bq25010
bq25011
bq25012
www.ti.com
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
SINGLE-CHIP CHARGER AND DC/DC CONVERTER IC FOR PORTABLE APPLICATIONS
(bq2501x)
FEATURES
1
•
2
•
•
•
•
•
•
•
DESCRIPTION
Li-Ion Or Li-Pol Charge Management and
Synchronous DC-DC Power Conversion In a
Single Chip
Optimized for Powering Bluetooth™ Headsets
and Accessories
Charges and Powers the System from Either
the AC Adapter or USB with Autonomous
Power Source Selection
Integrated USB Charge Control with
Selectable 100 mA and 500 mA Charge Rates
Integrated Power FET and Current Sensor for
Up to 500 mA Charge Applications AND
100 mA DC-DC Controller with Integrated
FETs
Reverse Leakage Protection Prevents Battery
Drainage
Automatic Power Save Mode For High
Efficiency at Low Current, or Forced PWM for
Frequency Sensitive Applications
3.5 mm × 4.5 mm QFN Package
The bq2501x series are highly integrated charge and
power management devices targeted at space-limited
bluetooth applications. The bq2501x series offer
integrated power FET and current sensor for charge
control, reverse blocking protection, high accuracy
current and voltage regulation, charge status, charge
termination, and a highly efficient and low-power
dc-dc converter in a small package.
The bq2501x charges the battery in three phases:
conditioning, constant current and constant voltage.
Charge is terminated based on minimum current. An
internal charge timer provides a backup safety feature
for charge termination. The bq2501x automatically
re-starts the charge if the battery voltage falls below
an internal threshold. The bq2501x automatically
enters sleep mode when VCC supply is removed.
The integrated low-power high-efficiency dc-dc
converter is designed to operate directly from a
single-cell Li-Ion or Li-Pol battery pack. The output
voltage is either adjustable from 0.7 V to VBAT
(bq25010), fixed at 3.3 V (bq25011), or fixed at 1.8 V
(bq25012), and is capable of delivering up to 150-mA
of load current. The dc-dc converter operates at a
synchronized 1 MHz switching frequency allowing for
the use of small inductors.
APPLICATIONS
•
•
•
Bluetooth™ Headsets
Bluetooth™ Accessories
Low-Power Handheld Devices
TYPICAL APPLICATION
Bluetooth Chipset
bq25012RHL
AC Adapter
PG 14
VDC
5
AC
GND
3
VSS
FB
1.8 V
SW 19
DSP
2
9
VSS
CE 15
D+
D−
18
VSS
BAT/OUT 17
VBUS
6
USB
BAT/OUT 16
7
STAT1
ISET1
12
8
STAT2
ISET2
13
4
EN
FPWM
20
Battery
Pack
PACK+
Processor
+
GND
USB Port
RSET
PACK−
UDG−04070
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Bluetooth is a trademark of Bluetooth SIG, Inc.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2007, Texas Instruments Incorporated
bq25010
bq25011
bq25012
www.ti.com
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION (1)
TA
PART NUMBER (2) (3)
PACKAGE
MARKING
Adjustable
bq25010RHLR
ANC
3.3
bq25011RHLR (4)
ANE
1.8
bq25012RHLR
ANF
OUTPUT VOLTAGE (V)
-40°C to 125°C
(1)
(2)
(3)
(4)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com
The RHL package is available taped and reeled only in quantities of 3,000 devices per reel.
This product is RoHS compatible, including a lead concentration that does not exceed 0.1% of total product weight, and is suitable for
use in specified lead-free soldering processes. In addition, this product uses package materials that do not contain halogens, including
bromine (Br) or antimony (Sb) above 0.1% of total product weight.
Advanced Information, contact factory for availability.
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
bq25010
bq25011
bq25012
Supply voltage
Input voltage
Output sink/source current
Output source current
AC, USB (wrt VSS)
–0.3 V to 7 V
PG, OUT, ISET1, ISET2, STAT1, STAT2, TS (wrt VSS)
–0.3 V to 7 V
EN, FB, FPWM, SW (wrt VSS)
VOUT + 0.3 V
PG, STAT1, STAT2
15 mA
TS
200 μA
OUT
1.5 A
Storage temperature range, Tstg
–65°C to 150°C
Junction temperature range, TJ
0°C to 125°C
Lead temperature (soldering, 10 seconds)
260°C
ESD rating (human body model, HBM)
1500 V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
VCC
Supply voltage (from AC input)
4.5
6.5
VCC
Supply voltage (from USB input)
4.35
6.5
TJ
Operating junction temperature range
–40
125
UNIT
V
°C
DISSIPATION RATINGS
(1)
2
PACKAGE
TA < 40°C
POWER RATING
DERATING FACTOR
ABOVE TA = 40°C
θJA
20-pin RHL (1)
1.81 W
21 mW/°C
46.87°C/W
This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is
connected to the ground plane by a 2 ׳via matrix.
