LMK04131SQX/NOPB

LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 LMK04100 Family Clock Jitter Cleaner with Cascaded PLLs Check for Samples: LMK04100, LMK04101, LMK04102, LMK04110, LMK04111, LMK04131, LMK04133 FEATURES 1 • 23 • • • • • Cascaded PLLatinum™ PLL Architecture – PLL1 – Redundant Reference Inputs – Loss of Signal Detection – Automatic and Manual Selection of Reference Clock Input – PLL2 – Phase Detector Rate up to 100 MHz – Input Frequency-Doubler – Integrated VCO Outputs – LVPECL/2VPECL, LVDS, and LVCMOS Formats – Support Clock Rates up to 1080 MHz – Five Dedicated Channel Divider Blocks – Common Output Frequencies Supported: – 30.72 MHz, 61.44 MHz, 62.5 MHz, 74.25 MHz, 75 MHz, 77.76 MHz, 100 MHz, 106.25 MHz, 125 MHz, 122.88 MHz, 150 MHz, 155.52 MHz, 156.25 MHz, 159.375 MHz, 187.5 MHz, 200 MHz, 212.5 MHz, 245.76 MHz, 250 MHz, 311.04 MHz, 312.5 MHz, 368.64 MHz, 491.52 MHz, 622.08 MHz, 625 MHz, 983.04 MHz MICROWIRE (SPI) Programming Interface Industrial Temperature Range: -40 to 85 °C 3.15 V to 3.45 V Operation Package: 48 Pin WQFN (7.0 x 7.0 x 0.8 mm) APPLICATIONS • • • • • • • • Multi-Carrier/Multi-Mode/Multi-Band 2G/3G/4G Basestations Cellular Repeaters High Speed A/D clocking SONET/SDH OC-48/OC-192/OC-768 Line Cards GbE/10GbE, 1/2/4/8/10G Fibre Channel Line Cards Optical Transport Networks Broadcast Video, HDTV Serial ATA DESCRIPTION The LMK04100 family of precision clock conditioners provides jitter cleaning, clock multiplication and distribution without the need for high-performance VCXO modules. When connected to a recovered system reference clock and a VCXO, the device generates 5 low jitter clocks in LVCMOS, LVDS, or LVPECL formats. External VCXO or low cost crystal OSCin (Single ended or differential) Internal VCO CLKin0 CLKout4 PLL2 PLL1 CLKout3 CLKin1 CLKout2 CLK DATA CLKout1 PWire Port LE CLKout0 GOE SYNC* 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PLLatinum is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011–2012, Texas Instruments Incorporated LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com Table 1. Device Configuration Information NSID 2VPECL / LVPECL OUTPUTS LMK04100SQ LVDS OUTPUTS LVCMOS OUTPUTS VCO 3 4 1185 to 1296 MHz LMK04101SQ 3 4 1430 to 1570 MHz LMK04102SQ 3 4 1600 to 1750 MHz LMK04110SQ 5 LMK04111SQ 5 LMK04131SQ 2 2 2 1430 to 1570 MHz LMK04133SQ 2 2 2 1840 to 2160 MHz 1185 to 1296 MHz 1430 to 1570 MHz Table 2. Device Output Format Information NSID CLKout0 CLKout1 CLKout2 CLKout3 CLKout4 LMK04100SQ 2VPECL / LVPECL LVCMOS x 2 LVCMOS x 2 2VPECL / LVPECL 2VPECL / LVPECL LMK04101SQ 2VPECL / LVPECL LVCMOS x 2 LVCMOS x 2 2VPECL / LVPECL 2VPECL / LVPECL LMK04102SQ 2VPECL / LVPECL LVCMOS x 2 LVCMOS x 2 2VPECL / LVPECL 2VPECL / LVPECL LMK04110SQ 2VPECL / LVPECL 2VPECL / LVPECL 2VPECL / LVPECL 2VPECL / LVPECL 2VPECL / LVPECL LMK04111SQ 2VPECL / LVPECL 2VPECL / LVPECL 2VPECL / LVPECL 2VPECL / LVPECL 2VPECL / LVPECL LMK04131SQ LVDS 2VPECL / LVPECL LVCMOS x 2 2VPECL / LVPECL LVDS LMK04133SQ LVDS 2VPECL / LVPECL LVCMOS x 2 2VPECL / LVPECL LVDS Table 3 shows a limited list of example frequencies. Multiple output frequencies can be programmed on a single device provided that the VCO frequency and VCO divider values are the same. 2 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 Table 3. Example Configurations for Common Frequencies (1) OSCin (MHz) VCO Divider PLL2 N 25 2 30 VCO Frequency (1) Output Divider Output Frequency Application 1500 12 62.5 GigE 25 2 30 1500 10 75 SATA 24.8832 2 25 1244.16 8 77.76 SONET 25 2 24 1200 6 100 PCI Express 26.5625 7 8 1487.5 2 106.25 Fibre Channel 25 2 30 1500 6 125 GigE 25 5 12 1500 2 150 SATA 24.8832 2 25 1244.16 4 155.52 SONET 25 2 25 1250 4 156.25 10 GigE 26.5625 2 25 1275 4 159.375 10-G Fibre Channel 25 2 25 1500 4 187.5 12 GigE 25 3 16 1200 2 200 PCI Express 26.5625 3 16 1275 2 212.5 4-G Fibre Channel 25 3 20 1500 2 250 GigE 24.8832 2 25 1244.16 2 311.04 SONET 25 2 25 1250 2 312.5 XGMII 24.8832 2 25 1244.16 1 622.08 SONET 25 2 25 1200 1 625 10 GigE Use VCO Frequency to select proper device option Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 3 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com CPout1 Functional Block Diagram LOS CLKin0 CLKin0* Mux CLKin1 CLKin1* R1 Divider Phase Detector PLL1 N1 Divider CPout2 LOS0 LOS LOS1 2X Mux OSCin OSCin* R2 Divider N2 Divider Partially Integrated Loop Filter Internal VCO Phase Detector PLL2 Fout VCO Divider Distribution Path Mux CLKout4 CLKout4* Divider GOE Device Control SYNC* LD CLKout3B Mux