AFE4405YZR

Product Folder Order Now Support & Community Tools & Software Technical Documents AFE4405 SBAS768C – APRIL 2016 – REVISED JULY 2019 AFE4405 Ultra-Small, Integrated AFE with FIFO for Wearable, Optical Heart-Rate Monitoring and Bio-Sensing 1 Features 2 Applications • • 1 • • • • • • • • • Transmitter: – Supports Common Anode LED Configuration – Dynamic Range: 100 dB – 8-Bit Programmable LED Current to 50 mA (Extendable to 100 mA) – Programmable LED On-Time – Simultaneous Support of 3 LEDs for Optimized SpO2, HRM, or Multi-Wavelength HRM Receiver: – Supports 2 Time-Multiplexed Photodiode Inputs – 24-Bit Representation of the Current Input from the Photodiode in Twos Complement Format – Individual DC Offset Subtraction DAC (±15.75-µA Range) at TIA Input for Each LED, Ambient – Digital Ambient Subtraction at ADC Output – Transimpedance Gain: 10 kΩ to 2 MΩ – Dynamic Range: 100 dB – Dynamic Power-Saving Mode to Reduce Receiver Current to 200 µA Pulse Frequency: 5 SPS to 1000 SPS Flexible Pulse Sequencing and Timing Control Flexible Clock Options: – External Clocking: 4-MHz to 60-MHz Input Clock – Internal Clocking: 4-MHz Oscillator FIFO with 240 Sample Depth: – Programmable Partitioning Across Phases I2C, SPI Interfaces: Selectable by Pin Operating Temperature Range: –20°C to +70°C 2.6-mm × 2.1-mm DSBGA, 0.4-mm Pitch Supplies: Rx: 2 V to 3.6 V, Tx: 3 V to 5.25 V, IO: 1.8 V to 3.6 V Optical Heart-Rate Monitoring (HRM) for Wearables, Hearables Heart-Rate Variability (HRV) Pulse Oximetry (SpO2) Measurements Maximum Oxygen Consumption (VO2 Max) Calorie Expenditure • • • • 3 Description The AFE4405 is an analog front-end (AFE) for optical bio-sensing applications, such as heart-rate monitoring (HRM) and saturation of peripheral capillary oxygen (SpO2). The device supports three switching light-emitting diodes (LEDs) and up to two photodiodes. The current from the photodiode is converted into voltage by the transimpedance amplifier (TIA) and digitized using an analog-to-digital converter (ADC). The ADC code can be stored in a 240-sample first in, first out (FIFO) block with programmable depth. The FIFO depth can be partitioned to accommodate the phases that must be stored. The FIFO can be read out using either an I2C or a SPI interface. The AFE also has a fullyintegrated LED driver with an 8-bit current control. The device has a high dynamic range transmit-andreceive circuitry that helps with the sensing of very small signal levels. To request a full data sheet or other design resources: request AFE4405 Device Information(1) PART NUMBER AFE4405 PACKAGE DSBGA (30) BODY SIZE (NOM) 2.60 mm × 2.10 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Simplified Block Diagram TX_SUP RX_SUP INP PD1 Offset DAC LED1 LED2 LED3 TX1 TX2 TX3 TX_SUP LDO CF ILED INM I2C_SPI_SEL RF TIA NoiseReduction Filter (x4) + ADC FIFO SPI, I2C Interface SPI Interface I2C Interface RESETZ RF INP2 PD2 INM2 Timing Engine ADC_RDY PROG_OUT1 CF 4-MHz Oscillator CLK Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. AFE4405 SBAS768C – APRIL 2016 – REVISED JULY 2019 www.ti.com 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (May 2016) to Revision C • Changed the Mechanical Packaging images ......................................................................................................................... 4 Changes from Revision A (May 2016) to Revision B • 2 Page Added link to request full data sheet ...................................................................................................................................... 1 Changes from Original (April 2016) to Revision A • Page Page Released to production........................................................................................................................................................... 1 Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: AFE4405 AFE4405 www.ti.com SBAS768C – APRIL 2016 – REVISED JULY 2019 5 Device and Documentation Support 5.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 5.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 5.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 5.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 5.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: AFE4405 3 AFE4405 SBAS768C – APRIL 2016 – REVISED JULY 2019 www.ti.com PACKAGE OUTLINE YZ0030-C01 DSBGA - 0.5 mm max height SCALE 5.000 DIE SIZE BALL GRID ARRAY 2.095 2.035 B A BALL A1 CORNER 2.595 2.535 0.5 MAX C SEATING PLANE BALL TYP 0.19 0.13 0.05 C 1.6 TYP 0.85 F E 2 TYP D 0.4 TYP SYMM C B A 30X 0.015 0.25 0.21 C A B 1 2 3 4 5 PKG 0.4 TYP 4222550/D 07/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com 4 Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: AFE4405 AFE4405 www.ti.com SBAS768C – APRIL 2016 – REVISED JULY 2019 EXAMPLE BOARD LAYOUT YZ0030-C01 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.85) (0.4) TYP 30X ( 0.23) 1 3 2 4 5 A (0.4) TYP B C PKG SYMM D E F PKG LAND PATTERN EXAMPLE SCALE:30X ( 0.23) METAL 0.05 MAX METAL UNDER SOLDER MASK 0.05 MIN ( 0.23) SOLDER MASK OPENING SOLDER MASK OPENING NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4222550/D 07/2019 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). www.ti.com Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: AFE4405 5 AFE4405 SBAS768C – APRIL 2016 – REVISED JULY 2019 www.ti.com EXAMPLE STENCIL DESIGN YZ0030-C01 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.85) (0.4) TYP 30X ( 0.25) (R0.05) TYP 1 2 4 3 5 A (0.4) TYP B METAL TYP C PKG SYMM D E F PKG SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:35X 4222550/D 07/2019 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com 6 Submit Documentation Feedback Copyright © 2016–2019, Texas Instruments Incorporated Product Folder Links: AFE4405 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) AFE4405YZR ACTIVE DSBGA YZ 30 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -20 to 70 AFE4405 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of