LM2791LD-L

Not Recommended For New Designs LM2791 www.ti.com SNVS156M – FEBRUARY 2001 – REVISED MAY 2013 LM2791 Current Regulated Switched Capacitor LED Driver with Analog Brightness Control Check for Samples: LM2791 FEATURES DESCRIPTION • • • • • • • • • • • • The LM2791 is a CMOS charge-pump voltage doubler and regulator that provides two regulated current sources. The LM2791 is designed to drive two white (or blue) LEDs with matched currents (within ± 0.3%) to produce balanced light sources for display backlights. They accept an input voltage range from 3V to 5.8V and maintain a constant current determined by an external set resistor. 1 2 • Output Matching of ± 0.3% Drives up to Two LEDs 3V to 5.8V Input Voltage Up to 36mA Output Current Soft Start Limits Inrush Current Analog Brightness Control Separate Shutdown Input Very Small Solution Size - No Inductor 0.7mA Typical Operating Current 1µA (max.) Shutdown Current 450kHz Switching Frequency (min.) Linear Regulation Generates Predictable Noise Spectrum WSON-10 Package: 3mm X 3mm X 0.8mm APPLICATIONS • • • • White LED Display Backlights White LED Keypad Backlights 1-Cell Li-Ion Battery-Operated Equipment Including PDAs, Hand-Held PCs, Cellular Phones Flat Panel Displays The LM2791 delivers up to 36mA of load current to accommodate two high forward voltage (typically white) LEDs. The switching frequency is 450kHz (min.) to keep the conducted noise spectrum away from sensitive frequencies within portable RF devices. In the LM2791, brightness is controlled by applying a voltage between GND and 3.0V to the BRGT pin. The LM2791 is available in active high or low shutdown versions. The shutdown pin reduces the operating current to 1µA (max.). The LM2791 is available in a 10 pin WSON CSP package. Basic Application Circuit 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2001–2013, Texas Instruments Incorporated Not Recommended For New Designs LM2791 SNVS156M – FEBRUARY 2001 – REVISED MAY 2013 www.ti.com Connection Diagram Figure 1. Top View 10-Lead WSON PIN DESCRIPTIONS Pin Name 1 BRGT Variable voltage input controls output current. Function 2 POUT Charge pump output. 3 C1− Connect this pin to the negative terminal of C1. 4 C1+ Connect this pin to the positive terminal of C1. 5 D2 Current source outputs. Connect directly to LED. 6 D1 7 GND Power supply ground input. Current source outputs. Connect directly to LED. 8 VIN Power supply voltage input. 9 SD/SD 10 ISET Shutdown input. Device operation is inhibited when pin is asserted. Current Sense Input. Connect resistor to ground to set constant current through LED. Block Diagram These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LM2791 Not Recommended For New Designs www.ti.com LM2791 SNVS156M – FEBRUARY 2001 – REVISED MAY 2013 Absolute Maximum Ratings (1) −0.3 to 6V VIN BRGT, SD -0.3 to (VIN +0.2V) Power Dissipation (2) 400 mW TJMAX (2) θJA 150°C (3) 55°C/W −65°C to +100°C Storge Temperature Lead Temp. (Soldering, 5 sec.) 260°C ESD Rating Human Body Model 2KV Machine Model (1) (2) (3) 200V Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device beyond its rated operating conditions. D1 and D2 may be shorted to GND without damage. POUT may be shorted to GND for 1sec without damage. For more information regarding the WSON package, please refer to Application note AN-1187. (SNOA401) Operating Conditions Input Voltage (VIN) 3.0V to 5.8V BRGT 0 to 3.0V Ambient Temperature (TA) −30°C to +85°C Junction Temperature (TJ) −30°C to +100°C Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LM2791 3 Not Recommended For New Designs LM2791 SNVS156M – FEBRUARY 2001 – REVISED MAY 2013 www.ti.com Electrical Characteristics (1) Limits in standard typeface are for TJ = 25°C and limits in boldface type apply over the full Operating Temperature Range. Unless otherwise specified, C1 = CIN = CHOLD = 1 µF, VIN = 3.6V, VDIODE = 3.6V, RSET = 332Ω, BRGT pin = 0V. Symbol IDX IDx Parameter Conditions Diode Current at ID1,2 VIN= 3V, RSET = 270Ω Available Current at Output Dx VIN= 3V Load Regulation at Output Dx Min Typ 16.5 18 Max Units mA 14.5 VIN= 3.3V 12.8 15.1 17.7 VIN= 3.6V 13.3 15.7 18.4 VIN = 4.4V 16.8 VIN =3.6V VDX=3.0V VDX=4.0V 16 15.4 mA IDX Line Regulation of Dx Output Current 3.3V ≤ VIN ≤ 4.4V VDX = 3.6V 15.7 mA ID-MATCH Current Matching Between Any Two Outputs 3.0V ≤ VIN ≤ 4.4V VD1, VD2 = 3.6V 0.3 % IQ Quiescent Supply Current 3.0V ≤ VIN ≤ 4.4V, Active, No Load Current 0.7 2 mA ISD Shutdown Supply Current 3.0V ≤ VIN ≤ 5.5V, Shutdown at 85°C 0.1 0.3 1 µA VIH SD Input Logic High 3.0V ≤ VIN ≤ 5.5V, (2) (2) VIL SD Input Logic Low 3.0V ≤ VIN ≤ 5.5V, ILEAK-SD SD Input Leakage Current 0V ≤ VSD ≤ VIN 0.8VIN V 0.2VIN 0.1 V µA RBRGT BRGT Input Resistance 250 kΩ ISET ISET Pin Output Current IDx/25 mA fSW Switching Frequency tSTART (1) (2) (3) (4) 4 Startup Time (3) (4) 3.0V ≤ VIN ≤ 4.4V IDx = 90% steady state 450 650 10 850 kHz µs In the test circuit, all capacitors are 1.0µF, 0.3Ω maximum ESR capacitors. Capacitors with higher ESR will increase output resistance, reduce output voltage and efficiency. The internal thresholds of the shutdown bar are set at about 40% of VIN. The output switches operate at one half of the oscillator frequency, fOSC = 2fSW. Specified by design.Not productin tested. Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LM2791 Not Recommended For New Designs www.ti.com LM2791 SNVS156M – FEBRUARY 2001 – REVISED MAY 2013 Typical Performance Characteristics Unless otherwise specified, C1 = CIN, CHOLD= 1uF, VIN= 3.6V, VDIODE = 3.6V, BRGT pin =0V, RSET = 330Ω Supply Current at No Load Supply Current vs Supply Voltage Figure 2. Figure 3. SD-Threshold IDIODE vs VDIODE Figure 4. Figure 5. Diode Current vs. Temperature IDIODE vs RSet Figure 6. Figure 7. Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LM2791 5 Not Recommended For New Designs LM2791 SNVS156M – FEBRUARY 2001 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, C1 = CIN, CHOLD= 1uF, VIN= 3.6V, VDIODE = 3.6V, BRGT pin =0V, RSET = 330Ω 6 IDIODE vs BRGT VSET vs BRGT Figure 8. Figure 9. Switching Frequency vs Supply Voltage Switching Frequency vs. Temperature Figure 10. Figure 11. Start Up Time @ 3.0VIN Start Up Time @ 3.6VIN Figure 12. Figure 13. Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LM2791 Not Recommended For New Designs www.ti.com LM2791 SNVS156M – FEBRUARY 2001 – REVISED MAY 2013 Typical Performance Characteristics (continued) Unless otherwise specified, C1 = CIN, CHOLD= 1uF, VIN= 3.6V, VDIODE = 3.6V, BRGT pin =0V, RSET = 330Ω Start Up Time @ 4.2 VIN Figure 14. Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LM2791 7 LM2791 Not Recommended For New Designs SNVS156M – FEBRUARY 2001 – REVISED MAY 2013 www.ti.com CIRCUIT DESCRIPTION The LM2791 provides two matched current sources for driving high forward voltage drop LEDs from Li-Ion battery sources. The device has on-chip current regulators which are composed of current mirrors with a 25 to 1 ratio. The mirrors control the LED current without using current limiting resistors in the LED current path. The device can drive up to a total of 36mA through the LEDs. The LED brightness can be controlled by both analog and or digital methods. The digital technique uses a PWM (Pulse Width Modulation) signal applied to the shutdown input. The analog technique applies an analog voltage to the brightness (BRGT) pin (see Application Information). For lowest cost, the LM2791 can be used for constant brightness by grounding BRGT and enabling the shutdown pin. APPLICATION INFORMATION SOFT START LM2791 includes a soft start function to reduce the inrush currents and high peak current during power up of the device. Soft start is implemented internally by ramping the bandgap more slowly than the applied voltage. This is done by holding the bandgap in shutdown for a short time. During soft start, the switch resistances limit the inrush current used to charge the flying and hold capacitors. SHUTDOWN MODE A shutdown pin (SD or /SD) is available to disable the LM2791 and reduce the quiescent current to 1µA maximum. The LM2791 is available with both senses of shutdown polarity. During normal operation mode of the "-L" options, an active high logic signal to the SD pin or tying the SD pin to VIN, will enable the device. Pulling SD low or connectingSD to ground will disable the device. During normal operation mode of the "-H" options, an active low logic signal to the SD pin or tying the SD pin to GND, will enable the device. Pulling SD high or connecting SD to VIN will disable the device. CAPACITOR SELECTION Low equivalent series resistance (ESR) capacitors such as X5R or X7R are recommended to be used for CIN, C1, C2, and CHOLD for best performance. Ceramic capacitors with less than or equal to 0.3 ohms ESR value are recommended for this application. Table 1 below lists suggested capacitor suppliers for the typical application circuit. 