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LM4895
1 Watt Fully Differential Audio Power Amplifier
With Shutdown Select and Fixed 6dB Gain
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FEATURES
DESCRIPTION
•
•
•
The LM4895 is a fully differential audio power
amplifier
primarily
designed
for
demanding
applications in mobile phones and other portable
communication device applications. It is capable of
delivering 1 watt of continuous average power to an
8Ω load with less than 1% distortion (THD+N) from a
5VDC power supply.
1
2
•
•
•
•
•
•
Fully Differential Amplification
Internal-Gain-Setting Resistors
Available in Space-Saving Packages Micro
SMD, VSSOP and WSON
Ultra Low Current Shutdown Mode
Can Drive Capacitive Loads up to 500 pF
Improved Pop & Click Circuitry Eliminates
Noises During Turn-On and Turn-Off
Transitions
2.2 - 5.5V Operation
No Output Coupling Capacitors, Snubber
Networks or Bootstrap Capacitors Required
Shutdown High or Low Selectivity
The LM4895 features a low-power consumption
shutdown mode. To facilitate this, Shutdown may be
enabled by either logic high or low depending on
mode selection. Driving the shutdown mode pin either
high or low enables the shutdown select pin to be
driven in a likewise manner to enable Shutdown.
Additionally, the LM4895 features an internal thermal
shutdown protection mechanism.
APPLICATIONS
•
•
•
Mobile Phones
PDAs
Portable Electronic Devices
KEY SPECIFICATIONS
•
•
•
•
Boomer audio power amplifiers were designed
specifically to provide high quality output power with a
minimal amount of external components. The
LM4895 does not require output coupling capacitors
or bootstrap capacitors, and therefore is ideally suited
for mobile phone and other low voltage applications
where minimal power consumption is a primary
requirement.
Improved PSRR at 217Hz: 80dB
Power Output at 5.0V & 1% THD: 1.0W(typ.)
Power Output at 3.3V & 1% THD: 400mW(typ.)
Shutdown Current: 0.1µA(typ.)
The LM4895 contains advanced pop & click circuitry
which eliminates noises which would otherwise occur
during turn-on and turn-off transitions.
The LM4895 has an internally fixed gain of 6dB.
Figure 1. TYPICAL APPLICATION
Figure 2. Typical Audio Amplifier Application Circuit
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
CONNECTION DIAGRAMS
9 Bump micro SMD Package
Figure 3. Top View
See Package Number YPB009
WSON Package
Figure 4. Top View
See Package Number NGZ0010B
Mini Small Outline (VSSOP) Package
Figure 5. Top View
See Package Number DGS0010A
2
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ABSOLUTE MAXIMUM RATINGS
(1) (2)
Supply Voltage
6.0V
−65°C to +150°C
Storage Temperature
−0.3V to VDD +0.3V
Input Voltage
Power Dissipation
(3)
Internally Limited
ESD Susceptibility
(4)
2000V
ESD Susceptibility
(5)
200V
Junction Temperature
150°C
Thermal Resistance
θJC (WSON)
12°C/W
θJA (WSON)
63°C/W
θJA (micro SMD)
220°C/W
θJC (VSSOP)
56°C/W
θJA (VSSOP)
190°C/W
Soldering Information
See AN-1112 "microSMD Wafers Level Chip Scale Package".
See AN-1187 "Leadless Leadframe Package (WSON)".
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which specify performance limits. This assumes that the device is within the Operating
Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication of device
performance.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature
TA. The maximum allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever
is lower. For the LM4895, see Figure 34 for additional information.
Human body model, 100pF discharged through a 1.5kΩ resistor.
Machine Model, 220pF–240pF discharged through all pins.
(2)
(3)
(4)
(5)
OPERATING RATINGS
Temperature Range
TMIN ≤ TA ≤ TMAX
−40°C ≤ TA ≤ 85°C
2.2V ≤ VDD ≤ 5.5V
Supply Voltage
ELECTRICAL CHARACTERISTICS VDD = 5V
(1) (2)
The following specifications apply for VDD = 5V and 8Ω load unless otherwise specified. Limits apply for TA = 25°C.
