User's Guide
SLVUAP4 – April 2016
bq25898, bq25898D, and bq25898C PWR730 Evaluation
Modules
This user's guide provides detailed testing instructions for the bq25898, bq25898D, and bq25898C
evaluation modules. Also included are descriptions of the necessary equipment, equipment setup, and
procedures. Section 4 contains the printed-circuit board layouts, schematic, and the bill of materials
(BOM).
Throughout this user's guide, the abbreviations EVM, bq25898xEVM, and the term evaluation module are
synonymous with the bq25898, bq25898D, and bq25898C evaluation modules, unless otherwise noted.
Also, the abbreviation bq25898x refers to any of the three devices – bq25898, bq25898D, and bq25898C,
unless otherwise noted.
1
2
3
4
Contents
Introduction ................................................................................................................... 2
1.1
EVM Features ....................................................................................................... 2
1.2
I/O Descriptions ..................................................................................................... 2
Test Summary ................................................................................................................ 4
2.1
Equipment ........................................................................................................... 4
2.2
Equipment Setup.................................................................................................... 4
2.3
Test Procedure ...................................................................................................... 6
PCB Layout Guideline ....................................................................................................... 9
Board Layout, Schematic, and Bill of Materials ........................................................................ 10
4.1
Board Layout ....................................................................................................... 10
4.2
Schematic .......................................................................................................... 12
4.3
Bill of Materials .................................................................................................... 15
List of Figures
1
Connections of the EV2300 Kit ............................................................................................ 4
2
Original Test Setup for bq25898X ......................................................................................... 5
3
Selection Window of the bqStudio Evaluation Software ................................................................ 6
4
Setup Window of the bqStudio Evaluation Software .................................................................... 7
5
Status Report From Window of the bqStudio Evaluation Software ................................................... 7
6
bq25898EVM-730 Top Layer ............................................................................................. 10
7
bq25898EVM-730 Mid Layer 1 ........................................................................................... 10
8
bq25898EVM-730 Mid Layer 2 ........................................................................................... 10
9
bq25898EVM-730 Bottom Layer ......................................................................................... 10
10
bq25898EVM-730 Top Layer Assembly................................................................................. 10
11
bq25898EVM-730 Bottom Layer Assembly
12
bq25898EVM-730-001 Schematic ....................................................................................... 12
13
bq25898DEVM-730-002 Schematic ..................................................................................... 13
14
bq25898CEVM-730-003 Schematic ..................................................................................... 14
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1
Introduction
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1
Introduction
1.1
EVM Features
The device data sheets, listed in Table 1, provide detailed features and operation.
Table 1. Device Data Sheets
Device
Datasheet
EVM Label
Variant
bq25898
SLUSCA6
bq25898EVM-730
001
bq25898D
SLUSCA6
bq25898DEVM-730
002
bq25898C
SLUSCH6
bq25898CEVM-730
003
The bq25898x evaluation module (EVM) is a complete charger module for evaluating an I2C-controlled
single NVDC-1 charge using the bq25898x device.
This EVM does not include the USB-TO-GPIO or EV2300/EV2400 interface board. To evaluate the EVM,
a USB-TO-GPIO interface board must be ordered separately.
1.2
I/O Descriptions
Table 2 lists the jumper connections available on this EVM.
Table 2. PWR730 EVM Connections
2
Jack
Description
J1–VBUS
Input: positive terminal
J1–GND
Input: negative terminal (ground terminal)
J2–PMID
PMID pin connection, power bank output
J2–GND
Ground and power bank output negative terminal
J3–SYS
Connected to system
J3–GND
Ground
J4–BAT
Connected to battery pack
J4–BATSEN
Connected to battery pack for voltage sensing
J4–GND
Ground
J5
Input mini-USB port
J6
Output mini-USB port
J7
USB-TO-GPIO connector
J8
I2C 4-pin connector
J9–VOK
VOK output
J9–GND
Ground
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Introduction
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Table 3 lists the EVM jumper connections.
Table 3. EVM Jumper Connections and Shunt Installation
Jack
Description
bq25898 Setting
bq25898D Setting
bq25898C Setting
JP1
Input current setting
short PSEL to LOW
Not installed
Short PSEL to
LOW
JP2
D–/PG pin selection
short to PG
short to D–
Short to PG
JP3
DSEL/VOK selection
Short to VOK
Short to DSEL
Not installed
JP4
STAT, PG, CE, INT, OTG pins internal pullup
source (VSYS or BAT)
Short to VSYS
Short to VSYS
Short to VSYS
JP5
D+/D– connections for input current limit setting
Not installed
Not installed
Not installed
JP6
Pulldown option for INT and OTG
Not installed
Not installed
Installed
JP7
CE pin setting: pull low to enable the charge
Not Installed
Not Installed
Not Installed
JP8
TS pin to GND
Not Installed
Not Installed
Installed
JP9
TS resistor divider pullup source (REGN)
connection
Installed
Installed
N/A
JP10
Internal 10 k to GND to TS pin
Installed
Installed
N/A
JP11
ILIM pin to GND
Not Installed
Not Installed
Installed
JP12
Short BATSEN pin to BAT pin
Installed
Installed
Installed
Table 4 lists the recommended operating conditions for this EVM.