CLKout3A Divider CLKout2B CLK DATA PWire Port Mux Control Registers CLKout2A Divider LE CLKout1 Mux CLKout1* Divider CLKout0 Mux Clock Buffers 4 Submit Documentation Feedback CLKout0* Divider Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 CLKout4* CLKout4 Vcc14 CLKout3* CLKout3 Vcc13 CLKout2* CLKout2 Vcc12 CLKout1* CLKout1 Vcc11 Connection Diagram 48 47 46 45 44 43 42 41 40 39 38 37 GND 1 36 Bias Fout 2 35 CLKin1_LOS Vcc1 3 34 CLKin0_LOS CLKuWire 4 33 Vcc10 DATAuWire 5 32 CPout2 LEuWire 6 31 Vcc9 NC 7 30 Vcc8 Vcc2 8 29 OSCin* LDObyp1 9 28 OSCin LDObyp2 10 27 SYNC* GOE 11 26 CLKin1* LD 12 25 CLKin1 18 19 20 21 22 23 24 Vcc5 CLKin0 CLKin0* Vcc6 CPout1 Vcc7 17 Vcc4 16 GND CLKout0 15 DLD_BYP 14 CLKout0* 13 Vcc3 DAP Figure 1. 48-Pin WQFN Package Top Down View PIN DESCRIPTIONS Pin Number Name(s) 1 GND 2 Fout I/O Type Description GND Ground (For Fout Buffer) O ANLG VCO Frequency Output Port PWR Power Supply for VCO Output Buffer 3 VCC1 4 CLKuWire I CMOS Microwire Clock Input 5 DATAuWire I CMOS Microwire Data Input 6 LEuWire I CMOS Microwire Latch Enable Input 7 NC 8 VCC2 PWR Power Supply for VCO No Connection 9 LDObyp1 ANLG LDO Bypass, bypassed to ground with a 10 µF capacitor 10 LDObyp2 ANLG LDO Bypass, bypassed to ground with a 0.1 µF capacitor 11 GOE I CMOS Global Output Enable 12 LD O CMOS Lock Detect and PLL multiplexer Output 13 VCC3 14 CLKout0 PWR O Copyright © 2011–2012, Texas Instruments Incorporated LVDS/LVPECL Power Supply for CLKout0 Clock Channel 0 Output Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 5 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com PIN DESCRIPTIONS (continued) (1) (2) Pin Number Name(s) I/O Type 15 CLKout0* O LVDS/LVPECL 16 DLD_BYP ANLG DLD Bypass, bypassed to ground with a 0.47 µF capacitor 17 GND GND Ground (Digital) 18 VCC4 PWR Power Supply for Digital 19 VCC5 PWR Power Supply for CLKin buffers and PLL1 R-divider 20 CLKin0 I ANLG Reference Clock Input Port for PLL1 - AC or DC Coupled (1) 21 CLKin0* I ANLG Reference Clock Input Port for PLL1 (complimentary) AC or DC Coupled (1) 22 VCC6 PWR Power Supply for PLL1 Phase Detector and Charge Pump 23 CPout1 ANLG Charge Pump1 Output 24 VCC7 PWR Power Supply for PLL1 N-Divider 25 CLKin1 I ANLG Reference Clock Input Port for PLL1 - AC or DC Coupled (1) 26 CLKin1* I ANLG Reference Clock Input Port for PLL1 (complimentary) AC or DC Coupled (2) 27 SYNC* I CMOS Global Clock Output Synchronization 28 OSCin I ANLG Reference oscillator Input for PLL2 - AC Coupled 29 OSCin* I ANLG Reference oscillator Input for PLL2 - AC Coupled 30 VCC8 PWR Power Supply for OSCin Buffer and PLL2 R-Divider 31 VCC9 PWR Power Supply for PLL2 Phase Detector and Charge Pump 32 CPout2 O ANLG Charge Pump2 Output PWR Power Supply for VCO Divider and PLL2 N-Divider O Description Clock Channel 0* Output 33 VCC10 34 CLKin0_LOS O LVCMOS Status of CLKin0 reference clock input 35 CLKin1_LOS O LVCMOS Status of CLKin1 reference clock input 36 Bias I ANLG Bias Bypass. AC coupled with 1 µF capacitor to Vcc1 37 VCC11 PWR Power Supply for CLKout1 38 CLKout1 O LVPECL/LVCMOS Clock Channel 1 Output 39 CLKout1* O LVPECL/LVCMOS Clock Channel 1* Output 40 VCC12 41 CLKout2 O LVPECL/LVCMOS PWR Clock Channel 2 Output 42 CLKout2* O LVPECL/LVCMOS Clock Channel 2* Output PWR Power Supply for CLKout2 43 VCC13 44 CLKout3 O LVPECL Clock Channel 3 Output 45 CLKout3* O LVPECL Clock Channel 3* Output PWR Power Supply for CLKout3 46 VCC14 47 CLKout4 O LVDS/LVPECL Power Supply for CLKout4 Clock Channel 4 Output 48 CLKout4* O LVDS/LVPECL Clock Channel 4* Output DAP DAP DIE ATTACH PAD, connect to GND The reference clock inputs may be either AC or DC coupled. The reference clock inputs may be either AC or DC coupled. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 6 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 Absolute Maximum Ratings (1) (2) (3) (4) Parameter Symbol Ratings Units VCC -0.3 to 3.6 V VIN -0.3 to (VCC + 0.3) V TSTG -65 to 150 °C Lead Temperature (solder 4 sec) TL +260 °C Junction Temperature TJ 125 °C Differential Input Current (CLKinX/X*, OSCin/OSCin*) IIN ±5 mA Supply Voltage (5) Input Voltage Storage Temperature Range (1) (2) (3) (4) (5) "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only to the test conditions listed. This device is a high performance RF integrated circuit with an ESD rating up to 8 KV Human Body Model, up to 300 V Machine Model and up to 1,250 V Charged Device Model and is ESD sensitive. Handling and assembly of this device should only be done at ESD-free