DAC5662-EP
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SGLS340A – JUNE 2006 – REVISED OCTOBER 2006
DUAL 12-BIT 200-MSPS DIGITAL-TO-ANALOG CONVERTER
FEATURES
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(1)
Controlled Baseline
– One Assembly
– One Test Site
– One Fabrication Site
Extended Temperature Performance of
–55°C to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree (1)
12-Bit Dual Transmit Digital-to-Analog
Converter (DAC)
200-MSPS Update Rate
Single Supply: 3 V to 3.6 V
Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
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High Spurious-Free Dynamic Range (SFDR):
85 dBc at 5 MHz
High Third-Order Two-Tone Intermodulation
(IMD3): 78 dBc at 15.1 and 16.1 MHz
WCDMA Adjacent Channel Leakage Ratio
(ACLR): 70 dB at 30.72 MHz
Independent or Single Resistor Gain Control
Dual or Interleaved Data
On-Chip 1.2-V Reference
Low Power: 330 mW
Power-Down Mode: 15 mW
Package: 48-Pin Thin Quad Flat Pack (TQFP)
APPLICATIONS
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Cellular Base Transceiver Station Transmit
Channel
– CDMA: W-CDMA, CDMA2000, IS-95
– TDMA: GSM, IS-136, EDGE/UWC-136
Medical/Test Instrumentation
Arbitrary Waveform Generators (ARB)
Direct Digital Synthesis (DDS)
Cable Modem Termination System (CMTS)
DESCRIPTION
The DAC5662 is a monolithic, dual-channel 12-bit, high-speed digital-to-analog converter (DAC) with on-chip
voltage reference.
Operating with update rates of up to 200 MSPS, the DAC5662 offers exceptional dynamic performance, tight
gain, and offset matching characteristics that make it suitable in either I/Q baseband or direct IF communication
applications.
Each DAC has a high-impedance differential-current output, suitable for single-ended or differential
analog-output configurations. External resistors allow scaling the full-scale output current for each DAC
separately or together, typically between 2 mA and 20 mA. An accurate on-chip voltage reference is temperature
compensated and delivers a stable 1.2-V reference voltage. Optionally, an external reference may be used.
The DAC5662 has two 12-bit parallel input ports with separate clocks and data latches. For flexibility, the
DAC5662 also supports multiplexed data for each DAC on one port when operating in the interleaved mode.
The DAC5662 has been specifically designed for a differential transformer coupled output with a 50-Ω doubly
terminated load. For a 20-mA full-scale output current a 4:1 impedance ratio (resulting in an output power of
4 dBm) and 1:1 impedance ratio transformer (–2-dBm output power) are supported.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
DAC5662-EP
www.ti.com
SGLS340A – JUNE 2006 – REVISED OCTOBER 2006
DESCRIPTION (CONTINUED)
The DAC5662 is available in a 48-pin thin quad flat pack (TQFP). Pin compatibility between family members
provides 12-bit (DAC5662) and 14-bit (DAC5672) resolution. Furthermore, the DAC5662 is pin compatible to the
DAC2902 and AD9765 dual DACs. The device is characterized for operation over the military temperature range
of –55°C to 125°C.
FUNCTIONAL BLOCK DIAGRAM
WRTB
WRTA
CLKB
CLKA
DE
MUX
IOUTA1
Latch A
12−b DAC
DA[11:0]
IOUTA2
BIASJ_A
IOUTB1
Latch B
DB[11:0]
12−b DAC
MODE
IOUTB2
BIASJ_B
GSET
1.2 V Reference
EXTIO
SLEEP
DVDD
DGND
AVDD
AGND
AVAILABLE OPTIONS
PACKAGED DEVICES
48-PIN TQFP
TA
DAC5662MPFBREP
–55°C to 125°C
2
DAC5662MPFBEP
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SGLS340A – JUNE 2006 – REVISED OCTOBER 2006
MODE
AVDD
IOUTA1
IOUTA2
BIASJ_A
EXTIO
GSET
BIASJ_B
IOUTB2
IOUTB1
AGND
SLEEP
DEVICE INFORMATION
48 47 46 45 44 43 42 41 40 39 38 37
1
36
2
35
3
34
4
33
5
Top View
48-Pin TQFP
PFB Package
6
7
32
31
30
8
29
9
28
10
27
11
26
25
12
13 14 15 16 17 18 19 20 21 22 23 24
NC
NC
DB0 (LSB)
DB1
DB2
DB3
DB4
DB5
DB6
DB7
DB8
DB9
NC
NC
DGND
DVDD
WRTA/WRTIQ
CLKA/CLKIQ
CLKB/RESETIQ
WRTB/SELECTIQ
DGND
DVDD
DB11 (MSB)
DB10
DA11 (MSB)
DA10
DA9
DA8
DA7
DA6
DA5
DA4
DA3
DA2
DA1
DA0 (LSB)
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DAC5662-EP
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SGLS340A – JUNE 2006 – REVISED OCTOBER 2006
DEVICE INFORMATION (continued)
TERMINAL FUNCTIONS
TERMINAL
DESCRIPTION
NO.
AGND
38
I
Analog ground
AVDD
47
I
Analog supply voltage
BIASJ_A
44
O
Full-scale output current bias for DACA
BIASJ_B
41
O
Full-scale output current bias for DACB
CLKA/CLKIQ
18
I
Clock input for DACA, CLKIQ in interleaved mode
CLKB/RESETIQ
19
I
Clock input for DACB, RESETIQ in interleaved mode
DA[11:0]
1–12
I
Data port A. DA11 is MSB and DA0 is LSB.
