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FDC1004QEVM

FDC1004QEVM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    EVALMODCAP-DGTLCONVFDC1004

  • 数据手册
  • 价格&库存
FDC1004QEVM 数据手册
FDC1004QEVM User Guide User's Guide Literature Number: SNAU178 April 2015 Contents 1 2 Introduction ......................................................................................................................... 4 Setup .................................................................................................................................. 4 2.1 FDC1004QEVM .......................................................................................................... 4 2.2 Input/Output Connector Description ................................................................................... 5 ................................................................................................................. 6 ................................................................................................................. 6 2.5 Operation .................................................................................................................. 6 3 Board Layout ....................................................................................................................... 6 4 Schematic ........................................................................................................................... 8 Revision History .......................................................................................................................... 10 2 2.3 HW Setup 2.4 SW Setup Table of Contents SNAU178 – April 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated www.ti.com List of Figures 1 FDC1004QEVM : Sections ................................................................................................. 5 2 Top Layer Routing ........................................................................................................... 6 3 Bottom Layer Routing ....................................................................................................... 7 4 FDC1004QEVM Schematic ................................................................................................ 8 List of Tables 1 Ordering ....................................................................................................................... 4 2 J1, J2 Pin Out ................................................................................................................ 5 3 J4 Pin Out..................................................................................................................... 5 4 J5 Pin Out..................................................................................................................... 6 5 Bill of Materials ............................................................................................................... 