CD74HC652,
CD74HCT652
Data sheet acquired from Harris Semiconductor
SCHS194A
High-Speed CMOS Logic
Octal-Bus Transceiver/Registers, Three-State
February 1998 - Revised May 2003
Features
Description
• CD74HC652, CD74HCT652 . . . . . . . . . . . Non-Inverting
The CD74HC652 and CD74HCT652 three-state, octal-bus
transceiver/registers use silicon-gate CMOS technology to
achieve operating speeds similar to LSTTL with the low power
consumption of standard CMOS integrated circuits. The
CD74HC652 and CD74HCT652 have non-inverting outputs.
These devices consists of bus transceiver circuits, D-type flipflops, and control circuitry arranged for multiplexed
transmission of data directly from the data bus or from the
internal storage registers. Output Enables OEAB and OEBA
are provided to control the transceiver functions. SAB and
SBA control pins are provided to select whether real-time or
stored data is transferred. The circuitry used for select control
will eliminate the typical decoding glitch that occurs in a
multiplexer during the transition between stored and real-time
data. A LOW input level selects real-time data, and a HIGH
selects stored data. The following examples demonstrates the
four fundamentals bus-management functions that can be
performed with the octal-bus transceivers and registers.
•[ /Title
Independent
Registers for
A and B Buses
(CD74HC652,
CD74HCT652)
(High-Speed
•/Subject
Three-State
Outputs
CMOS Logic Octal-Bus
Transceiver/Registers,
• Drives 15 LSTTL Loads Three-State)
/Author ()
• Typical Propagation Delay = 12ns at VCC = 5V, CL = 15pF
/Keywords ()
• Fanout (Over
/Creator
() Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
/DOCINFO pdfmark
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
o
oC
Wide Operating
Temperature Range . . . -55 C to 125
[• /PageMode
/UseOutlines
• Balanced Propagation
/DOCVIEW
pdfmark Delay and Transition Times
• Significant Power Reduction Compared to LSTTL
Logic ICs
• Alternate Source is Philips
Data on the A or B data bus, or both, can be stored in the
internal D flip-flops by low-to-high transitions at the appropriate
clock pins (CAB or CBA) regardless of the select of the control
pins. When SAB and SBA are in the real-time transfer mode, it
is also possible to store data without using the D-type flip-flops
by simultaneously enabling OEAB and OEBA. In this
configuration, each output reinforces its input. Thus, when all
other data sources to the two sets of bus lines are at high
impedance, each set of bus lines will remain at its last state.
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
Ordering Information
PART NUMBER
Pinout
CD74HC652
(PDIP)
CD74HCT652
( SOIC)
TOP VIEW
TEMP. RANGE
(oC)
CD74HC652EN
-55 to 125
24 Ld PDIP
CD74HCT652M
-55 to 125
24 Ld SOIC
CD74HCT652M96
-55 to 125
24 Ld SOIC
NOTE: When ordering, use the entire part number. The suffix 96
denotes tape and reel.
