User's Guide
SWRU444A – March 2016 – Revised October 2018
Dual-Mode Bluetooth® CC2564 Module With Integrated
Antenna BoosterPack™ Plug-in Module
The BOOST-CC2564MODA BoosterPack™ Plug-in Module is intended for evaluation and design
purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA). The
CC2564MODA module is based on TI's dual-mode Bluetooth CC2564B controller, which reduces design
effort and enables fast time to market. The CC2564MODA module provides one of the best RF
performance with a transmit power and receive sensitivity that provides range of about 2× compared to
other Bluetooth low energy only solutions.
For a complete evaluation solution, the BOOST-CC2564MODA board plugs directly into a TI
LaunchPad™ Development Kit and BoosterPack Plug-in Module, such as the following:
• MSP-EXP432P401R
• CC3200AUDBOOST
• CC31XXEMUBOOST
A certified and royalty-free TI Bluetooth stack (TIBLUETOOTHSTACK-SDK) is available for the
MSP432™ MCU.
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Contents
Features .......................................................................................................................
Introduction to BOOST-CC2564 BoosterPack™ Plug-in Module .....................................................
Kit Contents...................................................................................................................
Requirements ................................................................................................................
Hardware Description .......................................................................................................
Software Tools ..............................................................................................................
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List of Figures
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BOOST-CC2564MODA Board ............................................................................................. 2
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MSP43x Hardware Setup Examples ...................................................................................... 3
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MSP43x and CC3200AUDBOOST Hardware Setup Examples ....................................................... 3
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BOOST-CC2564MODA Block Diagram
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BOOST-CC2564MODA Board Front Overview
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BOOST-CC2564MODA Board Back Overview ..........................................................................
BOOST-CC2564MODA BoosterPack™ Connectors ...................................................................
BOOST-CC2564MODA Default PCM Jumper Settings ................................................................
BOOST-CC2564MODA Jumper Placement .............................................................................
BOOST-CC2564MODA Jumper Placement..............................................................................
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Trademarks
BoosterPack, LaunchPad, MSP432, SimpleLink are trademarks of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
All other trademarks are the property of their respective owners.
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Features
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Features
The BOOST-CC2564MODA BoosterPack Plug-in Module has the following features:
• Supports dual-mode (Bluetooth and Bluetooth low energy) Bluetooth Specification v4.1
• Offers an integrated antenna on the CC2564MODA module for ready-to-use application
• FCC, IC, and CE certified with a certified and royalty-free TI Bluetooth stack, getting started guide,
demonstrations, UART, and PCM-I2S interface
• Offers class 1.5 transmit power (10 dBm) and high sensitivity (–93 dBm typical)
• Offers BoosterPack connectors compatible with TI LaunchPad Development Kits and BoosterPack
Plug-in Modules such as the following:
– MSP-EXP432P401R
– CC3200AUDBOOST
– CC31XXEMUBOOST
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Introduction to BOOST-CC2564 BoosterPack™ Plug-in Module
TI intends this user's guide to help you integrate TI's Bluetooth development platform, the BOOSTCC2564 BoosterPack Plug-in Module, with TI's evaluation platforms and software development kits
(SDKs). This guide describes the components and configurations of the board for various Bluetooth
applications, and it includes specific information about the BoosterPack Plug-in Module to help apply the
board specifics to an application. Including pin descriptions and available software and tools, BoosterPack
Plug-in Module information and capabilities are provided to enhance the out-of-box experience for the
user. Figure 1 shows the BOOST-CC2564MODA board.
Figure 1. BOOST-CC2564MODA Board
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Kit Contents
The kit contains the BOOST-CC2564MODA board with a TI dual-mode Bluetooth CC2564 module with
integrated antenna.
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Dual-Mode Bluetooth® CC2564 Module With Integrated Antenna
BoosterPack™ Plug-in Module
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Requirements
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4
Requirements
The following hardware and software tools are required in combination with the BOOST-CC2564MODA
board for a complete evaluation.