Table 4. Recommended Operating Conditions
Symbol
Description
MIN
MAX
Unit
Supply voltage, VVBUS
Input voltage from AC adapter
3.9
14
V
0
4.5
V
3 or 4
A
Battery voltage, VBAT 0, 3.7, Voltage applied at VBAT terminal
4.4 V
IBAT
Supply current, IIN
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Fast charging current
Discharging current through internal MOSFET
9
Maximum input current from AC adapter input
0
TYP
A
3.25
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A
3
Test Summary
2
Test Summary
2.1
Equipment
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This section includes a list of supplies required to perform tests on this EVM:
1. Power Supplies
Power supply #1 (PS#1): a power supply capable of supplying 5 V at 1 A is required. While this part
can handle larger voltage and current, it is not necessary for this procedure.
2. Load #1 (4-quadrant supply, constant voltage < 4.5 V)
A 0–20 V/0–5 A, > 30-W system, dc electronic load and setting as constant voltage load mode
or
Kepco load: BOP 20–5 M, DC 0 to ±20 V, 0 to ±5 A (or higher)
3. Load #2 Use with Boost Mode
PMID to GND load, 10 Ω, 5 W, or greater
4. Meters
Six Fluke 75 multimeters, (equivalent or better)
or
Four equivalent voltage meters and two equivalent current meters, the current meters must be capable
of measuring 5-A current.
5. Computer
A computer with at least one USB port and a USB cable. The bq25898xEVM evaluation software must
be properly installed.
6. USB-to-GPIO Communication Kit
EV2300/EV2400 USB-based PC interface board
7. Software
Download bqStudio from www.ti.com
Double click the Battery Management Studio-1.3.20_Build2-Setup installation file, follow the installation
steps. The software supports the Microsoft® Windows® XP and Windows 7 operating systems.
2.2
Equipment Setup
Use the following steps for equipment setup:
1. Set PS#1 for 5-V DC, 1-A current limit and then turn off the supply.
2. Connect the output of PS#1 in series with a current meter (multimeter) to J1 (VBUS and GND).
3. Connect a voltage meter across TP2 (VBUS) and TP14 (PGND).
4. Turn on the load, set to constant voltage mode and output to 2.5 V. Turn off (disable) load. Connect
the load in series with a current meter (multimeter), ground side, to J4 (BAT and GND) as shown in
Figure 2.
5. Connect a voltage meter across TP18 (BAT) and TP22(GND).
6. Connect the EV2300/2400 USB interface board to the computer with a USB cable and from I2C port to
J8 with the 4-pin cable. The connections are shown in Figure 1.
I/O
EV2300/2400
Texas Instruments
USB
To Computer
USB Port
4-Pin
Cable to
EVM
Figure 1. Connections of the EV2300 Kit
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Test Summary
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7. Install shunts as shown in Table 3, or as shown in Figure 2.
Power
Supply #1
Ibat
I
+
V
í
+ í
I +
Iin
V
í
Load
V
í
GND
+
+
V
í
Shunt Installed
EV2300
USB
bq25898
Ibat
I
+
V
í
+ í
I +
Power
Iin
V
Supply #1
í
Load
GND
í
V
+
+
V
í
Shunt Installed
EV2300
USB
bq25898D
Power
Supply #1
+
V
í
+ í
I +
Iin
V
í
Ibat
I
Load
V
í
GND
+
+
V
í
Shunt Installed
EV2300
USB
bq25898C
Figure 2. Original Test Setup for bq25898X
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Test Summary
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8. Turn on the computer. Launch Battery Management Studio (bqStudio). Select Charge and bq25898
(or bq25898D, bq25898C, accordingly) evaluation software. The main window of the software is
shown in Figure 3.
Figure 3. Selection Window of the bqStudio Evaluation Software
2.3
2.3.1
Test Procedure
Current Settings
Use the following list when setting the current:
1. Make sure the Equipment Setup steps are followed.
ILIM Setting: Set the potentiometer to its lowest value for maximum input current by connecting an
ohmmeter between point TP9 and ground. Turn the screw on the potentiometer counterclockwise until
the resistance drops to its lowest point (this should be in the range of 40 Ω to 60 Ω, the value of R1).
2. Launch the bq25898x EVM GUI software, if not already done.
3. Turn on PS#1.
Measure → Vsys (TP19(SYS), T22(GND)) = 4.20 ±0.3 V
NOTE: #1. bq25898C reads Vsys = 3.7 ±0.3 V
#2. Completely disconnect Load#1 from the BAT pin, if different voltage value is seen.
2.3.2
Charge Voltage and Current Regulation of VIN and Device ID Verification
Follow the steps and verify the outputs and IC for the EVM.
2.3.3
Communication Verification
Use the following steps to ensure proper device communication:
1. In the EVM software, specify device I2C Address as 6A for bq25898D, and 6B for bq25898/C.
2. Click the Read button.
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3. In
•
•
•
•
•
•
•
the EVM software, make the following changes as necessary:
Select Disabled for the Watchdog Timer.
Set Input Voltage Limit to 4.2.
Set Input Current Limit to 500 mA.
Set Charge Voltage Limit to 4.208 V.
Set Fast Charge Current ICHG to 512 mA.
Set Pre-Charge Current to 256 mA.
Deselect Enable Termination (see Figure 4).
Figure 4. Setup Window of the bqStudio Evaluation Software
4. Click the Read button twice.
• Observe → Everything is ‘Normal’ in the Fault box.