CAB 1
24 VCC
SAB 2
23 CBA
OEAB 3
22 SBA
A0 4
21 OEBA
A1 5
20 B0
A2 6
19 B1
A3 7
18 B2
A4 8
17 B3
A5 9
16 B4
A6 10
15 B5
A7 11
14 B6
GND 12
13 B7
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2003, Texas Instruments Incorporated
PACKAGE
1
CD74HC652, CD74HCT652
Functional Diagram
A0
A1
A2
A
DATA
PORT
A3
A4
A5
A6
A7
4
20
5
19
6
18
7
17
8
16
9
15
10
14
11
13
21
OEBA
OEAB
CAB CLOCK
FLIP-FLOP
CLOCKS
DATA
SOURCE
SELECTION
INPUTS
CBA CLOCK
SAB SOURCE
SBA SOURCE
B0
B1
B2
B3
B4
B
DATA
PORT
B5
B6
B7
GND = PIN 12
VCC = PIN 24
3
1
23
2
22
FUNCTION TABLE
INPUTS
DATA I/O
OPERATION OR FUNCTION
OEAB
OEBA
CAB
CBA
SAB
SBA
A0 THRU A7
B0 THRU B7
651
652
L
H
H or L
H or L
X
X
Input
Input
Isolation (Note 1)
Isolation (Note 1)
L
H
↑
↑
X
X
Store A and B Data
Store A and B Data
X
H
↑
H or L
X
X
Input
Unspecified
(Note 2)
Store A, Hold B
Store A, Hold B
H
H
↑
↑
X
(Note 3)
X
Input
Output
Store A in Both
Registers
Store A in Both
Registers
L
X
H or L
↑
X
X
Unspecified
(Note 2)
Input
Hold A, Store B
Hold A, Store B
L
L
↑
↑
X
X
(Note 3)
Output
Input
Store B in Both
Registers
Store B in Both
Registers
L
L
X
X
X
L
Output
Input
L
L
X
H or L
X
H
H
H
X
X
L
X
H
H
H or L
X
H
X
H
L
H or L
H or L
H
H
Real-Time B Data to Real-Time B Data to
A Bus
A Bus
Stored B Data to A
Bus
Input
Output
Output
Output
Stored B Data to A
Bus
Real-Time A Data to Real-Time A Data to
B Bus
B Bus
Stored A Data to B
Bus
Stored A Data to B
Bus
Stored A Data to B
Bus and
Stored A Data to B
Bus
Stored B Data to A
Bus
Stored B Data to A
Bus
NOTES:
1. To prevent excess currents in the High-Z (isolation) modes, all I/O terminals should be terminated with 10kΩ to 1MΩ resistors.
2. The data output functions may be enabled or disabled by various signals at the OEAB or OEBA inputs. Data input functions are always
enabled; i.e., data at the bus pins will be stored on every low-to-high transition on the clock inputs.
3. Select Control = L: Clocks can occur simultaneously.
Select Control = H: Clocks must be staggered in order to load both registers.
2
OEBA
21
VCC
OEAB
3
SAB
2
TO CHANNELS
2 THRU 8
CD74HC652, CD74HCT652
SBA
3
FIGURE 1. LOGIC BLOCK DIAGRAM
22
CAB
1
CBA
23
VCC
†
P
CK
D
F/F
A
Q
4, (5, 6, 7, 8,
9, 10, 11)
N
VCC
GND
P
†
B
N
GND
P
N
24
VCC
12
GND
P
N
P
N
F/F
P
N
† Inverter not included in HC/HCT651
ONE OF EIGHT IDENTICAL CHANNELS
20, (19, 18,
17, 16, 15,
14, 13)
CD74HC652, CD74HCT652
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC
(Voltages Referenced to Ground) . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, IO
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±35mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Thermal Resistance (Typical)
θJA (oC/W)
EN (PDIP) Package (Note 4) . . . . . . . . . . . . . . . . . .
67
M (SOIC) Package (Note 5). . . . . . . . . . . . . . . . . . .
