DS90C402M

DS90C402 www.ti.com SNLS001C – JUNE 1998 – REVISED APRIL 2013 DS90C402 Dual Low Voltage Differential Signaling (LVDS) Receiver Check for Samples: DS90C402 FEATURES DESCRIPTION • • • • • • The DS90C402 is a dual receiver device optimized for high data rate and low power applications. This device along with the DS90C401 provides a pair chip solution for a dual high speed point-to-point interface. The device is in a PCB space saving 8 lead small outline package. The receiver offers ±100 mV threshold sensitivity, in addition to common-mode noise protection. 1 2 Ultra Low Power Dissipation Operates above 155.5 Mbps Standard TIA/EIA-644 8 Lead SOIC Package saves PCB space VCM ±1V center around 1.2V ±100 mV Receiver Sensitivity Connection Diagram See Package Number D (SOIC) Functional Diagram These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2013, Texas Instruments Incorporated DS90C402 SNLS001C – JUNE 1998 – REVISED APRIL 2013 www.ti.com Absolute Maximum Ratings (1) (2) −0.3V to +6V Supply Voltage (VCC) −0.3V to (VCC + 0.3V) Input Voltage (RIN+, RIN−) −0.3V to (VCC + 0.3V) Output Voltage (ROUT) D Package Maximum Package Power Dissipation @ +25°C 1025 mW Derate D Package 8.2 mW/°C above +25°C −65°C to +150°C Storage Temperature Range Lead Temperature Range Soldering (4 sec.) +260°C Maximum Junction Temperature +150°C ESD Rating (3) ≥ 3,500V (HBM, 1.5 kΩ, 100 pF) (EIAJ, 0 Ω, 200 pF) (1) (2) (3) ≥ 250V “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that the devices should be operated at these limits. Electrical Characteristics specifies conditions of device operation. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. ESD Rating: HBM (1.5 kΩ, 100 pF) ≥ 3,500V EIAJ (0Ω, 200 pF) ≥ 250V Recommended Operating Conditions Min Typ Max Units Supply Voltage (VCC) +4.5 +5.0 +5.5 V Receiver Input Voltage GND 2.4 V Operating Free Air Temperature (TA) −40 +85 °C +25 Electrical Characteristics Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (1) (2) Symbol Parameter VTH Differential Input High Threshold VTL Differential Input Low Threshold IIN Input Current Conditions VCM = + 1.2V VIN = +2.4V Pin Min RIN+, RIN− −100 VCC = 5.5V VIN = 0V VOH Output High Voltage IOH = −0.4 mA, VID = +200 mV ROUT Typ Max Units +100 mV mV −10 ±1 +10 μA −10 ±1 +10 µA 3.8 4.9 V IOH = −0.4mA, Inputs terminated 3.8 4.9 V IOH = −0.4mA, Inputs Open 3.8 4.9 V IOH = −0.4mA, Inputs Shorted 4.9 VOL Output Low Voltage IOL = 2 mA, VID = −200 mV 0.07 0.3 V IOS Output Short Circuit Current VOUT = 0V (3) −60 −100 mA ICC No Load Supply Current Inputs Open 3.5 10 mA (1) (2) (3) 2 −15 VCC V Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise specified. All typicals are given for: VCC = +5.0V, TA = +25°C. Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. Only one output should be shorted at a time, do not exceed maximum junction temperature specification. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS90C402 DS90C402 www.ti.com SNLS001C – JUNE 1998 – REVISED APRIL 2013 Switching Characteristics VCC = +5.0V ± 10%, TA = −40°C to +85°C (1) (2) (3) (4) (5) Symbol Parameter Conditions CL = 5 pF, VID = 200 mV (Figure 1 and Figure 2) Min Typ Max Units 1.0 3.40 6.0 ns 1.0 3.48 6.0 ns tPHLD Differential Propagation Delay High to Low tPLHD Differential Propagation Delay Low to High tSKD Differential Skew |tPHLD − tPLHD| 0 0.08 1.2 ns tSK1 Channel-to-Channel Skew (3) 0 0.6 1.5 ns (4) tSK2 Chip to Chip Skew 5.0 ns tTLH Rise Time 0.5 2.5 ns tTHL Fall Time 0.5 2.5 ns (1) (2) (3) (4) (5) All typicals are given for: VCC = +5.0V, TA = +25°C. Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr and tf (0%–100%) ≤ 1 ns for RIN. Channel-to-Channel Skew is defined as the difference between the propagation delay of one channel and that of the others on the same chip with an event on the inputs. Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays. CL includes probe and jig capacitance. Parameter Measurement Information Figure 1. Receiver Propagation Delay and Transition Time Test Circuit Figure 2. Receiver Propagation Delay and Transition Time Waveforms Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS90C402 3 DS90C402 SNLS001C – JUNE 1998 – REVISED APRIL 2013 www.ti.com TYPICAL APPLICATION Figure 3. Point-to-Point Application Applications Information LVDS drivers and receivers are intended to be primarily used in an uncomplicated point-to-point configuration as is shown in Figure 3. This configuration provides a clean signaling environment for the quick edge rates of the drivers. The receiver is connected to the driver through a balanced media which may be a standard twisted pair cable, a parallel pair cable, or simply PCB traces. Typically the characteristic impedance of the media is in the range of 100Ω. A termination resistor of 100Ω should be selected to match the media, and is located as close to the receiver input pins as possible. The termination resistor converts the current sourced by the driver into a voltage