LM3466
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SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013
Multi-String LED Current Balancer for Use with Constant-Current Power Supplies
Check for Samples: LM3466
FEATURES
DESCRIPTION
•
The LM3466 integrates a linear LED driver for lighting
systems which consist of multiple LED strings
powered by a constant current power supply. It
balances the current provided by the supply in a preset ratio for each active LED string, where an active
string is a fully turned on LED string, regardless of
the number of strings connected to the supply or the
forward voltage of each LED string. If any LED string
opens during operation, the LM3466 automatically
balances the supply current through all of the
remaining active LED strings. As a result, the overall
brightness of the lighting system is maintained even if
some LED strings open during operation.
1
2
•
•
•
•
•
•
•
•
•
•
•
•
•
Easy to Design for Lighting Systems
Consisting of Multiple LED Strings (Supports
Modular Design)
Automatically Balances the Current of Every
Active LED String, even the Forward Voltage
of Each String is Different
Easy to Pre-Set and Fine-Tune Current Ratio
Among LED Strings (e.g., color temperature
adjustment or CRI Enhancement)
±1% Current Accuracy at Room Temperature
and ±1.5% Over Temperature
Maintains Constant Output Power if Some
Strings Open (inactive) by Automatically
Balancing the Current of Remaining Active
LED Strings
Works with a Constant Current Power Supply
(ac/dc or dc/dc), and no Communication
to/from the Constant Current Power Supply is
Required
Operates with Minimum Voltage Overhead to
Maximize Power Efficiency
Wide Input Voltage Range from 6 V to 70 V
Fault Status Output
Thermal Shutdown
Integrated 70-V, 1.5-A MOSFET with 2.06 A
Current Limit
Maximum 70-V per LED String, 20 LEDs
Linear Circuitry Does Not Deteriorate EMI
DDA-8 Exposed Thermal Pad and TO220-7
Packages
The LM3466 lighting system is simple to design
owing to a proprietary control scheme. To minimize
the component count, the LM3466 integrates a 70-V,
1.5-A, N-channel power MOSFET with a current limit
of 2.06 A. To add one more LED string to the system,
only a single resistor, a capacitor, and a LM3466 are
required. Other supervisory features of the LM3466
include under-voltage lock-out, fault reporting,
thermal latch off, and thermal shutdown protection.
The LM3466 consists of only linear circuitry so that
the EMI of the application circuit is not deteriorated.
The LM3466 lighting system is EMI friendly if the
constant current power supply used is complied to
EMI standards. The LM3466 is available in the DDA8 exposed thermal pad and TO220-7 packages.
SIMPLIFIED APPLICATION
VIN
Connect to
VIN pin of
another
LM3466
APPLICATIONS
•
•
Street Lamps
Solid State Lighting Systems
LM3466
ILED
VIN
CLED
Connect to
VEQ pin of
another
LM3466
VEQ
COMM
SEN
SRC
CIN
Connect to
COMM pin
of another
LM3466
REQ
GND
CEQ
RSEN
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011–2013, Texas Instruments Incorporated
LM3466
SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1)
If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for
availability and specifications.
MIN
MAX
VIN, ILED to GND
–0.3
75
V
COMM to GND
–0.3
7
V
SEN, SRC, VEQ to GND
–0.3
5
V
–2
2
kV
–65
150
°C
150
°C
ESD Rating
(2)
, Human Body Model
Storage Temperature Range
Junction Temperature (TJ)
(1)
(2)
UNIT
Absolute Maximum Ratings are limits beyond which damage to the device may occur.
The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.
RECOMMENDED OPERATING CONDITIONS (1)
MIN
Supply Voltage Range (VIN)
Junction Temperature Range (TJ)
(1)
MAX
UNIT
6
70
V
−40
125
°C
Recommended Operating conditions are those under which operation of the device is intended to be functional. For specifications and
test conditions, see the Electrical Characteristics table.
