CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
www.ti.com
SCAS688D – JUNE 2005 – REVISED JULY 2007
FEATURES
•
•
•
•
•
•
•
•
1.8-V Phase Lock Loop Clock Driver for
Double Data Rate (DDR II) Applications
Spread Spectrum Clock Compatible
Operating Frequency: 10 MHz to 400 MHz
Low Current Consumption: VDDQ
±50
mA
IOK
Output clamp current
VO < 0 or VO > VDDQ
±50
mA
IO
Continuous output current
VO = 0 to VDDQ
Continuous current through each VDDQ or GND
Tstg
(1)
(2)
(3)
Storage temperature range
–65
V
±50
mA
±100
mA
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
This value is limited to 2.5 V maximum.
Recommended Operating Conditions
VCC
Output supply voltage, VDDQ
Supply Voltage, AVDD
MIN
NOM
MAX
1.7
1.8
1.9
(1)
VDDQ
UNIT
V
V
VIL
Low-level input voltage (2)
OE, OS
VIH
High-level input voltage (2)
CK, CK
IOH
High-level output current (see Figure 2)
-9
mA
IOL
Low-level output current (see Figure 2)
9
mA
VIX
Input differential-pair cross voltage
VI
Input voltage level
(2)
VID
Input differential voltage
(see Figure 9 )
TA
Operating free-air temperature
(1)
(2)
0.35 x VDDQ
0.65 x VDDQ
V
V
(VDDQ/2) - 0.15
(VDDQ/2) + 0.15
V
-0.3
VDDQ + 0.3
V
DC
0.3
VDDQ + 0.4
V
AC
0.6
VDDQ + 0.4
V
-40
85
°C
The PLL is turned off and bypassed for test purposes when AVDD is grounded. During this test mode, VDDQ remains within the
recommended operating conditions and no timing parameters are specified.
VID is the magnitude of the difference between the input level on CK and the input level on CK, see Figure 9 for definition. The CK and
CK, VIH and VIL limits define the dc low and high levels for the logic detect state.
Submit Documentation Feedback
5
CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
www.ti.com
SCAS688D – JUNE 2005 – REVISED JULY 2007
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
Input
VOH
High-level output voltage
VOL
Low-level output voltage
IO(DL)
Low-level output current, dissabled
VOD
Differential output voltage (1)
II = 18 mA
(1)
(2)
UNIT
-1.2
V
VDDQ – 0.2
V
1.1
0.1
IOL = 9 mA
1.7
VO(DL) = 100 mV, OE = L
1.7
100
1.7
0.5
μA
V
±250
OE, OS,
FBIN, FBIN
1.9
±10
CK and CK = L
1.9
500
CK and CK = 270 MHz. All
outputs are open (not connected
to a PCB)
1.9
135
All outputs are loaded with 2 pF
and 120-Ω termination resistor
1.9
CK, CK
FBIN, FBIN
CK, CK
FBIN, FBIN
VI = VDD or GND
VI = VDD or GND
V
0.6
1.9
Supply current, dynamic (IDDQ + IADD)
(see Note (2) for CPD calculation)
Change in input current
MAX
CK, CK
Supply current, static (IDDQ + IADD)
CI(Δ)
1.7
IOL = 100 μA
IDD(LD)
Input capacitance
1.7 to 1.9
IOH = –9 mA
Input current
CI
MIN TYP (1)
1.7
IOH = –100 μA
II
IDD
AVDD ,
VDDQ
μA
μA
mA
235
1.8
2
3
1.8
2
3
1.8
0.25
1.8
0.25
pF
VOD is the magnitude of the difference between the true and complimentary outputs. See Figure 9 for a definition.
Total IDD = IDDQ + IADD = fCK × CPD × VDDQ, solving for CPD = (IDDQ + IADD)/(fCK × VDDQ) where fCK is the input frequency, VDDQ is the
power supply, and CPD is the power dissipation capacitance.