Figure 5. Status Report From Window of the bqStudio Evaluation Software
5. Observe → D3 (STAT) is on.
6. Observe → D4 (/PG) is on (except on bq25898D).
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Test Summary
2.3.4
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Charger Mode Verification
Use the following steps to verify the charger mode:
1. Enable Load #1 from Section 2.2, step 4. Measure the voltage across J3 and J4 as follows:
• Measure → V(TP19(SYS), TP22(GND)) = 3.7 V ±0.3 V
• Measure → V(TP18(BAT), TP22(GND)) = 2.5 V ±0.1 V
• Measure → IBAT = 256 mA ±200 mA ( = pre-charge current)
2. Change load to 3.7 V.
• Measure → V(TP19(SYS), TP22(GND)) = 3.8 V ±0.3 V
• Measure → V(TP18(BAT), TP22(GND)) = 3.7 V ±0.1 V
• Measure → IBAT = 500 mA ±200 mA ( = fast charge current)
3. In the software, set Fast Charge Current Limit to 1024 mA.
• Measure → Iin = 500 mA ±200 mA ( = input current limit)
4. Turn off and disconnect load #1.
5. Turn off and disconnect power supply #1.
2.3.5
Boost Mode Verification
Use the following steps to verify Boost Mode:
1. If the constant voltage load connected from BAT+ to GND is not a four-quadrant supply (sources
current), remove the load and use the power source disconnected in step one. Set the power sourcee
to 3.7 V and 2-A current limit and connect between BAT+ and GND.
2. Apply 10 Ω (5 W or greater) across J2 PMID(+) to GND(–).
3. Uncheck the OTG Low box in the GUI.
4. Check the Enable OTG option in the GUI.
5. Verify VPMID to GND on J2
• Measure → VPMID = 5.0V ±0.2 V
6. Turn off and disconnect the power supply.
7. Remove 10-Ω resistor at PMID.
NOTE: Skip this test for bq25898C.
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PCB Layout Guideline
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3
PCB Layout Guideline
Minimize the switching node rise and fall times for minimum switching loss. Proper layout of the
components, minimizing high-frequency current path loop, is important to prevent electrical and magnetic
field radiation and high-frequency resonant problems. This PCB layout priority list must be followed in the
order presented for proper layout:
1. Place the input capacitor as close as possible to the PMID pin and GND pin connections and use the
shortest copper trace connection or GND plane.
2. Put the output capacitor near the inductor and the IC.
3. Place decoupling capacitors next to the IC pins and make trace connection as short as possible.
4. Place the inductor input terminal as close as possible to the SW pin. Minimize the copper area of this
trace to lower electrical and magnetic field radiation but make the trace wide enough to carry the
charging current. Do not use multiple layers in parallel for this connection. Minimize parasitic
capacitance from this area to any other trace or plane.
5. Connect all grounds together to reduce PCB size and improve thermal dissipation.
6. Avoid ground planes in parallel with high frequency traces in other layers
See the EVM design for the recommended component placement with trace and via locations.
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Board Layout, Schematic, and Bill of Materials
4
Board Layout, Schematic, and Bill of Materials
4.1
Board Layout
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Figure 6 through Figure 11 illustrate the EVM board layouts.
10
Figure 6. bq25898EVM-730 Top Layer
Figure 7. bq25898EVM-730 Mid Layer 1
Figure 8. bq25898EVM-730 Mid Layer 2
Figure 9. bq25898EVM-730 Bottom Layer