Hardware
• One MSP432 LaunchPad Development Kit—sold separately
– MSP-EXP432P401R LaunchPad
• One SimpleLink™ Wi-Fi® CC3200 Audio BoosterPack (optional)—for audio and voice sample
applications
– CC3200AUDBOOST BoosterPack
• One Advanced Emulation BoosterPack for SimpleLink Wi-Fi CC3100 BoosterPack (optional)—for
debugging purposes
– CC31XXEMUBOOST BoosterPack
Software
• TI dual-mode Bluetooth stack
– On MSP432 MCUs: CC2564CMSP432BTBLESW
Figure 2 shows MSP43x hardware setup examples. Figure 3 shows MSP43x and CC3200AUDBOOST
hardware setup examples.
Figure 2. MSP43x Hardware Setup Examples
Figure 3. MSP43x and CC3200AUDBOOST Hardware Setup Examples
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Hardware Description
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Hardware Description
5.1
Overview
The BOOST-CC2564MODA board has four BoosterPack connectors (J1 through J4). The board also has
six jumper connectors (J5 through J10). BoosterPack connectors are at 3.3 V. Figure 4 is a high-level
block diagram of the BoosterPack Plug-in Module. The onboard oscillator is the slow clock with a
frequency accuracy of 32.768 kHz + –250 ppm. The signals from the dual-mode Bluetooth CC2564MODA
module include:
• UART
• PCM
• nSHUTD
• TX_debug
BoosterPack connectors (J1 through J4) provide the default power to the CC2564MODA. The USB port
can be configured to power the BoosterPack Plug-in Module. Figure 5 is an overview of the front of the
BOOST-CC2564MODA and shows the default settings for the I/O connectors. Figure 6 shows the back
connectors of the board for the BOOST-CC2564MODA.
Figure 4. BOOST-CC2564MODA Block Diagram
4
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BoosterPack™ Plug-in Module
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Hardware Description
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Figure 5. BOOST-CC2564MODA Board Front Overview
Figure 6. BOOST-CC2564MODA Board Back Overview
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BoosterPack™ Plug-in Module
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Hardware Description
5.2
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BoosterPack™ Connectors
The BoosterPack connectors comply with the 40-pin BoosterPack standard and can be used to mount on
a variety of LaunchPad Development Kits. Figure 7 shows the pin assignments for the BOOSTCC2564MODA.
Figure 7. BOOST-CC2564MODA BoosterPack™ Connectors
BoosterPack Standard
+3.3 V
+3.3 V
2
Analog In
3
4
RX:MCU
UART
TX8MCU
5
GPIO
(!)
RST
7
SPI CLK
UART_RX_2
GPIO
GND
PWM Out
GPIO
(!)
19
SPI CS Wireless
GPIO
(!)
18
BT_nSHUTD_1
GPIO**
17
RST
16
15
MOSI
SPI
14
MISO
(!)
9
GND
UART_RX_1
UART_TX_2
I2C
J2
UART_TX_1
Analog In
10
J1
BoosterPack Standard
BT_nSHUTD_2
6
8
BOOST-CC2564MODA
Pin Map
BOOST-CC2564MODA
Pin Map
BOOST-CC2564MODA
SCL
SPI CS Display
GPIO
(!)
13
SPI CS Other
GPIO
(!)
12
GPIO
(!)
11
SDA
+5 V
+5 V
PWM out
GPIO
(!)
40
GND
GND
PWM out
GPIO
(!)
39
PWM out
GPIO
(!)
38
23
Analog In
24
Analog In
UART_CTS_1
PWM out
GPIO
(!)
37
25
Analog In
UART_RTS_1
Timer Capture
GPIO
(!)
36
26
Analog In
Timer Capture
GPIO
(!)
35
27
Analog In
WS
GPIO
(!)
