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DRV8824RHDT

DRV8824RHDT

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    QFN28_EP

  • 描述:

    IC MTR DRV BIPOLAR 8.2-45V 28QFN

  • 数据手册
  • 价格&库存
DRV8824RHDT 数据手册
DRV8824 SLVSA06K – OCTOBER 2009 – REVISED JANUARY 2022 DRV8824 Stepper Motor Controller IC 1 Features 3 Description • The DRV8824 provides an integrated motor driver solution for printers, scanners, and other automated equipment applications. The device has two Hbridge drivers and a microstepping indexer, and is intended to drive a bipolar stepper motor. The output driver block consists of N-channel power MOSFETs configured as full H-bridges to drive the motor windings. The DRV8824 is capable of driving up to 1.6 A of current from each output (with proper heatsinking, at 24 V and 25°C). • • • • • • • • PWM Microstepping Stepper Motor Driver – Built-In Microstepping Indexer – Up to 1/32 Microstepping Multiple Decay Modes: – Mixed Decay – Slow Decay – Fast Decay 8.2-V to 45-V Operating Supply Voltage Range 1.6-A Maximum Drive Current at 24 V and TA = 25°C Simple STEP/DIR Interface Low-Current Sleep Mode Built-In 3.3-V Reference Output Small Package and Footprint Protection Features: – Overcurrent Protection (OCP) – Thermal Shutdown (TSD) – VMx Undervoltage Lockout (UVLO) – Fault Condition Indication Pin (nFAULT) A simple STEP/DIR interface allows easy interfacing to controller circuits. Mode pins allow for configuration of the motor in full-step up to 1/32-step modes. Decay mode is configurable so that slow decay, fast decay, or mixed decay can be used. A low-power sleep mode is provided which shuts down internal circuitry to achieve very-low quiescent current draw. This sleep mode can be set using a dedicated nSLEEP pin. Internal shutdown functions are provided for overcurrent, short circuit, undervoltage lockout, and over temperature. Fault conditions are indicated through the nFAULT pin. 2 Applications Automatic Teller Machines Money Handling Machines Video Security Cameras Printers Scanners Office Automation Machines Gaming Machines Factory Automation Robotics Device Information(1) PART NUMBER DRV8824 (1) PACKAGE BODY SIZE (NOM) HTSSOP (28) 9.70 mm × 6.40 mm VQFN (28) 5.00 mm × 5.00 mm For all available packages, see the orderable addendum at the end of the data sheet. 8.2 to 45 V DRV8824 DIR Step Size M 1.6 A ± Decay Mode Output Current + STEP Controller • • • • • • • • • Stepper Motor Driver + ± nFAULT 1.6 A 1/32 µstep Simplified Schematic STEP Input Microstepping Current Waveform An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DRV8824 www.ti.com SLVSA06K – OCTOBER 2009 – REVISED JANUARY 2022 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................3 6 Specifications.................................................................. 5 6.1 Absolute Maximum Ratings........................................ 5 6.2 ESD Ratings............................................................... 5 6.3 Recommended Operating Conditions.........................5 6.4 Thermal Information....................................................5 6.5 Electrical Characteristics.............................................6 6.6 Timing Requirements.................................................. 7 6.7 Typical Characteristics................................................ 8 7 Detailed Description........................................................9 7.1 Overview..................................................................... 9 7.2 Functional Block Diagram......................................... 10 7.3 Feature Description...................................................11 7.4 Device Functional Modes..........................................17 8 Application and Implementation.................................. 18 8.1 Application Information............................................. 18 8.2 Typical Application.................................................... 18 9 Layout.............................................................................22 9.1 Layout Guidelines..................................................... 22 9.2 Layout Example........................................................ 22 9.3 Thermal Considerations............................................22 9.4 Power Dissipation..................................................... 23 9.5 Heatsinking............................................................... 23 10 Device and Documentation Support..........................24 10.1 Community Resources............................................24 10.2 Trademarks............................................................. 24 11 Mechanical, Packaging, and Orderable Information.................................................................... 24 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision J (July 2014) to Revision K (January 2022) Page • Updated RHD pinout ..........................................................................................................................................3 • Added additional external component to connect to the VCP pin ......................................................................3 • Updated the Handling Ratings table to and ESD Ratings table and moved Tstg to the Absolute Maximum Ratings table.......................................................................................................................................................5 • Corrected device part number ......................................................................................................................... 19 • Added Section 10.1 ......................................................................................................................................... 