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Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): bq25010 bq25011 bq25012
bq25010
bq25011
bq25012
www.ti.com
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
ELECTRICAL CHARACTERISTICS
over junction temperature range (0°C ≤ TJ ≤ 125°C) and the recommended supply voltage range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
INPUT CURRENT
ICC(VCC)
Supply current 1, VCC
VVCC > VVCC(min)
ICC(SLP)
Sleep current
Sum of currents into OUT/BAT,
VVCC < V(SLP)
ICC(STDBY)
Stand by current
CE = High, 0°C ≤ TJ ≤ 85°C
IIB(OUT)
Input current, OUT
Charge DONE, VVCC > VVCC(min),
IOUT(SW) = 0 mA, Converter not switching
IIB(CE)
Input current, CE
1.2
2
2
5
150
15
mA
μA
35
1
CHARGE VOLTAGE REGULATION (VBAT(REG) + V(DO-MAX) ≤ VVCC, I(TERM) < IOUT(BAT) ≤ 0.5 A)
VREG(BAT)
(V(AC) – V(OUT))
(V(USB) – V(OUT))
Charger regulation voltage
4.2
V
Charge voltage regulation
accuracy
TA = 25°C
AC dropout voltage
VOUT (BAT) = VREG (BAT), IOUT(BAT) = 0.5 A
175
250
VOUT (BAT) = VREG (BAT), ISET2 = High
350
500
VOUT (BAT) = VREG (BAT), ISET2 = Low
60
100
USB dropout voltage
–0.35%
0.35%
–1%
1%
mV
CHARGE CURRENT REGULATION
IOUT
IOUT
(BAT)
(BAT)
AC output current range
USB output current range
V(SET)
Output current set voltage
K(SET)
Output current set factor
VVCC ≥ 4.5 V, VOUT (BAT) = V(LOWV),
VVCC – VOUT (BAT) > V(DO-MAX),
IOUT(BAT) = (K(SET) × V(SET) / RSET)
50
500
VVCC(min) ≥ 4.5 V, VOUT (BAT) = V(LOWV),
VVCC – VOUT (BAT) > V(DO-MAX), ISET2 = Low
80
100
VVCC(min)≥ 4.5 V, VOUT (BAT) = V(LOWV),
VVCC – VOUT (BAT) > V(DO-MAX), ISET2 = High
400
500
Voltage on ISET1, VVCC ≥ 4.5 V,
VOUT (BAT) = V(LOWV),
VVCC – VOUT (BAT) > V(DO-MAX), ISET2 = High
2.436
2.500
2.538
50 mA ≤ IOUT(OUT) ≤ 500 mA
307
322
337
10 mA ≤ IOUT(OUT) ≤ 50 mA
296
320
346
10 mA ≤ IOUT(OUT) ≤ 10 mA
246
320
416
2.8
3
3.2
V
250
375
500
ms
100
mA
270
mV
100
mA
mA
V
PRECHARGE and SHORT-CIRCUIT CURRENT REGULATION
V(LOWV)
Precharge to fast-charge
transition threshold
tPRECHG_DG
V
≥ 4.5 V, tFALL = 100 ns,
Deglitch time for fast-charge to VCC(min)
10 mV overdrive,
precharge transition
VIN(BAT) decreasing below threshold
IOUT(PRECHG)
Precharge range
0 V < VIN(BAT) < V(LOWV), t < t(PRECHG),
IOUT(PRECHG) = (K(SET) נV(PRECHG))/ RSET
V(PRECHG)
Precharge set voltage
Voltage on ISET1, VREG(BAT) = 4.2 V,
0 V < VIN(BAT) < V(LOWV),
t < t(PRECHG)
Voltage on OUT/BAT
5
240
255
CHARGE TAPER and TERMINATION DETECTION
I(TAPER)
Charge taper detection range
VIN(BAT) > V(RCH), t < t(PRECHG),
I(TAPER) = (K(SET) נV(TAPER))/ RSET
V(TAPER)
Charge taper detection set
voltage
Voltage on ISET1, VREG(BAT) = 4.2 V,
VIN(BAT) > V(RCH), t < t(PRECHG)
235
250
265
V(TERM)
Charge termination detection
set voltage
Voltage on ISET1, VREG(BAT) = 4.2 V,
VIN(BAT) > V(RCH), t < t(PRECHG),
I(TERM) = (K(SET) נV(TERM))/ RSET
11
18
25
Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): bq25010 bq25011 bq25012
5
mV
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3
bq25010
bq25011
bq25012
www.ti.com
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
ELECTRICAL CHARACTERISTICS (continued)
over junction temperature range (0°C ≤ TJ ≤ 125°C) and the recommended supply voltage range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
tTPRDET_DG
Deglitch time for taper
detection
VVCC(min) ≥ 4.5 V, tFALL = 100 ns,
10 mV overdrive, ICHG increasing above or
decreasing below threshold
tTERMDET_DG
Deglitch time for termination
detection
VVCC(min) ≥ 4.5 V, tFALL = 100 ns,
10 mV overdrive,
ICHG decreasing below threshold
MIN
TYP
250
375
350
MAX UNIT
500
ms
375
500
VREG(BAT) VREG(BAT)
– 0.115
– 0.10
VREG(BAT)
– 0.085
BATTERY RECHARGE THRESHOLD
VRCH
Recharge threshold voltage
tRCHDET
Deglitch time for recharge
detect
VVCC(min) ≥ 4.5 V, tFALL = 100 ns,
10 mV overdrive, ICHG decreasing below or
increasing above threshold
250
375
V
500
ms
0.25
V
STAT1, STAT2 and PG OUTPUTS
VOL
Low-level output voltage
IOL = 5 mA
ISET2 and CE INPUTS
VIL
Low-level input voltage
IIL= 10 μA
0
VIH
High-level input voltage
IIL= 20 μA
1.4
IIL
Low-level input current, CE
IIH
High-level input current, CE
IIL
Low-level input current, ISET2
IIH
High-level input current, ISET2 VISET2 = VCC
IIHZ
High-Z input current, ISET2
0.4
V
–1
1
VISET2 = 0 V
μA
–20
40
VISET2 = High-Z
1
TIMERS
t(PRECHG)
Precharge time limit
1620
t(TAPER)
Taper time limit
t(CHG)
Charge time limit
I(FAULT)
Timer fault recovery current
1800
1930
1620
1800
1930
16200
18000
19300
s
μA
200
SLEEP COMPARATOR for CHARGER
V(SLP)
Sleep mode entry threshold
VVCC ≤
VIN(BAT)
+80 mV
2.3 V ≤ VIN(BAT) ≤ VREG(BAT)
V(SLP_DG)
Sleep mode exit threshold
2.3 V ≤ VIN(BAT) ≤ VREG(BAT)
t(DEGL)
Deglitch time for sleep mode
VCC decreasing below threshold,
tFALL = 100 ns, 10 mV overdrive,
VVCC ≥
VIN(BAT)
+190 mV
250
375
500
V
ms
THERMAL SHUTDOWN
T(SHTDWN)
Thermal trip threshold
temperature
165
Thermal hysteresis
°C
15
UNDERVOLTAGE LOCKOUT AND POR
V(UVLO_CHG)
Undervoltage lockout
threshold voltage
Decreasing VCC
2.4
2.5
2.3
2.4
Hysteresis
VPOR
(1)
4
2.6
27
POR threshold voltage (1)
V
mV
2.5
V
Ensured by design. Not production tested.