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Figure 10. bq25898EVM-730 Top Layer Assembly
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Figure 11. bq25898EVM-730 Bottom Layer Assembly
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Board Layout, Schematic, and Bill of Materials
4.2
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Schematic
Figure 12, Figure 13, and Figure 14 illustrate the schematics of the three EVM variants.
TP1
L1
D2 20V
PMID
DNP
REGN
DNPC12
10µF
DNPC11
10µF
DNPC10
22µF
DNPC9
1000pF
C2
10µF
TP20
REGN
VBUS
GND J1
DNP
4.7µF
VBUS
DNPC8
1000pF
GND
PG
3
1
D+/PSEL
GND
1
D+/PSEL
B5
1
JP2
DTP7
C3
PSEL
D3
PG
F2
D-/PG
SCL
SYS
SYS
SYS
SYS
SYS
3
B4
10.0k
CE
B6
R15
TP8
10.0k
G2
SDA
SDA
F1
A4
QON
PGND
PGND
PGND
PGND
PGND
ILIM
G1
STAT
D5
30V
SW
A2
B2
C2
D2
E2
BATSEN
TS
OTG
GND
DNP
C5
D5
E5
F5
G5
A1
B1
C1
D1
E1
INT
C4
PG
R14
PULL-UP
DNPC17
1000pF
DNPC21
0.01µF
A5
A6
BAT
BAT
BAT
BAT
BAT
SCL
SDA
D-/PG
PG
SCL
A3
B3
TP6
2
SW
SW
SW
SW
SW
VOK
D-
GND
REGN
BTST
VBUS
VBUS
VBUS
TP5
2
R13
0
PMID
PMID
PMID
PMID
E3
F3
G3
C25
0.047µF
JP1
DNPC16
10µF
GND
5
4
DNP
3
2
1
D4
E4
F4
G4
JP3
2
VOK
HI
PSEL
LOW
DNPC14
DNPC15
0.1µF
10µF
R17
DNP
1.00
D1
40V
U1
3
DSEL
R4
10.0k
C6
10µF
GND
C1
1µF
D6
13V
DSEL
REGN
J3
C5
10µF
C3
TP2
VBUS
GND
Vbus: 3.9V to 14V
System
GND
1uH
GND
TP19
TP22
SYS
1
DNPC13
10µF
J2
C4
0.047µF
SW1
GND
2
JP4
PULL-UP
C7 DNPC18
10µF
1µF
TP18
BAT
DNPC19
10µF
DNPC20
1000pF
GND
3
PMID
PMID
GND
BAT
C6
D6
E6
F6
G6
BATSEN
JP12
J4
TP21
TP14
1
2
3
BATSEN
GND1
PULL-UP
GND
Battery
BATSense
BQ25898YFFR
TP15
R6
R5
10.0k 10.0k
STAT
TP9
TP13
REGN
TP16
GND3
TP12
QON
PULL-UP
ILIM
R1
49.9
JP6
R21
2.21k
JP9
GND
JP11
TP11
CE
R19
R18
768
S1
CE
10k
TS
GND
R3
30.1k
JP8
GND
D3
Green
D4
Green
STAT
PG
TP23
R20
10.0k
JP7
R22
2.21k
R2
5.23k
R23
4.7k
GND
R7
DNP
10.0k
TS
INT
TP10
OTG
PULL-UP
TP17
GND2
ILIM
JP10
R8
10.0k
STAT
GND
GND
GND
S2A
VBUS
9
10
11
S2B
2
1
VIN
R10
100k
VOUT
ON/OFF
C24
2.2µF
LP2985AIM5-3.3/NOPB
4
BYPASS
GND
R11
GND
3
2
C22
0.01µF
J5
VBUS
1
D-
2
D+
3
7
8
U3
ID
4
GND
5
1D1D+
2D2D+
4
3
S
OE
ID
5
GND
8
7
6
DD+
2
1
GND
VCC
1D1D+
D-
VBUS
1D-
JP5
9
6
D+/PSEL
DSEL
10
1D+
ID
DSEL
1
VBUS
2
D-
3
D+
4
ID
5
GND
J7
J6
9
7
5
3
1
TP3
GND
3.3V
GND
CE
R12
10
8
6
4
2
4
3
2
1
SDA
200
VOK
SDA
VOK
SCL
TP4
J9
GND
J8
GND
GND
R9
GND
TS3USB221ARSER
SCL
200
5
U2
3
C23
1µF
GND
11
10
9
3.3V
R16
0
4
6
7
8
VBUS
1
CE
200
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Figure 12. bq25898EVM-730-001 Schematic
12
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Board Layout, Schematic, and Bill of Materials
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TP1
L1
D2 20V
PMID
DNP
REGN
DNPC12
10µF
DNPC11
10µF
DNPC10
22µF
DNPC9
1000pF
C2
10µF
REGN
VBUS
GND J1
DNPC8
1000pF
GND
PG
1
3
PMID
PMID
PMID
PMID
E3
F3
G3
C25
0.047µF
JP1
GND
1
2
D+/PSEL
D+/PSEL
B5
DSEL
C3
D+
D3
D-
1
D-
JP2
D-
GND
TP7
F2
PG
D-/PG
SW
SW
SW
SW
SW
SYS
SYS
SYS
SYS
SYS
3
CE
B6
R15
TP8
10.0k
G2
SDA
SDA
F1
A4
QON
PGND
PGND
PGND
PGND
PGND
ILIM
G1
STAT
GND
D5
30V
SW
A2
B2
C2
D2
E2
BATSEN
TS
OTG
B4
10.0k
PULL-UP
DNPC17
1000pF
DNP
C5
D5
E5
F5
G5
A1
B1
C1
D1
E1
INT
C4
PG
R14
DNPC16
10µF
DNPC21
0.01µF
A5
A6
BAT
BAT
BAT
BAT
BAT
SCL
SDA
D-/PG
SCL
SCL
A3
B3
TP6
2
REGN
BTST
VBUS
VBUS
VBUS
TP5
VOK
HI
PSEL
LOW
DNPC14
DNPC15
0.1µF
10µF
GND
5
4
DNP
3
2
1
D4
E4
F4
G4
JP3
2
R13
0
U1
3
DSEL
C6
10µF
R17
DNP
1.00
D1
40V
GND
C1
1µF
D6
13V
DSEL
R4
10.0k
C5
10µF
DNP
4.7µF
VBUS
GND
REGN
J3
C3
TP2
VBUS
Vbus: 3.9V to 14V
System
GND
1uH
C4
0.047µF
TP20
GND
TP19
TP22
SYS
1
DNPC13
10µF
J2
SW1
GND
2
JP4
PULL-UP
C7 DNPC18
10µF
1µF
TP18
BAT
DNPC19
10µF