DB[11:0]
23–34
I
Data port B. DB11 is MSB and DB0 is LSB.
DGND
15, 21
I
Digital ground
DVDD
16, 22
I
Digital supply voltage
EXTIO
43
I/O
GSET
42
I
Gain-setting mode: H = 1 resistor, L = 2 resistors. Internal pullup
IOUTA1
46
O
DACA current output. Full scale with all bits of DA high.
IOUTA2
45
O
DACA complementary current output. Full scale with all bits of DA low.
IOUTB1
39
O
DACB current output. Full scale with all bits of DB high.
IOUTB2
40
O
DACB complementary current output. Full scale with all bits of DB low.
MODE
48
I
Mode select: H = dual bus, L = interleaved. Internal pullup.
13, 14, 35,
36
–
No connection
SLEEP
37
I
Sleep function control input: H = DAC in power-down mode, L = DAC in operating mode.
Internal pulldown.
WRTA/WRTIQ
17
I
Input write signal for PORT A (WRTIQ in interleaving mode)
WRTB/SELECTIQ
20
I
Input write signal for PORT B (SELECTIQ in interleaving mode)
NC
4
I/O
NAME
Internal reference output (bypass with 0.1 µF to AGND) or external reference input
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SGLS340A – JUNE 2006 – REVISED OCTOBER 2006
PFB PACKAGE THERMAL CHARACTERISTICS
PARAMETER
POWERPAD CONNECTED TO PCB THERMAL PLANE
Thermal resistance, junction to ambient
63.7°C/W
Thermal resistance, junction to case
19.6°C/W
1000
Wirebond Voiding Fail Mode
Years Estimated Life
100
10
Electromigration Fail Mode
1
0.1
100
110
120
130
140
150
160
Continuous TJ − 5C
Figure 1. DAC5662MPFB Operating Life Derating Chart
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DAC5662-EP
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SGLS340A – JUNE 2006 – REVISED OCTOBER 2006
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
UNIT
Supply voltage range
AVDD (2)
–0.5 V to 4 V
DVDD (3)
–0.5 V to 4 V
Voltage between AGND and DGND
–0.5 V to 0.5 V
Voltage between AVDD and DVDD
Supply voltage range
–0.5 V to DVDD + 0.5 V
MODE, CLKA, CLKB, WRTA, WRTB (3)
–0.5 V to DVDD + 0.5 V
IOUTA1, IOUTA2, IOUTB1, IOUTB2 (2)
–1 V to AVDD + 0.5 V
EXTIO, BIASJ_A, BIASJ_B, SLEEP (2)
–0.5 V to AVDD + 0.5 V
Peak input current (any input)
20 mA
Peak total input current (all inputs)
–30 mA
Operating free-air temperature range
–55°C to 125°C
Storage temperature range
–65°C to 150°C
Lead temperature
(1)
(2)
(3)
6
–0.5 V to 0.5 V
DA[11:0] and DB[11:0] (3)
1,6 mm (1/16 in) from the case for 10 s
260°C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Measured with respect to AGND
Measured with respect to DGND
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SGLS340A – JUNE 2006 – REVISED OCTOBER 2006
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA, independent gain set mode
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DC Specifications
Resolution
12
Bits
DC Accuracy (1)
INL
Integral nonlinearity
1 LSB = IOUTFS/212, TA = 25°C
–2
0.3
2
LSB
DNL
Differential nonlinearity
1 LSB = IOUTFS/212, TA = 25°C
–2
0.2
2
LSB
Analog Output
Offset error
Gain error
0.03
%FSR
With external reference
0.25
%FSR
With internal reference
0.5
%FSR
current (2)
2
Maximum full-scale output current (2)
20
Minimum full-scale output
Gain mismatch
With internal reference
Output voltage compliance range (3)
RO
Output resistance
CO
Output capacitance
–2
0.07
–0.8
mA
mA
2
1.25
%FSR
V
300
kΩ
5
pF
Reference Output
Reference voltage
1.14
Reference output current (4)
1.2
1.26
100
V
nA
Reference Input
VEXTIO
Input voltage
RI
Input resistance
CI
0.1
1.25
V
1
MΩ
Small signal bandwidth
300
kHz
Input capacitance
100
pF
Temperature Coefficients
Offset drift
Gain drift
0
With external reference
±50
With internal reference
±50
ppm of
FSR/°C
±20
ppm/°C
Reference voltage drift
(1)
(2)
(3)
(4)
ppm of
FSR/°C
Measured differentially through 50 Ω to AGND.
Nominal full-scale current, IOUTFS, equals 32× the IBIAS current.
The lower limit of the output compliance is determined by the CMOS process. Exceeding this limit may result in transistor breakdown,
resulting in reduced reliability of the DAC5662 device. The upper limit of the output compliance is determined by the load resistors and
full-scale output current. Exceeding the upper limit adversely affects distortion performance and intergral nonlinearity.
Use an external buffer amplifier with high impedance input to drive any external load.
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DAC5662-EP
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SGLS340A – JUNE 2006 – REVISED OCTOBER 2006
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA, fDATA = 200 MSPS, fOUT = 1 MHz,
independent gain set mode (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Power Supply
AVDD
Analog supply voltage
3
3.3
3.6
V
DVDD
Digital supply voltage
3
3.3
3.6
V
Including output current through load resistor
75
90
IAVDD
Supply current, analog
Sleep mode with clock
2.5
6
Sleep mode without clock
2.5
IDVDD
Supply current, digital
25
38
Sleep mode with clock
12.5
18
Sleep mode without clock