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Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): bq25010 bq25011 bq25012
bq25010
bq25011
bq25012
www.ti.com
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
ELECTRICAL CHARACTERISTICS (continued)
over junction temperature range (0°C ≤ TJ ≤ 125°C) and the recommended supply voltage range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
DC-DC INPUT/OUTPUT CURRENT
V(BAT)
Input voltage range
UVLO
Undervoltage lockout
IOUT_L
Maximum output current
Input power absent
V(LOWV)
4.2
Input power present
V(UVLO)
4.2
V
2
150
mA
FPWM – bq25010
VIH(FPWM)
High-level input voltage
VIL(FPWM)
Low-level input voltage
2.0
0.4
FPWM bq25011 and bq25012
VIH(FPWM)
High-level input voltage
VIL(FPWM)
Low-level input voltage
IFPWM
Input bias current
1.3
0.4
VEN = GND or VBAT, VFPWM = GND or VBAT
0.01
0.1
V
μA
ENABLE
VIH(EN)
High-level input voltage
VIL(EN)
Low-level input voltage
1.3
IEN
Input bias current
VEN = GND or VBAT, VFPWM = GND or VBAT
0.01
0.1
Internal P-channel MOSFET
on-resistance
VIN = VGS = 3.6 V
0.97
1.52
VIN = VGS = 2.5 V
1.27
2.00
Internal N-channel MOSFET
on-resistance
VIN = VGS = 3.6 V
0.68
1.19
VIN = VGS = 2.5 V
0.86
1.45
Ilgk(P)
P-channel leakage current
VDS = 6 V
0.1
1
Ilgk(N)
N-channel leakage current
VDS = 6 V
0.1
1
I(LIM)
P-channel current limit
2.5 V < VBAT < 4.2 V
190
230
350
0.65
1
0.4
V
μA
POWER SWITCH
RDS(on)
Ω
μA
mA
OSCILLATOR
fSW
Switching frequency
1.5 MHz
OUTPUT
VREF
Reference voltage
bq25010
VFB
Feedback
voltage (2)
3.6 V ≤ VBAT ≤ 4.2 V, 0 mA ≤ IOUT ≤ 150
bq25010
mA
Adjustable output
voltage range
VDC-DC
(2)
Fixed output
voltage
0.5
–3%
+3%
bq25010
0.7
VBAT
3.6 V ≤ VBAT ≤ 4.2 V, 0 mA ≤ IOUT ≤ 150
bq25011
mA
3.2
3.3
3.4
3.6 V ≤ VBAT ≤ 4.2 V, 0 mA ≤ IOUT ≤ 150
mA
1.746
1.8
1.854
bq25012
V
For output voltages ≤ 1.2 V a 22-μF output capacitor value is required to achieve a maximum output voltage accuracy of +3% while
operating in power save mode (PFM).
Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): bq25010 bq25011 bq25012
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bq25010
bq25011
bq25012
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SLUS615B – DECEMBER 2004 – REVISED JULY 2007
TYPICAL OPERATING CHARACTERISTICS
EFFICIENCY
vs
LOAD CURRENT
100
100
Forced PWM,
VO = 1.8 V,
TA = 22oC
95
90
EFFICIENCY
vs
LOAD CURRENT
95
Efficiency − %
Efficiency − %
Vbat = 3.6 V
80
Vbat = 4 V
75
70
85
80
60
60
55
55
20
30
40
50
60
70
80
90
100
Vbat = 4.1 V
70
65
50
Vbat = 3.7 V
75
65
10
Vbat = 2.7 V
90
85
0
Power Save Mode,
VO = 1.8 V,
TA = 27oC
Vbat = 3.2 V
50
0
10
20
30
40
50
60
70
80
90
100
IL − Load Current − mA
IL − Load Current − mA
Figure 1.
Figure 2.
