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ADS1259-Q1
SLASE20 – MARCH 2014
ADS1259-Q1 Automotive, 14.4-kSPS, 24-Bit Analog-to-Digital Converter
With Integrated Low-Drift Reference
1 Features
3 Description
•
•
The ADS1259-Q1 is a precision, low-drift, 24-bit,
analog-to-digital converter (ADC). The device can
perform conversions at data rates up to 14.4 kSPS
with high resolution and is therefore ideally suited to
measure rapidly changing signals that have a wide
dynamic range. An integrated low-noise, low-drift
2.5-V reference eliminates the need for an external
voltage reference, thus reducing system cost and
component count.
1
•
•
•
•
•
•
•
•
•
•
Qualified for Automotive Applications
AEC-Q100 Qualified with the Following Results:
– Temperature Grade 1: –40°C to 125°C
– HBM ESD Classification 2
– CDM ESD Classification C4B
Programmable Data Rates: 10 SPS to 14.4 kSPS
Single-Cycle Settling Digital Filter
High Performance:
– 21.3 ENOB at 1.2 kSPS
– INL: 3 ppm
– Offset Drift: 0.05 μV/°C
– Gain Drift: 0.5 ppm/°C
Internal Reference: 2.5 V, 10 ppm/°C Drift
Internal 2% Accurate Oscillator
Input Signal Out-of-Range Detection
Optional Checksum and Redundant Data-Read
Capability to Augment Data Integrity
SPI™-Compatible Interface, Mode 1
Analog Supply: 5 V or ±2.5 V
Digital Supply: 2.7 V to 5 V
The converter uses a fourth-order, inherently stable,
delta-sigma (ΔΣ) modulator that provides outstanding
noise performance and linearity. The device can use
the integrated oscillator, an external crystal, or an
external clock as the ADC clock source.
A fast-responding input overrange detector flags the
conversion data if an input overrange event occurs.
To augment data integrity in noisy automotive
environments the ADS1259-Q1 offers an optional
checksum byte and a redundant conversion dataread capability.
The ADS1259-Q1 consumes 13 mW during operation
and less than 25 μW when powered down. TI offers
the ADS1259-Q1 device in a TSSOP-20 package
with full specification from –40°C to 125°C.
Device Information
2 Applications
•
•
ORDER NUMBER
Automotive Power Train
Electrical Vehicles
ADS1259QPWRQ1
PACKAGE
TSSOP (20)
BODY SIZE
6,5 mm × 4,4 mm
Space
Space
Space
ADS1259-Q1 Simplified Block Diagram
AVDD
AINP
REFP
REFN
DS
Modulator
AINN
REFOUT
SYNCOUT
DVDD
2.5-V
Reference
fCLK / 8
Clock
Generator
Programmable
Digital Filter
Calibration
Engine
START
DRDY
SCLK
DIN
DOUT
CS
ADS1259-Q1
AVSS
XTAL2
RESET/PWDN
Control
and
Serial
Interface
Out-of-Range
Detection
XTAL1/CLKIN
DGND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
ADS1259-Q1
SLASE20 – MARCH 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
Features .................................................................
Applications ..........................................................
Description ............................................................
Revision History ...................................................
Terminal Configuration and Functions ...............
Specifications ........................................................
6.4 Thermal Information ................................................. 5
6.5 Electrical Characteristics .......................................... 6
1
1
1
2
3
4
7
8
6.1 Absolute Maximum Ratings ..................................... 4
6.2 Handling Ratings ...................................................... 4
6.3 Recommended Operating Conditions ...................... 5
9
Residue .................................................................. 7
Device Documentation and Support ................... 8
8.1 Trademarks .............................................................. 8
8.2 Electrostatic Discharge Caution ............................... 8
8.3 Glossary ................................................................... 8
Mechanical, Packaging, and Orderable
Information ............................................................ 9
4 Revision History
2
DATE
REVISION
NOTES
March 2014
*
Initial release
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SLASE20 – MARCH 2014
5 Terminal Configuration and Functions
20-Terminal TSSOP
PW Package
(Top View)
AINP
1
20
AVDD
AINN
2
19
AVSS
RESET/PWDN
3
18
REFN
START
4
17
REFP
SYNCOUT
5
16
REFOUT
CS
6
15
DVDD
SCLK
7
14
DGND
DIN
8
13
BYPASS
DOUT
9
12
XTAL2
DRDY
10
11
XTAL1/CLKIN
Terminal Functions
TERMINAL
NO.
(1)
TYPE
NAME
DESCRIPTION
1
AINP
Analog input
Positive analog input
2
AINN
Analog input
Negative analog input
3
RESET/PWDN
Digital input
Reset or power down; reset is active-low; hold low for power down.