8 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LM2791 Not Recommended For New Designs www.ti.com LM2791 SNVS156M – FEBRUARY 2001 – REVISED MAY 2013 Table 1. Low ESR Capacitor Manufactures Manufacturer Contact website TDK (847) 803 6100 www.component.tdk.com MuRata (800) 831 9172 www.murata.com Taiyo Yuden (800) 348 2496 www.t-yuden.com SCHOTTKY DIODE SELECTION A schottky diode (D1) must be used between VIN and POUT for proper operation. During start-up, the low voltage drop across this diode is used to charge COUT and start the oscillator. It is necessary to protect the device from turning-on its own parasitic diode and potentially latching-up. As a result, it is important to select a schottky diode that will carry at least 200mA or higher current to charge the output capacitor during start-up. A schottky diode like 1N5817 can be used for most applications or a surface mount diode such as BAT54-series and MA2J704 used to reduce the circuit size. Table 2 below lists suggested schottky diode manufactures. Table 2. Diode Manufactures Manufacturer Contact ON Semiconductor (800) 344 3860 Schottky Diodes www.onsemi.con Phillips Semiconductors (800) 234 7381 www.philipssemiconduc tor.com Panasonic Semiconductor (408) 945 5622 www.panasonic.com LED SELECTION The LM2791 is designed to drive LEDs with a forward voltage of about 3.0V to 4.0V or higher. The typical and maximum VF depends highly on the manufacturer and their technology. Table 3 lists two suggested manufactures and example part numbers. Each supplier makes many LEDs that work well with the LM2791. The LEDs suggested below are in a surface mount package and TOPLED or SIDEVIEW configuration with a maximum forward current of 20mA. These diodes also come in SIDELED or SIDEVIEW configuration and various chromaticity groups. For applications that demand color and brightness matching, care must be taken to select LEDs from the same chromaticity group. Forward current matching is assured over the LED process variations due to the constant current output of the LM2791. For best fit selection for an application, consult the manufacturer for detailed information. Table 3. White LED Selection: Component Manufacture LWT673/LWT67C Osram Contact www.osram-os.com NSCW100/ NSCW215 Nichia www.nichia.com ISET PIN An external resistor, RSET, sets the mirror current that is required to provide a constant current through the LEDs. The current through RSET and the LED is set by the internal current mirror circuitry with a ratio of 25:1 The currents through each LED are matched within 0.3%. RSET should be chosen not to exceed the maximum current delivery capability of the device. Table 4 shows a list of RSET values when maximum BRGT = 0V is applied. For other BRGT voltages, RSET can be calculated using this formula: RSET = (((BRGT * 0.42) + VOFFSET))/(ILED)* 25 (1) Table 4. RSETSelections ( when BRGT pin = 0V) ILED per LED *RSET 15mA 330Ω 10mA 500Ω 5mA 1K Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LM2791 9 Not Recommended For New Designs LM2791 SNVS156M – FEBRUARY 2001 – REVISED MAY 2013 www.ti.com Calculation of LED Current When Grounding BRGT: VIN = 3.6V VOFFSET = 200mV(Reference Voltage) RSET = 330Ω ILED = ( VOFFSET/RSET) *25 ILED = (200mV/330) *25 = 15mA BRGT PIN The BRGT pin can be used to smoothly vary the brightness of the White LEDs. In the LM2791, current on BRGT is connected to an internal resistor divider which gives a factor 0.42 and summed with an offset voltage from the internal bandgap (200mV). This voltage is fed to the operational amplifier that controls the current through the mirror resistor RSET. The nominal range on BRGT is 0V to 3V. Care must be taken to prevent voltages on BRGT that cause LED current to exceed 36mA. Although this will not cause damage to the IC, it will not meet the specifications listed in the Electrical Characteristics. Table 5 shows the current through each LED for the LM2791 with various BRGT and RSET values. Calculation of LED Current When BRGT Pin > 0: RSET = 2000Ω BRGT = 2.5V VOFFSET = 200mV(Reference Voltage) ILED = (((BRGT * 0.42) + VOFFSET)/ RSET )* 25 ILED = (((2.5*0.42) + 0.20)/2000 )*25 =15.6mA Table 5. LED Current When Using BRGT Input (1) (1) RSET (Ω) 1000Ω 1500Ω 2000Ω 2500Ω BRGT (V) ILED (mA) ILED (mA) ILED (mA) ILED (mA) 0.5 10.25 6.84 5.10 4.1 1.0 15.5 10.3 7.75 6.2 1.5 20.75 13.8 10.37 8.3 2.0 26 17.3 13.00 10.4 2.5 31.25 20.80 15.6 12.5 3.0 36.5 24.3 18.3 14.6 Values Highlighted in Boldface exceeded maximum current range of the device if both LEDs are in use. BRIGHTNESS CONTROL USING PWM Brightness control can be implemented by pulsing a signal at the SD pin. The recommended signal should be between 100Hz to 1kHz. If the operating PWM frequency is much less than 100Hz, flicker may be seen in the LEDs. Likewise, if frequency is much higher, brightness in the LEDs will not be linear. When a PWM signal is used to drive the SD pin of the LM2791, connect BRGT pin to a maximun of GND. RSET value is selected using the above I SET equation as if BRGT pin is used. The brightness is controlled by increasing and decreasing the duty cycle of the PWM. Zero duty cycle will turn off the brightness and a 50% duty cycle waveform produces an average current of 7.5mA if RSET is set to produce a maximum LED current of 15mA. So the LED current varies linearly with the duty cycle. 