DEVICE INFORMATION
6
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1
2
FB
VSS
18
3
VSS
BAT/OUT
17
4
EN
BAT/OUT
16
5
AC
CE
15
6
USB
PG
14
7
STAT1
ISET2
13
8
STAT2
ISET1
12 11
10
9
VSS
N/C
19 20
N/C
SW
N/C
FPWM
bq25010, bq25011, bq25012
RHL PACKAGE
(BOTTOM VIEW)
Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): bq25010 bq25011 bq25012
bq25010
bq25011
bq25012
www.ti.com
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
TERMINAL FUNCTIONS
TERMINAL
NAME
NO.
I/O
DESCRIPTION
AC
5
I
BAT/OUT
16
I/O
Charge input voltage from AC adapter
BAT/OUT
17
I
Battery input to DC-DC converter
CE
15
I
Charge enable input (active low)
EN
4
I
Enable input for DC-DC converter (active high)
FB
2
I
Feedback pin for DC-DC converter
FPWM
20
I
PWM control input for the DC-DC converter. A high on FPWM = forced PWM mode. A low = power save
mode.
ISET1
12
I
Charge current set point for AC input and precharge and taper set point for both AC and USB
ISET2
13
I
Charge current set point for USB port (High = 500 mA, Low = 100 mA, High-Z = disable USB charge)
Charge current output
NC
1, 10, 11
–
No connect. These pins must be left floating.
PG
14
O
Power good status output (active low)
STAT1
7
O
Charge status output 1 (open-drain)
STAT2
8
O
Charge status output 2 (open-drain)
SW
19
O
Phase node of the DC-DC converter
USB
6
I
Charge input voltage from USB adapter
VSS
3, 9, 18
–
Ground Input. Also note that there is an internal electrical connection between the exposed thermal pad
and VSS pins of the device. The exposed thermal pad must be connected to the same potential as the
Vss pin on the printed circuit board. Do not use the thermal pad as the primary ground input for the
device. All VSS pins must be connected to ground at all times.
Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): bq25010 bq25011 bq25012
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bq25011
bq25012
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SLUS615B – DECEMBER 2004 – REVISED JULY 2007
FUNCTIONAL BLOCK DIAGRAM
AC
BAT/OUT
VI(OUT)
VI(AC)
AC
5
16
ISET1
VI(ISET)
VI(BAT)
12
+
VO(REG)
Sense FET
VI(ISET)
+
VI(SET)
AC/USB
USB
6
Sense FET
17 BAT/OUT
EN
4
FPWM
20
VSS
3
VSS
DC−DC
Controller
VCC
19 SW
Reference
and
Bias
VI(FB)
2
FB
9
VO(REG)
VSS 18
AC/USB
VI(BAT)
Sleep
CHG ENABLE
Deglitch
VI(SLP)
500 mA/ 100 mA
Thermal
Shutdown
VO(REG)
VI(OUT)
Suspend
500 mA/ 100 mA
Recharge
Deglitch
VI(OUT)
15 CE
Precharge
Charge
Control,
Timer
and
Display
Logic
V(ISET1)
V(ISET2)
13 ISET2
USB Charge
14 PG
7
STAT1
8
STAT2
Taper
Deglitch
V(ISET2)
Deglitch
Term
UDG−04072
8
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bq25010
bq25011
bq25012
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SLUS615B – DECEMBER 2004 – REVISED JULY 2007
FUNCTIONAL DESCRIPTIONS
BATTERY CHARGER
The bq2501x supports a precision Li-Ion or Li-Pol charging system suitable for single-cell battery packs and a
low-power DC-DC converter for providing power to system processor. See a typical charge profile, application
circuit and an operational flow chart in Figure 3 through Figure 5 respectively.
Figure 3. Typical Charger Profile
LOUT
10 µH
bq25010RHL
AC Adapter
SW 19
VDC
5
AC
COUT
10 µF
R1
GND
FB
2
SYSTEM
R2
D+
D−
Battery
Pack
BAT/OUT 17
PACK+
VBUS
BAT/OUT 16
6
USB
7
STAT1
8
STAT2
4
EN
ISET1
12
3
VSS
ISET2
13
9
VSS
CE 15
18 VSS
PG 14
CCHG
0.1 µF
+
PACK−
GND
USB Port
RSET
Control and
Status Signals
UDG_04095_lus615
Figure 4. Typical Application Circuit
Copyright © 2004–2007, Texas Instruments Incorporated
Product Folder Link(s): bq25010 bq25011 bq25012
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SLUS615B – DECEMBER 2004 – REVISED JULY 2007
POR
SLEEP MODE
Vcc > VI(BAT)
No
checked at all times
Indicate SLEEP
MODE
Yes
VI(BAT) BATTERY
USB MODE
AC MODE
AC < BATTERY
USB > BATTERY
Figure 6. Power Source Selection
Battery Pre-Conditioning
During a charge cycle if the battery voltage is below the V(LOWV) threshold, the bq2501x applies a precharge
current, IO(PRECHG), to the battery. This feature revives deeply discharged cells. The resistor connected between
the ISET1 and VSS pins, RSET, determines the precharge rate. The V(PRECHG) and K(SET) parameters are
specified in the specifications table.
V(PRECHG) K(SET)
I O (PRECHG) +
RSET
(1)
The bq2501x activates a safety timer, t(PRECHG), during the conditioning phase. If V(LOWV) threshold is not reached
within the timer period, the bq2501x turns off the charger and enunciates FAULT on the STAT1 and STAT2 pins.