34
28
Analog In
SCLK
GPIO
(!)
33
29
Analog Out
SDout
AUD_DOUTIN
GPIO
(!)
32
30
Analog Out
SDin
AUD_DINOUT
GPIO
(!)
31
AUD_FSYNC
UART_CTS_2
AUD_CLK
UART_RTS_2
TX_DBG
I2S
J3
J4
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NOTE: The dashed outline on the pins indicates that those pins are not connected or enabled by default.
5.3
5.3.1
Board Configuration
Power Supplies Configuration
The CC2564MODA module can be configured to be powered by one of the following sources:
• LaunchPad 3.3 V (J1.1) (default)
• Onboard 3.3-V LDO, which has the following two input options:
– An onboard USB connector
– LaunchPad 5 V (J3.21)
The LaunchPad 3.3 V (J1.1) is the default setup on the J10 jumper short-pins 1 and 2. The onboard 3.3-V
LDO (which has two input options) must be configured. The LDO can regulate the power source from the
LaunchPad 5.5 V (J3.21) or the onboard USB connector from a connected USB. To configure the power
from the LDO regulator, the J10 jumper must be moved to pins 2 and 3 (LDO_3V3) where the LDO takes
the higher-input voltage. The red LED, D1, indicates power to the board.
6
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BoosterPack™ Plug-in Module
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5.3.2
nSHUTD Configuration
The BOOST-CC2564MODA default nSHUTD comes from an internal switch (SW1). To disable the SW1,
do not populate (DNP) resistor R6. To configure the BoosterPack Plug-in Module to nSHUTD_1 or
nSHUTD_2, 1, add a jumper to J5 (nSHUTD) on pins 1 and 2 (nS1) for BoosterPack BT_nSHUTD_1 or
on pins 2 and 3 (nS2) for BT_nSHUTD_2.
NOTE: During initialization, the green LED (D2) indicates that the CC2564MODA has been
successfully powered up after a reset.
5.3.3
UART Configuration
The BOOST-CC2564MODA has two UART connections. The default is set to UART_TX_1, UART_RX_1,
UART_CTS_1, and UART_RTS_1.
To
1.
2.
3.
4.
5.
6.
7.
8.
9.
5.3.4
configure the BoosterPack Plug-in Module to use UART_2, do:
Populate resistor R20.
DNP R16 to UART_TX_1 (J1.3).
Populate resistor R21.
DNP R17 to UART_RX_1 (J1.4).
Populate resistor R22.
DNP R18 to UART_CTS_1 (J4.37).
Add a jumper to J8 on pins 2 and 3 (UART_CTS_2).
Populate resistor R23.
DNP R19 to UART_RTS_1 (J4.36).
PCM Configuration
For voice and assisted-audio features, the BOOST-CC2564MODA uses an auto-sensing voltage translator
so the CC2564MODA PCM interface can be master or slave without hardware configuration. The
CC2564MODA module can provide the PCM clock (BCLK) and fsync (WCLK) clock signals to the codec.
The PCM configuration is required for the following profiles:
• HFP
• HSP
• A3DP
To change the direction of the audio data pins, perform the following steps to configure the hardware:
1. Move jumper J6 from pins 1 and 2 (AUD_DINOUT J3.30) to pins 2 and 3 (AUD_DOUTIN J3.29).
2. Move jumper J7 from pins 1 and 2 (AUD_DOUTIN J3.29) to pins 2 and 3 (AUD_DINOUT J3.30) (see
Figure 8).
Figure 8. BOOST-CC2564MODA Default PCM Jumper Settings
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Hardware Description
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If audio is unused, the pins can be disabled from the connector to provide extra analog pins. Perform the
following steps to disable the audio pins:
1. Disable resistors R7 and R8 to disable pins J3.27 (AUD_FSYNC) and J3.28 (AUD_CLK) from the
connector.