THERMAL INFORMATION
THERMAL METRIC
Junction-to-ambient thermal resistance (2)
θJA
(3)
SO PowerPAD
TO-220
DDA
NEC (1)
8 PINS
7 PINS
50.7
32.2
θJCtop
Junction-to-case (top) thermal resistance
56.1
36.4
θJB
Junction-to-board thermal resistance (4)
28.9
25.2
ψJT
Junction-to-top characterization parameter (5)
9.8
6.2
ψJB
Junction-to-board characterization parameter (6)
28.8
23.8
θJCbot
Junction-to-case (bottom) thermal resistance (7)
3.3
0.3
(1)
(2)
(3)
(4)
(5)
(6)
(7)
2
UNITS
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
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ELECTRICAL CHARACTERISTICS
–40°C ≤ TJ ≤ 125°C, VIN = 48 V (unless otherwise stated)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
4.06
4.78
5.30
V
550
640
µA
VIN-UVLO-UPPER
VIN pin under-voltage lockout (UVLO)
Input voltage increasing
upper threshold
VIN-UVLO-HYS
VIN pin UVLO hysteresis
IIN
Operating current to the VIN pin
VSEN
SEN pin voltage regulation
ISEN
SEN pin bias current out
VSEN = 0 V
ILED-OFF
ILED pin off current
RDS(on)
Integrated power MOSFET onresistance
VSRC-OPEN
SRC pin open circuit threshold
VSEN = VSRC, VCOMM = 0 V
ILIMIT
Current limit
VSEN = VSRC = 0 V, VILED = 3 V
COMMILOW
COMM pin pull-low current
VCOMM = 5 V
COMMVHIGH
COMM pin pull-high voltage
COMM pin to ground through a 10-kΩ
resistor
6.0
V
TSD
Thermal shutdown
150
°C
Input voltage decreasing, TA = 25°C
0.52
V
VEQ = 200 mV, TA = 25°C
197.1
200
201.0
VEQ = 200 mV
195.6
200
201.5
9.35
10.29
11.23
µA
VILED = 70 V
0.1
0.6
µA
IILED = 300 mA
0.5
1.2
Ω
25
31
37
mV
1.75
2.06
2.35
A
34
54
µA
mV
Connection Diagrams
Figure 1. DDA (SO PowerPAD) Package, 8 Pins
(Top View)
Figure 2. NEC (TO-220) Package, 7 Pins
(Top View)
PIN DESCRIPTIONS
NAME
PINS
I/O
DESCRIPTION
DDA
NEC
COMM
2
6
O
Open-drain status output. Indicates the status of the LM3466 including startup, LED string
active/inactive, thermal shutdown.
GND
5
4
—
Ground. Connects to ground.
ILED
1
5
I
Current regulator input. Connects to the drain of the integrated power MOSFET. Connects this pin to
the cathode of an LED string. Connects a capacitor from this pin to ground to minimize noise if the
connecting cable to the LED string is long.
SEN
6
2
I
Current sense input. Senses the voltage of an external current sensing resistor.
3
O
Source of power MOSFET. Connects to the source of the integrated power MOSFET. Connect this
pin to an external current sensing resistor.
SRC
7
8
VEQ
4
1
O
Control voltage. Connects to the VEQ pin of other LM3466 with a 51-Ω resistor in series with a 1-µF
capacitor to ground.
VIN
3
7
I
Input voltage supply. Connects to voltage supply from 6 V to 70 V. Connects a 10-nF capacitor from
this pin to ground for decoupling.
Thermal Pad
—
Thermal connection pad. Connects to a ground plane.
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TYPICAL CHARACTERISTICS
Unless otherwise specified the following conditions apply: TJ = 25°C, VIN = 48V with configuration in the additional application
circuit for ILED = 0.35A shown in this datasheet.
600
580
IIN(A)
25°C
560
125°C
540
520
-40°C
500
0
4
10
20
30 40
VIN(V)
50
60
70
Figure 3. Quiescent Current, IIN vs VIN
Figure 4. Current Regulation vs VIN
Figure 5. Current Regulation (Channel to Channel) vs
Temperature
Figure 6. Efficiency vs VIN
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TYPICAL CHARACTERISTICS (continued)
Unless otherwise specified the following conditions apply: TJ = 25°C, VIN = 48V with configuration in the additional application
circuit for ILED = 0.35A shown in this datasheet.