Please refer to Timer Fault Recovery section for additional details.
Battery Charge Current
The bq2501x offers on-chip current regulation with programmable set point. The resistor connected between the
ISET1 and VSS pins, RSET, determines the charge rate. The V(SET) and K(SET) parameters are specified in the
specifications table.
V(SET) K(SET)
I O (OUT) +
RSET
(2)
When charging from a USB port, the host controller has the option of selecting either 100 mA or 500 mA charge
rate using the ISET2 pin. A low-level signal sets the current at 100 mA and a high-level signal sets the current at
500 mA. A high-Z input disables USB charging.
Battery Voltage Regulation
The voltage regulation feedback is through the BAT/OUT pin. This input is tied directly to the positive side of the
battery pack. The bq2501x monitors the battery-pack voltage between the BAT/OUT and VSS pins. When the
battery voltage rises to VO(REG) threshold, the voltage regulation phase begins and the charging current begins to
taper down.
As a safety backup, the bq2501x also monitors the charge time in the charge mode. If taper threshold is not
detected within this time period, t(CHG), the bq2501x turns off the charger and enunciates FAULT on the STAT1
and STAT2 pins. Please refer to section titled Timer Fault Recoverysection for additional details.
Charge Taper Detection, Termination and Recharge
The bq2501x monitors the charging current during the voltage regulation phase. Once the taper threshold,
I(TAPER), is detected the bq2501x initiates the taper timer, t(TAPER). Charge is terminated after the timer expires.
The resistor connected between the ISET1 and VSS pins, RSET, determines the taper detection level. The
V(TAPER) and K(SET) parameters are specified in the specifications table. Note that this applies to both AC and
USB charging.
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I (TAPER) +
V(TAPER)
K(SET)
RSET
(3)
The bq2501x resets the taper timer in the event that the charge current returns above the taper threshold,
I(TAPER).
In addition to the taper current detection, the bq2501x terminates charge in the event that the charge current falls
below the I(TERM) threshold. This feature allows for quick recognition of a battery removal condition or insertion of
a fully charged battery. Note that taper timer is not activated. The resistor connected between the ISET1 and
VSS pins, RSET, determines the taper detection level. The V(TERM) and K(SET) parameters are specified in the
specifications table. Note that this applies to both AC and USB charging.
V(TERM) K(SET)
I (TERM) +
R SET
(4)
After charge termination, the bq2501x restarts the charge once the voltage on the BAT/OUT pin falls below the
V(RCH) threshold. This feature keeps the battery at full capacity at all times.
Sleep Mode for Charger
The bq2501x enters the low-power sleep mode if both AC and USB are removed from the circuit. This feature
prevents draining the battery during the absence of VCC.
Operation Modes
Operational modes of the bq2501x are summarized in Table 1. Operation of DC-DC is not recommended while
charger is in precharge mode.
Table 1. Operation Modes
BATTERY VOLTAGE
AC or USB ADAPTER STATUS
CHARGER STATUS
DC-DC STATUS
VI(BAT) > V(LOWV)
Present
Fast
EN
0 V < VI(BAT) < V(LOWV)
Present
Precharge
EN
VI(BAT) < V(UVLO)
Both absent
Off
Off
Status Outputs
The STAT1 and STAT2 open-drain outputs indicate various charger and battery conditions as shown in Table 2.
These status pins can be used to communicate to the host processor. Note that OFF indicates the open-drain
transistor is turned off.
Table 2. Status Pins Summary
CHARGE STATE
INPUT POWER STATE
STAT1
STAT2
Precharge in progress
Present
ON
ON
OFF
Fast charge in progress
Present
ON
Charge done
Not reported
OFF
ON
Timer fault
Not reported
OFF
OFF
Speel mode
Absent
OFF
OFF
PG Output (Power Good)
The open-drain PG output indicates when the AC adapter is present. The output turns ON when a valid voltage
is detected. This output is turned off in the sleep mode. The PG pin can be used to drive an LED or communicate
to the host processor.
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CE Input (Charge Enable)
The CE digital input is used to enable or disable the charge process. A low-level signal on this pin enables the
charge and a high-level signal disables the charge and places the device into a low-power mode. A high-to-low
transition on this pin also resets all timers and timer fault conditions. Note that this applies to both AC and USB
charging.
Thermal Shutdown and Protection
The bq2501x monitors the junction temperature, TJ, of the die and suspends charging if TJ exceeds T(SHTDWN).
Charging resumes when TJ falls below T(SHTDWN) by approximately 15°C.
Timer Fault Recovery
As shown in Figure 5, bq2501x provides a recovery method to deal with timer fault conditions. The following
summarizes this method:
Condition 1: Charge voltage above recharge threshold (V(RCH)) and timeout fault occurs.
Recovery method: bq2501x waits for the battery voltage to fall below the recharge threshold. This could happen
as a result of a load on the battery, self-discharge or battery removal. Once the battery falls below the recharge
threshold, the bq2501x clears the fault and starts a new charge cycle. A POR or CE toggle also clears the fault.
Condition 2: Charge voltage below recharge threshold (V(RCH)) and timeout fault occurs.
Recovery method: Under this scenario, the bq2501x applies the I(FAULT) current. This small current is used to
detect a battery removal condition and remains on as long as the battery voltage stays below the recharge
threshold. If the battery voltage goes above the recharge threshold, then the bq2501x disables the I(FAULT) current
and executes the recovery method described for Condition 1. Once the battery falls below the recharge
threshold, the bq2501x clears the fault and starts a new charge cycle. A POR or CE toggle also clears the fault.