DNPC20
1000pF
GND
3
PMID
PMID
GND
BAT
C6
D6
E6
F6
G6
BATSEN
JP12
J4
TP21
TP14
1
2
3
BATSEN
GND1
PULL-UP
GND
Battery
BATSense
BQ25898DYFFR
TP15
R6
R5
10.0k 10.0k
STAT
TP9
TP13
REGN
TP16
GND3
TP12
QON
PULL-UP
ILIM
R1
49.9
JP6
PULL-UP
TS
INT
TP10
OTG
R21
2.21k
JP9
GND
JP11
TP11
CE
R19
R18
768
S1
CE
10k
R3
30.1k
JP8
GND
D3
Green
D4
Green
STAT
PG
TP23
TS
GND
R20
10.0k
JP7
R22
2.21k
R2
5.23k
R23
4.7k
GND
R7
DNP
10.0k
TP17
GND2
ILIM
JP10
R8
10.0k
STAT
GND
GND
GND
S2A
VBUS
9
10
11
S2B
2
1
VIN
VOUT
U2
3
ON/OFF
C24
2.2µF
LP2985AIM5-3.3/NOPB
4
BYPASS
GND
R11
GND
3
2
C22
0.01µF
J5
1
D-
2
D+
3
ID
4
GND
5
7
8
8
7
6
1D1D+
U3
ID
5
GND
GND
DD+
GND
2
1
2D2D+
4
3
S
OE
9
6
VCC
1D1D+
D-
VBUS
1D-
JP5
D+/PSEL
DSEL
10
1D+
ID
DSEL
1
VBUS
2
D-
3
D+
4
ID
5
GND
J7
J6
9
7
5
3
1
10
8
6
4
2
4
3
2
1
SDA
200
VOK
SDA
VOK
SCL
TP4
J9
GND
J8
GND
R9
TP3
CE
R12
GND
GND
TS3USB221ARSER
SCL
200
5
VBUS
R10
100k
C23
1µF
GND
11
10
9
3.3V
R16
0
4
GND
CE
200
6
7
8
VBUS
1
3.3V
Copyright © 2016, Texas Instruments Incorporated
Figure 13. bq25898DEVM-730-002 Schematic
SLVUAP4 – April 2016
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13
Board Layout, Schematic, and Bill of Materials
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TP1
L1
D2 20V
PMID
DNP
REGN
DNPC12
10µF
DNPC11
10µF
DNPC10
22µF
DNPC9
1000pF
C2
10µF
TP20
REGN
DNP
VBUS
GND J1
4.7µF
VBUS
GND
DNPC8
1000pF
GND
PG
1
3
GND
1
D+/PSEL
D+/PSEL
B5
1
JP2
DTP7
C3
PSEL
D3
PG
F2
D-/PG
SCL
SYS
SYS
SYS
SYS
SYS
SCL
SDA
D-/PG
PG
BAT
BAT
BAT
BAT
BAT
INT
C4
PGND
3
SCL
A3
B3
TP6
2
SW
SW
SW
SW
SW
NC
D-
GND
REGN
BTST
VBUS
VBUS
VBUS
TP5
2
R13
0
PMID
PMID
PMID
PMID
E3
F3
G3
C25
0.047µF
JP1
PG
R14
B4
10.0k
PULL-UP
TP8
10.0k
SDA
NC
G2
SDA
BATSEN
PGND
CE
B6
R15
DNPC16
10µF
DNPC17
1000pF
PGND
PGND
PGND
PGND
PGND
PGND
G1
STAT
GND
DNPC21
0.01µF
A5
A6
DNP
C5
D5
E5
F5
G5
D5
30V
SW
GND
5
4
DNP
3
2
1
D4
E4
F4
G4
JP3
2
VOK
HI
PSEL
LOW
DNPC14
DNPC15
0.1µF
10µF
R17
DNP
1.00
D1
40V
U1
3
DSEL
R4
10.0k
C6
10µF
GND
C1
1µF
D6
13V
DSEL
REGN
J3
C5
10µF
C3
TP2
VBUS
Vbus: 3.9V to 14V
System
GND
1uH
A2
B2
C2
D2
E2
GND
TP19
TP22
SYS
1
DNPC13
10µF
J2
C4
0.047µF
SW1
GND
2
JP4
A1
B1
C1
D1
E1
PULL-UP
C7 DNPC18
10µF
1µF
TP18
BAT
DNPC19
10µF
DNPC20
1000pF
GND
3
PMID
PMID
GND
F1
A4
BAT
C6
D6
E6
F6
G6
BATSEN
JP12
J4
TP21
TP14
1
2
3
BATSEN
GND1
PULL-UP
GND
Battery
BATSense
BQ25898CYFFR
TP15
R6
R5
10.0k 10.0k
STAT
TP9
TP13
REGN
TP16
GND3
TP12
QON
PULL-UP
ILIM
DNP
R1
49.9
JP6
R21
2.21k
JP9
GND
JP11
TP11
CE
R19
R18
768
S1
CE
DNP
10k
TS
GND
R20
10.0k
JP7
R22
2.21k
R2
DNP
5.23k
R23
4.7k
GND
R7
DNP
10.0k
TS
INT
TP10
OTG
PULL-UP
TP17
GND2
ILIM
JP10
R3
R8
DNP
30.1k DNP
10.0k
JP8
GND
D3
Green
D4
Green
STAT
PG
TP23
STAT
GND
GND
GND
S2A
VBUS
9
10
11
GND
11
10
9
3.3V
R16
DNP
0
4
S2B
2
1
VIN
R10
DNP
100k
VOUT
U2
3
ON/OFF
DNP
DNPC24
2.2µF
LP2985AIM5-3.3/NOPB
4
BYPASS
GND
R11
GND
3
2
DNPC23 DNPC22
1µF
0.01µF
J5
VBUS
1
D-
2
D+
3
ID
4
GND
5
7
8
U3
DNP
ID
5
GND
8
7
6
DD+
GND
1D1D+
2
1
2D2D+
4
3
S
OE
9
6
VCC
1D1D+
D-
VBUS
1D-
DNP
JP5
D+/PSEL
DSEL
10
1D+
ID
DSEL
1
VBUS
2
D-
3
D+
DNP
4
ID
5
GND
J7
J6
9
7
5
3
1
TP3
GND
3.3V
CE
R12
10
8
6
4
2
4
3
2
1
SDA
200
VOK
SDA
VOK
SCL
TP4
DNP
J9
GND
J8
GND
GND
R9
GND
TS3USB221ARSER
GND
SCL
200
5
6
7
8
VBUS
1
CE
200
Copyright © 2016, Texas Instruments Incorporated
Figure 14. bq25898CEVM-730-003 Schematic
14
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Board Layout, Schematic, and Bill of Materials
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4.3
Bill of Materials
Table 5, Table 6, and Table 7 list the bill of materials for the three EVM variants.