workstations. Stresses in excess of the absolute maximum ratings can cause permanent or latent damage to the device. These are absolute stress ratings only. Functional operation of the device is only implied at these or any other conditions in excess of those given in the operation sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Never to exceed 3.6 V. Package Thermal Resistance Package 48-Lead WQFN (1) (1) θJA θJ-PAD (Thermal Pad) 27.4° C/W 5.8° C/W Specification assumes 16 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC board. These vias play a key role in improving the thermal performance of the WQFN. It is recommended that the maximum number of vias be used in the board layout. Recommended Operating Conditions Parameter Ambient Temperature Supply Voltage Symbol Condition Min Typical Max Unit TA VCC = 3.3 V -40 25 85 °C 3.15 3.3 3.45 V VCC Electrical Characteristics (3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25 °C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.) Symbol Parameter Conditions Min Typ Max Units Current Consumption ICC_PD Power Down Supply Current 0.7 LMK04100, LMK04101, LMK04102 (2) ICC_CLKS Supply Current with all clocks enabled, Fout disabled. (1) LMK04110, LMK04111 (2) LMK04131, LMK04133 (2) (1) (2) mA 380 435 378 435 335 385 mA Load conditions for output clocks: LVPECL: 50 Ω to VCC-2 V. 2VPECL: 50 Ω to VCC-2.36 V. LVDS: 100 Ω differential. LVCMOS: 10 pF. Additional test conditions for ICC limits: CLKoutX_DIV = 510, PLL1 and PLL2 locked. (See Table 34 for more information) Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 7 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com Electrical Characteristics (continued) (3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25 °C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.) Symbol Parameter Conditions Min Typ Max Units CLKin0/0* and CLKin1/1* Input Clock Specifications Clock Input Frequency fCLKin (3) SLEWCLKin Slew Rate on CLKin (4) VIDCLKin VSSCLKin Clock Input Differential Input Voltage (5) VIDCLKin Input Voltage Swing, single-ended VCLKin-offset 0.001 400 Auto-Switching mode 1 400 DC offset voltage between CLKinX/CLKinX* |CLKinX-CLKinX*| 0.5 MHz 20% to 80% 0.15 Each pin AC coupled CLKinX_TYPE=0 (Bipolar) 0.25 1.55 |V| CLKinX and CLKinX* are both driven, AC coupled. CLKinX_TYPE=0 (Bipolar) 0.5 3.1 Vpp 0.25 1.55 |V| 0.5 3.1 Vpp AC coupled to CLKinX; CLKinX* AC coupled to Ground CLKinX_TYPE=0 (Bipolar) 0.25 2.0 Vpp AC coupled to CLKinX; CLKinX* AC coupled to Ground CLKinX_TYPE=1 (MOS) 0.25 2.0 Vpp CLKinX and CLKinX* are both driven, AC coupled. CLKinX_TYPE=1 (MOS) VSSCLKin VCLKin Manual Select mode V/ns Each pin AC coupled CLKinX_TYPE=0 (Bipolar) 44 mV Each pin AC coupled CLKinX_TYPE=1 (MOS) 294 mV VCLKin-VIH High Input Voltage DC coupled to CLKinX; CLKinX* AC coupled to Ground CLKinX_TYPE=1 (MOS) 2.0 VCC V VCLKin-VIL Low Input Voltage DC coupled to CLKinX; CLKinX* AC coupled to Ground CLKinX_TYPE=1 (MOS) 0.0 0.4 V (3) (4) (5) 8 CLKin0 and CLKin1 maximum of 400 MHz is guaranteed by characterization, production tested at 200 MHz. In order to meet the jitter performance listed in the subsequent sections of this data sheet, the minimum recommended slew rate for all input clocks is 0.5 V/ns. This is especially true for single-ended clocks. Phase noise performance will begin to degrade as the clock input slew rate is reduced. However, the device will function at slew rates down to the minimum listed. When compared to single-ended clocks, differential clocks (LVDS, LVPECL) will be less susceptible to degradation in phase noise performance at lower slew rates due to their common mode noise rejection. However, it is also recommended to use the highest possible slew rate for differential clocks to achieve optimal phase noise performance at the device outputs. See Differential Voltage Measurement Terminology for definition of VID and VOD voltages. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 Electrical Characteristics (continued) (3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25 °C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.) Symbol Parameter Conditions Min Typ Max Units 40 MHz PLL1 Specifications fPD PLL1 Phase Detector Frequency ICPout1 SOURCE ICPout1 SINK PLL1 Charge Pump Source Current (6) PLL1 Charge Pump Sink Current (6) VCPout1 = VCC/2, PLL1_CP_GAIN = 100b 25 VCPout1 = VCC/2, PLL1_CP_GAIN = 101b 50 VCPout1 = VCC/2, PLL1_CP_GAIN = 110b 100 VCPout1 = VCC/2, PLL1_CP_GAIN = 111b 400 PLL1_CP_GAIN = 000b NA PLL1_CP_GAIN = 001b NA VCPout1=VCC/2, PLL1_CP_GAIN = 010b 20 VCPout1=VCC/2, PLL1_CP_GAIN = 011b 80 VCPout1=VCC/2, PLL1_CP_GAIN = 100b -25 VCPout1=VCC/2, PLL1_CP_GAIN = 101b -50 VCPout1=VCC/2, PLL1_CP_GAIN = 110b -100 VCPout1=VCC/2, PLL1_CP_GAIN = 111b -400 PLL1_CP_GAIN = 000b NA PLL1_CP_GAIN = 001b NA VCPout1=VCC/2, PLL1_CP_GAIN = 010b -20 VCPout1=VCC/2, PLL1_CP_GAIN = 011b -80 µA µA ICPout1 %MIS Charge Pump Sink / Source Mismatch VCPout1 = VCC/2, T = 25 °C 3 ICPout1VTUNE Magnitude of Charge Pump Current vs. Charge Pump Voltage Variation 0.5 V < VCPout1 < VCC - 0.5 V TA = 25 °C 4 % ICPout1 %TEMP Charge Pump Current vs. Temperature Variation 4 % PLL1 ICPout1 TRI Charge Pump TRI-STATE Leakage Current 0.5 V < VCPout < VCC - 0.5 V 10 5 % nA PLL2 Reference Input (OSCin) Specifications fOSCin PLL2 Reference Input EN_PLL2_REF 2X = 0 250 (8) (7) EN_PLL2_REF 2X = 1 SLEWOSCin PLL2 Reference Clock minimum slew rate on OSCin VIDOSCin Differential voltage swing VSSOSCin VOSCin (6) (7) (8) (9) 20% to 80% (9) AC coupled Single-ended Input Voltage for OSCin or OSCin* AC coupled; Unused pin AC coupled to GND MHz 50 0.15 0.5 V/ns 0.2 1.55 |V| 0.4 3.1 Vpp 0.2 2.0 Vpp This parameter is programmable FOSCin maximum frequency guaranteed by characterization. Production tested at 200 MHz. The EN_PLL2_REF2X bit (Register 13) enables/disables a frequency doubler mode for the PLL2 OSCin path. See Differential Voltage Measurement Terminology for definition of VID and VOD voltages. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 9 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com Electrical Characteristics (continued) (3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25 °C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.) Symbol Parameter Conditions Min Typ Max Units Crystal Oscillator Mode Specifications fXTAL Crystal Frequency Range ESR Crystal Effective Series Resistance 6 MHz < FXTAL < 20 MHz 6 PXTAL Crystal Power Dissipation CIN Input Capacitance of LMK041xx OSCin port (10) Vectron VXB1 crystal, 12.288 MHz, RESR < 40 Ω -40 to +85 °C 20 MHz 100 Ohms 200 µW 6 pF PLL2 Phase Detector and Charge Pump Specifications fPD Phase Detector Frequency ICPoutSOURCE ICPoutSINK PLL2 Charge Pump Source Current (6) PLL2 Charge Pump Sink Current (6) 100 VCPout2=VCC/2, PLL2_CP_GAIN = 00b 100 VCPout2=VCC/2, PLL2_CP_GAIN = 01b 400 VCPout2=VCC/2, PLL2_CP_GAIN = 10b 1600 VCPout2=VCC/2, PLL2_CP_GAIN = 11b 3200 VCPout2=VCC/2, PLL2_CP_GAIN = 00b -100 VCPout2=VCC/2, PLL2_CP_GAIN = 01b -400 VCPout2=VCC/2, PLL2_CP_GAIN = 10b -1600 VCPout2=VCC/2, PLL2_CP_GAIN = 11b -3200 MHz µA µA ICPout2%MIS Charge Pump Sink/Source Mismatch VCPout2=VCC/2, TA = 25 °C 3 ICPout2VTUNE Magnitude of Charge Pump Current vs. Charge Pump Voltage Variation 0.5 V < VCPout2 < VCC - 0.5 V TA = 25 °C 4 % ICPout2%TEMP Charge Pump Current vs. Temperature Variation 4 % ICPout2TRI Charge Pump Leakage 0.5 V < VCPout2 < VCC - 0.5 V 10 10 % nA Internal VCO Specifications fVCO PVCO VCO Tuning Range VCO Output power to a 50 Ω load driven by Fout LMK041x0 1185 1296 LMK041x1 1430 1570 LMK041x2 1600 1750 LMK041x3 1840 2160 LMK041x0, TA = 25 °C, singleended 3 LMK041x1, TA = 25 °C, singleended 3 LMK041x2, TA = 25 °C, singleended 2 LMK041x3, TA = 25 °C, singleended 1840 MHz 0 LMK041x3, TA = 25 °C, singleended 2160 MHz -5 MHz dBm (10) See Application Section discussion of Crystal Power Dissipation. 10 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 Electrical Characteristics (continued) (3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25 °C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.) Symbol KVCO |ΔTCL| Parameter Conditions Fine Tuning Sensitivity (The range displayed in the typical column indicates the lower sensitivity is typical at the lower end of the tuning range, and the higher tuning sensitivity is typical at the higher end of the tuning range). Min Typ LMK041x0 7 to 9 LMK041x1 8 to 11 LMK041x2 9 to 14 LMK041x3 14 to 26 After programming R15 for lock, no changes to output configuration are permitted to guarantee continuous lock Allowable Temperature Drift for Continuous Lock (11) Max Units MHz/V 125 °C CLKout's Internal VCO Closed Loop Jitter Specifications using a Commercial Quality VCXO JCLKout 12 kHz–20MHz LMK041x0/ LMK041x1/ LMK041x2/ fCLKout = 122.88 MHz Integrated RMS Jitter LMK041x3 fCLKout = 122.88 MHz Integrated RMS Jitter JCLKout 1.875–20MHz LMK041x0/ LMK041x1/ LMK041x3/ fCLKout = 153.6 MHz Integrated RMS Jitter LVDS 160 LVPECL 1600 mVpp 150 LVCMOS 140 LVDS 170 LVPECL 1600 mVpp 160 LVCMOS 150 LVDS 90 