46
Maximum Junction Temperature (Hermetic Package or Die) . . . 175oC
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
4. The package thermal impedance is calculated in accordance with JESD 51-3.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
25oC
-40oC TO 85oC
-55oC TO 125oC
SYMBOL
VI (V)
VIS (V)
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
VIH
-
-
2
1.5
-
-
1.5
-
1.5
-
V
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
2
-
-
0.3
-
0.3
-
0.3
V
4.5
-
-
0.9
-
0.9
-
0.9
V
6
-
-
1.2
-
1.2
-
1.2
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-
-
-
-
-
-
-
-
-
V
-6
4.5
3.98
-
-
3.84
-
3.7
-
V
-7.8
6
5.48
-
-
5.34
-
5.2
-
V
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
VIL
VOH
-
VIH or
VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
Low Level Output
Voltage
TTL Loads
VOL
VIH or
VIL
-
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
-
-
-
-
-
-
-
-
-
V
6
4.5
-
-
0.26
-
0.33
-
0.4
V
7.8
6
-
-
0.26
-
0.33
-
0.4
V
4
CD74HC652, CD74HCT652
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
25oC
-40oC TO 85oC
-55oC TO 125oC
SYMBOL
VI (V)
VIS (V)
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
II
VCC or
GND
-
6
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
6
-
-
8
-
80
-
160
µA
VIL or VIH
VO =
VCC or
GND
-
6
-
-
±0.5
-
±5.0
-
±10
µA
High Level Input
Voltage
VIH
-
-
4.5 to
5.5
2
-
-
2
-
2
-
V
Low Level Input
Voltage
VIL
-
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
High Level Output
Voltage
CMOS Loads
VOH
VIH or
VIL
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-6
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
6
4.5
-
-
0.26
-
0.33
-
0.4
V
±0.1
-
±1
-
±1
µA
PARAMETER
Input Leakage
Current
Quiescent Device
Current
Three- State Leakage
Current
HCT TYPES
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or
VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
II
VCC
and
GND
0
5.5
-
ICC
VCC or
GND
0
5.5
-
-
8
-
80
-
160
µA
Three- State Leakage
Current
VIL or VIH
VO =
VCC or
GND
-
5.5
-
-
±0.5
-
±5.0
-
±10
µA
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
∆ICC
(Note 6)
VCC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
Quiescent Device
Current
NOTE:
6. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
OEBA
1.3
OEAB
0.75
Clock A to B, B to A
0.6
Select A, Select B
0.45
Inputs A0-A7, B0-B7
0.3
NOTE: Unit Load is ∆ICC limit specified in DC Electrical Specifications table, e.g., 360µA max at 25oC.
5
CD74HC652, CD74HCT652
Prerequisite for Switching Specifications
25oC
PARAMETER
-40oC TO 85oC
-55oC TO 125oC
SYMBOL
VCC (V)
MIN
TYP
MAX
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
fMAX
2
6
-
-
5
-
-
4
-
-
MHz
4.5
30
-
-
25
-
-
20
-
-
MHz
6
35
-
-
29
-
-
23
-
-
MHz
2
60
-
-
75
-
-
90
-
-
ns
4.5
12
-
-
15
-
-
18
-
-
ns
6
10
-
-
13
-
-
15
-
-
ns
2
35
-
-
45
-
-
55
-
-
ns
4.5
7
-
-
9
-
-
11
-
-
ns
6
6
-
-
8
-
-
9
-
-
ns
2
80
-
-
100
-
-
120
-
-
ns
4.5
16
-
-
20
-
-
24
-
-
ns
6
14
-
-
17
-
-
20
-
-
ns
fMAX
4.5
25
-
-
20
-
-
17
-
-
MHz
Setup Time
Data to Clock
tSU
4.5
12
-
-
15
-
-
18
-
-
ns
Hold Time