10 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LM2791 Not Recommended For New Designs www.ti.com LM2791 SNVS156M – FEBRUARY 2001 – REVISED MAY 2013 PARALLEL Dx OUTPUTS FOR INCREASED CURRENT DRIVE Outputs D1 and D2 may be connected together to drive a single LED. In such a configuration, two parallel current sources of equal value drive the single LED. RSET and VBRGT should be chosen so that the current through each of the outputs is programmed to 50% of the total desired LED current. For example, if 30mA is the desired drive current for the single LED, RSET and VBRGT should be selected so that the current through each of the outputs is 15mA. Connecting the outputs in parallel does not affect internal operation of the LM2791and has no impact on the Electrical Characteristics and limits previously presented. The available Dx output current, maximum Dx voltage, and all other specifications provided in the Electrical Characteristics table apply to this parallel output configuration, just as they do to the standard 2-LED application circuit. THERMAL PROTECTION The LM2791 has internal thermal protection circuitry to disable the charge pump if the junction temperature exceeds 150°C. This feature will protect the device from damage due to excessive power dissipation. The device will recover and operate normally when the junction temperature falls below the maximum operating junction temperature of 100°C. It is important to have good thermal conduction with a proper layout to reduce thermal resistance. POWER EFFICIENCY An ideal power efficiency for a voltage doubler switched capacitor converter is given as the output voltage of the doubler over twice the input voltage as follows: Efficiency = (VDIODE* IDIODE) / ( VIN * IDIODE* Gain) = VDIODE / 2VIN (2) In the case of the LM2791, a more accurate efficiency calculation can be applied as the given formula below. Efficiency = ((VD1* ID1) + (VD2* ID2)) / (ISUPPLY* VIN) (3) It is clear that the efficiency will depend on the supply voltage in the above equation. As such, the lower the supply voltage, the higher the efficiency. POWER DISSIPATION The maximum allowable power dissipation that this package is capable of handling can be determined as follows: PDMax = (TJMax - TA) / θJA (4) where TJMax is the maximum junction temperature, TA is the ambient temperature, and θJA is the junction-toambient thermal resistance of the specified package. The actual power dissipation of the device can be calculated using this equation: PDissipation = (2VIN -VDIODE)*ILOAD (5) As an example, if VIN in the target application is 4.2V, VDIODE = 3.0V and worse case current consumption is 32mA (16mA for each diode). PDissipation = ((2*4.2) -3.0)*0.032 = 173mW (6) Power dissipation must be less than that allowed by the package. Please refer to the Absolute Maximum Rating of the LM2791. PCB LAYOUT CONSIDERATIONS The WSON is a leadframe based Chip Scale Package (CSP) with very good thermal properties. This package has an exposed DAP (die attach pad) at the center of the package measuring 2.0mm x 1.2mm. The main advantage of this exposed DAP is to offer lower thermal resistance when it is soldered to the thermal land on the PCB. For PCB layout, a 1:1 ratio between the package and the PCB thermal land is highly recommended. To further enhance thermal conductivity, the PCB thermal land may include vias to a ground plane. For more detailed instructions on mounting WSON packages, please refer to Application Note AN-1187. (SNOA401) Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LM2791 11 LM2791 Not Recommended For New Designs SNVS156M – FEBRUARY 2001 – REVISED MAY 2013 www.ti.com REVISION HISTORY Changes from Revision L (May 2013) to Revision M • 12 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 11 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LM2791 PACKAGE OPTION ADDENDUM www.ti.com 1-Oct-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM2791LD-L NRND WSON NGY 10 TBD Call TI Call TI -30 to 85 SNB LM2791LD-L/NOPB OBSOLETE WSON NGY 10 TBD Call TI Call TI -30 to 85 SNB (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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