIUT

ADC10D1500CIUT

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    PBGA292

  • 描述:

    IC ADC 10BIT FOLD INTERP 292BGA

  • 数据手册
  • 价格&库存
ADC10D1500CIUT 数据手册
ADC10D1000, ADC10D1500 www.ti.com SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 ADC10D1000/ADC10D1500 Low Power, 10-Bit, Dual 1.0/1.5 GSPS or Single 2.0/3.0 GSPS ADC Check for Samples: ADC10D1000, ADC10D1500 FEATURES DESCRIPTION • • • The ADC10D1000/1500 is the latest advance in TI's Ultra-High-Speed ADC family. This low-power, highperformance CMOS analog-to-digital converter digitizes signals at 10-bit resolution for dual channels at sampling rates of up to 1.0/1.5 GSPS (Non-DES Mode) or for a single channel up to 2.0/3.0 GSPS (DES Mode). The ADC10D1000/1500 achieves excellent accuracy and dynamic performance while dissipating less than 2.8/3.6 Watts. The product is packaged in a leaded or lead-free 292-ball thermally enhanced BGA package over the rated industrial temperature range of -40°C to +85°C. 1 2 • • • • • • • • • • Excellent Accuracy and Dynamic Performance Pin Compatible with ADC12D1000/1600/1800 Low Power Consumption, Further Reduced at Lower Fs Internally Terminated, Buffered, Differential Analog Inputs R/W SPI Interface for Extended Control Mode Dual-Edge Sampling Mode, in Which the I- and Q-channels Sample One Input at Twice the Sampling Clock Rate Test Patterns at Output for System Debug Programmable 15-bit Gain and 12-bit Plus Sign Offset Programmable tAD Adjust Feature 1:1 Non-demuxed or 1:2 Demuxed LVDS Outputs AutoSync Feature for Multi-Chip Systems Single 1.9V ± 0.1V Power Supply 292-Ball BGA Package (27mm x 27mm x 2.4mm with 1.27mm Ball-Pitch); No Heat Sink Required APPLICATIONS • • • Wideband Communications Data Acquisition Systems Digital Oscilloscopes The ADC10D1000/1500 builds upon the features, architecture and functionality of the 8-bit GHz family of ADCs. An expanded feature set includes AutoSync for multi-chip synchronization, 15-bit programmable gain and 12-bit plus sign programmable offset adjustment for each channel. The improved internal track-and-hold amplifier and the extended selfcalibration scheme enable a very flat response of all dynamic parameters beyond Nyquist, producing 9.1/9.0 Effective Number of Bits (ENOB) with a 100 MHz input signal and a 1.0/1.5 GHz sample rate while providing a 10-18 Code Error Rate (CER) Dissipating a typical 2.77/3.59 Watts in NonDemultiplex Mode at 1.0/1.5 GSPS from a single 1.9V supply, this device is specified to have no missing codes over the full operating temperature range. Each channel has its own independent DDR Data Clock, DCLKI and DCLKQ, which are in phase when both channels are powered up, so that only one Data Clock could be used to capture all data, which is sent out at the same rate as the input sample clock. If the 1:2 Demux Mode is selected, a second 10-bit LVDS bus becomes active for each channel, such that the output data rate is sent out two times slower to relax data-capture timing requirements. The part can also be used as a single 2.0/3.0 GSPS ADC to sample one of the I or Q inputs. The output formatting can be programmed to be offset binary or two's complement and the Low Voltage Differential Signaling (LVDS) digital outputs are compatible with IEEE 1596.3-1996, with the exception of an adjustable common mode voltage between 0.8V and 1.2V to allow for power reduction for well-controlled back planes. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2013, Texas Instruments Incorporated ADC10D1000, ADC10D1500 SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Table 1. Key Specifications (Non-Demux Non-DES Mode, Fs=1.0/1.5 GSPS, Fin = 100 MHz) Resolution 10 Bits Conversion Rate Dual channels at 1.0/1.5 GSPS (typ) Single channel at 2.0/3.0 GSPS (typ) Code Error Rate 10-18/10-18 (typ) ENOB 9.1/9.0 bits (typ) SNR 57/56.8 dB (typ) SFDR 70/68 dBc (typ) Full Power Bandwidth 2.8/2.8 GHz (typ) DNL ±0.25/±0.25 LSB (typ) Power Consumption Single Channel Enabled 1.61/1.92 W (typ) Dual Channels Enabled 2.77/3.59 W (typ) Power Down Mode 6/6 mW (typ) Table 2. Ordering Information (1) (2) (1) (2) 2 Industrial Temperature Range (–40°C < TA < 85°C) Package ADC10D1000/1500CIUT/NOPB Lead-free 292-Ball BGA Thermally Enhanced Package ADC10D1000/1500CIUT Leaded 292-Ball BGA Thermally Enhanced Package ADC10D1000/1500RB Reference Board For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. IBIS models are available at www.ti.com Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 ADC10D1000, ADC10D1500 www.ti.com SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 Block Diagram 10 VinI+ 10 Rterm T/H 10- Bit ADC DI(9:0) 1:2 Demux 10 DId(9:0) VinI- DCLKI M ORI RCOut1 Output RCOut2 Buffers ORQ Clock Management and AutoSync U X DCLKQ 10 VinQ+ 10 Rterm T/H 10- Bit ADC DQ(9:0) 1:2 Demux 10 DQd(9:0) VinQCLK+ Rterm Control/Status and Other Logic CLKRCLK+ Rterm Control Pins SPI RCLK- Figure 1. Simplified Block Diagram Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 Submit Documentation Feedback 3 ADC10D1000, ADC10D1500 SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 www.ti.com Connection Diagram 1 2 3 4 5 6 7 8 A GND V_A SDO TPM NDM V_A GND V_E B Vbg GND ECEb SDI CalRun V_A GND GND_E C Rtrim+ Vcmo Rext+ SCSb SCLK V_A NC V_E D DNC Rtrim- Rext- GND GND CAL DNC V_A E V_A Tdiode+ DNC F V_A GND _TC G V_TC H 11 12 13 14 15 16 17 18 19 20 V_DR DId1+ GND_ DR DId4+ V_DR DId7+ GND_ DR DId9+ DId9- GND_ DR A RSV0- DId0+ DId1- DId3+ DId4- DId6+ DId7- DId8+ RSV2+ RSV3+ RSV3- B GND_E RSV1+ DId0- DId2+ DId3- DId5+ DId6- DId8- RSV2- V_DR DI0+ DI0- C V_DR DId2- GND_ DR DId5- V_DR GND_ DR V_DR DI1+ DI2+ DI2- D GND GND_ DR DI1- DI3+ DI3- E Tdiode- DNC GND_ DR DI4+ DI4- GND_ DR F GND _TC V_TC V_TC DI5+ DI5- DI6+ DI6- G VinI+ V_TC GND _TC V_A GND GND GND GND GND GND DI7+ DI7- DI8+ DI8- H J VinI- GND _TC V_TC VbiasI GND GND GND GND GND GND V_DR DI9+ DI9- V_DR J K GND VbiasI V_TC GND _TC GND GND GND GND GND GND ORI+ ORI- DCLK _I+ L GND VbiasQ V_TC GND _TC GND GND GND GND GND GND ORQ+ ORQ- DCLK _Q+ DCLK _Q- L M VinQ- GND _TC V_TC VbiasQ GND GND GND GND GND GND GND_ DR DQ9+ DQ9- GND_ DR M N VinQ+ V_TC GND _TC V_A GND GND GND GND GND GND DQ7+ DQ7- DQ8+ DQ8- N P V_TC GND _TC V_TC V_TC DQ5+ DQ5- DQ6+ DQ6- P R V_A GND _TC V_TC V_TC V_DR DQ4+ DQ4- V_DR R T V_A GND _TC GND _TC GND V_DR DQ1- DQ3+ DQ3- T U GND _TC CLK+ PDI GND GND RCOut _1- DNC V_A V CLK- DCLK _RST+ PDQ CalDly DES RCOut _2+ RCOut _2- V_E W DCLK _RST- GND DNC DDRPh RCLK- V_A GND GND_E Y GND V_A FSR RCLK+ RCOut _1+ V_A GND V_E 1 2 3 4 6 7 8 5 9 10 GND_E RSV0+ V_E V_A RSV1- DCLK _I- K RSV7- V_DR DQd2- GND_ DR DQd5- V_DR V_DR GND_ DR DQ1+ DQ2+ DQ2- U GND_E RSV7+ DQd0- DQd2+ DQd3- DQd5+ DQd6- DQd8- RSV4- GND_ DR DQ0+ DQ0- V DQd0+ DQd1- DQd3+ DQd4- DQd6+ DQd7- DQd8+ RSV4+ RSV5+ RSV5- W V_DR DQd1+ GND_ DR DQd4+ V_DR DQd7+ GND_ DR DQd9+ DQd9- GND_ DR Y 11 12 13 14 15 16 17 18 19 20 V_A V_E RSV6- GND_E RSV6+ 9 10 Figure 2. ADC10D1000/1500 Connection Diagram NOTE The center ground pins are for thermal dissipation and must be soldered to a ground plane to ensure rated performance. See SUPPLY/GROUNDING, LAYOUT AND THERMAL RECOMMENDATIONS for more information. 4 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 ADC10D1000, ADC10D1500 www.ti.com SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 Ball Descriptions and Equivalent Circuits Table 3. Analog Front-End and Clock Balls Ball No. Name Equivalent Circuit Description VA 50k AGND H1/J1 N1/M1 VinI+/VinQ+/- VCMO 100 Control from VCMO VA 50k AGND Differential signal I- and Q-inputs. In the Non-Dual Edge Sampling (Non-DES) Mode, each I- and Qinput is sampled and converted by its respective channel with each positive transition of the CLK input. In Non-ECM (Non-Extended Control Mode) and DES Mode, both channels sample the I-input. In Extended Control Mode (ECM), the Q-input may optionally be selected for conversion in DES Mode by the DEQ Bit (Addr: 0h, Bit 6). Each I- and Q-channel input has an internal common mode bias that is disabled when DCcoupled Mode is selected. Both inputs must be either AC- or DC-coupled. The coupling mode is selected by the VCMO Pin. In Non-ECM, the full-scale range of these inputs is determined by the FSR Pin; both I- and Qchannels have the same full-scale input range. In ECM, the full-scale input range of the I- and Qchannel inputs may be independently set via the Control Register (Addr: 3h and Addr: Bh). Note that the high and low full-scale input range setting in Non-ECM corresponds to the mid and minimum full-scale input range in ECM. The input offset may also be adjusted in ECM. VA U2/V1 50k AGND CLK+/- VA 100 VBIAS 50k Differential Converter Sampling Clock. In the NonDES Mode, the analog inputs are sampled on the positive transitions of this clock signal. In the DES Mode, the selected input is sampled on both transitions of this clock. This clock must be ACcoupled. AGND VA AGND V2/W1 DCLK_RST+/- 100 VA Differential DCLK Reset. A positive pulse on this input is used to reset the DCLKI and DCLKQ outputs of two or more ADC10D1000/1500s in order to synchronize them with other ADC10D1000/1500s in the system. DCLKI and DCLKQ are always in phase with each other, unless one channel is powered down, and do not require a pulse from DCLK_RST to become synchronized. The pulse applied here must meet timing relationships with respect to the CLK input. Although supported, this feature has been superseded by AutoSync. AGND Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 Submit Documentation Feedback 5 ADC10D1000, ADC10D1500 SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 www.ti.com Table 3. Analog Front-End and Clock Balls (continued) Ball No. Name Equivalent Circuit Description VA VCMO C2 200k VCMO Enable AC Coupling 8 pF GND VA B1 Common Mode Voltage Output or Signal Coupling Select. If AC-coupled operation at the analog inputs is desired, this pin should be held at logiclow level. This pin is capable of sourcing/ sinking up to 100 µA. For DC-coupled operation, this pin should be left floating or terminated into highimpedance. In DC-coupled Mode, this pin provides an output voltage which is the optimal commonmode voltage for the input signal and should be used to set the common-mode voltage of the driving buffer. Bandgap Voltage Output or LVDS Common-mode Voltage Select. This pin provides a buffered version of the bandgap output voltage and is capable of sourcing/sinking 100 uA and driving a load of up to 80 pF. Alternately, this pin may be used to select the LVDS digital output commonmode voltage. If tied to logic-high, the 1.2V LVDS common-mode voltage is selected; 0.8V is the default. VBG GND VA C3/D3 Rext+/- V External Reference Resistor terminals. A 3.3 kΩ ±0.1% resistor should be connected between Rext+/-. The Rext resistor is used as a reference to trim internal circuits which affect the linearity of the converter; the value and precision of this resistor should not be compromised. V Input Termination Trim Resistor terminals. A 3.3 kΩ ±0.1% resistor should be connected between Rtrim+/-. The