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AFE0256GBTD

AFE0256GBTD

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    Module

  • 描述:

    ANALOGFRONTENDAFEDIGITLXRAY

  • 数据手册
  • 价格&库存
AFE0256GBTD 数据手册
AFE0256 www.ti.com SBAS560A – DECEMBER 2012 – REVISED AUGUST 2013 256-Channel Analog Front-End for Flat-Panel Digital X-Ray Detector Check for Samples: AFE0256 FEATURES APPLICATIONS • • • • 1 23 • • • • 256 Channels On-Chip, 14-Bit ADC High Performance: – Noise: 758 electronRMS (eRMS) with 28-pF Sensor Capacitor in 1.2-pC Range – Integral Nonlinearity: ±1.25 LSB with Internal 14-Bit ADC – Minimum Scan Time: – Normal Mode: 37.9 µs, Internal ADC – 2x Binning Mode: 26 µs, Internal ADC Integration: – Eight Selectable, Full-Scale Ranges: – 0.15 pC (min) to 9.6 pC (max) – Built-In Correlated Double Sampler – 2x Binning for Faster Throughput: – Averages Charge of Two Adjacent Channels – Pipelined Integration and Read: – Allows Data Read During Integration Flexibility: – Electron and Hole Integration – Analog Output Provided for External HighResolution ADC Low Power: – 2.9 mW per Channel with ADC – 2.3 mW per Channel without ADC – 0.1 mW per Channel in Nap Mode – Total Power-Down Feature 22-mm × 5-mm Gold-Bump Die Suitable for Tape Carrier Package (TCP) or Chip-on-Film (COF) Flat-Panel X-Ray Detectors DESCRIPTION The AFE0256 is a 256-channel analog front-end (AFE) designed to suit the requirements of flat-panel detector (FPD)-based digital x-ray systems. The device includes 256 integrators, a programmable gain amplifier (PGA) for full-scale charge level selection, a correlated double sampler (CDS) with dual banking, 256:4 analog multiplexers, and four differential output drivers. The device also features four 14-bit successiveapproximation register (SAR) analog-to-digital converters (ADCs) on board. Serial data from the ADCs are available in SPI™ format. Hardware-selectable integration polarity allows positive or negative charge integration and provides more flexibility in system design. The Nap feature enables substantial power saving that is especially useful in battery-powered systems. The AFE0256 is available as a 22-mm × 5-mm singulated format with known good gold-bump dies. 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SPI is a trademark of Motorola. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012–2013, Texas Instruments Incorporated AFE0256 SBAS560A – DECEMBER 2012 – REVISED AUGUST 2013 www.ti.com Tray, Top Side Single Gold-Bump Unit, Back Side Figure 1. Tray Information 2 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: AFE0256 AFE0256 www.ti.com SBAS560A – DECEMBER 2012 – REVISED AUGUST 2013 REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (December 2012) to Revision A Page • Changed last Features bullet ................................................................................................................................................ 1 • Updated Figure 1 .................................................................................................................................................................. 2 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: AFE0256 3 PACKAGE OPTION ADDENDUM www.ti.com 23-Sep-2016 PACKAGING INFORMATION Orderable Device Status (1) AFE0256GBTD NRND Package Type Package Pins Package Drawing Qty 0 39 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) AU Level-1-260C-UNLIM Op Temp (°C) Device Marking (4/5) 0 to 85 AFE0256 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 23-Sep-2016 Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. 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AFE0256GBTD 价格&库存

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