DC-DC CONVERTER
The bq2501x provides a low quiescent-current synchronous DC-DC converter. The internally compensated
converter is designed to operate over the entire voltage range of a single-cell Li-Ion or Li-Pol battery. Under
nominal load current, the device operates with a fixed PWM switching frequency of typically 1 MHz. At light load
currents, the device enters the power save mode of operation; the switching frequency is reduced and the
quiescent current drawn by the converter from the BAT/OUT pin is typically only 15 μA.
During PWM operation the converter uses a unique fast-response voltage mode controller scheme with input
voltage feedforward to achieve good line and load regulation allowing the use of small ceramic input and output
capacitors. At the beginning of each clock cycle initiated by the clock signal (S), the P-channel MOSFET switch
is turned on and the inductor current ramps up until the comparator trips and the control logic turns off the switch.
The current limit comparator also turns off the switch in case the current limit of the P-channel switch is
exceeded. After the dead time preventing current shoot through the N-cannel MOSFET rectifier is turned on and
the inductor current ramps down. The next cycle is initiated by the clock signal again turning off the N-channel
rectifier and turning on the on the P-channel switch. The gM amplifier as well as the input voltage determines the
rise time of the saw-tooth generator and therefore any change in input voltage or output voltage directly controls
the duty cycle of the converter giving a very good line and load transient regulation.
Power Save Mode Operation
As the load current decreases, the converter enters the power save mode operation. During power save mode,
the converter operates with reduced switching frequency in PFM mode and with a minimum quiescent current to
maintain high efficiency.
Two conditions allow the converter to enter the power save mode operation. One is the detection of
discontinuous conduction mode. The other is when the peak switch current in the P-channel switch goes below
the skip current limit. The typical skip current limit can be calculated as:
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I SKIP + 66 mA )
VIN
160 W
(5)
During the power save mode, the output voltage is monitored with the comparator by the thresholds comp low
and comp high. As the output voltage falls below the comp low threshold (set to typically 0.8% above VOUT
nominal), the P-channel switch turns on. The P-channel switch is turned off as the peak switch current is
reached. The typical peak switch current can be calculated as:
V
I PEAK + 66 mA ) IN
80 W
(6)
The N-channel rectifier is turned on and the inductor current ramps down. As the inductor current approaches
zero, the N-channel rectifier is turned off, and the P-channel switch is turned on starting the next pulse. The
converter continues these pulses until the comp high threshold (set to typically 1.6% above VOUT nominal) is
reached. The converter enters a sleep mode, reducing the quiescent current to a minimum. The converter wakes
up again as the output voltage falls below the comp low threshold again. This control method reduces the
quiescent current to typically to 15 μA and the switching frequency to a minimum; thereby, achieving high
converter efficiency. Setting the skip current thresholds to typically 0.8% and 1.6% above the nominal output
voltage at light load current results in a dynamic output voltage achieving lower absolute voltage drops during
heavy load transient changes. This allows the converter to operate with a small output capacitor of only 10 μF
and still have a low absolute voltage drop during heavy load transient changes. Refer to Figure 7 as well for
detailed operation of the power save mode.
PFM Mode at Light Load
1.6%
Comparator High
0.8%
Comparator Low
VOUT
Comparator Low 2
PWM Mode at Medium to Full Load
Figure 7. Power Save Mode Thresholds and Dynamic Voltage Positioning
The converter enters the fixed-frequency PWM mode again as soon as the output voltage drops below the comp
low 2 threshold.
Dynamic Voltage Positioning
As described in the power save mode operation section and as detailed in Figure 7, the output voltage is typically
0.8% above the nominal output voltage at light load currents as the device is in power save mode. This gives
additional headroom for the voltage drop during a load transient from light load to full load. During a load
transient from full load to light load the voltage overshoot is also minimized due to active regulation turning on the
N-Channel rectifier switch.
Soft-Start
The bq2501x has an internal soft-start circuit that limits the inrush current during startup. This soft-start is
implemented as a digital circuit increasing the switch current in steps of typically 30 mA, 60 mA, 120 mA and
then the typical switch current limit of 230 mA. Therefore the startup time depends mainly on the output capacitor
and load current. Typical startup time with a 10-μF output capacitor and a 100-mA load current is 1.6 ms.
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100% Duty Cycle Low Dropout Operation
The bq2501x offers a low input-to-output voltage difference while still maintaining operation with the use of the
100% duty cycle mode. In this mode the P-channel switch is constantly turned on. This is particularly useful in
battery-powered applications to achieve longest operation time by taking full advantage of the whole battery
voltage range. The minimum input voltage to maintain regulation depends on the load current and output voltage
and can be calculated as:
V IN(min) + VOUT(max) ) I OUT(max)
ǒRDS(on)MAX ) RLǓ
(7)
where
IOUT(max) = maximum output current plus indicator ripple current
RDS(on)MAX = maximum P-channel switch RDS(on)
RL = DC resistance of the inductor
VOUT(max) = nominal output voltage plus maximum output voltage tolerance
Enable
Pulling the enable pin (EN) low forces the DC-DC converter into shutdown mode, with a shutdown quiescent
current of typically 0.1 μA. In this mode the P-channel switch and N-channel rectifier are turned off, the internal
resistor feedback divider is disconnected, and the converter enters shutdown mode. If an output voltage, which
could be an external voltage source or a super capacitor, is present during shut down, the reverse leakage
current is specified under electrical characteristics. For proper operation the EN pin must be terminated and
should not be left floating.