Data to Clock
tH
4.5
5
-
-
5
-
-
5
-
-
ns
Clock Pulse Width
tW
4.5
25
-
-
31
-
-
38
-
-
ns
HC TYPES
Maximum Clock
Frequency
Setup Time
Data to Clock
Hold Time
Data to Clock
Clock Pulse Width
tSU
tH
tW
HCT TYPES
Maximum Clock
Frequency
Switching Specifications Input tr, tf = 6ns
PARAMETER
SYMBOL
TEST
CONDITIONS
tPLH, tPHL
CL = 50pF
VCC
(V)
25oC
MIN
-40oC TO 85oC -55oC TO 125oC
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
HC TYPES
Propagation Delay,
Store A Data to B Bus
Store B Data to A Bus
Propagation Delay,
A Data to B Bus
B Data to A Bus
tPLH, tPHL
2
-
-
220
-
275
-
300
ns
4.5
-
-
44
-
55
-
66
ns
6
-
-
37
-
47
-
5.6
ns
CL = 15pF
5
-
18
-
-
-
-
-
ns
CL = 50pF
2
-
-
135
-
170
-
205
ns
4.5
-
-
27
-
34
-
41
ns
6
-
-
23
-
29
-
35
ns
5
-
12
-
-
-
-
-
ns
CL = 15pF
Propagation Delay,
Select to Data
tPLH, tPHL
CL = 50pF
CL = 15pF
2
-
-
170
-
215
-
255
ns
4.5
-
-
34
-
43
-
51
ns
6
-
-
29
-
37
-
43
ns
5
-
14
-
-
-
-
-
ns
6
CD74HC652, CD74HCT652
Switching Specifications Input tr, tf = 6ns
(Continued)
PARAMETER
SYMBOL
TEST
CONDITIONS
Three-State Disabling Time Bus
to Output or Register to Output
tPLZ, tPHZ
CL = 50pF
Three-State Enabling Time Bus
to Output or Register to Output
Output Transition Time
tPZL, tPZH
tTLH, tTHL
25oC
-40oC TO 85oC -55oC TO 125oC
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
-
-
175
-
220
-
265
ns
4.5
-
-
35
-
44
-
53
ns
6
-
-
30
-
37
-
45
ns
CL = 15pF
5
-
14
-
-
-
-
-
ns
CL = 50pF
2
-
-
175
-
220
-
265
ns
4.5
-
-
35
-
44
-
53
ns
6
-
-
30
-
37
-
45
ns
CL = 15pF
5
-
14
-
-
-
-
-
ns
CL = 50pF
2
-
-
60
-
75
-
90
ns
4.5
-
-
12
-
15
-
18
ns
6
-
-
10
-
13
-
15
ns
Three-State Output
Capacitance
CO
-
-
-
-
20
-
20
-
20
pF
Input Capacitance
CI
-
-
-
-
10
-
10
-
10
pF
Maximum Frequency
fMAX
CL = 15pF
5
-
60
-
-
-
-
-
MHz
Power Dissipation Capacitance
(Notes 7, 8)
CPD
-
5
-
52
-
-
-
-
-
pF
Propagation Delay,
Store A Data to B Bus
Store B Data to A Bus
tPLH, tPHL
CL = 50pF
4.5
-
-
44
-
55
-
66
ns
CL = 15pF
5
-
18
-
-
-
-
-
ns
Propagation Delay,
A Data to B Bus
B Data to A Bus
tPLH, tPHL
CL = 50pF
4.5
-
-
37
-
46
-
56
ns
CL = 15pF
5
-
15
-
-
-
-
-
ns
Propagation Delay,
Select to Data
tPLH, tPHL
CL = 50pF
4.5
-
-
46
-
58
-
69
ns
CL = 15pF
5
-
19
-
-
-
-
-
ns
Three-State Disabling Time Bus
to Output or Register to Output
tPLZ, tPHZ
CL = 50pF
4.5
-
-
35
-
44
-
53
ns
Three-State Enabling Time Bus
to Output or Register to Output
tPZL, tPZH
Output Transition Time
HCT TYPES
CL = 15pF
5
-
14
-
-
-
-
-
ns
CL = 50pF
4.5
-
-
45
-
56
-
68
ns
CL = 15pF
5
-
19
-
-
-
-
-
ns
tTLH, tTHL
CL = 50pF
4.5
-
-
12
-
15
-
18
ns
Three-State Output
Capacitance
CO
-
-
-
-
20
-
20
-
20
pF
Input Capacitance
CI
-
-
-
-
10
-
10
-
10
pF
Maximum Frequency
fMAX
CL = 15pF
5
-
45
-
-
-
-
-
MHz
Power Dissipation Capacitance
(Notes 7, 8)
CPD
-
5
-
52
-
-
-
-
-
pF
NOTES:
7. CPD is used to determine the dynamic power consumption, per package.
8. PD = VCC2 CPD fi + Σ VCC2 CL fo where fi = input frequency, fo = output frequency, CL = output load capacitance, CS = switch capacitance, VCC = supply voltage.