24 Changes from Revision I (June 2014) to Revision J (July 2014) Page • Updated images on the front page .................................................................................................................... 1 • Update the continuous motor drive output current value in Absolute Maximum Ratings .................................. 5 • Updated typical tDEG time .................................................................................................................................. 6 • Updated text and equations in Section 8.2.2 ................................................................................................... 19 • Updated Section 9.1 and image....................................................................................................................... 21 • Layout Example image updated. ..................................................................................................................... 22 Changes from Revision H (December 2013) to Revision I (June 2014) Page • Updated data sheet to new TI standard: added sections and rearranged material ........................................... 1 • Updated pin description for AVREF and BVREF ............................................................................................... 3 • Added power supply ramp rate to Absolute Maximum Ratings ......................................................................... 5 • Added minimum voltage for VIL and removed typical......................................................................................... 6 • Updated parameter descriptions in Timing Requirements and tWAKE minimum and maximum .........................7 Changes from Revision G (August 2013) to Revision H (December 2013) Page • Changed in Electrical Characteristics table, section DECAY INPUT third row................................................... 6 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: DRV8824 DRV8824 www.ti.com SLVSA06K – OCTOBER 2009 – REVISED JANUARY 2022 5 Pin Configuration and Functions Figure 5-1. PWP Package 28-Pin HTSSOP Top View DECAY DIR nENBL STEP NC MODE0 MODE1 22 23 24 25 26 27 28 MODE2 nHOME GND CP1 CP2 VCP VMA 1 21 2 20 3 19 GND (PPAD) 4 18 5 17 6 16 7 15 nFAULT nSLEEP nRESET V3P3OUT GND BVREF AVREF 14 13 12 11 10 9 8 VMB BOUT1 ISENB BOUT2 AOUT2 ISENA AOUT1 Figure 5-2. RHD Package 28-Pin VQFN Top View Table 5-1. Pin Functions PIN NAME PWP RHD I/O(1) DESCRIPTION EXTERNAL COMPONENTS OR CONNECTIONS POWER AND GROUND GND 14, 28 3, 17 — Device ground VMA 4 7 — Bridge A power supply VMB 11 14 — Bridge B power supply V3P3OUT 15 18 O 3.3-V regulator output CP1 1 4 IO Charge pump flying capacitor CP2 2 5 IO Charge pump flying capacitor Connect to motor supply (8.2 to 45 V). Both pins must be connected to same supply, bypassed with a 0.1-µF capacitor to GND, and connected to appropriate bulk capacitance. Bypass to GND with a 0.47-μF 6.3-V ceramic capacitor. Can be used to supply VREF. Connect a 0.01-μF 50-V capacitor between CP1 and CP2. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: DRV8824 3 DRV8824 www.ti.com SLVSA06K – OCTOBER 2009 – REVISED JANUARY 2022 Table 5-1. Pin Functions (continued) PIN NAME I/O(1) DESCRIPTION EXTERNAL COMPONENTS OR CONNECTIONS PWP RHD 3 6 IO nENBL 21 24 I Enable input Logic high to disable device outputs and indexer operation, logic low to enable. Internal pulldown. nSLEEP 17 20 I Sleep mode input Logic high to enable device, logic low to enter low-power sleep mode. Internal pulldown. STEP 22 25 I Step input Rising edge causes the indexer to move one step. Internal pulldown. DIR 20 23 I Direction input Level sets the direction of stepping. Internal pulldown. MODE0 24 27 I Microstep mode 0 MODE1 25 28 I Microstep mode 1 MODE2 26 1 I Microstep mode 2 DECAY 19 22 I Decay mode Low = slow decay, Open = mixed decay, High = fast decay. Internal pulldown and pullup. nRESET 16 19 I Reset input Active-low reset input initializes the indexer logic and disables the H-bridge outputs. Internal pulldown. AVREF 12 15 I Bridge A current set reference input BVREF 13 16 I Bridge B current set reference input NC 23 26 — No connect Leave this pin unconnected. nHOME 27 2 OD Home position Logic low when at home state of step table nFAULT 18 21 OD Fault Logic low when in fault condition (overtemperature, overcurrent) VCP Connect a 0.1-μF 16-V ceramic capacitor. A 1-MΩ resistor High-side gate drive voltage can be connected to VM to accelerate discharge of the VCP capacitor. CONTROL MODE0 through MODE2 set the step mode: full, 1/2, 1/4, 1/8/ 1/16, or 1/32 step. Internal pulldown. Reference voltage for winding current set. Normally AVREF and BVREF are connected to the same voltage. Can be connected to V3P3OUT. STATUS OUTPUT ISENA 6 9 IO Bridge A ground / Isense Connect to current sense resistor for bridge A. ISENB 9 12 IO Bridge B ground / Isense Connect to current sense resistor for bridge B. AOUT1 5 8 O Bridge A output 1 AOUT2 7 10 O Bridge A output 2 Connect to bipolar stepper motor winding A. Positive current is AOUT1 → AOUT2 BOUT1 10 13 O Bridge B output 1 BOUT2 8 11 O Bridge B output 2 (1) 4 Connect to bipolar stepper motor winding B. Positive current is BOUT1 → BOUT2 Directions: I = input, O = output, OD = open-drain output, IO = input/output Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: DRV8824 DRV8824 www.ti.com SLVSA06K – OCTOBER 2009 – REVISED JANUARY 2022 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature (unless otherwise noted) (1) (2) V(VMx) Power supply voltage V(VMx) Power supply ramp rate V(xVREF) MIN MAX UNIT –0.3 47 V 1 V/µs 7 V Digital pin voltage –0.5 Input voltage –0.3 4 V ISENSEx pin voltage(4) –0.8 0.8 V Peak motor drive output current, t
DRV8824RHDT 价格&库存

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