Timing Requirements
over recommended operating free-air temperature range (unless otherwise noted) (1)
PARAMETER
fCK
Duty cycle, input clock
tL
Stabiliztion time
(3)
(4)
6
Clock frequency (application) (1) (3)
tDC
(1)
(2)
TEST CONDITIONS
Clock frequency (operating) (1) (2)
AVDD, VDD = 1.8 V ±0.1 V
(4)
MIN
MAX
UNIT
10
400
MHz
160
340
MHz
40%
60%
12
μs
The PLL must be able to handle spread spectrum induced skew.
Operating clock frequency indicates a range over which the PLL must be able to lock, but in which it is not required to meet the other
timing parameters (used for low speed system debug).
Application clock frequency indicates a range over which the PLL must meet all timing parameters.
Stabilization time is the time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal after
power up. During normal operation, the stabilization time is also the time required for the integrated PLL circuit to obtain phase lock of
its feedback signal to its reference signal when CK and CK go to a logic low state, enter the power-down mode and later return to active
operation. CK and CK may be left floating after they have been driven low for one complete clock cycle.
Submit Documentation Feedback
CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
www.ti.com
SCAS688D – JUNE 2005 – REVISED JULY 2007
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see
PARAMETER
TEST CONDITIONS
(1)
) AVDD, VDD = 1.8 V ± 0.1 V
MIN
TYP
MAX
UNIT
ten
Enable time, OE to any Y/Y
See Figure 11
8
ns
tdis
Disable time, OE to any Y/Y
See Figure 11
8
ns
Cycle-to-cycle period jitter (2)
160 MHz to 190 MHz, see Figure 4
Cycle-to-cycle period jitter (2)
160 MHz to 340 MHz, see Figure 4
t(ω)
Static phase offset time (3)
t(ω)dyn
Dynamic phase offset time
tsk(o)
Output clock skew
See Figure 6
tjit(cc+)
tjit(cc-)
tjit(cc+)
tjit(cc-)
tjit(per)
VOX
40
0
-40
0
30
0
-30
See Figure 5
-50
50
ps
See Figure 10
-15
15
ps
35
ps
160 MHz to 190 MHz, see Figure 7
-30
30
190 MHz to 340 MHz, see Figure 7
-20
20
160 MHz to 190 MHz, see Figure 8
-115
115
190 MHz to 250 MHz, see Figure 8
-70
70
250 MHz to 300 MHz, see Figure 8
-40
40
300 MHz to 340 MHz, see Figure 8
-60
60
Slew rate, OE
See Figure 3 and Figure 9
0.5
Input clock slew rate
See Figure 3 and Figure 9
1
2.5
4
Output clock slew rate (5) (6) (no load)
See Figure 3 and Figure 9
1.5
2.5
3
Period jitter
(4) (2)
tjit(hper) Half-period jitter (4) (2)
SR
0
Output differential-pair cross voltage
CDCU877, See Figure 2
(VDDQ/2) 0.1
(VDDQ/2) +
0.1
CDCU877A (8), See Figure 2
(0 - 85°C)
(VDDQ/2) 0.1
(VDDQ/2) +
0.1
(7)
SSC modulation frequency
SSC clock input frequency deviation
PLL loop bandwidth
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
30
33
0%
-0.5%
2
ps
ps
ps
ps
V/ns
V
kHz
MHz
There are two different terminations that are used with the following tests. The load/board in Figure 2 is used to measure the input and
output differential-pair cross voltage only. The load/board in Figure 3 is used to measure all other tests. For consistency, equal length
cables must be used.
This parameter is specifieded by design and characterization.
Phase static offset time does not include jitter.
Period jitter, half-period jitter specifications are separate specifications that must be met independently of each other.
The output slew rate is determined from the IBIS model with a 120-Ω load only.
To eliminate the impact of input slew rates on static phase offset, the input skew rates of reference clock input CK and CK and feedback
clock inputs FBIN and FBIN are recommended to be nearly equal. The 2.5-V/ns skew rates are shown as a recommended target.