LM4895
Symbol
Parameter
Conditions
Typical
Limit
(3)
(4)
Units
(Limits)
IDD
Quiescent Power Supply Current
VIN = 0V, Io = 0A
4
8
mA (max)
ISD
Shutdown Current
Vshutdown = GND
0.1
1
µA (max)
Po
Output Power
THD = 1% (max); f = 1 kHz
LM4895LD, RL = 4Ω
(5)
LM4895, RL = 8Ω
THD+N
(1)
(2)
(3)
(4)
(5)
Total Harmonic Distortion+Noise
Po = 0.4 Wrms; f = 1kHz
1.4
1
0.1
W (min)
0.850
%
All voltages are measured with respect to the ground pin, unless otherwise specified.
For micro SMD only, shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase ISD by a
maximum of 2µA.
Typicals are measured at 25°C and represent the parametric norm.
Datasheet min/max specification limits are specified by design, test, or statistical analysis.
When driving 4Ω loads from a 5V supply, the LM4895LD must be mounted to a circuit board.
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ELECTRICAL CHARACTERISTICS VDD = 5V (1)(2) (continued)
The following specifications apply for VDD = 5V and 8Ω load unless otherwise specified. Limits apply for TA = 25°C.
LM4895
Symbol
Parameter
Conditions
Typical
Units
(Limits)
Limit
(3)
(4)
Vripple = 200mV sine p-p
f = 217Hz
PSRR
Power Supply Rejection Ratio
f =1kHz
f = 217Hz
f =1kHz
CMRR
(6)
(7)
Common-Mode Rejection Ratio
(6)
84
(6)
80
(7)
80
(7)
dB (min)
60
77
f =217Hz
50
dB
Unterminated input.
10Ω terminated input.
ELECTRICAL CHARACTERISTICS VDD = 3V
(1) (2)
The following specifications apply for VDD = 3V and 8Ω load unless otherwise specified. Limits apply for TA = 25°C.
LM4895
Symbol
Parameter
Conditions
Typical
(3)
Limit
(4)
Units
(Limits)
IDD
Quiescent Power Supply Current
VIN = 0V, Io = 0A
3.5
6
mA (max)
ISD
Shutdown Current
Vshutdown = GND
0.1
1
µA (max)
Po
Output Power
THD = 1% (max); f = 1kHz
0.35
W
THD+N
Total Harmonic Distortion+Noise
Po = 0.25Wrms; f = 1kHz
0.325
%
Vripple = 200mV sine p-p
f = 217Hz
PSRR
Power Supply Rejection Ratio
f = 1kHz
CMRR
(1)
(2)
(3)
(4)
(5)
(6)
Common-Mode Rejection Ratio
84
(5)
f = 217Hz
f = 1kHz
(5)
80
(6)
77
(6)
dB
75
f = 217Hz
49
dB
All voltages are measured with respect to the ground pin, unless otherwise specified.
For micro SMD only, shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase ISD by a
maximum of 2µA.
Typicals are measured at 25°C and represent the parametric norm.
Datasheet min/max specification limits are specified by design, test, or statistical analysis.
Unterminated input.
10Ω terminated input.
EXTERNAL COMPONENTS DESCRIPTION
(Figure 2)
Components
4
Functional Description
1.
CS
Supply bypass capacitor which provides power supply filtering. Refer to the POWER SUPPLY BYPASSING section for
information concerning proper placement and selection of the supply bypass capacitor.
2.
CB
Bypass pin capacitor which provides half-supply filtering.
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TYPICAL PERFORMANCE CHARACTERISTICS LD SPECIFIC CHARACTERISTICS
LM4895LD
THD+N vs Output Power
VDD = 5V, 4Ω RL
LM4895LD
THD+N vs Frequency
VDD = 5V, 4Ω RL, and Power = 1W
Figure 6.
Figure 7.
LM4895LD
Power Dissipation vs Output Power
LM4895LD
Power Derating Curve
Figure 8.
Figure 9.
