LM3466MRX/NOPB

LM3466 www.ti.com SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013 Multi-String LED Current Balancer for Use with Constant-Current Power Supplies Check for Samples: LM3466 FEATURES DESCRIPTION • The LM3466 integrates a linear LED driver for lighting systems which consist of multiple LED strings powered by a constant current power supply. It balances the current provided by the supply in a preset ratio for each active LED string, where an active string is a fully turned on LED string, regardless of the number of strings connected to the supply or the forward voltage of each LED string. If any LED string opens during operation, the LM3466 automatically balances the supply current through all of the remaining active LED strings. As a result, the overall brightness of the lighting system is maintained even if some LED strings open during operation. 1 2 • • • • • • • • • • • • • Easy to Design for Lighting Systems Consisting of Multiple LED Strings (Supports Modular Design) Automatically Balances the Current of Every Active LED String, even the Forward Voltage of Each String is Different Easy to Pre-Set and Fine-Tune Current Ratio Among LED Strings (e.g., color temperature adjustment or CRI Enhancement) ±1% Current Accuracy at Room Temperature and ±1.5% Over Temperature Maintains Constant Output Power if Some Strings Open (inactive) by Automatically Balancing the Current of Remaining Active LED Strings Works with a Constant Current Power Supply (ac/dc or dc/dc), and no Communication to/from the Constant Current Power Supply is Required Operates with Minimum Voltage Overhead to Maximize Power Efficiency Wide Input Voltage Range from 6 V to 70 V Fault Status Output Thermal Shutdown Integrated 70-V, 1.5-A MOSFET with 2.06 A Current Limit Maximum 70-V per LED String, 20 LEDs Linear Circuitry Does Not Deteriorate EMI DDA-8 Exposed Thermal Pad and TO220-7 Packages The LM3466 lighting system is simple to design owing to a proprietary control scheme. To minimize the component count, the LM3466 integrates a 70-V, 1.5-A, N-channel power MOSFET with a current limit of 2.06 A. To add one more LED string to the system, only a single resistor, a capacitor, and a LM3466 are required. Other supervisory features of the LM3466 include under-voltage lock-out, fault reporting, thermal latch off, and thermal shutdown protection. The LM3466 consists of only linear circuitry so that the EMI of the application circuit is not deteriorated. The LM3466 lighting system is EMI friendly if the constant current power supply used is complied to EMI standards. The LM3466 is available in the DDA8 exposed thermal pad and TO220-7 packages. SIMPLIFIED APPLICATION VIN Connect to VIN pin of another LM3466 APPLICATIONS • • Street Lamps Solid State Lighting Systems LM3466 ILED VIN CLED Connect to VEQ pin of another LM3466 VEQ COMM SEN SRC CIN Connect to COMM pin of another LM3466 REQ GND CEQ RSEN 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011–2013, Texas Instruments Incorporated LM3466 SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications. MIN MAX VIN, ILED to GND –0.3 75 V COMM to GND –0.3 7 V SEN, SRC, VEQ to GND –0.3 5 V –2 2 kV –65 150 °C 150 °C ESD Rating (2) , Human Body Model Storage Temperature Range Junction Temperature (TJ) (1) (2) UNIT Absolute Maximum Ratings are limits beyond which damage to the device may occur. The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. RECOMMENDED OPERATING CONDITIONS (1) MIN Supply Voltage Range (VIN) Junction Temperature Range (TJ) (1) MAX UNIT 6 70 V −40 125 °C Recommended Operating conditions are those under which operation of the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics table. THERMAL INFORMATION THERMAL METRIC Junction-to-ambient thermal resistance (2) θJA (3) SO PowerPAD TO-220 DDA NEC (1) 8 PINS 7 PINS 50.7 32.2 θJCtop Junction-to-case (top) thermal resistance 56.1 36.4 θJB Junction-to-board thermal resistance (4) 28.9 25.2 ψJT Junction-to-top characterization parameter (5) 9.8 6.2 ψJB Junction-to-board characterization parameter (6) 28.8 23.8 θJCbot Junction-to-case (bottom) thermal resistance (7) 3.3 0.3 (1) (2) (3) (4) (5) (6) (7) 2 UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88. The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Spacer Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM3466 LM3466 www.ti.com SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013 ELECTRICAL CHARACTERISTICS –40°C ≤ TJ ≤ 125°C, VIN = 48 V (unless otherwise stated) PARAMETER CONDITIONS MIN TYP MAX UNITS 4.06 4.78 5.30 V 550 640 µA VIN-UVLO-UPPER VIN pin under-voltage lockout (UVLO) Input voltage increasing upper threshold VIN-UVLO-HYS VIN pin UVLO hysteresis IIN Operating current to the VIN pin VSEN SEN pin voltage regulation ISEN SEN pin bias current out VSEN = 0 V ILED-OFF ILED pin off current RDS(on) Integrated power MOSFET onresistance VSRC-OPEN SRC pin open circuit threshold VSEN = VSRC, VCOMM = 0 V ILIMIT Current limit VSEN = VSRC = 0 V, VILED = 3 V COMMILOW COMM pin pull-low current VCOMM = 5 V COMMVHIGH COMM pin pull-high voltage COMM pin to ground through a 10-kΩ resistor 6.0 V TSD Thermal shutdown 150 °C Input voltage decreasing, TA = 25°C 0.52 V VEQ = 200 mV, TA = 25°C 197.1 200 201.0 VEQ = 200 mV 195.6 200 201.5 9.35 10.29 11.23 µA VILED = 70 V 0.1 0.6 µA IILED = 300 mA 0.5 1.2 Ω 25 31 37 mV 1.75 2.06 2.35 A 34 54 µA mV Connection Diagrams Figure 1. DDA (SO PowerPAD) Package, 8 Pins (Top View) Figure 2. NEC (TO-220) Package, 7 Pins (Top View) PIN DESCRIPTIONS NAME PINS I/O DESCRIPTION DDA NEC COMM 2 6 O Open-drain status output. Indicates the status of the LM3466 including startup, LED string active/inactive, thermal shutdown. GND 5 4 — Ground. Connects to ground. ILED 1 5 I Current regulator input. Connects to the drain of the integrated power MOSFET. Connects this pin to the cathode of an LED string. Connects a capacitor from this pin to ground to minimize noise if the connecting cable to the LED string is long. SEN 6 2 I Current sense input. Senses the voltage of an external current sensing resistor. 3 O Source of power MOSFET. Connects to the source of the integrated power MOSFET. Connect this pin to an external current sensing resistor. SRC 7 8 VEQ 4 1 O Control voltage. Connects to the VEQ pin of other LM3466 with a 51-Ω resistor in series with a 1-µF capacitor to ground. VIN 3 7 I Input voltage supply. Connects to voltage supply from 6 V to 70 V. Connects a 10-nF capacitor from this pin to ground for decoupling. Thermal Pad — Thermal connection pad. Connects to a ground plane. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM3466 3 LM3466 SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013 www.ti.com TYPICAL CHARACTERISTICS Unless otherwise specified the following conditions apply: TJ = 25°C, VIN = 48V with configuration in the additional application circuit for ILED = 0.35A shown in this datasheet. 600 580 IIN(A) 25°C 560 125°C 540 520 -40°C 500 0 4 10 20 30 40 VIN(V) 50 60 70 Figure 3. Quiescent Current, IIN vs VIN Figure 4. Current Regulation vs VIN Figure 5. Current Regulation (Channel to Channel) vs Temperature Figure 6. Efficiency vs VIN Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM3466 LM3466 www.ti.com SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013 TYPICAL CHARACTERISTICS (continued) Unless otherwise specified the following conditions apply: TJ = 25°C, VIN = 48V with configuration in the additional application circuit for ILED = 0.35A shown in this datasheet. 700 RDS(on)(m ) 650 600 550 500 450 400 -50 0 50 100 TEMPERATURE (°C) 150 Figure 7. RDS(on) vs Tempearture Figure 8. Current Regulation vs VLED Figure 9. Power Up Figure 10. LED String Disconnect Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM3466 5 LM3466 SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) Unless otherwise specified the following conditions apply: TJ = 25°C, VIN = 48V with configuration in the additional application circuit for ILED = 0.35A shown in this datasheet. 2.5 10.9 2.4 10.8 2.3 CURRENT LIMIT (A) 11.0 ISEN(A) 10.7 10.6 10.5 10.4 10.3 10.2 2.1 2.0 1.9 1.8 1.7 10.1 1.6 10.0 -50 2.2 0 50 100 TEMPERATURE (°C) 150 1.5 -50 Figure 11. ISEN vs Temperature 6 0 50 100 TEMPERATURE (°C) 150 Figure 12. Current Limit vs Temperature Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM3466 LM3466 www.ti.com SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013 BLOCK DIAGRAM OVERVIEW The LM3466 integrates a linear LED driver for lighting systems which consist of multiple LED strings powered by a constant current power supply. An ideal constant current power supply delivers a constant current (IS) regardless of the output voltage of the connecting load. In the lighting system, each device regulates the current of an LED string. The