700
RDS(on)(m
)
650
600
550
500
450
400
-50
0
50
100
TEMPERATURE (°C)
150
Figure 7. RDS(on) vs Tempearture
Figure 8. Current Regulation vs VLED
Figure 9. Power Up
Figure 10. LED String Disconnect
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TYPICAL CHARACTERISTICS (continued)
Unless otherwise specified the following conditions apply: TJ = 25°C, VIN = 48V with configuration in the additional application
circuit for ILED = 0.35A shown in this datasheet.
2.5
10.9
2.4
10.8
2.3
CURRENT LIMIT (A)
11.0
ISEN(A)
10.7
10.6
10.5
10.4
10.3
10.2
2.1
2.0
1.9
1.8
1.7
10.1
1.6
10.0
-50
2.2
0
50
100
TEMPERATURE (°C)
150
1.5
-50
Figure 11. ISEN vs Temperature
6
0
50
100
TEMPERATURE (°C)
150
Figure 12. Current Limit vs Temperature
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BLOCK DIAGRAM
OVERVIEW
The LM3466 integrates a linear LED driver for lighting systems which consist of multiple LED strings powered by
a constant current power supply. An ideal constant current power supply delivers a constant current (IS)
regardless of the output voltage of the connecting load. In the lighting system, each device regulates the current
of an LED string. The current IS provided by the supply is balanced (i.e. shared in a pre-set ratio determined by a
single resistor) through each active LED string automatically, regardless of the number of strings connected to
the supply or the forward voltage of each string. Here, an active LED string refers to a fully turned on LED string.
If any LED string opens during operation, the LED current of all remaining active LED strings will increase to
balance the current provided by the supply automatically. As a result, the total output power remains nearly the
same in case of the decrease of active LED strings. This gives an advantage that the overall brightness of the
lighting system is maintained even if some LED strings open during operation.
A LM3466 lighting system is simple to design owing to a proprietary control scheme. To minimize the component
count, the LM3466 integrates a 70-V, 1.5-A, N-channel MOSFET with a current limit of 2.06 A. To add one more
LED string to the system, only a single resistor, a capacitor, and an additional LM3466 device are required. Other
supervisory features of the LM3466 include under-voltage lock-out, fault reporting, thermal latchoff, and thermal
shutdown protection.
The LM3466 consists of only linear circuitry so that the EMI of the application circuit is not deteriorated. The
LM3466 lighting system is EMI friendly if the constant current power supply used is complied to EMI standards.
The LM3466 is available in a DDA thermal pad and NEC packages.
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Current Regulator
The LM3466 integrates a current regulator to control the current of a connected LED string. The current is
delivered from the supply through the LED string, the ILED pin, the integrated power MOSFET, the SRC pin, and
the sensing resistor RSEN connecting from the SRC pin to ground as shown in Figure 13. The sensing resistor
voltage is fed back to the LM3466 through the SEN pin, either by direct connection or through an extra resistor
RSL. The device regulates the voltage of the SEN pin (VSEN) to a voltage set by its control block. If the sensing
resistor of each LM3466 (RSEN,k, k = 1, 2, …, n) is the same, the LED current of each active LED string is the
same. If RSEN,k of any device is different from others, the corresponding LED current (ILED,k) is different, while
VSEN of each LM3466 remains the same as others. The LED current of string k is shown in Equation 1.
ILED,k =
ISRTOTAL
RSEN,k
where
•
IS is the current of the supply, and
(1)
n
1
RSEN,i
1
=
RTOTAL
(2)
i-1
In addition to determining the LED current from the RSEN,k resistor, an external resistor RSL,k connecting between
the SEN pin and RSEN,k can be used to fine tune the LED current for the purpose of color temperature adjustment
or CRI enhancement. The SEN pin sources a constant bias current ISEN (typically 10.5 µA for DDA package and
10.29 µA for the NEC package) such that a constant voltage drop on RSL,k reduces the LED current. Using an
external resistor RSL,k affects the current of other LED strings. If RSL,k is added in the k-th LM3466, the
corresponding LED current is shown in Equation 3 .
æ
æ
1
1
ç (IS ´ RTOTAL ) - (ISEN ´ RSL,k ´ RTOTAL )´ ç
ç
ç
è RTOTAL RSEN,k
ILED,k = ç
RSEN,k
ç
ç
è
öö
÷÷ ÷
ø÷
÷
÷
÷
ø
(3)
and the LED current of other strings is shown in Equation 4.