Rtrim resistor is used to establish the calibrated 100Ω input impedance of VinI, VinQ and CLK. These impedances may be fine tuned by varying the value of the resistor by a corresponding percentage; however, the tuning range and performance is not specified for such an alternate value. GND VA C1/D2 Rtrim+/- GND VA Tdiode_P E2/F3 GND Tdiode+/- VA Temperature Sensor Diode Positive (Anode) and Negative (Cathode) Terminals. This set of pins is used for die temperature measurements. It has not been fully characterized. Tdiode_N GND 6 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 ADC10D1000, ADC10D1500 www.ti.com SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 Table 3. Analog Front-End and Clock Balls (continued) Ball No. Name Equivalent Circuit Description VA Y4/W5 50k AGND RCLK+/- 100 VA VBIAS 50k Reference Clock Input. When the AutoSync feature is active, and the ADC10D1000/1500 is in Slave Mode, the internal divided clocks are synchronized with respect to this input clock. The delay on this clock may be adjusted when synchronizing multiple ADCs. This feature is available in ECM via Control Register (Addr: Eh). AGND VA 100: Y5/U6 V6/V7 100: RCOut1+/RCOut2+/- + Reference Clock Output 1 and 2. These signals provide a reference clock at a rate of CLK/4, when enabled, independently of whether the ADC is in Master or Slave Mode. They are used to drive the RCLK of another ADC10D1000/1500, to enable automatic synchronization for multiple ADCs (AutoSync feature). The impedance of each trace from RCOut1 and RCOut2 to the RCLK of another ADC10D1000/1500 should be 100Ω differential. Having two clock outputs allows the autosynchronization to propagate as a binary tree. Use the DOC Bit (Addr: Eh, Bit 1) to enable/ disable this feature; default is disabled. A GND Table 4. Control and Status Balls Ball No. Name Equivalent Circuit VA V5 DES GND Description Dual Edge Sampling (DES) Mode select. In the Non-Extended Control Mode (Non-ECM), when this input is set to logic-high, the DES Mode of operation is selected, meaning that the VinI input is sampled by both channels in a time-interleaved manner. The VinQ input is ignored. When this input is set to logic-low, the device is in Non-DES Mode, i.e. the I- and Q-channels operate independently. In the Extended Control Mode (ECM), this input is ignored and DES Mode selection is controlled through the Control Register by the DES Bit (Addr: 0h, Bit 7); default is NonDES Mode operation. VA V4 Calibration Delay select. By setting this input logichigh or logic-low, the user can select the device to wait a longer or shorter amount of time, respectively, before the automatic power-on selfcalibration is initiated. This feature is pin-controlled only and is always active during ECM and NonECM. CalDly GND Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 Submit Documentation Feedback 7 ADC10D1000, ADC10D1500 SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 www.ti.com Table 4. Control and Status Balls (continued) Ball No. Name Equivalent Circuit VA D6 CAL GND Description Calibration cycle initiate. The user can command the device to execute a self-calibration cycle by holding this input high a minimum of tCAL_H after having held it low a minimum of tCAL_L. If this input is held high at the time of power-on, the automatic power-on calibration cycle is inhibited until this input is cycled low-then-high. This pin is active in both ECM and Non-ECM. In ECM, this pin is logically OR'd with the CAL Bit (Addr: 0h, Bit 15) in the Control Register. Therefore, both pin and bit must be set low and then either can be set high to execute an on-command calibration. VA B5 Calibration Running indication. This output is logic-high while the calibration sequence is executing. This output is logic-low otherwise. CalRun GND VA 50 k: U3 V3 PDI PDQ GND Power Down I- and Q-channel. Setting either input to logic-high powers down the respective I- or Qchannel. Setting either input to logic-low brings the respective I- or Q-channel to a operational state after a finite time delay. This pin is active in both ECM and Non-ECM. In ECM, each Pin is logically OR'd with its respective Bit. Therefore, either this pin or the PDI and PDQ Bit in the Control Register can be used to power-down the I- and Q-channel (Addr: 0h, Bit 11 and Bit 10), respectively. VA A4 Test Pattern Mode select. With this input at logichigh, the device continuously outputs a fixed, repetitive test pattern at the digital outputs. In the ECM, this input is ignored and the Test Pattern Mode can only be activated through the Control Register by the TPM Bit (Addr: 0h, Bit 12). TPM GND VA A5 Non-Demuxed Mode select. Setting this input to logic-high causes the digital output bus to be in the 1:1 Non-Demuxed Mode. Setting this input to logic-low causes the digital output bus to be in the 1:2 Demuxed Mode. This feature is pin-controlled only and remains active during ECM and NonECM. NDM GND 8 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 ADC10D1000, ADC10D1500 www.ti.com SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 Table 4. Control and Status Balls (continued) Ball No. Name Equivalent Circuit VA Y3 FSR GND VA W4 DDRPh GND Description Full-Scale input Range select. In Non-ECM, when this input is set to logic-low or logic-high, the fullscale differential input range for both I- and Qchannel inputs is set to the lower or higher FSR value, respectively. In the ECM, this input is ignored and the full-scale range of the I- and Qchannel inputs is