LVPECL 1600 mVpp 80 LVCMOS 75 fs fs fs Digital Inputs (CLKuWire, DATAuWire, LEuWire) VIH High-Level Input Voltage 1.6 VIL Low-Level Input Voltage IIH High-Level Input Current VIH = VCC IIL Low-Level Input Current VIL = 0 VIH High-Level Input Voltage VIL Low-Level Input Voltage IIH High-Level Input Current VIH = VCC IIL Low-Level Input Current VIL = 0 VCC V 0.4 V -5 25 µA -5.0 5.0 µA 1.6 VCC V 0.4 V -5.0 5.0 µA -40.0 5.0 µA Digital Inputs (GOE, SYNC*) Digital Outputs (CLKinX_LOS, LD) VOH High-Level Output Voltage IOH = -500 µA VOL Low-Level Output Voltage IOL = 500 µA VCC - 0.4 V 0.4 V Default Power On Reset Clock Output Frequency fCLKout-startup Default output clock frequency at device power on CLKout2, LM041x0 50 CLKout2, LM041x1 62 CLKout2, LM041x2 68 CLKout2, LM041x3 81 MHz (11) Maximum Allowable Temperature Drift for Continuous Lock is how far the temperature can drift in either direction from the value it was at the time that the R0 register was last programmed, and still have the part stay in lock. The action of programming the R0 register, even to the same value, activates a frequency calibration routine. This implies the part will work over the entire frequency range, but if the temperature drifts more than the maximum allowable drift for continuous lock, then it will be necessary to reload the R0 register to ensure it stays in lock. Regardless of what temperature the part was initially programmed at, the temperature can never drift outside the frequency range of -40 °C to 85 °C without violating specifications. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 11 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com Electrical Characteristics (continued) (3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25 °C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.) Symbol Parameter Conditions Min Typ Max Units LVDS Clock Outputs (CLKoutX) fCLKout TSKEW VOD VSS Maximum Frequency RL = 100 Ω CLKoutX to CLKoutY LVDS-LVDS, T = 25 °C, FCLK = 800 MHz, RL= 100 Ω (12) 1080 Differential Output Voltage (13) R = 100 Ω differential termination, AC coupled to receiver input, FCLK = 800 MHz, T = 25 °C MHz 30 ps 250 350 450 |mV| 500 700 900 mVpp 50 mV 1.375 V 35 |mV| ΔVOD Change in Magnitude of VOD for complementary output states VOS Output Offset Voltage ΔVOS Change in VOS for complementary output states ISA ISB Output short circuit current - single Single-ended output shorted to ended GND, T = 25 °C -24 24 mA ISAB Output short circuit current differential -12 12 mA TSKEW CLKoutX to CLKoutY (12) Output High Voltage VOL Output Low Voltage VOD Output Voltage (13) 1.25 (14) Maximum Frequency VOH VSS 1.125 Complimentary outputs tied together LVPECL Clock Outputs (CLKoutX) fCLKout -50 1080 MHz LVPECL-to-LVPECL, T = 25 °C, FCLK = 800 MHz, each output terminated with 120 Ω to GND. FCLK = 100 MHz, T = 25 °C Termination = 50 Ω to VCC - 2 V 40 ps VCC 0.93 V VCC 1.82 V 660 890 965 |mV| 1320 1780 1930 mVpp (12) Equal loading and identical channel configuration on each channel is required for specification to be valid. (13) See Differential Voltage Measurement Terminology for definition of VID and VOD voltages. (14) LVPECL/2VPECL is programmable for all NSIDs. 12 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 Electrical Characteristics (continued) (3.15 V ≤ VCC ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C. Typical values represent most likely parametric norms at VCC = 3.3 V, TA = 25 °C, at the Recommended Operating Conditions at the time of product characterization and are not guaranteed.) Symbol Parameter Conditions Min Typ Max Units 2VPECL Clock Outputs (CLKoutX) fCLKout TSKEW Maximum Frequency CLKoutX to CLKoutY (15) VOH Output High Voltage VOL Output Low Voltage VOD Output Voltage VSS 1080 MHz 2VPECL-2VPECL, T=25 °C, FCLK = 800 MHz, each output terminated with 120 Ω to GND. FCLK = 100 MHz, T = 25 °C Termination = 50 Ω to VCC - 2 V (16) 40 ps VCC 0.95 V VCC 1.98 V 800 1030 1200 |mV| 1600 2060 2400 mVpp LVCMOS Clock Outputs (CLKoutX) fCLKout Maximum Frequency 5 pF Load 250 VOH Output High Voltage 1 mA Load VCC - 0.1 MHz VOL Output Low Voltage 1 mA Load IOH Output High Current (Source) VCC = 3.3 V, VO = 1.65 V 28 mA IOL Output Low Current (Sink) VCC = 3.3 V, VO = 1.65 V 28 mA TSKEW Skew between any two LVCMOS outputs, same channel or different channel RL = 50 Ω, CL = 10 pF, T = 25 °C, FCLK = 100 MHz. DUTYCLK Output Duty Cycle VCC/2 to VCC/2, FCLK = 100 MHz, T = 25 °C (17) TR Output Rise Time 20% to 80%, RL = 50 Ω, CL = 5 pF 400 ps TF