Pulling the EN pin high starts up the DC-DC converter with the soft-start as previously described.
Undervoltage Lockout
The undervoltage lockout circuit prevents the converter from turning on the switch or rectifier MOSFET at low
input voltages or under undefined conditions.
Forced PWM Mode
The FPWM input pin allows the host system to override the power save mode by driving the FPWM pin high. In
this state, the DC-DC converter remains in the PWM mode of operation with continuous current conduction
regardless of the load conditions. Tying the FPWM pin low allows the device to enter power save mode
automatically as previously described.
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APPLICATION INFORMATION
ADJUSTABLE OUTPUT VOLTAGE VERSION (bq25010)
When the adjustable output voltage version of the bq2501x is being used (bq25010), the output is set by the
external resistor divider, as shown in Figure 4.
The output voltage can be calculated as:
V OUT + 0.5 V
ǒ1 ) R1
Ǔ
R2
(8)
where
R1 + R2 ≤ 1 MΩ
Internal reference voltage VREF(typ) = 0.5 V
C1 and C2 should be selected as:
1
C1 +
2p 10 kHz R1
(9)
where
R1 = upper resistor of the voltage divider
C1 = upper capacitor of the voltage divider
For C1, a value should be chosen that comes closest to the calculated result.
C2 + R1 C1
R2
(10)
where
R2 = lower resistor of the voltage divider
C2 = lower capacitor of the voltage divider
For C2, the selected capacitor value should always be selected larger than the calculated result. For example, in
Figure 4, a 100-pF capacitor is selected for a calculated result of C2 = 86.17 pF.
If quiescent current is not a key design parameter, C1 and C2 can be omitted and a low-impedance feedback
divider must be used with R1 + R2 < 100 kΩ. This design reduces the noise available on the feedback pin (FB)
as well, but increases the overall quiescent current during operation.
FIXED OUTPUT VOLTAGE VERSION (bq25011, bq25012)
When a fixed output voltage version of the device is being used, no external resistive divider network is
necessary. In this case, the output of the inductor should be connected directly the FB pin, as shown in Figure 4.
INPUT CAPACITOR SELECTION
In most applications, all that is needed is a high-frequency decoupling capacitor. A 0.1-μF ceramic, placed in
close proximity to AC/USB and VSS pins, works fine. The bq2501x is designed to work with both regulated and
unregulated external DC supplies. If a non-regulated supply is chosen, the supply unit should have enough
capacitance to hold up the supply voltage to the minimum required input voltage at maximum load. If not, more
capacitance has to be added to the input of the charger.
CHARGER OUTPUT CAPACITOR (DC-DC CONVERTER INPUT CAPACITOR) SELECTION
Because the buck converter has a pulsating input current, a low ESR input capacitor is required. This results in
the best input voltage filtering and minimizes the interference with other circuits caused by high input voltage
spikes. Also, the input capacitor must be sufficiently large to stabilize the input voltage during heavy load
transients.
For good input voltage filtering, a 4.7-μF input capacitor is normally sufficient, and can be increased without any
limit for better input voltage filtering.
If ceramic output capacitors are used, the capacitor RMS ripple current rating ensures the application
requirements. For completeness, the RMS ripple current is calculated as:
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I RMS + I OUT(max)
SLUS615B – DECEMBER 2004 – REVISED JULY 2007
Ǹ
VOUT
V IN
ǒ
V
1 * OUT
VIN
Ǔ
(11)
The worst case RMS ripple current occurs at D = 0.5 and is calculated as:
I
I RMS + OUT
2
(12)
Ceramic capacitors perform well because of the low ESR value, and they are less sensitive to voltage transients
and spikes compared to tantalum capacitors. The input capacitor should be placed as close as possible to the
BAT/OUT pin of the device for best performance. Refer to Table 1for recommended components.
DC-DC CONVERTER OUTPUT CAPACITOR SELECTION
The advanced fast response voltage mode control scheme of the bq2501x allows the use of tiny ceramic
capacitors without having large output voltage under and overshoots during heavy load transients. Ceramic
capacitors having low ESR values have the lowest output voltage ripple and are therefore recommended. If
required, tantalum capacitors may be used as well (refer to Table 1 for recommended components). If ceramic
output capacitors are used, the capacitor RMS ripple current rating always meets the application requirements.
For completeness, the RMS ripple current is calculated as:
ǒ
1*
I RMS(Cout) + VOUT
V OUT
VIN
Ǔ
L
1
f
2
Ǹ3
(13)
At nominal load current, the device operates in PWM mode and the overall output voltage ripple is the sum of the
voltage spike caused by the output capacitor ESR plus the voltage ripple caused by charging and discharging the
output capacitor:
ǒ
DV OUT + VOUT
1*
L
V OUT
VIN
Ǔ
f
ǒ
8
1
COUT
f
Ǔ
) ESR
(14)
where the output voltage ripple occurs at the highest input voltage VIN.
At light load currents, the device operates in power save mode, and the output voltage ripple is independent of
the output capacitor value. The output voltage ripple is set by the internal comparator thresholds. The typical
output voltage ripple is 1% of the output voltage VOUT.