current IS provided by the supply is balanced (i.e. shared in a pre-set ratio determined by a single resistor) through each active LED string automatically, regardless of the number of strings connected to the supply or the forward voltage of each string. Here, an active LED string refers to a fully turned on LED string. If any LED string opens during operation, the LED current of all remaining active LED strings will increase to balance the current provided by the supply automatically. As a result, the total output power remains nearly the same in case of the decrease of active LED strings. This gives an advantage that the overall brightness of the lighting system is maintained even if some LED strings open during operation. A LM3466 lighting system is simple to design owing to a proprietary control scheme. To minimize the component count, the LM3466 integrates a 70-V, 1.5-A, N-channel MOSFET with a current limit of 2.06 A. To add one more LED string to the system, only a single resistor, a capacitor, and an additional LM3466 device are required. Other supervisory features of the LM3466 include under-voltage lock-out, fault reporting, thermal latchoff, and thermal shutdown protection. The LM3466 consists of only linear circuitry so that the EMI of the application circuit is not deteriorated. The LM3466 lighting system is EMI friendly if the constant current power supply used is complied to EMI standards. The LM3466 is available in a DDA thermal pad and NEC packages. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM3466 7 LM3466 SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013 www.ti.com Current Regulator The LM3466 integrates a current regulator to control the current of a connected LED string. The current is delivered from the supply through the LED string, the ILED pin, the integrated power MOSFET, the SRC pin, and the sensing resistor RSEN connecting from the SRC pin to ground as shown in Figure 13. The sensing resistor voltage is fed back to the LM3466 through the SEN pin, either by direct connection or through an extra resistor RSL. The device regulates the voltage of the SEN pin (VSEN) to a voltage set by its control block. If the sensing resistor of each LM3466 (RSEN,k, k = 1, 2, …, n) is the same, the LED current of each active LED string is the same. If RSEN,k of any device is different from others, the corresponding LED current (ILED,k) is different, while VSEN of each LM3466 remains the same as others. The LED current of string k is shown in Equation 1. ILED,k = ISRTOTAL RSEN,k where • IS is the current of the supply, and (1) n 1 RSEN,i 1 = RTOTAL (2) i-1 In addition to determining the LED current from the RSEN,k resistor, an external resistor RSL,k connecting between the SEN pin and RSEN,k can be used to fine tune the LED current for the purpose of color temperature adjustment or CRI enhancement. The SEN pin sources a constant bias current ISEN (typically 10.5 µA for DDA package and 10.29 µA for the NEC package) such that a constant voltage drop on RSL,k reduces the LED current. Using an external resistor RSL,k affects the current of other LED strings. If RSL,k is added in the k-th LM3466, the corresponding LED current is shown in Equation 3 . æ æ 1 1 ç (IS ´ RTOTAL ) - (ISEN ´ RSL,k ´ RTOTAL )´ ç ç ç è RTOTAL RSEN,k ILED,k = ç RSEN,k ç ç è öö ÷÷ ÷ ø÷ ÷ ÷ ÷ ø (3) and the LED current of other strings is shown in Equation 4. æ æ æR ´ RTOTAL ö ö ö ç (IS ´ RTOTAL ) + ç ISEN ´ ç SL,k ÷÷ ÷ ÷ ç ç ÷ R ç SEN,k è ø è ø÷ ILED,i = ç ÷ RSEN,i ç ÷ çç ÷÷ è ø where • 8 i = 1, 2, …n (except k) (4) Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM3466 LM3466 www.ti.com SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013 The LED current of LED string k is reduced, while the LED current of other channels increases. Figure 14 shows a typical example that the variation of LED current on varying RSL,k. VIN Connect to VIN pin of another LM3466 LM3466 ILED VIN CLED Connect to VEQ pin of another LM3466 VEQ COMM SEN SRC CIN Connect to COMM pin of another LM3466 REQ 51.1 Ÿ GND CEQ 1 µF RSEN Figure 13. A Single LM3466 within a Lighting System Figure 14. Variation of ILED vs RSL,k LED String Disconnect and Reconnect One major advantage of the LM3466 lighting system is that the overall brightness can be maintained even if some LED strings open during operation. If an active LED string is suddenly disconnected, the