Output Fall Time 80% to 20%, RL = 50 Ω, CL = 5 pF 400 ps LVPECL to LVDS skew Same device, T = 25 °C, 250 MHz -230 ps LVDS to LVCMOS skew Same device, T = 25 °C, 250 MHz 770 ps LVCMOS to LVPECL skew Same device, T = 25 °C, 250 MHz -540 ps V 0.1 (15) 45 50 V 100 ps 55 % Mixed Clock Skew TSKEW ChanX ChanY Microwire Interface Timing TCS Data to Clock Setup Time See MICROWIRE Input Timing 25 ns TCH Data to Clock Hold Time See MICROWIRE Input Timing 8 ns TCWH Clock Pulse Width High See MICROWIRE Input Timing 25 ns TCWL Clock Pulse Width Low See MICROWIRE Input Timing 25 ns TES Clock to Latch Enable Setup Time See MICROWIRE Input Timing 25 ns TCES Enable to Clock Setup See MICROWIRE Input Timing 25 ns TEW Load Enable Pulse Width See MICROWIRE Input Timing 25 ns (15) Equal loading and identical channel configuration on each channel is required for specification to be valid. (16) See Differential Voltage Measurement Terminology for definition of VID and VOD voltages. (17) Guaranteed by characterization. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 13 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com Serial Data Timing Diagram MSB DATAuWire D27 LSB D26 D25 D24 D23 D0 A3 A2 A1 A0 CLKuWire tCES tCS tCH tCWH tES tCWL LEuWire tEWH Register programming information on the DATAuWire pin is clocked into a shift register on each rising edge of the CLKuWire signal. On the rising edge of the LEuWire signal, the register is sent from the shift register to the register addressed. A slew rate of at least 30 V/µs is recommended for these signals. After programming is complete the CLKuWire, DATAuWire, and LEuWire signals should be returned to a low state. If the CLKuWire or DATAuWire lines are toggled while the VCO is in lock, as is sometimes the case when these lines are shared with other parts, the phase noise may be degraded during this programming. Figure 2. Charge Pump Current Specification Definitions I1 = Charge Pump Sink Current at VCPout = VCC - ΔV I2 = Charge Pump Sink Current at VCPout = VCC/2 I3 = Charge Pump Sink Current at VCPout = ΔV I4 = Charge Pump Source Current at VCPout = VCC - ΔV I5 = Charge Pump Source Current at VCPout = VCC/2 I6 = Charge Pump Source Current at VCPout = ΔV ΔV = Voltage offset from the positive and negative supply rails. Defined to be 0.5 V for this device. 14 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 CHARGE PUMP OUTPUT CURRENT MAGNITUDE VARIATION VS. CHARGE PUMP OUTPUT VOLTAGE CHARGE PUMP SINK CURRENT VS. CHARGE PUMP OUTPUT SOURCE CURRENT MISMATCH CHARGE PUMP OUTPUT CURRENT MAGNITUDE VARIATION VS. TEMPERATURE Differential Voltage Measurement Terminology The differential voltage of a differential signal can be described by two different definitions causing confusion when reading datasheets or communicating with other engineers. This section will address the measurement and description of a differential signal so that the reader will be able to understand and discern between the two different definitions when used. The first definition used to describe a differential signal is the absolute value of the voltage potential between the inverting and non-inverting signal. The symbol for this first measurement is typically VID or VOD depending on if an input or output voltage is being described. The second definition used to describe a differential signal is to measure the potential of the non-inverting signal with respect to the inverting signal. The symbol for this second measurement is VSS and is a calculated parameter. Nowhere in the IC does this signal exist with respect to ground, it only exists in reference to its differential pair. VSS can be measured directly by oscilloscopes with floating references, otherwise this value can be calculated as twice the value of VOD as described in the first description. Figure 11 illustrates the two different definitions side-by-side for inputs and Figure 12 illustrates the two different definitions side-by-side for outputs. The VID and VOD definitions show VA and VB DC levels that the non-inverting and inverting signals toggle between with respect to ground. VSS input and output definitions show that if the inverting signal is considered the voltage potential reference, the non-inverting signal voltage potential is now increasing and decreasing above and below the non-inverting reference. Thus the peak-to-peak voltage of the differential signal can be measured. VID and VOD are often defined as volts (V) and VSS is often defined as volts peak-to-peak (VPP). VID Definition