Table 5. bq25898EVM-730-001 Bill of Materials
Designator
Description
Manufacturer
Part Number
Qty
!PCB
Printed Circuit Board
Any
PWR730
1
C1
CAP, CERM, 1 µF, 25 V, +/- 10%, X7R, 0805
Murata
GRM219R71E105KA88D
1
C2
CAP, CERM, 10uF, 25V, +/-10%, X5R, 0805
TDK
C2012X5R1E106K125AB
1
C3
CAP, CERM, 4.7uF, 16V, +/-10%, X5R, 0603
Murata
GRM188R61C475KAAJ
1
C4, C25
CAP, CERM, 0.047uF, 25V, +/-10%, X7R, 0402
Murata
GRM155R71E473KA88D
2
C5, C6, C7
CAP, CERM, 10 µF, 10 V, +/- 10%, X7R, 0805
Murata
GRM21BR71A106KE51L
3
C22
CAP, CERM, 0.01uF, 25V, +/-10%, X7R, 0402
TDK
C1005X7R1E103K
1
C23
CAP, CERM, 1uF, 25V, +/-10%, X7R, 0603
TDK
C1608X7R1E105K080AB
1
C24
CAP, CERM, 2.2uF, 10V, +/-10%, X5R, 0402
TDK
C1005X5R1A225K050BC
1
D3, D4
LED, Green, SMD
Lite-On
LTST-C190GKT
2
D6
Diode, TVS, Uni, 13 V, W, SOD-123W
NXP Semiconductor
PTVS13VS1UR,115
1
H1, H2, H3, H4
Bumpon, Hemisphere, 0.44 X 0.20, Clear
3M
SJ-5303 (CLEAR)
4
J1, J2, J3, J9
Conn Term Block, 2POS, 3.81mm, TH
Phoenix Contact
1727010
4
J4
Terminal Block Receptacle, 3x1, 3.81mm, R/A, TH
Phoenix Contact
1727023
1
J5, J6
Connector, Receptacle, Micro-USB Type B, R/A, Bottom Mount SMT
Molex
0473460001
2
J7
Header (shrouded), 100mil, 5x2, High-Temperature, Gold, TH
3M
N2510-6002-RB
1
J8
Header, 100mil, 4x1, R/A, TH
Molex
22-05-3041
1
JP1, JP2, JP3, JP4
Header, 100mil, 3x1, Tin plated, TH
Sullins Connector
Solutions
PEC03SAAN
4
JP5, JP6, JP7, JP8, JP9, JP10,
JP11, JP12
Header, 100mil, 2x1, Tin plated, TH
Sullins Connector
Solutions
PEC02SAAN
8
L1
Inductor, Wirewound, 1 µH, 4 A, 0.041 ohm, SMD
Wurth Elektronik
74437321010
1
LBL1
Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll
Brady
THT-14-423-10
1
R1
RES, 49.9, 1%, 0.063 W, 0402
Vishay-Dale
CRCW040249R9FKED
1
R2
RES, 5.23k ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW04025K23FKED
1
R3
RES, 30.1k ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW040230K1FKED
1
R4, R5, R6, R8, R14, R15, R20
RES, 10.0k ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW040210K0FKED
7
R9, R11, R12
RES, 200 ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW0402200RFKED
3
R10
RES, 100k ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW0402100KFKED
1
R13, R16
RES, 0 ohm, 5%, 0.063W, 0402
Vishay-Dale
CRCW04020000Z0ED
2
R18
RES, 768 ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW0402768RFKED
1
R19
Trimmer, 10k ohm, 0.25W, TH
Bourns
3266W-1-103LF
1
R21, R22
RES, 2.21k ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW04022K21FKED
2
R23
RES, 4.7k ohm, 5%, 0.063W, 0402
Vishay-Dale
CRCW04024K70JNED
1
S1
Switch, Normally open, 2.3N force, 200k operations, SMD
C and K Components
KSR221GLFS
1
S2
DIP Switch, SPST, 2Pos, Slide, SMT
Copal Electronics
CVS-02TB
1
SH-JP1, SH-JP2, SH-JP3, SH-JP4,
SH-JP5, SH-JP6, SH-JP7, SH-JP8,
SH-JP9, SH-JP10, SH-JP11, SHJP12
Shunt, 100mil, Gold plated, Black
3M
969102-0000-DA
12
SW1
Compact Probe Tip Circuit Board Test Points, TH, 25 per
Tektronix
131-5031-00
1
TP1, TP2
Test Point, Miniature, Red, TH
Keystone
5000
2
TP3, TP4, TP5, TP6, TP7, TP8,
TP9, TP10, TP11, TP12, TP13,
TP17, TP21, TP23
Test Point, Miniature, White, TH
Keystone
5002
14
TP14, TP15, TP16, TP22
Test Point, Compact, SMT
Keystone
5016
4
TP18
Test Point, Miniature, Yellow, TH
Keystone
5004
1
TP19, TP20
Test Point, Miniature, Orange, TH
Keystone
5003
2
U1
I2C Controlled 4A Single Cell NVDC Power Path Management with MaxChargeTM
High Voltage Adapter Support, YFF0042-C01
Texas Instruments
BQ25898YFFR
1
U2
Micropower 150 mA Low-Noise Ultra Low-Dropout Regulator in SOT-23 Package,
DBV0005A
Texas Instruments
LP2985AIM5-3.3/NOPB
1
U3
ESD Protected,High-Speed USB 2.0 (480-Mbps) 1:2 Multiplexer / Demultiplexer
Switch, 1:2 Mux / Demux, 6 ohm RON, 2.5 to 3.3V, -40 to 85 degC, 10-Pin UQFN
(RSE), Green (RoHS & no Sb/Br)
Texas Instruments
TS3USB221ARSER
1
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Table 6. Bill of Materials bq25898DEVM-730-002 BOM
16
Designator
Description
Manufacturer