that is detected by the receiver. Other configurations are possible such as a multi-receiver configuration, but the effects of a mid-stream connector(s), cable stub(s), and other impedance discontinuities as well as ground shifting, noise margin limits, and total termination loading must be taken into account. The DS90C402 differential line receiver is capable of detecting signals as low as 100 mV, over a ±1V commonmode range centered around +1.2V. This is related to the driver offset voltage which is typically +1.2V. The driven signal is centered around this voltage and may shift ±1V around this center point. The ±1V shifting may be the result of a ground potential difference between the driver's ground reference and the receiver's ground reference, the common-mode effects of coupled noise, or a combination of the two. Both receiver input pins should honor their specified operating input voltage range of 0V to +2.4V (measured from each pin to ground), exceeding these limits may turn on the ESD protection circuitry which will clamp the bus voltages. Fail-Safe Feature: The LVDS receiver is a high gain, high speed device that amplifies a small differential signal (20mV) to CMOS logic levels. Due to the high gain and tight threshold of the receiver, care should be taken to prevent noise from appearing as a valid signal. The receiver's internal fail-safe circuitry is designed to source/sink a small amount of current, providing fail-safe protection (a stable known state HIGH output voltage) for floating, terminated or shorted receiver inputs. 1. Open Input Pins. The DS90C402 is a dual receiver device, and if an application requires only one receiver, the unused channel(s) inputs should be left OPEN. Do not tie unused receiver inputs to ground or any other voltages. The input is biased by internal high value pull up and pull down resistors to set the output to a HIGH state. This internal circuitry will ensure a HIGH, stable output state for open inputs. 2. Terminated Input. If the driver is disconnected (cable unplugged), or if the driver is in a power-off condition, the receiver output will again be in a HIGH state, even with the end of cable 100Ω termination resistor across the input pins. The unplugged cable can become a floating antenna which can pick up noise. If the cable picks up more than 10mV of differential noise, the receiver may see the noise as a valid signal and switch. To insure that any noise is seen as common-mode and not differential, a balanced interconnect should be used. Twisted pair cable will offer better balance than flat ribbon cable 3. Shorted Inputs. If a fault condition occurs that shorts the receiver inputs together, thus resulting in a 0V differential input voltage, the receiver output will remain in a HIGH state. Shorted input fail-safe is not supported across the common-mode range of the device (GND to 2.4V). It is only supported with inputs shorted and no external common-mode voltage applied. 4 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS90C402 DS90C402 www.ti.com SNLS001C – JUNE 1998 – REVISED APRIL 2013 PIN DESCRIPTIONS Pin No. Name Description 2, 6 ROUT Receiver output pin 3, 7 RIN+ Positive receiver input pin 4, 8 RIN- Negative receiver input pin 5 GND Ground pin 1 VCC Positive power supply pin, +5V ± 10% Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS90C402 5 DS90C402 SNLS001C – JUNE 1998 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics 6 Output High Voltage vs Power Supply Voltage Output High Voltage vs Ambient Temperature Figure 4. Figure 5. Output Low Voltage vs Power Supply Voltage Output Low Voltage vs Ambient Temperature Figure 6. Figure 7. Output Short Circuit Current vs Power Supply Voltage Output Short Circuit Current vs Ambient Temperature Figure 8. Figure 9. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS90C402 DS90C402 www.ti.com SNLS001C – JUNE 1998 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Differential Propagation Delay vs Power Supply Voltage Differential Propagation Delay vs Ambient Temperature Figure 10. Figure 11. Differential Skew vs Power Supply Voltage Differential Skew vs Ambient Temperature Figure 12. Figure 13. Transition Time vs Power Supply Voltage Transition Time vs Ambient Temperature Figure 14. Figure 15. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS90C402 7 DS90C402 SNLS001C – JUNE 1998 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision B (April 2013) to Revision C • 8 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 7 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS90C402 PACKAGE OPTION ADDENDUM www.ti.com 30-Sep-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) DS90C402M NRND SOIC D 8 95 Non-RoHS & Green Call TI Level-1-235C-UNLIM -40 to 85 DS90C 402M DS90C402M/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DS90C 402M DS90C402MX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DS90C 402M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of