4
START
Digital input
Start conversions, active-high
5
SYNCOUT
6
CS
Digital input
SPI chip-select, active-low
7
SCLK
Digital input
SPI clock input
8
DIN
Digital input
SPI data input
9
DOUT
Digital output
SPI data output
10
DRDY
Digital output
Data-ready output, active-low
11
XTAL1/CLKIN
12
XTAL2
Digital
External crystal2, otherwise no connection
13
BYPASS
Analog
Core voltage bypass. Connect a 1-µF capacitor to DGND.
14
DGND
Digital
Digital ground
15
DVDD
Digital
Digital power supply
16
REFOUT
17
REFP
Analog input
Positive reference input. Connect a 1-µF capacitor, CREFIN, to REFN. (1)
18
REFN
Analog input
Negative reference input (1)
19
AVSS
Analog
Negative analog power supply and negative internal reference output
20
AVDD
Analog
Positive analog power supply
Digital output
Digital input
Analog output
Sync clock output (f(CLK) / 8)
Internal oscillator: DGND
External clock: clock input
Crystal oscillator: external crystal1
Positive internal reference output. Connect a 1-µF capacitor, CREFOUT, to AVSS.
Leave unused reference inputs unconnected or tie to AVDD.
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SLASE20 – MARCH 2014
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6 Specifications
6.1 Absolute Maximum Ratings (1)
over operating ambient temperature range (unless otherwise noted)
MIN
MAX
AVDD to AVSS
–0.3
7
UNIT
V
AVSS to DGND
–2.8
0.3
V
DVDD to DGND
–0.3
7
V
Analog input voltage
AINN, AINP, REFN, REFP
AVSS – 0.3
AVDD + 0.3
V
Digital input voltage
CS, DIN, RESET/PDWN, SCLK, START,
XTAL1/CLKIN
DGND – 0.3
DVDD + 0.3
V
Input current, continuous
Any terminal except supply terminals
–10
10
mA
–40
150
°C
Operating junction temperature, TJ
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 Handling Ratings
Tstg
Storage temperature range
V(ESD) (1)
(1)
(2)
4
MIN
MAX
UNIT
–60
150
°C
Human-body model (HBM) ESD stress voltage (2)
–2
2
kV
Charged-device model (CDM) ESD stress voltage (2)
–1
1
kV
Electrostatic discharge (ESD) to measure device sensitivity or immunity to damage caused by assembly-line electrostatic discharges
into the device.
Meets or exceeds the passing level per AEC-Q100.
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SLASE20 – MARCH 2014
6.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
POWER SUPPLY
Analog power supply
Digital power supply
AVDD to AVSS
4.75
5.0
5.25
V
AVSS to DGND
–2.6
–2.5
0
V
DVDD to DGND
2.7
3.3
5.25
V
ANALOG INPUTS
Absolute input voltage
AINP or AINN
AVSS – 0.1
AVDD + 0.1
V
Differential input voltage (1)
V(IN) = (V(AINP) – V(AINN))
–Vref
Vref
V
Reference input voltage
Vref = (V(REFP) – V(REFN))
0.5
2.5
AVDD – AVSS +
0.2
V
Absolute negative reference voltage
REFN
AVSS – 0.1
AVSS
REFP – 0.5
V
Absolute positive reference voltage
REFP
REFN + 0.5
AVSS + 2.5
AVDD + 0.1
V
2
7.3728
8
MHz
Frequency
0.1
7.3728
8
MHz
Duty cycle
40%
VOLTAGE REFERENCE INPUTS
EXTERNAL CLOCK SOURCES (f(CLK))
Crystal oscillator
Frequency
External clock
60%
DIGITAL INPUTS
High-level input voltage, VIH
Low-level input voltage, VIL
0.8 DVDD
DVDD
V
DGND
0.2 DVDD
V
–40
125
°C
TEMPERATURE RANGE
Operating ambient temperature, TA
(1)
Excluding the effects of offset and gain error.
6.4 Thermal Information
THERMAL METRIC (1)
PW
(20 TERMINALS)
UNIT
86.9
°C/W
21
°C/W
RθJA
Junction-to-ambient thermal resistance
RθJC(top)
Junction-to-case (top) thermal resistance
RθJB
Junction-to-board thermal resistance
39.1
°C/W
ψJT
Junction-to-top characterization parameter
0.8
°C/W
ψJB
Junction-to-board characterization parameter
38.4
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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SLASE20 – MARCH 2014
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6.5 Electrical Characteristics
Minimum and maximum specifications are at TA = –40°C to 125°C. Typical specifications are at TA = 25°C, AVDD = 2.5 V, AVSS = –2.5 V,
DVDD = 3.3 V, external f(CLK) = 7.3728 MHz, external Vref = 2.5 V, and f(DATA) = 60 SPS (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ANALOG INPUTS
Differential input impedance
120
kΩ
Common-mode input impedance
500
kΩ
SYSTEM PERFORMANCE
Resolution (no missing codes)
24
Data rate, f(DATA)
10
Noise (input referred)
Shorted inputs, See SBAS424 for more information.