independently determined by the setting of Addr: 3h and Addr: Bh, respectively. Note that the high (lower) FSR value in Non-ECM corresponds to the mid (min) available selection in ECM; the FSR range in ECM is greater. DDR Phase select. This input, when logic-low, selects the 0° Data-to-DCLK phase relationship. When logic-high, it selects the 90° Data-to-DCLK phase relationship, i.e. the DCLK transition indicates the middle of the valid data outputs. This pin only has an effect when the chip is in 1:2 Demuxed Mode, i.e. the NDM pin is set to logiclow. In ECM, this input is ignored and the DDR phase is selected through the Control Register by the DPS Bit (Addr: 0h, Bit 14); the default is 0° Mode. VA 50 k: B3 ECE Extended Control Enable bar. Extended feature control through the SPI interface is enabled when this signal is asserted (logic-low). In this case, most of the direct control pins have no effect. When this signal is de-asserted (logic-high), the SPI interface is disabled, all SPI registers are reset to their default values, and all available settings are controlled via the control pins. GND VA 100 k: C4 SCS Serial Chip Select bar. In ECM, when this signal is asserted (logic-low), SCLK is used to clock in serial data which is present on SDI and to source serial data on SDO. When this signal is deasserted (logic-high), SDI is ignored and SDO is in tri-stated. GND VA 100 k: C5 SCLK Serial Clock. In ECM, serial data is shifted into and out of the device synchronously to this clock signal. This clock may be disabled and held logiclow, as long as timing specifications are not violated when the clock is enabled or disabled. GND Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 Submit Documentation Feedback 9 ADC10D1000, ADC10D1500 SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 www.ti.com Table 4. Control and Status Balls (continued) Ball No. Name Equivalent Circuit Description VA 100 k: B4 Serial Data-In. In ECM, serial data is shifted into the device on this pin while SCS signal is asserted (logic-low). SDI GND VA A3 Serial Data-Out. In ECM, serial data is shifted out of the device on this pin while SCS signal is asserted (logic-low). This output is tri-stated when SCS is de-asserted. SDO GND D1, D7, E3, F4, W3, U7 DNC NONE Do Not Connect. These pins are used for internal purposes and should not be connected, i.e. left floating. Do not ground. C7 NC NONE Not Connected. This pin is not bonded and may be left floating or connected to any potential. Table 5. Power and Ground Balls Ball No. Name Equivalent Circuit A2, A6, B6, C6, D8, D9, E1, F1, H4, N4, R1, T1, U8, U9, W6, Y2, Y6 VA NONE Power Supply for the Analog circuitry. This supply is tied to the ESD ring. Therefore, it must be powered up before or with any other supply. G1, G3, G4, H2, J3, K3, L3, M3, N2, P1, P3, P4, R3, R4 VTC NONE Power Supply for the Track-and-Hold and Clock circuitry. A11, A15, C18, D11, D15, D17, J17, J20, R17, R20, T17, U11, U15, U16, Y11, Y15 VDR NONE Power Supply for the Output Drivers. A8, B9, C8, V8, W9, Y8 VE NONE Power Supply for the Digital Encoder. NONE Bias Voltage I-channel. This is an externally decoupled bias voltage for the I-channel. Each pin should individually be decoupled with a 100 nF capacitor via a low resistance, low inductance path to GND. NONE Bias Voltage Q-channel. This is an externally decoupled bias voltage for the Q-channel. Each pin should individually be decoupled with a 100 nF capacitor via a low resistance, low inductance path to GND. J4, K2 L2, M4 10 VbiasI VbiasQ Submit Documentation Feedback Description Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 ADC10D1000, ADC10D1500 www.ti.com SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 Table 5. Power and Ground Balls (continued) Ball No. Name Equivalent Circuit A1, A7, B2, B7, D4, D5, E4, K1, L1, T4, U4, U5, W2, W7, Y1, Y7, H8:N13 Description GND NONE Ground Return for the Analog circuitry. F2, G2, H3, J2, K4, L4, M2, N3, P2, R2, T2, T3, U1 GNDTC NONE Ground Return for the Track-and-Hold and Clock circuitry. A13, A17, A20, D13, D16, E17, F17, F20, M17, M20, U13, U17, V18, Y13, Y17, Y20 GNDDR NONE Ground Return for the Output Drivers. A9, B8, C9, V9, W8, Y9 GNDE NONE Ground Return for the Digital Encoder. Table 6. High-Speed Digital Outputs Ball No. Name Equivalent Circuit Description VDR K19/K20 L19/L20 DCLKI+/DCLKQ+/- - + + - Data Clock Output for the I- and Q-channel data bus. These differential clock outputs are used to latch the output data and, if used, should always be terminated with a 100Ω differential resistor placed as closely as possible to the differential receiver. Delayed and non-delayed data outputs are supplied synchronously to this signal. In 1:2 Demux Mode or Non-Demux Mode, this signal is at ¼ or ½ the sampling clock rate, respectively. DCLKI and DCLKQ are always in phase with each other, unless one channel is powered down, and do not require a pulse from DCLK_RST to become synchronized. DR GND VDR K17/K18 L17/L18 ORI+/ORQ+/- - + + - Out-of-Range Output for the I- and Q-channel. This differential output is asserted logic-high while the over- or under-range condition exists, i.e. the differential signal at each respective analog input exceeds the full-scale value. Each OR result refers to the current Data, with which it is clocked out. If used, each of these outputs should always be terminated with a 100Ω differential resistor placed as closely as possible to the differential receiver. DR GND Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 