VSS Definition for Input Non-Inverting Clock VA 2· VID VID VB Inverting Clock VID = | VA - VB | VSS = 2· VID GND Figure 3. Two Different Definitions for Differential Input Signals Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 15 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com VOD Definition VSS Definition for Output Non-Inverting Clock VA 2· VOD VOD VB Inverting Clock VOD = | VA - VB | VSS = 2· VOD GND Refer to application note AN-912 Common Data Transmission Parameters and their Definitions (SNLA036) for more information. Figure 4. Two Different Definitions for Differential Output Signals 16 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 Typical Performance Characteristics CLOCK OUTPUT AC CHARACTERISTICS LVPECL VOD vs. Frequency DIFFERENTIAL P-P VOLTAGE (mV) DIFFERENTIAL P-P VOLTAGE (mV) LVDS VOD vs. Frequency 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 300 600 900 1.2k 1.5k 2.5 2.0 LV2PECL Mode 1.5 1.0 NORMAL Mode 0.5 0.0 0 1.8k 400 5 1.2k 1.6k 2k Figure 5. Figure 6. LVCMOS Vpp vs. Frequency Typical Dynamic ICC, LVCMOS Driver, VCC = 3.3 V, Temp = 25 °C, CL= 5 pF No Load 10 pF Load 22 pF Load 4 3 2 47 pF Load 1 800 FREQUENCY (MHz) ICC (mA) SINGLE-ENDED P-P VOLTAGE (V) FREQUENCY (MHz) 40 35 30 25 20 15 10 5 0 100 pF Load 0 0 100 200 300 400 500 0 FREQUENCY (MHz) 50 100 150 200 250 300 350 400 FREQUENCY (MHz) Figure 7. Figure 8. NOISE FLOOR (dBc/Hz) Clock Output Noise Floor vs. Frequency -130 -135 -140 LVPECL (differential) -145 -150 LVDS (differential) -155 -160 -165 -170 LVCMOS 10 100 1000 FREQUENCY (MHz) To estimate this noise, only the output frequency is required. Divide value and input frequency are not relevant. Figure 9. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 17 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com FEATURES SYSTEM ARCHITECTURE The cascaded PLL architecture of the LMK041xx was chosen to provide the lowest jitter performance over the widest range of output frequencies and phase noise offset frequencies. The first stage PLL (PLL1) is used in conjunction with an external reference clock and an external VCXO to provide a frequency accurate, low phase noise reference clock for the second stage frequency multiplication PLL (PLL2). PLL1 typically uses a narrow loop bandwidth (10 Hz to 200 Hz) to retain the frequency accuracy of the reference clock input signal while at the same time suppressing the higher offset frequency phase noise that the reference clock may have accumulated along its path or from other circuits. The “cleaned” reference clock frequency accuracy is combined with the low phase noise of an external VCXO to provide the reference input to PLL2. The low phase noise reference provided to PLL2 allows it to use wider loop bandwidths (50 kHz to 200 kHz). The chosen loop bandwidth for PLL2 should take best advantage of the superior high offset frequency phase noise profile of the internal VCO and the good low offset frequency phase noise of the reference VCXO for PLL2. Low jitter is achieved by allowing the external VCXO’s phase noise to dominate the final output phase noise at low offset frequencies and the internal VCO’s phase noise to dominate the final output phase noise at high offset frequencies. This results in best overall phase noise and jitter performance. REDUNDANT REFERENCE INPUTS (CLKin0/CLKin0*, CLKin1/CLKin1*) The LMK041xx has two LVDS/LVPECL/LVCMOS compatible reference clock inputs for PLL1, CLKin0 and CLKin1. The selection of the preferred input may be fixed to either CLKin0 or CLKin1, or may be configured to employ one of two automatic switching modes when redundant clock signals are present. The PLL1 reference clock input buffers may also be individually configured as either a CMOS buffered input or a bipolar buffered input. PLL1 CLKinX (X=0,1) LOSS OF SIGNAL (LOS) When either of the two auto-switching modes is selected for the reference clock input mode, the signal status of the selected reference clock input is indicated by the state of the CLKinX_LOS (loss-of-signal) output. These outputs may be configured as either CMOS (active HIGH on loss-of-signal), NMOS open-drain or PMOS opendrain. If PLL1 was originally locked and then both reference clocks go away, then the frequency accuracy of the LMK04100 device will be set by the absolute tuning range of the VCXO used on PLL1. The absolute tuning range of the VCXO can be determined by multiplying its' tuning constant by the charge pump voltage. INTEGRATED LOOP FILTER POLES The LMK041xx features programmable 