Part Number
Qty
!PCB
Printed Circuit Board
Any
PWR730
1
C1
CAP, CERM, 1 µF, 25 V, +/- 10%, X7R, 0805
Murata
GRM219R71E105KA88D
1
C2
CAP, CERM, 10uF, 25V, +/-10%, X5R, 0805
TDK
C2012X5R1E106K125AB
1
C3
CAP, CERM, 4.7uF, 16V, +/-10%, X5R, 0603
Murata
GRM188R61C475KAAJ
1
C4, C25
CAP, CERM, 0.047uF, 25V, +/-10%, X7R, 0402
Murata
GRM155R71E473KA88D
2
C5, C6, C7
CAP, CERM, 10 µF, 10 V, +/- 10%, X7R, 0805
Murata
GRM21BR71A106KE51L
3
C22
CAP, CERM, 0.01uF, 25V, +/-10%, X7R, 0402
TDK
C1005X7R1E103K
1
C23
CAP, CERM, 1uF, 25V, +/-10%, X7R, 0603
TDK
C1608X7R1E105K080AB
1
C24
CAP, CERM, 2.2uF, 10V, +/-10%, X5R, 0402
TDK
C1005X5R1A225K050BC
1
D3, D4
LED, Green, SMD
Lite-On
LTST-C190GKT
2
D6
Diode, TVS, Uni, 13 V, W, SOD-123W
NXP Semiconductor
PTVS13VS1UR,115
1
H1, H2, H3, H4
Bumpon, Hemisphere, 0.44 X 0.20, Clear
3M
SJ-5303 (CLEAR)
4
J1, J2, J3, J9
Conn Term Block, 2POS, 3.81mm, TH
Phoenix Contact
1727010
4
J4
Terminal Block Receptacle, 3x1, 3.81mm, R/A, TH
Phoenix Contact
1727023
1
J5, J6
Connector, Receptacle, Micro-USB Type B, R/A, Bottom Mount SMT
Molex
0473460001
2
J7
Header (shrouded), 100mil, 5x2, High-Temperature, Gold, TH
3M
N2510-6002-RB
1
J8
Header, 100mil, 4x1, R/A, TH
Molex
22-05-3041
1
JP1, JP2, JP3, JP4
Header, 100mil, 3x1, Tin plated, TH
Sullins Connector
Solutions
PEC03SAAN
4
JP5, JP6, JP7, JP8, JP9, JP10,
JP11, JP12
Header, 100mil, 2x1, Tin plated, TH
Sullins Connector
Solutions
PEC02SAAN
8
L1
Inductor, Wirewound, 1 µH, 4 A, 0.041 ohm, SMD
Wurth Elektronik
74437321010
1
LBL1
Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll
Brady
THT-14-423-10
1
R1
RES, 49.9, 1%, 0.063 W, 0402
Vishay-Dale
CRCW040249R9FKED
1
R2
RES, 5.23k ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW04025K23FKED
1
R3
RES, 30.1k ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW040230K1FKED
1
R4, R5, R6, R8, R14, R15, R20
RES, 10.0k ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW040210K0FKED
7
R9, R11, R12
RES, 200 ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW0402200RFKED
3
R10
RES, 100k ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW0402100KFKED
1
R13, R16
RES, 0 ohm, 5%, 0.063W, 0402
Vishay-Dale
CRCW04020000Z0ED
2
R18
RES, 768 ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW0402768RFKED
1
R19
Trimmer, 10k ohm, 0.25W, TH
Bourns
3266W-1-103LF
1
R21, R22
RES, 2.21k ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW04022K21FKED
2
R23
RES, 4.7k ohm, 5%, 0.063W, 0402
Vishay-Dale
CRCW04024K70JNED
1
S1
Switch, Normally open, 2.3N force, 200k operations, SMD
C and K
Components
KSR221GLFS
1
S2
DIP Switch, SPST, 2Pos, Slide, SMT
Copal Electronics
CVS-02TB
1
SH-JP1, SH-JP2, SH-JP3, SHJP4, SH-JP5, SH-JP6, SH-JP7,
SH-JP8, SH-JP9, SH-JP10, SHJP11, SH-JP12
Shunt, 100mil, Gold plated, Black
3M
969102-0000-DA
12
SW1
Compact Probe Tip Circuit Board Test Points, TH, 25 per
Tektronix
131-5031-00
1
TP1, TP2
Test Point, Miniature, Red, TH
Keystone
5000
2
TP3, TP4, TP5, TP6, TP7, TP8,
TP9, TP10, TP11, TP12, TP13,
TP17, TP21, TP23
Test Point, Miniature, White, TH
Keystone
5002
14
TP14, TP15, TP16, TP22
Test Point, Compact, SMT
Keystone
5016
4
TP18
Test Point, Miniature, Yellow, TH
Keystone
5004
1
TP19, TP20
Test Point, Miniature, Orange, TH
Keystone
5003
2
U1
I2C Controlled 4A Single Cell NVDC Power Path Management with
MaxChargeTM High Voltage Adapter Support, YFF0042AHAC
Texas Instruments
BQ25898DYFFR
1
U2
Micropower 150 mA Low-Noise Ultra Low-Dropout Regulator in SOT-23
Package, DBV0005A
Texas Instruments
LP2985AIM5-3.3/NOPB
1
U3
ESD Protected,High-Speed USB 2.0 (480-Mbps) 1:2 Multiplexer /
Demultiplexer Switch, 1:2 Mux / Demux, 6 ohm RON, 2.5 to 3.3V, -40 to 85
degC, 10-Pin UQFN (RSE), Green (RoHS & no Sb/Br)
Texas Instruments
TS3USB221ARSER
1
bq25898, bq25898D, and bq25898C PWR730 Evaluation Modules
Copyright © 2016, Texas Instruments Incorporated
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Table 7. Bill of Materials bq25898CEVM-730-003 BOM
Designator