2. Remove the jumpers on J6 and J7 to disable pins J3.29 (AUD_DOUTIN) and J3.30 (AUD_DINOUT).
5.3.5
TX_Debug Configuration
The CC31XXEMUBOOST emulation BoosterPack can be used along with the BOOST-CC2564MODA to
collect internal CC2564MODA logging information for debugging purposes. Also, the
CC31XXEMUBOOST emulation BoosterPack can allow direct HCI communication to the CC2564MODA.
To connect the CC31XXEMUBOOST BoosterPack board and the BOOST-CC2564MODA BoosterPack
board, do:
On the BOOST-CC2564MODA:
1. Move jumper J5 and nSHUTD to pins 2 and 3 (nS2).
2. Add a jumper to pins 1 and 2 (TX_DBG) on J8.
On the CC31XXEMUBOOST:
1. Populate J22, J2, and J4.
2. Do not install (DNI) J1.
3. Connect PC to J6 (USB connector).
NOTE: The third and fourth virtual COM ports correspond to CC2564 UART and Bluetooth logger
UART, respectively.
You can communicate to the CC2564MODA UART directly from the PC and collect the
Bluetooth logger logs. See Figure 9 for more information.
Figure 9. BOOST-CC2564MODA Jumper Placement
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Software Tools
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To connect the CC31XXEMUBOOST BoosterPack board and the BOOST-CC2564MODA BoosterPack
board and any LaunchPad, do:
1. Add a jumper to pins 1 and 2 (TX_DBG) on J8 of the BOOST-CC2564MODA.
2. DNI J22 and J4 on the CC31XXEMUBOOST.
3. Populate J1 and J2 on the CC31XXEMUBOOST.
NOTE: You can collect the Bluetooth logger logs but cannot communicate to the CC2564MODA
UART directly from the PC because the LaunchPad is communicating to the CC2564MODA
over the UART. See Figure 10.
Figure 10. BOOST-CC2564MODA Jumper Placement
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Software Tools
6.1
TI Dual-Mode Bluetooth Stack
TI’s dual-mode Bluetooth stack enables Bluetooth and Bluetooth low energy and is comprised of singlemode and dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack provides
simple command line sample applications to speed development. The stack works with the following:
• Any MSP43X MCU with flash equal to or greater than 128KB and RAM equal to or greater than 8KB
(CC256XMSPBTBLESW)
• Any TM4C MCU with flash equal to or greater than 128KB (CC256XM4BTBLESW)
For detailed documentation, see the Bluetooth Demo APPS page.
6.2
TI Dual-Mode Bluetooth Service Packs for the CC256x Device
The CC256x Bluetooth service packs (SPs) are mandatory initialization scripts that contain bug fixes and
platform-specific configurations. The scripts must be loaded into the corresponding CC256x device after
every power cycle. The CC256x SPs are delivered as a Bluetooth script (BTS) file. A BTS file is a scripted
binary file that contains the embedded host controller interface (HCI) commands and HCI events.
6.3
Bluetooth Hardware Evaluation Tool
The CC256x Bluetooth hardware evaluation tool can be downloaded as a complete package from TI. The
tool is an intuitive user-friendly tool used to test TI's Bluetooth chips, including this CC256xQFNEM board.
The tool tests RF performance and modifies the service packs of TI's Bluetooth chips
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Revision History
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (March 2016) to A Revision ....................................................................................................... Page
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Deleted MSP-EXP430F5529LP .........................................................................................................
Deleted MSP430 ..........................................................................................................................
Deleted MSP-EXP430F5529LP .........................................................................................................
Deleted MSP-EXP430F5529LP LaunchPad ...........................................................................................
Changed MSP43x Hardware Setup Examples figure ................................................................................
Changed MSP43x and CC3200AUDBOOST Hardware Setup Examples figure .................................................
Changed BOOST-CC2564MODA BoosterPack™ Connectors figure ..............................................................
Revision History
1
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3
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