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LM4431M3X-2.5/NOPB

LM4431M3X-2.5/NOPB

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SOT-23

  • 描述:

    IC VREF SHUNT 2% SOT23-3

  • 数据手册
  • 价格&库存
LM4431M3X-2.5/NOPB 数据手册
LM4431 www.ti.com SNVS103C – JUNE 2000 – REVISED APRIL 2013 LM4431 Micropower Shunt Voltage Reference Check for Samples: LM4431 FEATURES DESCRIPTION • • • • Ideal for space critical applications, the LM4431 voltage reference is available in the sub-miniature (3 mm x 1.3 mm) SOT-23 surface-mount package. The LM4431's advanced design eliminates the need for an external stabilizing capacitor while ensuring stability with any capacitive load, thus making the LM4431 easy to use. The operating current range is 100 μA to 15 mA. 1 2 Small Package: SOT-23 No Output Capacitor Required Tolerates Capacitive Loads Fixed Reverse Breakdown Voltage of 2.50V APPLICATIONS • • • • • • • Portable, Battery-Powered Equipment Data Acquisition Systems Instrumentation Process Control Energy Management Product Testing Power Supplies The LM4431 utilizes fuse and zener-zap reverse breakdown voltage trim during wafer sort to ensure that the parts have an accuracy of better than ±2.0% at 25°C. Bandgap reference temperature drift curvature correction and low dynamic impedance ensure stable reverse breakdown voltage accuracy over a wide range of operating temperatures and currents. KEY SPECIFICATIONS • • • • • Output Voltage Tolerance: 25°C: ±2.0% (Max) Low Output Noise (10 Hz to 10 kHz): 35 μVrms (Typ) Wide Operating Current Range: 100 μA to 15 mA Commercial Temperature Range: 0 to +70 °C Low Temperature Coefficient: 30 ppm/°C (Typ) Connection Diagram Top View * This pin must be left floating or connected to pin 2. Figure 1. SOT-23 Package See Package Number DBZ0003A These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated LM4431 SNVS103C – JUNE 2000 – REVISED APRIL 2013 www.ti.com Absolute Maximum Ratings (1) (2) Reverse Current 20 mA Forward Current 10 mA Power Dissipation (TA = 25°C) (3) DBZ0003A Package −65°C to +150°C Storage Temperature Lead Temperature DBZ0003A Package ESD Susceptibility (1) (2) (3) (4) 306 mW Vapor phase (60 seconds) +215°C Infrared (15 seconds) +220°C Human Body Model (4) 2 kV Machine Model (4) 200V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax − TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4431, TJmax = 125°C, and the typical thermal resistance (θJA), when board mounted, is 326°C/W for the SOT-23 package. The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. Operating Ratings (1) (2) Temperature Range (Tmin ≤ TA ≤ Tmax) Reverse Current (1) (2) 2 0°C ≤ TA ≤ +70°C LM4431-2.5 100 μA to 15 mA Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax − TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4431, TJmax = 125°C, and the typical thermal resistance (θJA), when board mounted, is 326°C/W for the SOT-23 package. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4431 LM4431 www.ti.com SNVS103C – JUNE 2000 – REVISED APRIL 2013 LM4431-2.5 Electrical Characteristics Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C. Symbol VR IRMIN Parameter Conditions Reverse Breakdown Voltage IR = 100 μA Reverse Breakdown VoltageTolerance IR = 100 μA Average Reverse Breakdown Voltage Temperature Coefficient ΔVR/ΔIR Reverse Breakdown Voltage Change with Operating Current Change LM4431M3 Limits (2) Units (Limit) ±50 mV (max) 2.500 V μA 45 Minimum Operating Current ΔVR/ΔT Typical (1) 100 μA (max) IR = 10 mA ±30 ppm/°C IR = 1 mA ±30 ppm/°C IR = 100 μA ±30 ppm/°C IRMIN ≤ IR ≤ 1 mA 0.4 1 mA ≤ IR ≤ 15 mA mV 1.0 mV (max) 1.2 mV (max) 8.0 mV (max) 25 mV (max) 2.5 mV ZR Reverse Dynamic Impedance IR = 1 mA, f = 120 Hz, IAC = 0.1 IR 1.0 Ω eN Wideband Noise IR = 100 μA, 10 Hz ≤ f ≤ 10 kHz 35 μVrms 120 ppm ΔVR t = 1000 hrs Reverse Breakdown Voltage Long Term Stability T = 25°C ±0.1°C IR = 100 μA (1) (2) Typicals are at TJ = 25°C and represent most likely parametric norm. Limits are 100% production tested at 25°C. Limits over temperature are ensured through correlation using Statistical Quality Control (SQC) methods. The limits are used to calculate AOQL. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4431 3 LM4431 SNVS103C – JUNE 2000 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics Temperature Drift for Different Average Temperature Coefficient Output Impedance vs Frequency Figure 2. Figure 3. Reverse Characteristics and Minimum Operating Current Noise Voltage Figure 4. Figure 5. Start-Up Characteristics Figure 6. Test Circuit 4 Figure 7. LM4431-2.5, RS = 30k Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4431 LM4431 www.ti.com SNVS103C – JUNE 2000 – REVISED APRIL 2013 Functional Block Diagram APPLICATIONS INFORMATION The LM4431 is a micro-power curvature-corrected 2.5V bandgap shunt voltage reference. For space critical applications, the LM4431 is available in the sub-miniature SOT-23 surface-mount package. The LM4431 has been designed for stable operation without the need of an external capacitor connected between the “+” pin and the “−” pin. If, however, a bypass capacitor is used, the LM4431 remains stable. The operating current range is 100 μA to 15 mA. The LM4431's SOT-23 package has a parasitic Schottky diode between pin 2 (−) and pin 3 (Die attach interface contact). Therefore, pin 3 of the SOT-23 package must be left floating or connected to pin 2. In a conventional shunt regulator application (Figure 8), an external series resistor (RS) is connected between the supply voltage and the LM4431. RS determines the current that flows through the load (IL) and the LM4431 (IQ). Since load current and supply voltage may vary, RS should be small enough to supply at least the minimum acceptable IQ to the LM4431 even when the supply voltage is at its minimum and the load current is at its maximum value. When the supply voltage is at its maximum and IL is at its minimum, RS should be large enough so that the current flowing through the LM4431 is less than 15 mA. RS is determined by the supply voltage, (VS), the load and operating current, (IL and IQ), and the LM4431's reverse breakdown voltage, VR. (1) Typical Applications Figure 8. Shunt Regulator Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4431 5 LM4431 SNVS103C – JUNE 2000 – REVISED APRIL 2013 www.ti.com Figure 9. Bounded amplifier reduces saturation-induced delays and can prevent succeeding stage damage. Nominal clamping voltage is ±3.9V (LM4431’s reverse breakdown voltage +2 diode VF). Figure 10. Protecting Op Amp input. The bounding voltage is ±4V with the LM4431 (LM4431’s reverse breakdown voltage + 3 diode VF). 6 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4431 LM4431 www.ti.com SNVS103C – JUNE 2000 – REVISED APRIL 2013 Figure 11. Programmable Current Source Figure 12. Precision 1 μA to 1 mA Current Sources Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4431 7 LM4431 SNVS103C – JUNE 2000 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision B (April 2013) to Revision C • 8 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 7 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM4431 PACKAGE OPTION ADDENDUM www.ti.com 30-Sep-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LM4431M3-2.5 NRND SOT-23 DBZ 3 1000 Non-RoHS & Green Call TI Level-1-260C-UNLIM 0 to 70 S2E LM4431M3-2.5/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 S2E LM4431M3X-2.5/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM 0 to 70 S2E (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
LM4431M3X-2.5/NOPB 价格&库存

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