Description
Manufacturer
Part Number
Qty
!PCB
Printed Circuit Board
Any
PWR730
1
C1
CAP, CERM, 1 µF, 25 V, +/- 10%, X7R, 0805
Murata
GRM219R71E105KA88D
1
C2
CAP, CERM, 10uF, 25V, +/-10%, X5R, 0805
TDK
C2012X5R1E106K125AB
1
C3
CAP, CERM, 4.7uF, 16V, +/-10%, X5R, 0603
Murata
GRM188R61C475KAAJ
1
C4, C25
CAP, CERM, 0.047uF, 25V, +/-10%, X7R, 0402
Murata
GRM155R71E473KA88D
2
C5, C6, C7
CAP, CERM, 10 µF, 10 V, +/- 10%, X7R, 0805
Murata
GRM21BR71A106KE51L
3
D3, D4
LED, Green, SMD
Lite-On
LTST-C190GKT
2
D6
Diode, TVS, Uni, 13 V, W, SOD-123W
NXP Semiconductor
PTVS13VS1UR,115
1
H1, H2, H3, H4
Bumpon, Hemisphere, 0.44 X 0.20, Clear
3M
SJ-5303 (CLEAR)
4
J1, J2, J3
Conn Term Block, 2POS, 3.81mm, TH
Phoenix Contact
1727010
3
J4
Terminal Block Receptacle, 3x1, 3.81mm, R/A, TH
Phoenix Contact
1727023
1
J5
Connector, Receptacle, Micro-USB Type B, R/A, Bottom Mount SMT
Molex
0473460001
1
J7
Header (shrouded), 100mil, 5x2, High-Temperature, Gold, TH
3M
N2510-6002-RB
1
J8
Header, 100mil, 4x1, R/A, TH
Molex
22-05-3041
1
JP1, JP2, JP3, JP4
Header, 100mil, 3x1, Tin plated, TH
Sullins Connector
Solutions
PEC03SAAN
4
JP6, JP7, JP8, JP11, JP12
Header, 100mil, 2x1, Tin plated, TH
Sullins Connector
Solutions
PEC02SAAN
5
L1
Inductor, Wirewound, 1 µH, 4 A, 0.041 ohm, SMD
Wurth Elektronik
74437321010
1
LBL1
Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll
Brady
THT-14-423-10
1
R1
RES, 49.9, 1%, 0.063 W, 0402
Vishay-Dale
CRCW040249R9FKED
1
R4, R5, R6, R14, R15, R20
RES, 10.0k ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW040210K0FKED
6
R9, R11, R12
RES, 200 ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW0402200RFKED
3
R13
RES, 0 ohm, 5%, 0.063W, 0402
Vishay-Dale
CRCW04020000Z0ED
1
R18
RES, 768 ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW0402768RFKED
1
R19
Trimmer, 10k ohm, 0.25W, TH
Bourns
3266W-1-103LF
1
R21, R22
RES, 2.21k ohm, 1%, 0.063W, 0402
Vishay-Dale
CRCW04022K21FKED
2
R23
RES, 4.7k ohm, 5%, 0.063W, 0402
Vishay-Dale
CRCW04024K70JNED
1
S1
Switch, Normally open, 2.3N force, 200k operations, SMD
C and K
Components
KSR221GLFS
1
S2
DIP Switch, SPST, 2Pos, Slide, SMT
Copal Electronics
CVS-02TB
1
SH-JP1, SH-JP2, SH-JP3, SHJP4, SH-JP5, SH-JP6, SH-JP7,
SH-JP8, SH-JP9, SH-JP10, SHJP11, SH-JP12
Shunt, 100mil, Gold plated, Black
3M
969102-0000-DA
12
SW1
Compact Probe Tip Circuit Board Test Points, TH, 25 per
Tektronix
131-5031-00
1
TP1, TP2
Test Point, Miniature, Red, TH
Keystone
5000
2
TP3, TP4, TP5, TP6, TP7, TP8,
TP9, TP10, TP11, TP12, TP13,
TP17, TP21, TP23
Test Point, Miniature, White, TH
Keystone
5002
14
TP14, TP15, TP16, TP22
Test Point, Compact, SMT
Keystone
5016
4
TP18
Test Point, Miniature, Yellow, TH
Keystone
5004
1
TP19, TP20
Test Point, Miniature, Orange, TH
Keystone
5003
2
U1
I2C Controlled 4A Single Cell NVDC Power Path Management with
MaxChargeTM High Voltage Adapter Support, YFF0042-C01
Texas Instruments
BQ25898CYFFR
1
SLVUAP4 – April 2016
Submit Documentation Feedback
bq25898, bq25898D, and bq25898C PWR730 Evaluation Modules
Copyright © 2016, Texas Instruments Incorporated
17
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
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www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
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dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
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www.ti.com/consumer-apps
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dsp.ti.com
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www.ti.com/energy
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Industrial
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interface.ti.com
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Logic
logic.ti.com
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power.ti.com
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microcontroller.ti.com
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