æ
æ
æR
´ RTOTAL ö ö ö
ç (IS ´ RTOTAL ) + ç ISEN ´ ç SL,k
÷÷ ÷ ÷
ç
ç
÷
R
ç
SEN,k
è
ø
è
ø÷
ILED,i = ç
÷
RSEN,i
ç
÷
çç
÷÷
è
ø
where
•
8
i = 1, 2, …n (except k)
(4)
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The LED current of LED string k is reduced, while the LED current of other channels increases. Figure 14 shows
a typical example that the variation of LED current on varying RSL,k.
VIN
Connect to
VIN pin of
another LM3466
LM3466
ILED
VIN
CLED
Connect to
VEQ pin of
another LM3466
VEQ
COMM
SEN
SRC
CIN
Connect to
COMM pin of
another LM3466
REQ
51.1
GND
CEQ
1 µF
RSEN
Figure 13. A Single LM3466 within a Lighting
System
Figure 14. Variation of ILED vs RSL,k
LED String Disconnect and Reconnect
One major advantage of the LM3466 lighting system is that the overall brightness can be maintained even if
some LED strings open during operation. If an active LED string is suddenly disconnected, the LM3466
automatically balances the current delivered by the supply IS (i.e. each string increases its LED current in this
case) so as to keep IS constant. However, the current balancing occurs only after the LED string is confirmed
inactive. Once the string is disconnected, VEQ cycles (goes up and down). If the string remains disconnected for
a period of 253 consecutive cycles, the string is confirmed inactive. Consequently, the current of other LED
strings increases to balance IS. The output power and the overall brightness of the lighting system can be
maintained.
If a new LED string connects to the system, such as if the disconnected LED string is reconnected again, a
power reset is recommended to ensure proper operation. The forward voltage of the new LED string may be
higher than the instantaneous VIN, which corresponds to the forward voltage of the highest active LED string. A
power reset ensures that VIN goes to the peak voltage (a default characteristic of a constant current power
supply) in order to start up the LED string with the highest forward voltage.
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Communication Pin (COMM)
The COMM pin serves as a communication link among all LM3466 in the lighting system. It also indicates the
status of the device. The COMM pin is pulled low at startup. After startup, the COMM pin is high or low to
indicate that the corresponding LED string is active or inactive.
For proper operation of an LM3466 lighting system, the COMM pin of all LM3466 should be either shorted
together or connected through a diode in parallel with a resistor.
Figure 15 shows an optional circuit for the COMM pin to indicate whether each LED string is active by means of
small signal LEDs. The COMM pin of each LM3466 is connected to an external test point COMM_ALL through
the optional circuit.
The COMM pin is low if the LM3466 is under thermal protection.
COMM_ALL
COMM
LM3466
GND
Figure 15. Optional Circuit for the COMM Pin
High Voltage Application
For any application with the forward voltage of an LED string higher than 70 V, which is the maximum operating
voltage of the LM3466, an external MOSFET circuit as shown in Figure 16 is recommended for each channel in
order to protect the ILED pin from damaging by a high voltage owing to shorting LEDs (or even the whole LED
string). To avoid the ILED pin damage from a high voltage generated by the leakage current, a resistor RLED (1
MΩ is suggested) is placed between the ILED pin and ground. In addition, because VLED is higher than 70 V in
this case, the VIN pin cannot be directly connected to VLED. External power supplies for VIN and VG (to drive the
external MOSFET) are required. Alternatively, as shown in Figure 17, a circuit for supplying VIN and VG (for all
channels in the system).
10
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Figure 16. External MOSFET Circuit for High
Voltage Applications
Figure 17. Power Supply Circuit for the External
MOSFET Circuit
Thermal Protection
Thermal protection is implemented by an internal thermal shutdown circuit which activates at 150°C (typically) to
disable the LM3466. In this case, the integrated power MOSFET turns off and the COMM pin is pulled low.
Thermal protection helps prevent catastrophic failures from accidental device overheating. When the junction
temperature of the LM3466 falls back below 140°C (typical hysteresis = 10°C), the LM3466 resumes normal
operation.