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TYPICAL PERFORMANCE CHARACTERISTICS NON-LD SPECIFIC CHARACTERISTICS
6
THD+N vs Frequency
at VDD = 5V, 8Ω RL, and PWR = 400mW
THD+N vs Frequency
VDD = 3V, 8Ω RL, and PWR = 250mW
Figure 10.
Figure 11.
THD+N vs Frequency
at VDD = 3V, 4Ω RL, and PWR = 225mW
THD+N vs Frequency
VDD = 2.6V, 8Ω RL, and PWR = 150mW
Figure 12.
Figure 13.
THD+N vs Frequency
at VDD = 2.6V, 4Ω RL, and PWR = 150mW
THD+N vs Output Power
VDD = 5V, 8Ω RL
Figure 14.
Figure 15.
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TYPICAL PERFORMANCE CHARACTERISTICS NON-LD SPECIFIC
CHARACTERISTICS (continued)
THD+N vs Output Power
at VDD = 3V, 8Ω RL
THD+N vs Output Power
VDD = 3V, 4Ω RL
Figure 16.
Figure 17.
THD+N vs Output Power
at VDD = 2.6V, 8Ω RL
THD+N vs Output Power
VDD = 2.6V, 4Ω RL
Figure 18.
Figure 19.
Power Supply Rejection Ratio (PSRR) VDD = 5V
Input 10Ω Terminated
Power Supply Rejection Ratio (PSRR) VDD = 5V
Input Floating
Figure 20.
Figure 21.
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TYPICAL PERFORMANCE CHARACTERISTICS NON-LD SPECIFIC
CHARACTERISTICS (continued)
8
Power Supply Rejection Ratio (PSRR) VDD = 3V
Input 10Ω Terminated
Power Supply Rejection Ratio (PSRR) VDD = 3V
Input Floating
Figure 22.
Figure 23.
Output Power vs
Supply Voltage
Output Power vs
Supply Voltage
Figure 24.
Figure 25.
Power Dissipation vs
Output Power
Power Dissipation vs
Output Power
Figure 26.
Figure 27.
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TYPICAL PERFORMANCE CHARACTERISTICS NON-LD SPECIFIC
CHARACTERISTICS (continued)
Power Dissipation vs
Output Power
Output Power vs
Load Resistance
Figure 28.
Figure 29.
Supply Current vs Shutdown Voltage
Shutdown Low
Supply Current vs Shutdown Voltage
Shutdown High
Figure 30.
Figure 31.
Clipping (Dropout) Voltage vs
Supply Voltage
Open Loop Frequency Response
Figure 32.
Figure 33.
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TYPICAL PERFORMANCE CHARACTERISTICS NON-LD SPECIFIC
CHARACTERISTICS (continued)
10
Power Derating Curve
Noise Floor
Figure 34.
Figure 35.
Input CMRR vs Frequency
Input CMRR vs Frequency
Figure 36.
Figure 37.
PSRR vs
DC Common-Mode Voltage
PSRR vs
DC Common-Mode Voltage
Figure 38.
Figure 39.
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TYPICAL PERFORMANCE CHARACTERISTICS NON-LD SPECIFIC
CHARACTERISTICS (continued)
THD vs
Common-Mode Voltage
THD vs
Common-Mode Voltage
Figure 40.
Figure 41.
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APPLICATION INFORMATION
DIFFERENTIAL AMPLIFIER EXPLANATION
The LM4895 is a fully differential audio amplifier that features differential input and output stages. Internally this is
accomplished by two circuits: a differential amplifier and a common mode feedback amplifier that adjusts the
output voltages so that the average value remains VDD/2. The LM4895 features precisely matched internal gainsetting resistors, thus eliminating the need for external resistors and fixing the differential gain at AVD = 6dB.
A differential amplifier works in a manner where the difference between the two input signals is amplified. In most
applications, this would require input signals that are 180° out of phase with each other.
The LM4895 provides what is known as a "bridged mode" output (bridge-tied-load, BTL). This results in output
signals at Vo1 and Vo2 that are 180° out of phase with respect to each other. Bridged mode operation is different
from the single-ended amplifier configuration that connects the load between the amplifier output and ground. A
bridged amplifier design has distinct advantages over the single-ended configuration: it provides differential drive
to the load, thus doubling maximum possible output swing for a specific supply voltage. Four times the output
power is possible compared with a single-ended amplifier under the same conditions. This increase in attainable
output power assumes that the amplifier is not current limited or clipped.