Compliance with these typical values is not mandatory if it can adequately shown that alternative characteristics meet the requirements
of the registered DDR2 DIMM application.
Output differential-pair cross voltage specified at the DRAM clock input or the test load.
VOX of CDCU877A is on average 30 mV lower than that of CDCU877 for the same application.
Submit Documentation Feedback
7
CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
www.ti.com
SCAS688D – JUNE 2005 – REVISED JULY 2007
PARAMETER MEASUREMENT INFORMATION
VDD
CU877
SCOPE
GND
C = 10 pF
Z = 60 W
L = 2.97”
C = 1 pF
Z = 120 W
R = 1 MW
VTT
Z = 60 W
L = 2.97”
C = 1 pF
R = 1 MW
C = 10 pF
VTT
GND
Note: VTT = GND
Figure 2. Output Load Test Circuit 1
VDD/2
CU877
SCOPE
−VDD/2
C = 10 pF
Z = 60 W
Z = 50 W
L = 2.97”
R = 10 W
Z = 60 W
R = 50 W
VTT
Z = 50 W
L = 2.97”
R = 10 W
R = 50 W
C = 10 pF
−VDD/2
VTT
Note: VTT = GND
−VDD/2
Figure 3. Output Load Test Circuit 2
Yx, FBOUT
Yx, FBOUT
tcycle n
tcycle n+1
tjit(cc) = tcycle n − tcycle n+1
Figure 4. Cycle-To-Cycle Period Jitter
8
Submit Documentation Feedback
CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
www.ti.com
SCAS688D – JUNE 2005 – REVISED JULY 2007
PARAMETER MEASUREMENT INFORMATION (continued)
tjn
tjn+1
Figure 5. Static Phase Offset
n=N
å1
tj =
tjn
N
(N is the large number of samples)
(N > 1000 samples)
(1)
Figure 6. Output Skew
Figure 7. Period Jitter
t jit(per) = tcycle n -
1
fO
(fO average input frequency measured at CK/CK
Submit Documentation Feedback
(2)
9
CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
www.ti.com
SCAS688D – JUNE 2005 – REVISED JULY 2007
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 8. Half-Period Jitter
t jit(hper) = thalf period n -
1
2 x fO
n = any half cycle
(fO average input frequency measured at CK/CK
(3)
80%
80%
VID, VOD
Clock Inputs
and Outputs, OE
20%
20%
tr(i), tr(o)
tf(i), tf(o)
Figure 9. Input and Output Slew Rates
slrr(i/o) =
V80% - V20%
tr(i/o)
slrf(i/o) =
V80% - V20%
t f(i/o)
(4)
tj
tj
tjdyn
tjdyn
tjdyn
Figure 10. Dynamic Phase Offset
10
Submit Documentation Feedback
tjdyn
CDCU877,, CDCU877A
1.8-V PHASE LOCK LOOP CLOCK DRIVER
www.ti.com
SCAS688D – JUNE 2005 – REVISED JULY 2007
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 11. Time Delay Between OE and Clock Output (Y, Y)
RECOMMENDED AVDD FILTERING
Bead
0603
CARD
VIA
AV DD
V DDQ
1W
4.7 mF
1206
0.1 mF
0603
2200 pF
0603
PLL
GND
AGND
CARD
VIA
A.
Place the 2200-pF capacitor close to the PLL.
B.
Use a wide trace for the PLL analog power and ground. Connect PLL and capacitors to AGND trace and connect
trace to one GND via (farthest from the PLL).
C.
Recommended bead: Fair-Rite PN 2506036017Y0 or equilvalent (0.8 Ω dc maximum, 600 Ω at 100 MHz).