7
CD74HC652, CD74HCT652
Test Circuits and Waveforms
tfCL
trCL
CLOCK
tWL + tWH =
90%
10%
I
fCL
CLOCK
50%
50%
tfCL = 6ns
2.7V
1.3V
0.3V
0.3V
GND
1.3V
1.3V
GND
tWH
tWL
tWH
tWL
I
fCL
3V
VCC
50%
10%
tWL + tWH =
trCL = 6ns
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
FIGURE 2. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
FIGURE 3. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
tr = 6ns
tf = 6ns
VCC
90%
50%
10%
INPUT
GND
tTLH
GND
tTHL
90%
50%
10%
INVERTING
OUTPUT
3V
2.7V
1.3V
0.3V
INPUT
tTHL
tPHL
tf = 6ns
tr = 6ns
tTLH
90%
1.3V
10%
INVERTING
OUTPUT
tPHL
tPLH
FIGURE 4. HC TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
tPLH
FIGURE 5. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
8
CD74HC652, CD74HCT652
Test Circuits and Waveforms
(Continued)
trCL
tfCL
trCL
VCC
90%
CLOCK
INPUT
GND
tH(H)
3V
2.7V
CLOCK
INPUT
50%
10%
tfCL
1.3V
0.3V
GND
tH(H)
tH(L)
VCC
DATA
INPUT
3V
DATA
INPUT
50%
tH(L)
1.3V
1.3V
1.3V
GND
tSU(H)
tSU(H)
tSU(L)
tTLH
tTHL
90%
50%
10%
90%
OUTPUT
tREM
VCC
SET, RESET
OR PRESET
tTLH
OUTPUT
tREM
3V
SET, RESET
OR PRESET
GND
6ns
tr
VCC
10%
OUTPUTS
ENABLED
OUTPUT LOW
TO OFF
FIGURE 8. HC THREE-STATE PROPAGATION DELAY
WAVEFORM
OTHER
INPUTS
TIED HIGH
OR LOW
OUTPUT
DISABLE
IC WITH
THREESTATE
OUTPUT
GND
1.3V
tPZH
90%
OUTPUTS
ENABLED
OUTPUTS
ENABLED
0.3
10%
OUTPUT HIGH
TO OFF
50%
3V
tPZL
tPHZ
tPZH
90%
OUTPUTS
DISABLED
6ns
2.7
1.3
tPLZ
10%
tPHZ
tf
GND
50%
OUTPUT HIGH
TO OFF
6ns
OUTPUT
DISABLE
tPZL
tPLZ
CL
50pF
FIGURE 7. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
6ns
OUTPUT LOW
TO OFF
GND
IC
90%
50%
tPHL
1.3V
CL
50pF
FIGURE 6. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
OUTPUT
DISABLE
1.3V
10%
tPLH
50%
IC
tTHL
90%
90%
1.3V
tPHL
tPLH
GND
tSU(L)
1.3V
OUTPUTS
DISABLED
OUTPUTS
ENABLED
FIGURE 9. HCT THREE-STATE PROPAGATION DELAY
WAVEFORM
OUTPUT
RL = 1kΩ
CL
50pF
VCC FOR tPLZ AND tPZL
GND FOR tPHZ AND tPZH
NOTE: Open drain waveforms tPLZ and tPZL are the same as those for three-state shown on the left. The test circuit is Output RL = 1kΩ to
VCC, CL = 50pF.
FIGURE 10. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT
9
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
CD74HCT652M
ACTIVE
SOIC
DW
24
25
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
HCT652M
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of