9 SNAU178 – April 2015 Submit Documentation Feedback List of Figures Copyright © 2015, Texas Instruments Incorporated 3 User's Guide SNAU178 – April 2015 FDC1004QEVM User's Guide 1 Introduction The FDC1004QEVM evaluation kit is a plug and play system to test and evaluate the FDC1004Q, AECQ100 qualified, 4-channel capacitive to digital converter. The EVM is a breakable PCB which consists of 3 sections. The first section is a USB to I2C converter based on MSP430F5528 micro-controller, the second section contains the FDC1004Q and the third section is a touchless sensor (to demonstrate the sensitivity of the FDC1004Q) . The third section can be removed and replace with customized sensors to evaluate the capabilities of the FDC1004Q in various applications. The FDC1004QEVM can be used with the FDC1004EVM GUI. The software is able to configure the FDC1004Q’s registers, display on four graphs (one for each measurement) the capacitive values and export data in CSV format. The EVM contains one FDC1004Q (See Table 1). Table 1. Ordering 2 DEVICE IC Package U1 FDC1004QDGS VSSOP 10pin Setup This section provides a general description about FDC1004QEVM, its I/O connectors and how to properly setup the evaluation module. 2.1 FDC1004QEVM The FDC1004QEVM is divided in three sections: 1. USB to I2C section: this has the purpose to interface the communication of FDC1004Q to a USB port. 2. FDC1004Q section: this section embeds FDC1004Q capacitive to digital converter. 3. Sensor section: this section contains a capacitive sensor that can be used for human proximity. The EVM has precut lines on the borders of each section that allow for a flexible and specific system design. As an example of the flexibility of this design, the sensor can be replaced with a customer sensor, or the MCU section can be separated to allow for a remote placement of the FDC1004Q. 4 FDC1004QEVM User's Guide SNAU178 – April 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Setup www.ti.com USB to I2C FDC1004 SENSOR Figure 1. FDC1004QEVM : Sections 2.2 Input/Output Connector Description J1, J2: 4x1 Header: the I/O ports of sections between the USB to I2C and the FDC1004Q sections. This provides the I2C communication channel and the power connections between these two sections should the EVM be separated into sections. A simple 4 wire cable can be used to interface the sections. Table 2. J1, J2 Pin Out Pin Pin Description J1.1 J2.1 GND J1.2 J2.2 VDD J1.3 J2.3 SCL J1.4 J2.4 SDA J3: USB interface to connect the EVM to a PC; it also provides power to the EVM. J4: 10x1 Headers. This is not populated by default. It provides an easy method to change sensors or to remotely place the sensor away from the FDC1004Q. This connector with its counterpart, J5, allows the communication of the two modules through a 10-wire cable. Table 3. J4 Pin Out Pin Description J4.1 GND J4.2 SHLD1 J4.3 CIN1 J4.4 CIN2 J4.5 SHLD1 J4.6 SHLD2 J4.7 CIN3 J4.8 CIN4 J4.9 SHLD2 J4.10 GND J5: 10x1 Header, for the electrical connection between the FDC1004 and the sensor section. SNAU178 – April 2015 Submit Documentation Feedback FDC1004QEVM User's Guide Copyright © 2015, Texas Instruments Incorporated 5 Setup www.ti.com Table 4. J5 Pin Out Pin Description J5.1 Not Connected J5.2 SHLD1 J5.3 CIN1 J5.4 Not Connected J5.5 SHLD1 J5.6 Not Connected J5.7 Not Connected J5.8 Not Connected J5.9 Not Connected J5.10 Not Connected 2.3 HW Setup The power supply of FDC1004Q is provided by the LDO (U4), which is sourced from the USB 5.0V. The I2C communication with FDC1004Q is fully managed by the MSP430F5528IRGC microcontroller (U3). The FDC1004Q has a fixed I2C address. 