LM2611AMF

Sample & Buy Product Folder Support & Community Tools & Software Technical Documents LM2611 SNOS965J – JUNE 2001 – REVISED DECEMBER 2015 LM2611 1.4-MHz Cuk Converter 1 Features 3 Description • • • • • • • • • The LM2611 is a current mode, PWM inverting switching regulator. Operating from a 2.7-V to 4-V supply, it is capable of producing a regulated negative output voltage of up to −(36 VIN(MAX)). The LM2611 utilizes an input and output inductor, which enables low voltage ripple and RMS current on both the input and the output. With a switching frequency of 1.4 MHz, the inductors and output capacitor can be physically small and low cost. High efficiency is achieved through the use of a low RDS(ON) FET. 1 1.4-MHz Switching Frequency Low RDS(ON) DMOS FET 1-mVp-p Output Ripple −5 V at 300 mA From 5-V Input Better Regulation Than a Charge Pump Uses Tiny Capacitors and Inductors Wide Input Range: 2.7 V to 14 V Low Shutdown Current: 0.5) and high load currents. The duty cycle begins to increase beyond 50% as the input voltage drops below the absolute magnitude of the output voltage. RFB3 and CFF2 are added to the feedback network to introduce a low frequency lag compensation (pole-zero pair) necessary to stabilize the circuit under the combination of high duty cycle and high load currents. 9 Power Supply Recommendations The power supply must never exceed the absolute maximum rating of the device given in Absolute Maximum Ratings. If the regulator is connected to the input supply through long wires or PCB traces, special care is required to achieve good performance. The parasitic inductance and resistance of the input cables can have an adverse effect on the operation of the regulator. The parasitic inductance, in combination with the low ESR ceramic input capacitors, can form an under-damped resonant circuit. This circuit may cause overvoltage transients at the VIN pin, each time the input supply is cycled on and off. Submit Documentation Feedback Copyright © 2001–2015, Texas Instruments Incorporated Product Folder Links: LM2611 19 LM2611 SNOS965J – JUNE 2001 – REVISED DECEMBER 2015 www.ti.com 10 Layout 10.1 Layout Guidelines • • • • • • Connection between L1 and SW pin should be kept as short as possible to minimize inductance Connection between CCUK and SW should also be kept short The feedback resistor should be placed close to the NFB pin to minimize the path of the higher impedance feedback node The feedback trace leading from Vout to the output to the feedback resistors should not pass under the switch node between L1 and CCUK and the switch node between CCUK, L2 and D The feedback trace leading from Vout to the output to the feedback resistors should not pass under the inductors L1 and L2 A bypass capacitor CBYP of 0.1 µF should be placed close to VIN and GND pin 10.2 Layout Example Figure 36. Example Layout Top Figure 37. Example Layout Bottom 20 Submit Documentation Feedback Copyright © 2001–2015, Texas Instruments Incorporated Product Folder Links: LM2611 LM2611 www.ti.com SNOS965J – JUNE 2001 – REVISED DECEMBER 2015 11 Device and Documentation Support 11.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.2 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2001–2015, Texas Instruments Incorporated Product Folder Links: LM2611 21 PACKAGE OPTION ADDENDUM www.ti.com 6-Aug-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) LM2611AMF NRND SOT-23 DBV 5 1000 Non-RoHS & Green Call TI Level-1-260C-UNLIM -40 to 125 S40A LM2611AMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 S40A Samples LM2611AMFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 S40A Samples LM2611BMF/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 S40B Samples LM2611BMFX/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 S40B Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of