A bridged configuration, such as the one used in the LM4895, also creates a second advantage over singleended amplifiers. Since the differential outputs, Vo1 and Vo2, are biased at half-supply, no net DC voltage exists
across the load. BTL configuration eliminates the output coupling capacitor required in single-supply, singleended amplifier configurations. If an output coupling capacitor is not used in a single-ended output configuration,
the half-supply bias across the load would result in both increased internal IC power dissipation as well as
permanent loudspeaker damage. Further advantages of bridged mode operation specific to fully differential
amplifiers like the LM4895 include increased power supply rejection ratio, common-mode noise reduction, and
click and pop reduction.
EXPOSED-DAP PACKAGE PCB MOUNTING CONSIDERATIONS
The LM4895's exposed-DAP (die attach paddle) package (LD) provide a low thermal resistance between the die
and the PCB to which the part is mounted and soldered. This allows rapid heat transfer from the die to the
surrounding PCB copper traces, ground plane and, finally, surrounding air. The result is a low voltage audio
power amplifier that produces 1.4W at ≤ 1% THD with a 4Ω load. This high power is achieved through careful
consideration of necessary thermal design. Failing to optimize thermal design may compromise the LM4895's
high power performance and activate unwanted, though necessary, thermal shutdown protection. The LD
package must have its DAP soldered to a copper pad on the PCB. The DAP's PCB copper pad is connected to a
large plane of continuous unbroken copper. This plane forms a thermal mass and heat sink and radiation area.
Place the heat sink area on either outside plane in the case of a two-sided PCB, or on an inner layer of a board
with more than two layers. Connect the DAP copper pad to the inner layer or backside copper heat sink area
with 4 (2x2) vias. The via diameter should be 0.012in - 0.013in with a 0.050in pitch. Ensure efficient thermal
conductivity by plating-through and solder-filling the vias.
Best thermal performance is achieved with the largest practical copper heat sink area. If the heatsink and
amplifier share the same PCB layer, a nominal 2.5in2 (min) area is necessary for 5V operation with a 4Ω load.
Heatsink areas not placed on the same PCB layer as the LM4895 should be 5in2 (min) for the same supply
voltage and load resistance. The last two area recommendations apply for 25°C ambient temperature. In all
circumstances and conditions, the junction temperature must be held below 150°C to prevent activating the
LM4895's thermal shutdown protection. The LM4895's power de-rating curve in the Typical Performance
Characteristics shows the maximum power dissipation versus temperature. Further detailed and specific
information concerning PCB layout, fabrication, and mounting an WSON package is available from Texas
Instrument's package Engineering Group under application note AN-1187.
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PCB LAYOUT AND SUPPLY REGULATION
CONSIDERATIONS FOR DRIVING 3Ω AND 4Ω LOADS
Power dissipated by a load is a function of the voltage swing across the load and the load's impedance. As load
impedance decreases, load dissipation becomes increasingly dependent on the interconnect (PCB trace and
wire) resistance between the amplifier output pins and the load's connections. Residual trace resistance causes
a voltage drop, which results in power dissipated in the trace and not in the load as desired. For example, 0.1Ω
trace resistance reduces the output power dissipated by a 4Ω load from 1.4W to 1.37W. This problem of
decreased load dissipation is exacerbated as load impedance decreases. Therefore, to maintain the highest load
dissipation and widest output voltage swing, PCB traces that connect the output pins to a load must be as wide
as possible.
Poor power supply regulation adversely affects maximum output power. A poorly regulated supply's output
voltage decreases with increasing load current. Reduced supply voltage causes decreased headroom, output
signal clipping, and reduced output power. Even with tightly regulated supplies, trace resistance creates the
same effects as poor sup-ply regulation. Therefore, making the power supply traces as wide as possible helps
maintain full output voltage swing.
POWER DISSIPATION
Power dissipation is a major concern when designing a successful amplifer, whether the amplifier is bridged or
single-ended. Equation 2 states the maximum power dissipation point for a single-ended amplifier operating at a
given supply voltage and driving a specified output load.
