AIC111RHBG4

AIC111 www.ti.com SLAS382A – JUNE 2003 – REVISED NOVEMBER 2005 IC DESIGN SPECIFICATION 1.3-V microPower™ DSP/μC VOICE BAND AUDIO CODEC Check for Samples: AIC111 FEATURES – - 32-Pin QFN 5×5-mm Plastic Package – - 32-Pad Bumped Die in Waffle Pack (wafer scale packaging) 1 • • 2 • • • • • • • • • • • • Single Channel Codec Noise Shaped Delta Sigma ADC and DAC Technology Low Supply Voltage and Current: – 1.3-V Typical Power Supply – 350-µA Typical Supply Current Drain Power Supply Up Monitor and Low Battery Monitor That Also Automatically Shuts Off HBridge Output When Battery Decays Below 1.05 V in a Nontransient Manner Typical 2.4-µVrms Input Referred Noise With 0.01% Total Harmonic Distortion for Front End and 108-dB Dynamic Range ADC Has 87-dB Dynamic Range With 73-dB Total Harmonic Distortion 100 Hz-10 kHz, 40kHz Sampling Rate Typical 55-dB PSRR 100 Hz to 10 kHz for Analog Front End Low Noise Programmable Gain Amplifier/Compressor Front End With Programmable Fast and Slow Attack and Decay Rates With Dual or Single Attack and Decay Rate Option Typical Output Noise of 12 µVrms With 0.05% Total Harmonic Distortion for Delta Sigma DAC and H-Bridge Output Driver Low Jitter Oscillator That Generates all Internal Clocks and Generates 5-MHz Output DSP/µC Clock Regulated Bandgap Voltage Reference Programmable Functionality via Digital Serial Interface – McBSP Interface, DSP Protocol – TI TMS320VC54x™, TMS320VC55x™ DSPs – SPI Interface, Microcontroller Protocol – TI MSP430xx External Chip Power Down and Reset Available in: APPLICATIONS • • • • • Hearing Instruments Personal Medical Devices Hearing Protection Aural Processing Low-Power Headsets DESCRIPTION The AIC111 IC design specification serves to provide product development teams with a guideline for how the AIC111 IC is specified and programmable options that are available. The document outlines a top-level block description of the IC along with system specifications and functions. Individual block descriptions and target specifications are also outlined. The Texas Instruments AIC111 is a TI µPower DSP compatible, or microcontroller compatible audio codec product, or analog interface circuit. The AIC111 is part of a comprehensive family of DSP/µC based high-performance analog interface solutions. The AIC111 is targeted primarily at personal medical devices, such as hearing instruments, aural preprocessing applications, and low-power headset applications. The AIC111 is used in any design requiring a programmable time constant PGA/compressor interface, high dynamic range analog-to-digital converter, an external DSP/µC handling signal processing, or a low distortion digitalto-analog converter with a balanced H-Bridge speaker driver. It supports a CMOS digital interface tailored for TI DSPs with the McBSP protocol such as TMS320VC54x™ DSP family and SPI-based controllers such as TI MSP430x family of microcontrollers. The AIC111 also has an external microphone or sensor supply and bias and power supply up low-battery monitor indicator. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. microPower is a trademark of Texas Instruments. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003–2005, Texas Instruments Incorporated AIC111 SLAS382A – JUNE 2003 – REVISED NOVEMBER 2005 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. The AIC111 comes in a 32-pin QFN 5×5-mm package. A 32-pad solder ball bumped flip chip die that comes in waffle packs or tape and reel is in preview and will be available 3rd quarter 2003. AVAILABLE OPTIONS (1) Part Number Package AIC111RHB 32-pin QFN (5 mm x 5 mm), in tube. AIC111RHBR 32-pin QFN (5 mm x 5 mm), tape and reel AIC111YE 32-pad waffle scale chip package, bumped die in waffle pack (commercial) AIC111YE 32-pad waffle scale chip package, bumped die in waffle pack (industrial) AIC111YER (1) 32-pad (WSCP) bumped die in tape and reel For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted( (1))( (2)) UNIT TA Input voltage AI or DI pins Power supply VDD, power pins Latch-up tolerance JEDEC latch-up (EIA/JEDS78) Operating free-air temperature range, -0.3 V to 4 V -0.3 V to 4.5 V 100 mA Commerical 0°C to 70°C −40°C to 85°C Industrial Functional temperature range Tstg -15°C to 85°C Reflow temperature range (flip chip) 220°C to 230°C Storage temperature range -40°C to 125°C Storage humidity (1) (2) 65% R.H. Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Specifications are assured operating at maximum device limits for QFN package only, unless otherwise specified. ELECTRICAL CHARACTERISTICS INPUT/OUTPUT, OPERATING TEMPERATURE AT 25°C PARAMETER Digital interface (see (1) and TEST CONDITION (2) ) BUF_DVDD (see Note MIN TYP (1) ) MAX UNIT 3.6 V VIH High-level input voltage BUF_DVDD0.2 VIL Low-level input voltage BUF_DVSS+ 0.2 V VOH High-level output voltage BUF_DVDD V VOL Low-level output voltage BUF_DVSS V Maximum allowed input voltage (AVIN) (1) (2) 2 Differential V 450 mVpk DVDD, VDD_OSC, and AVDD should be within 50 mV, preferably connected together. AVSS1, 2, DVSS, and VSS_OSC should be within 50 mV, preferably connected together. Maximum (0.9 V, DVDD -0.5 V) ≤ BUF_DVDD ≤3.6 V Copyright © 2003–2005, Texas Instruments Incorporated AIC111 www.ti.com SLAS382A – JUNE 2003 – REVISED NOVEMBER 2005 ELECTRICAL CHARACTERISTICS (continued) INPUT/OUTPUT, OPERATING TEMPERATURE AT 25°C PARAMETER Input impedance (AVIN) (see TEST CONDITION (3) ) MIN Nominal gain = 50x Input capacitance (AVIN) Microphone bias voltage (MIC_VSUP) 20-μA maximum Microphone bias resistor (MIC_BIAS) (3) H-bridge amplifier output DAC full scale output differential Output resistance Differential, HB - VDD = 1.3 V TYP MAX UNIT 20 kΩ 5 pF 0.87 0.94 0.99 V 27 29.1 31 kΩ Fixed Q 3/4 HB_VDD Adaptive Q HB_VDD 20 or 40 VPP Ω Driving single-ended: Rin = R × [(1+A)/(2+A)], A = PGAC Gain (linear), R = 20.4 kΩ for A ≥4 or 20.4 kΩ× (4/A) for A