2.4 SW Setup Ensure that the FDC1004QEVM GUI and the drivers have been installed on the host computer. Plug the EVM into an available USB port on the host. 2.5 Operation Plug the EVM into the host computer. The host computer should automatically detect the device as an EVM. Launch the GUI and configure the desired data acquisition mode for FDC1004Q. Then, it should automatically start measuring on the configured sensors. 3 Board Layout Figure 2 and Figure 3 show the board layout of the FDC1004QEVM. Sensor layout has been designed to demonstrate human proximity sensing with a single sensor. A shield layer below the sensor and a shield ring around the sensor is designed to significantly reduce parasitic capacitance interference from directions not intended to sense the target. The intended sensing area for this EVM is towards the top side of the sensor. For more information about shielding, refer to the application note Capacitive Sensing: The Ins and Outs of Active Shielding (SNOA926). Figure 2. Top Layer Routing 6 FDC1004QEVM User's Guide SNAU178 – April 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Board Layout www.ti.com Figure 3. Bottom Layer Routing SNAU178 – April 2015 Submit Documentation Feedback FDC1004QEVM User's Guide Copyright © 2015, Texas Instruments Incorporated 7 FID3 FDC1004QEVM User's Guide Copyright © 2015, Texas Instruments Incorporated COFF 100pF GND GND GND 5 4 CIN4 3 CIN2 CIN3 8 CIN1 C10 220pF GND GND GND SHLD2 SHLD1 7 6 1 9 10 GND VDD SCL SDA GND C11 1300pF VBUS VUSB VDD 11 15 40 53 54 55 17 51 50 52 9 10 57 58 12 13 34 35 36 37 38 AVCC1 DVCC1 DVCC2 VBUS VUSB V18 VCORE PUR PU.0/DP PU.1/DM P5.0/A8/VREF+/VEREF+ P5.1/A9/VREF-/VEREFP5.2/XT2IN P5.3/XT2OUT P5.4/XIN P5.5/XOUT P3.0/UCB0SIMO/UCB0SDA P3.1/UCB0SOMI/UCB0SCL P3.2/UCB0CLK/UCA0STE P3.3/UCA0TXD/UCA0SIMO P3.4/UCA0RXD/UCA0SOMI GND GND CS2 51pF SDA CS1 GND 51pF VDD TSW-104-07-G-S J2 R10 4.99k SCL 1 2 3 4 MSP430F5528IRGC SHLD1 SHLD2 R11 4.99k GND C19 1300pF 1.0k R6 PUR DP DM 1.0k R7 SCL SDA C6 1300pF C17 0.47µF FDC1004QDGS CIN4 CIN3 CIN2 CIN1 VDD U1 C8 18pF GND 1 3 TSW-104-07-G-S 2 C1 0.1µF G G 24.000MHz GND J1 2 4 C20 1µF 1 2 3 4 C9 18pF GND Super Red D2 Y1 Texas Instruments PCB LOGO VDD GND VDD SCL SDA GND 1 2 GND Green D1 Texas Instruments PCB LOGO FID2 1 2 GND GND 10 9 CIN4 8 CIN3 7 SHLD2 6 SHLD1 5 CIN2 4 CIN1 3 SHLD1 2 1 SHLD2 J4 QFN PAD VSSU AVSS1 AVSS2 DVSS1 DVSS2 RST/NMI/SBWTDIO TEST/SBWTCK PJ.0/TDO PJ.1/TDI/TCLK PJ.2/TMS PJ.3/TCK P6.0/CB0/A0 P6.1/CB1/A1 P6.2/CB2/A2 P6.3/CB3/A3 P6.4/CB4/A4 P6.5/CB5/A5 P6.6/CB6/A6 P6.7/CB7/A7 P4.0/PM_UCB1STE/PM_UCA1CLK P4.1/PM_UCB1SIMO/PM_UCB1SDA P4.2/PM_UCB1SOMI/PM_UCB1SCL P4.3/PM_UCB1CLK/PM_UCA1STE P4.4/PM_UCA1TXD/PM_UCA1SIMO P4.5/PM_UCA1RXD/PM_UCA1SOMI P4.6/PM_NONE P4.7/PM_NONE P2.0/TA1.1 P2.1/TA1.2 P2.2/TA2CLK/SMCLK P2.3/TA2.0 P2.4/TA2.1 P2.5/TA2.2 P2.6/RTCCLK/DMAE0 P2.7/UCB0STE/UCA0CLK 65 49 14 56 16 39 64 59 60 61 62 63 1 2 3 4 5 6 7 8 J5 GND C7 2200pF R5 33k SBWTDIO VDD SBWTCK 10 9 8 7 6 SHLD1 5 4 CIN1 3 SHLD1 2 1 GND 41 42 SDA 43 SCL 44 45 46 47 48 26 27 28 29 30 31 32 33 CIN1 SHLD1 J3 PROXIMITY SENSOR GND 48037-2200 5 6 GND 1 GND U2 C3 3 1300pF GND C2 10µF GND VLS201610ET-100M L1 D21 5.6V MMSZ5232B-7-F VBUS GND 2 P1.0/TA0CLK/ACLK P1.1/TA0.0 P1.2/TA0.1 P1.3/TA0.2 P1.4/TA0.3 P1.5/TA0.4 P1.6/TA1CLK/CBOUT P1.7/TA1.0 3 FID1 4 U3 6 18 19 20 21 22 23 24 25 5 VCC IO1 1 IO4 IO2 4 IO3 GND 2 8 3 GND ON/OFF IN VBUS C5 1300pF GND CBYP OUT R8 33 DM C4 0.01µF