Figure 12. Recommended AVDD Filtering
Submit Documentation Feedback
11
PACKAGE OPTION ADDENDUM
www.ti.com
9-Sep-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
CDCU877AGQLT
NRND
BGA
MICROSTAR
JUNIOR
GQL
52
250
TBD
SNPB
Level-2-235C-1 YEAR
-40 to 85
CDCU877A
CDCU877ARHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877A
CDCU877ARHARG4
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877A
CDCU877ARHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877A
CDCU877ARHATG4
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877A
CDCU877ARTBR
OBSOLETE
VQFN
RTB
40
TBD
Call TI
Call TI
-40 to 85
CDCU877A
CDCU877AZQLR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQL
52
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-2-260C-1 YEAR
-40 to 85
CDCU877A
CDCU877AZQLT
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQL
52
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-2-260C-1 YEAR
-40 to 85
CDCU877A
CDCU877GQLR
NRND
BGA
MICROSTAR
JUNIOR
GQL
52
1000
TBD
SNPB
Level-2-235C-1 YEAR
-40 to 85
CDCU877
CDCU877GQLT
NRND
BGA
MICROSTAR
JUNIOR
GQL
52
250
TBD
SNPB
Level-2-235C-1 YEAR
-40 to 85
CDCU877
CDCU877RHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877
CDCU877RHARG4
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877
CDCU877RHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877
CDCU877RHATG4
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877
CDCU877RTBR
OBSOLETE
VQFN
RHA
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CDCU877
CDCU877RTBT
OBSOLETE
VQFN
RTB
40
TBD
Call TI
Call TI
-40 to 85
CDCU877
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
9-Sep-2014
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
CDCU877ZQLR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQL
52
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-2-260C-1 YEAR
-40 to 85
CDCU877
CDCU877ZQLT
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQL
52
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-2-260C-1 YEAR
-40 to 85
CDCU877
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
9-Sep-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CDCU877AGQLT
CDCU877ARHAR
CDCU877ARHAT
Package Package Pins
Type Drawing
BGA MI
CROSTA
R JUNI
OR
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
GQL
52
250
180.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
VQFN
RHA
40
2500
330.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
VQFN
RHA
40
250
180.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
CDCU877AZQLR
BGA MI
CROSTA
R JUNI
OR
ZQL
52
1000
330.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
CDCU877AZQLT
BGA MI
CROSTA
R JUNI
OR
ZQL
52
250
180.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
CDCU877GQLR
BGA MI
CROSTA
R JUNI
OR
GQL
52
1000
330.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
CDCU877GQLT
BGA MI
CROSTA
R JUNI
OR
GQL
52
250
180.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CDCU877RHAR
VQFN
RHA
40
2500
330.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
CDCU877RHAT
VQFN
RHA
40
250
180.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
CDCU877ZQLR
BGA MI
CROSTA
R JUNI
OR
ZQL
52
1000
330.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
CDCU877ZQLT
BGA MI
CROSTA
R JUNI
OR
ZQL
52
250
180.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CDCU877AGQLT
BGA MICROSTAR
JUNIOR
GQL
52
250
213.0
191.0
55.0
CDCU877ARHAR
VQFN
RHA
40
2500
367.0
367.0
38.0
CDCU877ARHAT
VQFN
RHA
40
250
210.0
185.0
35.0
CDCU877AZQLR
BGA MICROSTAR
JUNIOR
ZQL
52
1000
336.6
336.6
28.6
CDCU877AZQLT
BGA MICROSTAR
JUNIOR
ZQL
52
250
213.0
191.0
55.0
CDCU877GQLR
BGA MICROSTAR
JUNIOR
GQL
52
1000
336.6
336.6
28.6
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Sep-2015
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CDCU877GQLT
BGA MICROSTAR
JUNIOR
GQL
52
250
213.0
191.0
55.0
CDCU877RHAR
VQFN
RHA
40
2500
367.0
367.0
38.0
CDCU877RHAT
VQFN
RHA
40
250
210.0
185.0
35.0
CDCU877ZQLR
BGA MICROSTAR
JUNIOR
ZQL
52
1000
336.6
336.6
28.6
CDCU877ZQLT
BGA MICROSTAR
JUNIOR
ZQL
52
250
213.0
191.0
55.0
Pack Materials-Page 3
IMPORTANT NOTICE
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