Integral nonlinearity, INL
Best-fit method
Offset voltage (input referred)
±3
10
ppm
–250
±40
250
μV
0.05
0.25
μV/°C
±0.05%
0.5%
TA = –40°C to 125°C
–0.5%
Gain error after calibration (1)
Gain drift
μVRMS
0.7
μV
±1
Gain error (2)
SPS
–10
Offset voltage after calibration (1)
Offset drift
Bits
14,400
±0.0002%
TA = –40°C to 125°C
0.5
Normal-mode rejection ratio, NMRR
2.5
ppm/°C
See SBAS424.
Common-mode rejection ratio, CMRR
60 Hz, ac (3)
100
120
dB
AVDD, AVSS power-supply rejection ratio, PSRR
60 Hz, ac (3)
85
95
dB
DVDD power supply-rejection ratio, PSRR
60 Hz, ac (3)
85
110
dB
OUT-OF-RANGE DETECTION
Threshold level
AVSS + 150 mV ≤ V(AINP), V(AINN) ≤ AVDD – 150 mV
±105
%FSR
Threshold level accuracy
AVSS + 150 mV ≤ V(AINP), V(AINN) ≤ AVDD – 150 mV
±0.5
%FSR
AVSS ≤ V(REFP) , V(REFN) ≤ AVDD
350
nA
0.2
nA/°C
VOLTAGE REFERENCE INPUTS
Average reference input current
Average reference input current drift
INTERNAL VOLTAGE REFERENCE
Reference output voltage
V(REFOUT) = (REFOUT – AVSS)
Accuracy
TA = 25°C
Temperature drift
TA = –40°C to 125°C
2.5
–0.4%
Drive current (sink and source)
10
–10
Load regulation
V
0.4%
40
10
±0.001% settling, CREFIN = 1 μF, CREFOUT = 1 μF
Long-term stability
0 to 1000 hours
Thermal hysteresis
mA
μV/mA
10
Turn-on settling time
ppm/°C
1
s
70
ppm
30
ppm
CLOCK SOURCE (f(CLK))
Internal oscillator frequency
7.3728
Internal oscillator accuracy
External crystal oscillator start-up time (4)
–2%
18-pF load capacitors
±0.2%
MHz
2%
20
ms
DIGITAL INPUTS AND OUTPUTS (DVDD = 2.7 V to 5.25 V)
High-level output voltage, VOH
Low-level output voltage, VOL
IOH = 1 mA
0.8 DVDD
V
IOH = 8 mA
0.75 DVDD
IOL = 1 mA
0.2 DVDD
V
IOL = 8 mA
0.2 DVDD
Input hysteresis
Input leakage
(1)
(2)
(3)
(4)
6
0.1
0 < V(DIGITAL INPUT) < DVDD
–10
V
10
μA
Calibration accuracy is on the level of noise (signal and ADC), reduced by the effect of 16-reading averaging.
Excludes internal reference error.
f(DATA) = 14.4 kSPS. Placing a notch of the digital filter at 60 Hz (setting f(DATA) = 10 SPS or 60 SPS) further improves the commonmode rejection and power-supply rejection of this input frequency.
External crystal start-up time can vary with crystal manufacturer and over temperature.
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SLASE20 – MARCH 2014
Electrical Characteristics (continued)
Minimum and maximum specifications are at TA = –40°C to 125°C. Typical specifications are at TA = 25°C, AVDD = 2.5 V,
AVSS = –2.5 V, DVDD = 3.3 V, external f(CLK) = 7.3728 MHz, external Vref = 2.5 V, and f(DATA) = 60 SPS (unless otherwise
noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
Operating
(internal reference enabled)
2.3
5
Standby mode
(internal reference enabled)
200
Standby mode
(internal reference disabled)
1
Power-down mode
1
UNIT
POWER SUPPLY
Absolute analog supply current (AVDD, AVSS)
Digital supply current (DVDD)
Power dissipation
(5)
μA
Operating
(internal oscillator (5))
500
700
Standby mode
(internal oscillator)
160
300
1
10
Operating
(internal reference enabled, internal oscillator)
13
28
Standby mode
(internal reference enabled, internal oscillator)
1.5
Standby mode
(internal reference disabled, internal oscillator)
0.5
Power-down mode
10
Power-down mode
(external CLKIN, SCLK stopped,
digital inputs maintained at VIH or VIL voltage levels)
mA
μA
mW
μW
Internal oscillator current: 40 µA (typ.)
7 Residue
See SBAS424 for any information on the ADS1259-Q1 device that is not covered in the foregoing sections.
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SLASE20 – MARCH 2014
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8 Device Documentation and Support
8.1 Trademarks
SPI is a trademark of Motorola.
All other trademarks are the property of their respective owners.
8.2 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
8
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9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and without
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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9
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
ADS1259QPWRQ1
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
AD1259Q1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of