GND R9 33 4 5 LP2985AIM5-3.3/NOPB U4 GND R20 33k R40 33k GND C15 2.2µF VDD DP PUR 4 2 PCB Number: SV601125 PCB Rev: A Schematic www.ti.com Schematic Figure 4. FDC1004QEVM Schematic SNAU178 – April 2015 Submit Documentation Feedback 1 Schematic www.ti.com Table 5. Bill of Materials Qty Designator Description Footprint Manufacturer Part Number 1 C1 CAP, CERM, 0.1uF, 6.3V, +/-10%, X5R, 0402 402 C1005X5R0J104K050BA 1 C2 CAP CER 10UF 10V 10% X5R 0603 603 C1608X5R1A106K080AC 4 C3, C5, C11, C19 CAP CER 0.1UF 16V 5% X7R 0402 402 0402YC132KAT2A 1 C4 CAP, CERM, 0.01uF, 25V, +/-5%, C0G/NP0, 0603 603 C1608C0G1E103J080AA 1 C6 CAP CER 220PF 50V 1% NP0 0402 402 0402YC132KAT2A 1 C7 CAP, CERM, 2200pF, 50V, +/-10%, X7R, 0603 603 C0603X222K5RACTU 2 C8, C9 CAP CER 18PF 100V 5% NP0 0603 603 GRM1885C2A300JA01D 1 C10 CAP, CERM, 220pF, 50V, +/-1%, C0G/NP0, 0603 603 06035A221FAT2A 1 C15 CAP, CERM, 2.2uF, 10V, +/-10%, X5R, 0603 603 C0603C225K8PACTU 1 C17 CAP, CERM, 0.47uF, 10V, +/-10%, X7R, 0603 603 C0603C474K8RACTU 1 C20 CAP, CERM, 1uF, 6.3V, +/-20%, X5R, 0402 402 C1005X5R0J105M050BB 0 COFF CAP, CERM, 100pF, 50V, +/-5%, C0G/NP0, 0402 402 GRM1535C1H101JDD5D 0 CS1, CS2 CAP, CERM, 51pF, 50V, +/-5%, C0G/NP0, 0402 402 GRM1555C1H510JA01D 1 D1 LED SMARTLED GREEN 570NM 0603 603 LG L29K-G2J1-24-Z 1 D2 LED 660NM SUPER RED DIFF 0603SMD 603 SML-LX0603SRW-TR 1 D21 Diode, Zener, 5.6V, 500mW, SOD-123 SOD-123 MMSZ5232B-7-F 0 J1, J2 Header, TH, 100mil, 4x1, Gold plated, 230 mil above insulator TSW-104-07-G-S TSW-104-07-G-S 1 J3 Connector, USB Type A, 4POS R/A, SMD CONN_USB_04803722 00 480372200 0 J4 Receptacle, 50mil 10x1, R/A, TH CONN_851-43-010-20001000 851-43-010-20-001000 0 J5 Header, 50mil, 10x1, R/A, TH CONN_850-80-010-20001101 850-80-010-20-001101 1 L1 INDUCTOR POWER 10UH .45A SMD VLS201610E VLS201610ET-100M 1 R5 RES, 33k ohm, 5%, 0.063W, 0402 402 CRCW040233K0JNED 2 R6, R7 RES 1K OHM 1/10W 5% 0402 SMD 402 CRCW040233R0JNED 2 R8, R9 RES, 33 ohm, 5%, 0.063W, 0402 402 CRCW040233R0JNED 2 R10, R11 RES, 4.99k ohm, 1%, 0.063W, 0402 402 CRCW04024K99FKED 1 R20 RES,1M ohm, 5%, 0.063W, 0402 402 RC0402JR-071ML 1 R40 RES 1.5K OHM 1/16W 5% 0402 SMD 402 CRCW04021K50JNED 1 U1 Q Grade 4-Channel Capacitance-to-Digital Converter for Capacitive Sensing Solutions, DGS0010A DGS0010A FDC1004QDGS 1 U2 4-CHANNEL ESD-PROTECTION ARRAY FOR HIGH-SPEED DATA INTERFACES, DRY006A DRY0006A TPD4E004DRY 1 U3 Mixed Signal MicroController, RGC0064B RGC0064B MSP430F5528IRGCT 1 U4 Micropower 150 mA Low-Noise Ultra Low-Dropout Regulator, 5-pin SOT-23, Pb-Free MF05A_N LP2985AIM5-3.3/NOPB 1 Y1 CRYSTAL 24.000MHZ 18PF SMD ABMM ABMM-24.000MHZ-B2-T SNAU178 – April 2015 Submit Documentation Feedback FDC1004QEVM User's Guide Copyright © 2015, Texas Instruments Incorporated 9 Revision History www.ti.com Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 10 DATE REVISION NOTES April 2015 * Initial release. Revision History SNAU178 – April 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM. 2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. SPACER SPACER SPACER SPACER SPACER 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. SPACER SPACER SPACER SPACER SPACER SPACER SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated spacer IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated
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