PDMAX=(VDD)2/(2π2RL) Single-Ended
(1)
However, a direct consequence of the increased power delivered to the load by a bridge amplifier is an increase
in internal power dissipation versus a single-ended amplifier operating at the same conditions.
PDMAX = 4 x(VDD)2/(2π2RL) Bridge Mode
(2)
Since the LM4895 has bridged outputs, the maximum internal power dissipation is 4 times that of a single-ended
amplifier. Even with this substantial increase in power dissipation, the LM4895 does not require additional
heatsinking under most operating conditions and output loading. From Equation 3, assuming a 5V power supply
and an 8Ω load, the maximum power dissipation point is 625mW. The maximum power dissipation point obtained
from Equation 3 must not be greater than the power dissipation results from Equation 2:
PDMAX = (TJMAX - TA)/θJA
(3)
The LM4895's θJA in an MUA10A package is 190°C/W. Depending on the ambient temperature, TA, of the
system surroundings, Equation 1 can be used to find the maximum internal power dissipation supported by the
IC packaging. If the result of Equation 3 is greater than that of Equation 1, then either the supply voltage must be
decreased, the load impedance increased, the ambient temperature reduced, or the θJA reduced with
heatsinking. In many cases, larger traces near the output, VDD, and GND pins can be used to lower the θJA. The
larger areas of copper provide a form of heatsinking allowing higher power dissipation. For the typical application
of a 5V power supply, with an 8Ω load, the maximum ambient temperature possible without violating the
maximum junction temperature is approximately 30°C provided that device operation is around the maximum
power dissipation point. Recall that internal power dissipation is a function of output power. If typical operation is
not around the maximum power dissipation point, the LM4895 can operate at higher ambient temperatures.
Refer to the Typical Performance Characteristics curves for power dissipation information.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply
rejection ratio (PSRR). The capacitor location on both the bypass and power supply pins should be as close to
the device as possible. A larger half-supply bypass capacitor improves PSRR because it increases half-supply
stability. Typical applications employ a 5V regulator with 10µF and 0.1µF bypass capacitors that increase supply
stability. This, however, does not eliminate the need for bypassing the supply nodes of the LM4895. Although the
LM4895 will operate without the bypass capacitor CB, although the PSRR may decrease. A 1µF capacitor is
recommended for CB. This value maximizes PSRR performance. Lesser values may be used, but PSRR
decreases at frequencies below 1kHz. The issue of CB selection is thus dependant upon desired PSRR and click
and pop performance.
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SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the LM4895 contains shutdown circuitry that is used to
turn off the amplifier's bias circuitry. In addition, the LM4895 contains a Shutdown Mode pin, allowing the
designer to designate whether the part will be driven into shutdown with a high level logic signal or a low level
logic signal. This allows the designer maximum flexibility in device use, as the Shutdown Mode pin may simply
be tied permanently to either VDD or GND to set the LM4895 as either a "shutdown-high" device or a "shutdownlow" device, respectively. The device may then be placed into shutdown mode by toggling the Shutdown Select
pin to the same state as the Shutdown Mode pin. For simplicity's sake, this is called "shutdown same", as the
LM4895 enters shutdown mode whenever the two pins are in the same logic state. The trigger point for either
shutdown high or shutdown low is shown as a typical value in the Supply Current vs Shutdown Voltage graphs in
the Typical Performance Characteristics section. It is best to switch between ground and supply for maximum
performance. While the device may be disabled with shutdown voltages in between ground and supply, the idle
current may be greater than the typical value of 0.1µA. In either case, the shutdown pin should be tied to a
definite voltage to avoid unwanted state changes.
In many applications, a microcontroller or microprocessor output is used to control the shutdown circuitry, which
provides a quick, smooth transition to shutdown. Another solution is to use a single-throw switch in conjunction
with an external pull-up resistor (or pull-down, depending on shutdown high or low application). This scheme
ensures that the shutdown pin will not float, thus preventing unwanted state changes.
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REVISION HISTORY
Changes from Revision E (April 2013) to Revision F
•
Page
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non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
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