Submit Documentation Feedback 11 ADC10D1000, ADC10D1500 SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 www.ti.com Table 6. High-Speed Digital Outputs (continued) 12 Ball No. Name J18/J19 H19/H20 H17/H18 G19/G20 G17/G18 F18/F19 E19/E20 D19/D20 D18/E18 C19/C20 · M18/M19 N19/N20 N17/N18 P19/P20 P17/P18 R18/R19 T19/T20 U19/U20 U18/T18 V19/V20 DI9+/DI8+/DI7+/DI6+/DI5+/DI4+/DI3+/DI2+/DI1+/DI0+/· DQ9+/DQ8+/DQ7+/DQ6+/DQ5+/DQ4+/DQ3+/DQ2+/DQ1+/DQ0+/- A18/A19 B17/C16 A16/B16 B15/C15 C14/D14 A14/B14 B13/C13 C12/D12 A12/B12 B11/C11 · Y18/Y19 W17/V16 Y16/W16 W15/V15 V14/U14 Y14/W14 W13/V13 V12/U12 Y12/W12 W11/V11 DId9+/DId8+/DId7+/DId6+/DId5+/DId4+/DId3+/DId2+/DId1+/DId0+/· DQd9+/DQd8+/DQd7+/DQd6+/DQd5+/DQd4+/DQd3+/DQd2+/DQd1+/DQd0+/- V10/U10 Y10/W10 W19/W20 W18/V17 B19/B20 B18/C17 C10/D10 A10/B10 RSV7+/RSV6+/RSV5+/RSV4+/RSV3+/RSV2+/RSV1+/RSV0+/- Submit Documentation Feedback Equivalent Circuit Description VDR - + + - I- and Q-channel Digital Data Outputs. In NonDemux Mode, this LVDS data is transmitted at the sampling clock rate. In Demux Mode, these outputs provide ½ the data at ½ the sampling clock rate, synchronized with the delayed data, i.e. the other ½ of the data which was sampled one clock cycle earlier. Compared with the DId and DQd outputs, these outputs represent the later time samples. If used, each of these outputs should always be terminated with a 100Ω differential resistor placed as closely as possible to the differential receiver. DR GND VDR - + + - Delayed I- and Q-channel Digital Data Outputs. In Non-Demux Mode, these outputs are tri-stated. In Demux Mode, these outputs provide ½ the data at ½ the sampling clock rate, synchronized with the non-delayed data, i.e. the other ½ of the data which was sampled one clock cycle later. Compared with the DI and DQ outputs, these outputs represent the earlier time samples. If used, each of these outputs should always be terminated with a 100Ω differential resistor placed as closely as possible to the differential receiver. DR GND NONE Reserved. These pins are used for internal purposes. They may be left unconnected and floating or connected as recommended in Terminating RSV Pins. Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 ADC10D1000, ADC10D1500 www.ti.com SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 Absolute Maximum Ratings See notes (1) (2) Supply Voltage (VA, VTC, VDR, VE) 2.2V Supply Difference max(VA/TC/DR/E)min(VA/TC/DR/E) 0V to 100 mV −0.15V to (VA + 0.15V) Voltage on Any Input Pin (except VIN+/-) VIN+/- Voltage Range -0.15V to 2.5V Ground Difference max(GNDTC/DR/E) -min(GNDTC/DR/E) Input Current at Any Pin 0V to 100 mV (3) ±50 mA ADC10D1000 Package Power Dissipation at TA ≤ 85°C (3) 3.7 W ADC10D1500 Package Power Dissipation at TA ≤ 70°C (3) 4.4 W ESD Susceptibility (4) Human Body Model Charged Device Model Machine Model 2500V 750V 250V −65°C to +150°C Storage Temperature (1) (2) (3) (4) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. There is no assurance of operation at the Absolute Maximum Ratings. For specifications and test conditions, see the Electrical Characteristics. The specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. All voltages are measured with respect to GND = GNDTC = GNDDR = GNDE = 0V, unless otherwise specified. When the input voltage at any pin exceeds the power supply limits, i.e. less than GND or greater than VA, the current at that pin should be limited to 50 mA. In addition, over-voltage at a pin must adhere to the maximum voltage limits. Simultaneous over-voltage at multiple pins requires adherence to the maximum package power dissipation limits. These dissipation limits are calculated using JEDEC JESD51-7 thermal model. Higher dissipation may be possible based on specific customer thermal situation and specified package thermal resistances from junction to case. Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through 0Ω. Charged device model simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then rapidly being discharged. Operating Ratings See notes (1) (2) Ambient Temperature Range ADC10D1000 −40°C ≤ TA ≤ +85°C ADC10D1500 (Standard JEDEC thermal model) −40°C ≤ TA ≤ +70°C ADC10D1500 (Enhanced thermal model/heatsink) −40°C ≤ TA ≤ +85°C Junction Temperature Range TJ ≤ +138°C Supply Voltage (VA, VTC, VE) +1.8V to +2.0V Driver Supply Voltage (VDR) +1.8V to VA VIN+/- Voltage Range (Maintaining Common Mode) 0V to 2.15V (100% duty cycle) 0V to 2.5V (10% duty cycle) Ground Difference max(GNDTC/DR/E) -min(GNDTC/DR/E) 0V CLK+/- Voltage Range 0V to VA Differential CLK Amplitude 0.4VP-P to 2.0VP-P Common Mode Input Voltage (1) (2) VCMO - 150mV < VCMI < VCMO +150mV Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For specifications and test conditions, see the Electrical Characteristics. The specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. All voltages are measured with respect to GND = GNDTC = GNDDR = GNDE = 0V, unless otherwise specified. Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 Submit Documentation Feedback 13 ADC10D1000, ADC10D1500 SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 www.ti.com Package Thermal Resistance Package θJA θJC1 θJC2 292-Ball BGA Thermally Enhanced Package 16°C/W 2.9°C/W 2.5°C/W Converter Electrical Characteristics – Static Converter Characteristics The following specifications apply after calibration for VA = VDR = VTC = VE = +1.9V; I- and Q-channels, AC-coupled, unused channel terminated to AC ground, FSR Pin = High; CL = 10 pF; Differential, AC coupled Sine Wave Sampling Clock, fCLK = 1.0/1.5 GHz at 0.5 VP-P with 50% duty cycle (as specified); VBG = Floating; Non-Extended Control Mode; Rext = Rtrim = 3300Ω ± 0.1%; Analog Signal Source Impedance = 100Ω Differential; 1:2 Demultiplex Non-DES Mode; Duty Cycle Stabilizer on. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25°C, unless otherwise noted. (1) (2) (3) (4) _ Symbol Parameter Conditions ADC10D1000 ADC10D1500 Typ Typ Resolution with No Missing Codes Lim 10 Lim Units (Limits) 10 bits INL Integral Non-Linearity (Best fit) 1 MHz DC-coupled over-ranged sine wave ±0.65 ±1.4 ±0.65 ±1.4 LSB (max) DNL Differential Non-Linearity 1 MHz DC-coupled over-ranged sine wave ±0.25 ±0.5 ±0.25 ±0.55 LSB (max) VOFF Offset Error VOFF_ADJ Input Offset Adjustment Range PFSE Positive Full-Scale Error (5) NFSE Negative Full-Scale Error (5) -2 Out-of-Range Output Code (1) (6) Extended Control Mode -2 ±45 LSB ±45 ±25 mV ±25 mV (max) mV (max) ±25 ±25 (VIN+) − (VIN−) > + Full Scale 1023 1023 (VIN+) − (VIN−) < − Full Scale 0 0 The analog inputs, labeled "I/O", are protected as shown below. Input voltage magnitudes beyond the Absolute Maximum Ratings may damage this device. V A TO INTERNAL CIRCUITRY I/O GND (2) (3) (4) (5) (6) 14 To specify accuracy, it is required that VA, VTC, VE and VDR be well-bypassed. Each supply pin must be decoupled with separate bypass capacitors. Typical figures are at TA = 25°C, and represent most likely parametric norms. Test limits are specified to AOQL (Average Outgoing Quality Level). The maximum clock frequency for Non-Demux Mode is tested up to 1.0 GHz for both the ADC10D1000 and the ADC10D1500 and specified by design and characterization up to 1.5 GHz for the ADC10D1500. Calculation of Full-Scale Error for this device assumes that the actual reference voltage is exactly its nominal value. Full-Scale Error for this device, therefore, is a combination of Full-Scale Error and Reference Voltage Error. See Figure 4. For relationship between Gain Error and Full-Scale Error, see Specification Definitions for Gain Error. This parameter is specified by design and is not tested in production. Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 ADC10D1000, ADC10D1500 www.ti.com SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 Converter Electrical Characteristics – Dynamic Converter Characteristics The following specifications apply after calibration for VA = VDR = VTC = VE = +1.9V; I- and Q-channels, AC-coupled, unused channel terminated to AC ground, FSR Pin = High; CL = 10 pF; Differential, AC coupled Sine Wave Sampling Clock, fCLK = 1.0/1.5 GHz at 0.5 VP-P with 50% duty cycle (as specified); VBG = Floating; Non-Extended Control Mode; Rext = Rtrim = 3300Ω ± 0.1%; Analog Signal Source Impedance = 100Ω Differential; 1:2 Demultiplex Non-DES Mode; Duty Cycle Stabilizer on. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25°C, unless otherwise noted. (1) (2) (3) (4) _ Symbol FPBW Parameter Conditions Full Power Bandwidth Gain Flatness CER Code Error Rate NPR Noise Power Ratio ADC10D1000 ADC10D1500 Typ Typ Lim Lim Units (Limits) Non-DES Mode 2.8 2.8 GHz DES Mode 1.25 1.25 GHz DESIQ Mode 1.75 1.75 GHz D.C. to Fs/2 ±0.35 ±0.4 dBFS D.C. to Fs ±0.5 ±1.2 -18 -18 10 dBFS Error/Sam ple 10 fc,notch = 325 MHz, Notch width = 5% 48 48 dB AIN = 100 MHz @ -0.5 dBFS 9.1 9.0 bits AIN = 248 MHz @ -0.5 dBFS 9.1 1:2 Demux Non-DES Mode ENOB Effective Number of Bits 8.3 AIN = 373 MHz @ -0.5 dBFS AIN = 498 MHz @ -0.5 dBFS 8.8 9.0 Signal-to-Noise Plus Distortion Ratio 56.5 AIN = 248 MHz @ -0.5 dBFS 56.5 52 56 52 AIN = 373 MHz @ -0.5 dBFS Signal-to-Noise Ratio AIN = 100 MHz @ -0.5 dBFS 57 AIN = 248 MHz @ -0.5 dBFS 57 52.7 AIN = 373 MHz @ -0.5 dBFS AIN = 498 MHz @ -0.5 dBFS 56.5 bits 56.1 dB 55.6 dB (min) 48.4 dB (min) dB (min) 54.5 dB 56.8 dB 56.4 56.4 AIN = 748 MHz @ -0.5 dBFS (1) bits (min) 54.9 AIN = 748 MHz @ -0.5 dBFS SNR bits (min) 8.8 AIN = 100 MHz @ -0.5 dBFS AIN = 498 MHz @ -0.5 dBFS bits (min) 7.8 8.3 AIN = 748 MHz @ -0.5 dBFS SINAD 8.9 52.7 dB (min) 50 dB (min) dB (min) 55 dB The analog inputs, labeled "I/O", are protected as shown below. Input voltage magnitudes beyond the Absolute Maximum Ratings may damage this device. V A TO INTERNAL CIRCUITRY I/O GND (2) (3) (4) To specify accuracy, it is required that VA, VTC, VE and VDR be well-bypassed. Each supply pin must be decoupled with separate bypass capacitors. Typical figures are at TA = 25°C, and represent most likely parametric norms. Test limits are specified to AOQL (Average Outgoing Quality Level). The maximum clock frequency for Non-Demux Mode is tested up to 1.0 GHz for both the ADC10D1000 and the ADC10D1500 and specified by design and characterization up to 1.5 GHz for the ADC10D1500. Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 Submit Documentation Feedback 15 ADC10D1000, ADC10D1500 SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 www.ti.com Converter Electrical Characteristics – Dynamic Converter Characteristics (continued) The following specifications apply after calibration for VA = VDR = VTC = VE = +1.9V; I- and Q-channels, AC-coupled, unused channel terminated to AC ground, FSR Pin = High; CL = 10 pF; Differential, AC coupled Sine Wave Sampling Clock, fCLK = 1.0/1.5 GHz at 0.5 VP-P with 50% duty cycle (as specified); VBG = Floating; Non-Extended Control Mode; Rext = Rtrim = 3300Ω ± 0.1%; Analog Signal Source Impedance = 100Ω Differential; 1:2 Demultiplex Non-DES Mode; Duty Cycle Stabilizer on. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25°C, unless otherwise noted. (1) (2) (3) (4) _ Symbol THD Parameter Conditions Total Harmonic Distortion ADC10D1000 ADC10D1500 Typ Typ Lim AIN = 100 MHz @ -0.5 dBFS -67 AIN = 248 MHz @ -0.5 dBFS -69 -60 -66 -60 AIN = 373 MHz @ -0.5 dBFS AIN = 498 MHz @ -0.5 dBFS Second Harmonic Distortion dB AIN = 248 MHz @ -0.5 dBFS -71 -71 dBc -71 dBc -71 dBc -70 dBc AIN = 100 MHz @ -0.5 dBFS -70 -68 dBc AIN = 248 MHz @ -0.5 dBFS -70 -72 dBc -63 dBc -69 dBc AIN = 748 MHz @ -0.5 dBFS -65 AIN = 100 MHz @ -0.5 dBFS 70 AIN = 248 MHz @ -0.5 dBFS 66 57.9 66 57.9 AIN = 373 MHz @ -0.5 dBFS AIN = 498 MHz @ -0.5 dBFS dBc 68 dBc 68 dBc (min) 63 AIN = 748 MHz @ -0.5 dBFS ENOB dB (max) dBc AIN = 498 MHz @ -0.5 dBFS Non-Demux Non-DES Mode 54 dBc (4) Effective Number of Bits AIN = 100 MHz @ -0.5 dBFS 9.1 AIN = 248 MHz @ -0.5 dBFS 9.1 AIN = 498 MHz @ -0.5 dBFS 8.4 9.1 bits 9.1 bits (min) 8.8 9.0 8.3 7.8 9.0 Signal-to-Noise Plus Distortion Ratio bits AIN = 100 MHz @ -0.5 dBFS 56.6 AIN = 248 MHz @ -0.5 dBFS 56.5 56.5 52.6 AIN = 373 MHz @ -0.5 dBFS AIN = 498 MHz @ -0.5 dBFS 56.5 54.5 56 52.0 dB dB (min) 48.4 56 dB AIN = 100 MHz @ -0.5 dBFS 57 AIN = 248 MHz @ -0.5 dBFS 57 53.5 AIN = 373 MHz @ -0.5 dBFS AIN = 498 MHz @ -0.5 dBFS 57 dB 57 dB (min) 55.5 56.5 52.7 50 56.5 Total Harmonic Distortion dB AIN = 100 MHz @ -0.5 dBFS -67 AIN = 248 MHz @ -0.5 dBFS -66 -67 -60 -66 AIN = 748 MHz @ -0.5 dBFS 16 Submit Documentation Feedback -60 dB -66 −60 AIN = 373 MHz @ -0.5 dBFS AIN = 498 MHz @ -0.5 dBFS dB (min) dB (min) AIN = 748 MHz @ -0.5 dBFS THD dB (min) dB (min) AIN = 748 MHz @ -0.5 dBFS Signal-to-Noise Ratio bits (min) bits (min) AIN = 748 MHz @ -0.5 dBFS SNR dBc (min) dBc (min) 65 AIN = 373 MHz @ -0.5 dBFS SINAD dB (max) -76 AIN = 373 MHz @ -0.5 dBFS Spurious-Free Dynamic Range -53.6 -63 AIN = 748 MHz @ -0.5 dBFS SFDR dB (max) -76 AIN = 498 MHz @ -0.5 dBFS Third Harmonic Distortion dB -63 AIN = 100 MHz @ -0.5 dBFS AIN = 373 MHz @ -0.5 dBFS 3rd Harm Units (Limits) -65 -60 AIN = 748 MHz @ -0.5 dBFS 2nd Harm Lim -66 dB (max) −53.6 dB (max) dB (max) dB Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 ADC10D1000, ADC10D1500 www.ti.com SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 Converter Electrical Characteristics – Dynamic Converter Characteristics (continued) The following specifications apply after calibration for VA = VDR = VTC = VE = +1.9V; I- and Q-channels, AC-coupled, unused channel terminated to AC ground, FSR Pin = High; CL = 10 pF; Differential, AC coupled Sine Wave Sampling Clock, fCLK = 1.0/1.5 GHz at 0.5 VP-P with 50% duty cycle (as specified); VBG = Floating; Non-Extended Control Mode; Rext = Rtrim = 3300Ω ± 0.1%; Analog Signal Source Impedance = 100Ω Differential; 1:2 Demultiplex Non-DES Mode; Duty Cycle Stabilizer on. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25°C, unless otherwise noted. (1) (2) (3) (4) _ Symbol 2nd Harm Parameter Conditions Second Harmonic Distortion ADC10D1000 ADC10D1500 Typ Typ Lim Lim Units (Limits) AIN = 100 MHz @ -0.5 dBFS -85 -85 dBc AIN = 248 MHz @ -0.5 dBFS -71 -71 dBc -71 -71 AIN = 100 MHz @ -0.5 dBFS -68 -68 dBc AIN = 248 MHz @ -0.5 dBFS -70 -70 dBc -70 -70 AIN = 373 MHz @ -0.5 dBFS AIN = 498 MHz @ -0.5 dBFS dBc dBc AIN = 748 MHz @ -0.5 dBFS 3rd Harm Third Harmonic Distortion dBc AIN = 373 MHz @ -0.5 dBFS AIN = 498 MHz @ -0.5 dBFS dBc dBc AIN = 748 MHz @ -0.5 dBFS SFDR Spurious-Free Dynamic Range dBc AIN = 100 MHz @ -0.5 dBFS 68 AIN = 248 MHz @ -0.5 dBFS 66 59 66 57.9 AIN = 373 MHz @ -0.5 dBFS AIN = 498 MHz @ -0.5 dBFS 68 dBc 66 dBc (min) 63 66 54 dBc (min) dBc (min) AIN = 748 MHz @ -0.5 dBFS dBc DES Mode (Demux and Non-Demux Modes, Q-input only) ENOB Effective Number of Bits AIN = 100 MHz @ -0.5 dBFS 8.6 8.9 bits AIN = 248 MHz @ -0.5 dBFS 8.5 8.7 bits 8.5 bits AIN = 373 MHz @ -0.5 dBFS AIN = 498 MHz @ -0.5 dBFS 8.4 AIN = 748 MHz @ -0.5 dBFS SINAD Signal-to-Noise Plus Distortion Ratio 8.3 bits AIN = 100 MHz @ -0.5 dBFS 53.6 55.5 dB AIN = 248 MHz @ -0.5 dBFS 52.9 53.9 dB 52.7 dB AIN = 373 MHz @ -0.5 dBFS AIN = 498 MHz @ -0.5 dBFS 52.3 AIN = 748 MHz @ -0.5 dBFS SNR Signal-to-Noise Ratio 55.9 dB AIN = 248 MHz @ -0.5 dBFS 53.3 54.6 dB 53.8 dB 52.7 AIN = 748 MHz @ -0.5 dBFS 52.1 dB -67 -66 dB AIN = 248 MHz @ -0.5 dBFS -64 -62 dB -59 dB AIN = 498 MHz @ -0.5 dBFS -63 AIN = 748 MHz @ -0.5 dBFS Second Harmonic Distortion dB AIN = 100 MHz @ -0.5 dBFS AIN = 373 MHz @ -0.5 dBFS 2nd Harm dB 53.8 AIN = 498 MHz @ -0.5 dBFS Total Harmonic Distortion dB 51.7 AIN = 100 MHz @ -0.5 dBFS AIN = 373 MHz @ -0.5 dBFS THD bits dB -62 dB AIN = 100 MHz @ -0.5 dBFS -77 -80 dBc AIN = 248 MHz @ -0.5 dBFS -66 -66 dBc -64 dBc AIN = 373 MHz @ -0.5 dBFS AIN = 498 MHz @ -0.5 dBFS -66 AIN = 748 MHz @ -0.5 dBFS Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 dBc -70 Submit Documentation Feedback dBc 17 ADC10D1000, ADC10D1500 SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 www.ti.com Converter Electrical Characteristics – Dynamic Converter Characteristics (continued) The following specifications apply after calibration for VA = VDR = VTC = VE = +1.9V; I- and Q-channels, AC-coupled, unused channel terminated to AC ground, FSR Pin = High; CL = 10 pF; Differential, AC coupled Sine Wave Sampling Clock, fCLK = 1.0/1.5 GHz at 0.5 VP-P with 50% duty cycle (as specified); VBG = Floating; Non-Extended Control Mode; Rext = Rtrim = 3300Ω ± 0.1%; Analog Signal Source Impedance = 100Ω Differential; 1:2 Demultiplex Non-DES Mode; Duty Cycle Stabilizer on. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25°C, unless otherwise noted. (1) (2) (3) (4) _ Symbol 3rd Harm Parameter Conditions Third Harmonic Distortion ADC10D1000 ADC10D1500 Typ Typ -69 -67 dBc -65 -70 dBc -62 dBc -63 AIN = 748 MHz @ -0.5 dBFS -62 dBc 59.3 67 dBc AIN = 248 MHz @ -0.5 dBFS 58.9 62 dBc 60 dBc AIN = 498 MHz @ -0.5 dBFS 57.4 AIN = 748 MHz @ -0.5 dBFS Submit Documentation Feedback dBc AIN = 100 MHz @ -0.5 dBFS AIN = 373 MHz @ -0.5 dBFS 18 Units (Limits) AIN = 248 MHz @ -0.5 dBFS AIN = 498 MHz @ -0.5 dBFS Spurious-Free Dynamic Range Lim AIN = 100 MHz @ -0.5 dBFS AIN = 373 MHz @ -0.5 dBFS SFDR Lim dBc 59 dBc Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 ADC10D1000, ADC10D1500 www.ti.com SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 Converter Electrical Characteristics – Analog Input/Output and Reference Characteristics The following specifications apply after calibration for VA = VDR = VTC = VE = +1.9V; I- and Q-channels, AC-coupled, unused channel terminated to AC ground, FSR Pin = High; CL = 10 pF; Differential, AC coupled Sine Wave Sampling Clock, fCLK = 1.0/1.5 GHz at 0.5 VP-P with 50% duty cycle (as specified); VBG = Floating; Non-Extended Control Mode; Rext = Rtrim = 3300Ω ± 0.1%; Analog Signal Source Impedance = 100Ω Differential; 1:2 Demultiplex Non-DES Mode; Duty Cycle Stabilizer on. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25°C, unless otherwise noted. (1) (2) (3) (4) _ Symbol Parameter Conditions ADC10D1000 ADC10D1500 Typ Typ Lim Lim Units (Limits) Analog Inputs VIN_FSR Analog Differential Input Full Scale Non-Extended Control Mode Range FSR Pin Low 540 mVP-P (min) 660 660 mVP-P (max) 720 720 mVP-P (min) 860 mVP-P (max) 540 600 FSR Pin High 600 790 790 860 Extended Control Mode CIN RIN FM(14:0) = 0000h 600 600 mVP-P FM(14:0) = 4000h (default) 790 790 mVP-P FM(14:0) = 7FFFh 980 980 mVP-P Analog Input Capacitance, Non-DES Mode (5) Differential 0.02 0.02 pF Each input pin to ground 1.6 1.6 pF Analog Input Capacitance, DES Mode (5) Differential 0.08 0.08 pF Each input pin to ground 2.2 2.2 pF Differential Input Resistance 100 96 104 100 93 Ω (min) 107 Ω (max) Common Mode Output VCMO Common Mode Output Voltage TC_VCMO Common Mode Output Voltage Temperature Coefficient VCMO_LVL VCMO input threshold to set DC-coupling Mode CL_VCMO Maximum VCMO Load Capacitance (1) ICMO = ±100 µA ICMO = ±100 µA 1.25 1.15 1.35 1.25 1.15 V (min) 1.35 V (max) 38 38 ppm/°C 0.63 0.63 V (5) 80 80 pF The analog inputs, labeled "I/O", are protected as shown below. Input voltage magnitudes beyond the Absolute Maximum Ratings may damage this device. V A TO INTERNAL CIRCUITRY I/O GND (2) (3) (4) (5) To specify accuracy, it is required that VA, VTC, VE and VDR be well-bypassed. Each supply pin must be decoupled with separate bypass capacitors. Typical figures are at TA = 25°C, and represent most likely parametric norms. Test limits are specified to AOQL (Average Outgoing Quality Level). The maximum clock frequency for Non-Demux Mode is tested up to 1.0 GHz for both the ADC10D1000 and the ADC10D1500 and specified by design and characterization up to 1.5 GHz for the ADC10D1500. This parameter is specified by design and is not tested in production. Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 Submit Documentation Feedback 19 ADC10D1000, ADC10D1500 SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 www.ti.com Converter Electrical Characteristics – Analog Input/Output and Reference Characteristics (continued) The following specifications apply after calibration for VA = VDR = VTC = VE = +1.9V; I- and Q-channels, AC-coupled, unused channel terminated to AC ground, FSR Pin = High; CL = 10 pF; Differential, AC coupled Sine Wave Sampling Clock, fCLK = 1.0/1.5 GHz at 0.5 VP-P with 50% duty cycle (as specified); VBG = Floating; Non-Extended Control Mode; Rext = Rtrim = 3300Ω ± 0.1%; Analog Signal Source Impedance = 100Ω Differential; 1:2 Demultiplex Non-DES Mode; Duty Cycle Stabilizer on. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25°C, unless otherwise noted. (1) (2) (3) (4) _ Symbol Parameter Conditions ADC10D1000 ADC10D1500 Typ Typ Lim Lim Units (Limits) Bandgap Reference VBG Bandgap Reference Output Voltage IBG = ±100 µA TC_VBG Bandgap Reference Voltage Temperature Coefficient IBG = ±100 µA CL_VBG Maximum Bandgap Reference load Capacitance 20 Submit Documentation Feedback 1.25 1.15 1.35 32 1.25 1.15 V (min) 1.35 V (max) 32 ppm/°C (5) 80 80 pF Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: ADC10D1000 ADC10D1500 ADC10D1000, ADC10D1500 www.ti.com SNAS462Q – OCTOBER 2008 – REVISED MARCH 2013 Converter Electrical Characteristics – I-Channel to Q-Channel Characteristics The following specifications apply after calibration for VA = VDR = VTC = VE = +1.9V; I- and Q-channels, AC-coupled, unused channel terminated to AC ground, FSR Pin = High; CL = 10 pF; Differential, AC coupled Sine Wave Sampling Clock, fCLK = 1.0/1.5 GHz at 0.5 VP-P with 50% duty cycle (as specified); VBG = Floating; Non-Extended Control Mode; Rext = Rtrim = 3300Ω ± 0.1%; Analog Signal Source Impedance = 100Ω Differential; 1:2 Demultiplex Non-DES Mode; Duty Cycle Stabilizer on. Boldface limits apply for TA = TMIN to TMAX. All other limits TA = 25°C, unless otherwise noted. (1) (2) (3) (4) _ Symbol Parameter Conditions Offset Match X-TALK (1) ADC10D1000 ADC10D1500 Typ Typ Lim Lim Units (Limits) 2 2 LSB Positive Full-Scale Match Zero offset selected in Control Register 2 2 LSB Negative Full-Scale Match Zero offset selected in Control Register 2 2 LSB Phase Matching (I, Q) fIN = 1.0 GHz
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