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DC-DC CONVERTER OUTPUT INDUCTOR SELECTION
For high efficiencies, the inductor should have a low dc resistance to minimize conduction losses. Although the
inductor core material has less effect on efficiency than its dc resistance, an appropriate inductor core material
must be used. The inductor value determines the inductor ripple current. The larger the inductor value, the
smaller the inductor ripple current, and the lower the conduction losses of the converter. On the other hand,
larger inductor values causes a slower load transient response. Usually the inductor ripple current, as calculated
below, should be around 30% of the average output current.
In order to avoid saturation of the inductor, the inductor should be rated at least for the maximum output current
of the converter plus the inductor ripple current that is calculated as:
ǒ
DI L + VOUT
1*
V OUT
VIN
L
Ǔ
f
(15)
where
f = switching frequency (1 MHz typical, 650 kHz minimal)
L = inductor value
ΔIL = peak-to-peak inductor ripple current
IL(max) = maximum inductor current
The highest inductor current occurs at maximum VIN. A more conservative approach is to select the inductor
current rating just for the maximum switch current of 350 mA. The internal compensator is designed in such a
way that the optimized resonant frequency of the output inductor and capacitor is approximately 16 kHz. The
recommended inductor and capacitor values for various output current are given in Table 3.
Table 3. Recommended Inductor and Capacitor Values
TYPICAL OUTPUT CURRENT
(mA)
INDUCTOR VALUE
(μH)
CAPACITOR VALUE
(μF)
APPLICATION
30
100
1
60
47
2.2
For low current, small capacitor
80
33
3.3
For medium current, small capacitor
120
22
4.7
For medium current
150
10
10
For highest current, smallest inductor
For low current, smallest capacitor
CHARGING WHILE UNDER LOAD
The bq2501x is designed such that maximum charging safety and efficiency can be obtained by suspending
normal operation while the device is actively charging the battery. In this mode of operation, the timeout function
prevents a defective battery from being charged indefinitely. If charging does not terminate normally within five
hours, the device annunciates a fault condition on the STAT1 and STAT2 pins as indicated in Table 2.
If a load is applied to the device while it is being used to charge a battery, a false fault condition may result due
to a slower rate of charge being applied to the battery. For this reason, it is recommended that the load be
disconnected from the bq2501x while it is charging a battery.
THERMAL CONSIDERATIONS
The bq2501x is packaged in a thermally enhanced MLP package. The package includes a thermal pad to
provide an effective thermal contact between the device and the printed circuit board (PCB). Full PCB design
guidelines for this package are provided in the application note QFN/SON PCB Attachment (SLUA271). The
most common measure of package thermal performance is thermal impedance (θJA) measured (or modeled)
from the chip junction to the air surrounding the package surface (ambient). The mathematical expression for θJA
is:
T * TA
q JA + J
P
(16)
where
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TJ = chip junction temperature
TA = ambient temperature
P = device power dissipation
Factors that can greatly influence the measurement and calculation of θJA include:
• Whether or not the device is board mounted
• Trace size, composition, thickness, and geometry
• Orientation of the device (horizontal or vertical)
• Volume of the ambient air surrounding the device under test and airflow
• Whether other surfaces are in close proximity to the device being tested
The device power dissipation (P) is a function of the charge rate and the voltage drop across the internal power
FET. It can be calculated from the following equation:
ǒ
Ǔ
P + V IN * V IN(BAT)
I OUT(OUT)
(17)
Due to the charge profile of Li-xx batteries, the maximum power dissipation is typically seen at the beginning of
the charge cycle when the battery voltage is at its lowest.
PCB LAYOUT CONSIDERATIONS
For all switching power supplies, the layout is an important step in the design, especially at high peak currents
and switching frequencies. If the layout is not carefully done the regulator could exhibit stability problems as well
as EMI problems. With this in mind, one should lay out the PCB using wide, short traces for the main current
paths. The input capacitor, as well as the inductor and output capacitors, should be placed as close as possible
to the IC pins.
The feedback resistor network (bq25010) must be routed away from the inductor and switch node to minimize
noise and magnetic interference. To further minimize noise from coupling into the feedback network and
feedback pin, the ground plane or ground traces must be used for shielding. This becomes important especially
at high switching frequencies.
The following are some additional guidelines that should be observed:
• To obtain optimal performance, the decoupling capacitor from AC to VSS (and from USB to VSS) and the
output filter capacitors from BAT/OUT to VSS should be placed as close as possible to the bq2501x, with
short trace runs to both signal and VSS pins.
• All low-current VSS connections should be kept separate from the high-current charge or discharge paths
from the battery. Use a single-point ground technique incorporating both the small signal ground path and the
power ground path.
• The BAT/OUT pin provides voltage feedback to the IC for the charging function and should be connected
with its trace as close to the battery pack as possible.
• The high current charge paths into AC and USB and from the BAT/OUT and SW pins must be sized
appropriately for the maximum charge or output current in order to avoid voltage drops in these traces.
• The bq2501x is packaged in a thermally enhanced MLP package. The package includes a thermal pad to
provide an effective thermal contact between the IC and the printed circuit board (PCB). Full PCB design
guidelines for this package are provided in the application note QFN/SON PCB Attachment (SLUA271).
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
BQ25010RHLR
ACTIVE
VQFN
RHL
20
3000
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 85
ANC
BQ25012RHLR
ACTIVE
VQFN
RHL
20
3000
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
ANF
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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