LM3466 automatically balances the current delivered by the supply IS (i.e. each string increases its LED current in this case) so as to keep IS constant. However, the current balancing occurs only after the LED string is confirmed inactive. Once the string is disconnected, VEQ cycles (goes up and down). If the string remains disconnected for a period of 253 consecutive cycles, the string is confirmed inactive. Consequently, the current of other LED strings increases to balance IS. The output power and the overall brightness of the lighting system can be maintained. If a new LED string connects to the system, such as if the disconnected LED string is reconnected again, a power reset is recommended to ensure proper operation. The forward voltage of the new LED string may be higher than the instantaneous VIN, which corresponds to the forward voltage of the highest active LED string. A power reset ensures that VIN goes to the peak voltage (a default characteristic of a constant current power supply) in order to start up the LED string with the highest forward voltage. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM3466 9 LM3466 SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013 www.ti.com Communication Pin (COMM) The COMM pin serves as a communication link among all LM3466 in the lighting system. It also indicates the status of the device. The COMM pin is pulled low at startup. After startup, the COMM pin is high or low to indicate that the corresponding LED string is active or inactive. For proper operation of an LM3466 lighting system, the COMM pin of all LM3466 should be either shorted together or connected through a diode in parallel with a resistor. Figure 15 shows an optional circuit for the COMM pin to indicate whether each LED string is active by means of small signal LEDs. The COMM pin of each LM3466 is connected to an external test point COMM_ALL through the optional circuit. The COMM pin is low if the LM3466 is under thermal protection. COMM_ALL COMM LM3466 GND Figure 15. Optional Circuit for the COMM Pin High Voltage Application For any application with the forward voltage of an LED string higher than 70 V, which is the maximum operating voltage of the LM3466, an external MOSFET circuit as shown in Figure 16 is recommended for each channel in order to protect the ILED pin from damaging by a high voltage owing to shorting LEDs (or even the whole LED string). To avoid the ILED pin damage from a high voltage generated by the leakage current, a resistor RLED (1 MΩ is suggested) is placed between the ILED pin and ground. In addition, because VLED is higher than 70 V in this case, the VIN pin cannot be directly connected to VLED. External power supplies for VIN and VG (to drive the external MOSFET) are required. Alternatively, as shown in Figure 17, a circuit for supplying VIN and VG (for all channels in the system). 10 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM3466 LM3466 www.ti.com SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013 Figure 16. External MOSFET Circuit for High Voltage Applications Figure 17. Power Supply Circuit for the External MOSFET Circuit Thermal Protection Thermal protection is implemented by an internal thermal shutdown circuit which activates at 150°C (typically) to disable the LM3466. In this case, the integrated power MOSFET turns off and the COMM pin is pulled low. Thermal protection helps prevent catastrophic failures from accidental device overheating. When the junction temperature of the LM3466 falls back below 140°C (typical hysteresis = 10°C), the LM3466 resumes normal operation. Thermal Latch Off and Derating If thermal protection cycles for 253 times consecutively, the LM3466 is latched off until power reset. Thermal derating is required for only the DDA package (but not the NEC package). When fully turned on, the integrated power MOSFET of the LM3466 is capable of conducting a current of 1.5 A below an ambient temperature of 100°C. At 125°C, the LM3466 can conduct a current of 1 A without thermal shutdown with a PCB ground plane copper area of 60 cm2, 2 oz/Cu. Figure 18 shows a thermal derating curve for the minimum conducting current of a fully turned on LM3466 integrated power MOSFET without thermal shutdown against an ambient temperature up to 125°C. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM3466 11 LM3466 SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013 www.ti.com 1.6 ILED CURRENT (A) 1.5 1.4 1.3 1.2 1.1 1.0 0 25 50 75 100 AMBIENT TEMPERATURE (°C) 125 Figure 18. Thermal Derating Curve for the eDDA-8 Package 12 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM3466 LM3466 www.ti.com SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013 APPLICATION INFORMATION Consider a LM3466 lighting system which is powered by a 1.75 A constant current power supply and consists of 5 LED strings with 14 LEDs per string. It is designed that the LED current of every LED string is 0.35 A. EXTERNAL COMPONENTS RSEN: To set the LED current of all 5 LED strings equal, the sensing resistors corresponding to all 5 LM3466 are equal. It is recommended that the nominal voltage of the SEN pin VSEN should be around 0.3 V. Therefore, RSEN is selected to be 1 Ω. As a result, VSEN should be 0.35 V if the LED current is 0.35 A. CLED: If the cable connecting the LED string is long, the parasitic inductance of the cable may generate noise. If this happens, a high quality ceramic capacitor should be connected between the ILED pin and ground. In this example, a 100 V, 1 µF ceramic capacitor is used. CIN: A high quality ceramic capacitor for decoupling should be connected from the VIN pin to ground. In this example, a 100 V, 0.01 µF ceramic capacitor is used. REQ and CEQ: The VEQ pins of all LM3466 are shorted together and then connected to ground through REQ and CEQ. Only one REQ and one CEQ are required for each LM3466 lighting system. It is recommended that REQ be 51.1 Ω and CEQ be 1 µF. PC BOARD LAYOUT To minimize the effect of noise, the ground connections of the LM3466 and the sense resistor RSEN,k should be closed. Good heat dissipation helps optimize the performance of the LM3466. The ground plane should be used to connect the exposed pad of the LM3466, which is internally connected to the LM3466 die substrate. The area of the ground plane should be extended as much as possible on the same copper layer above and below the LM3466. Using numerous vias beneath the exposed pad to dissipate heat of the LM3466 to another copper layer is also a good practice. Additional Application Circuit Figure 19. Application Circuit of a LM3466 Lighting System Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM3466 13 LM3466 SNOSB96F – JUNE 2011 – REVISED NOVEMBER 2013 www.ti.com REVISION HISTORY Changes from Revision C (May 2013) to Revision D • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 13 Changes from Revision D (MAY 2013) to Revision E Page • Changed title ......................................................................................................................................................................... 1 • Changed updated layout to TI standards ............................................................................................................................. 1 • Changed updated SIMPLIFIED APPLICATION ................................................................................................................... 1 • Added updated Thermal Table ............................................................................................................................................. 2 • Changed updated Equation 3 ............................................................................................................................................... 8 • Changed updated Equation 4 ............................................................................................................................................... 8 • Changed updated Figure 13 ................................................................................................................................................. 9 Changes from Revision E (AUGUST 2013) to Revision F • 14 Page Changed Electrical Characteristics table. Updated current sense specification. .................................................................. 3 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: LM3466 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LM3466MR/NOPB ACTIVE SO PowerPAD DDA 8 95 RoHS & Green SN Level-3-260C-168 HR -40 to 125 L3466 LM3466MRX/NOPB ACTIVE SO PowerPAD DDA 8 2500 RoHS & Green SN Level-3-260C-168 HR -40 to 125 L3466 ACTIVE NEC 7 45 RoHS & Green SN Level-1-NA-UNLIM LM3466TA/NOPB TO-220 LM3466 TA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of