Thermal Latch Off and Derating
If thermal protection cycles for 253 times consecutively, the LM3466 is latched off until power reset.
Thermal derating is required for only the DDA package (but not the NEC package). When fully turned on, the
integrated power MOSFET of the LM3466 is capable of conducting a current of 1.5 A below an ambient
temperature of 100°C. At 125°C, the LM3466 can conduct a current of 1 A without thermal shutdown with a PCB
ground plane copper area of 60 cm2, 2 oz/Cu. Figure 18 shows a thermal derating curve for the minimum
conducting current of a fully turned on LM3466 integrated power MOSFET without thermal shutdown against an
ambient temperature up to 125°C.
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1.6
ILED CURRENT (A)
1.5
1.4
1.3
1.2
1.1
1.0
0
25
50
75
100
AMBIENT TEMPERATURE (°C)
125
Figure 18. Thermal Derating Curve for the eDDA-8 Package
12
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APPLICATION INFORMATION
Consider a LM3466 lighting system which is powered by a 1.75 A constant current power supply and consists of
5 LED strings with 14 LEDs per string. It is designed that the LED current of every LED string is 0.35 A.
EXTERNAL COMPONENTS
RSEN: To set the LED current of all 5 LED strings equal, the sensing resistors corresponding to all 5 LM3466 are
equal. It is recommended that the nominal voltage of the SEN pin VSEN should be around 0.3 V.
Therefore, RSEN is selected to be 1 Ω. As a result, VSEN should be 0.35 V if the LED current is 0.35 A.
CLED: If the cable connecting the LED string is long, the parasitic inductance of the cable may generate noise. If
this happens, a high quality ceramic capacitor should be connected between the ILED pin and ground. In
this example, a 100 V, 1 µF ceramic capacitor is used.
CIN:
A high quality ceramic capacitor for decoupling should be connected from the VIN pin to ground. In this
example, a 100 V, 0.01 µF ceramic capacitor is used.
REQ and CEQ: The VEQ pins of all LM3466 are shorted together and then connected to ground through REQ and
CEQ. Only one REQ and one CEQ are required for each LM3466 lighting system. It is recommended that
REQ be 51.1 Ω and CEQ be 1 µF.
PC BOARD LAYOUT
To minimize the effect of noise, the ground connections of the LM3466 and the sense resistor RSEN,k should be
closed. Good heat dissipation helps optimize the performance of the LM3466. The ground plane should be used
to connect the exposed pad of the LM3466, which is internally connected to the LM3466 die substrate. The area
of the ground plane should be extended as much as possible on the same copper layer above and below the
LM3466. Using numerous vias beneath the exposed pad to dissipate heat of the LM3466 to another copper layer
is also a good practice.
Additional Application Circuit
Figure 19. Application Circuit of a LM3466 Lighting System
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REVISION HISTORY
Changes from Revision C (May 2013) to Revision D
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 13
Changes from Revision D (MAY 2013) to Revision E
Page
•
Changed title ......................................................................................................................................................................... 1
•
Changed updated layout to TI standards ............................................................................................................................. 1
•
Changed updated SIMPLIFIED APPLICATION ................................................................................................................... 1
•
Added updated Thermal Table ............................................................................................................................................. 2
•
Changed updated Equation 3 ............................................................................................................................................... 8
•
Changed updated Equation 4 ............................................................................................................................................... 8
•
Changed updated Figure 13 ................................................................................................................................................. 9
Changes from Revision E (AUGUST 2013) to Revision F
•
14
Page
Changed Electrical Characteristics table. Updated current sense specification. .................................................................. 3
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
LM3466MR/NOPB
ACTIVE SO PowerPAD
DDA
8
95
RoHS & Green
SN
Level-3-260C-168 HR
-40 to 125
L3466
LM3466MRX/NOPB
ACTIVE SO PowerPAD
DDA
8
2500
RoHS & Green
SN
Level-3-260C-168 HR
-40 to 125
L3466
ACTIVE
NEC
7
45
RoHS & Green
SN
Level-1-NA-UNLIM
LM3466TA/NOPB
TO-220
LM3466
TA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of