3rd and 4th order loop filter poles for PLL2. When enabled, internal resistors and capacitor values may be selected from a fixed range of values to achieve either 3rd or 4th order loop filter response. These programmable components compliment external components mounted near the chip. CLOCK DISTRIBUTION The LMK041xx features a clock distribution block with a minimum of five outputs that are a mixture of LVPECL, 2VPECL, LVDS, and LVCMOS. The exact combination is determined by the part number. The 2VPECL is a Texas Instruments proprietary configuration that produces a 2 Vpp differential swing for compatibility with many data converters. More than five outputs may be available for device versions that offer dual LVCMOS outputs. CLKout DIVIDE (CLKoutX_DIV, X = 0 to 4) Each individual clock distribution channel includes a channel divider. The range of divide values is 2 to 510, in steps of 2. “Bypass” mode operates as a divide-by-1. GLOBAL CLOCK OUTPUT SYNCHRONIZATION (SYNC*) The SYNC* input is used to synchronize the active clock outputs. When SYNC* is held in a logic low state, the outputs are also held in a logic low state. When SYNC* goes high, the clock outputs are activated and will transition to a high state simultaneously with one another. 18 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 SYNC* must be held low for greater than one clock cycle of the Clock Distribution Path. After this low event has been registered, the outputs will not reflect the low state for four more cycles. Similarly after SYNC* becomes high, the outputs will simultaneously transition high after four Clock Distribution Path cycles have passed. See Figure 10 for further detail. Distribution Path SYNC* CLKout0 CLKout1 CLKout2 Figure 10. Clock Output synchronization using the SYNC* pin GLOBAL OUTPUT ENABLE AND LOCK DETECT Each Clock Output Channel may be either enabled or put into a high impedance state via the Clock Output Enable control bit (one for each channel). Each output enable control bit is gated with the Global Output Enable input pin (GOE). The GOE pin provides an internal pull-up so that if it is un-terminated externally, then the clock output states are determined by the Clock Channel Output Enable Register bits. All clock outputs can be disabled simultaneously if the GOE pin is pulled low by an external signal. Table 4. Clock Output Control CLKoutX _EN bit EN_CLKout _Global bit GOE pin CLKoutX Output State 1 1 Low Low Don't care 0 Don't care Off 0 Don't care Don't care Off 1 1 High / No Connect Enabled The Lock Detect (LD) signal can be connected to the GOE pin in which case all outputs are disabled automatically if the synthesizer is not locked. See EN_CLKoutX: Clock Channel Output Enable and also SYSTEM LEVEL DIAGRAM for actual implementation details. The Lock Detect (LD) pin can be programmed to output a ‘High’ when both PLL1 and PLL2 are locked, or only when PLL1 is locked or only when PLL2 is locked. Functional Description ARCHITECTURAL OVERVIEW The LMK041xx chip consists of two high performance synthesizer blocks (Phase Locked Loop, internal VCO/VCO Divider, and loop filter), source selection, distribution system, and independent clock output channels. The Phase Frequency Detector in PLL1 compares the divided (R Divider 1) system clock signal from the selected CLKinX and CLKinX* input with the divided (N Divider 1) output of the external VCXO attached to the PLL2 OSCin port. The external loop filter for PLL1 should be narrow to provide an clean reference clock from the external VCXO to the OSCin/OSCin* pins for PLL2. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 19 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com The Phase Frequency Detector in PLL2 then compares the divided (R Divider 2) reference signal from the PLL2 OSCin port with the divided (N Divider 2 and VCO Divider) output of the internal VCO. The bandwidth of the external loop filter for PLL2 should be designed to be wide enough to take advantage of the low in-band phase noise of PLL2 and the low high offset phase noise of the internal VCO. The VCO output is passed through a common VCO divider block and placed on a distribution path for the clock distribution section. It is also routed to the PLL2_N counter. Each clock output channel allows the user to select a path with a programmable divider block, a phase synchronization circuit, and LVDS/LVPECL/2VPECL/LVCMOS compatible output buffers. PHASE DETECTOR 1 (PD1) Phase Detector 1 in PLL1 (PD1) can operate up to 40 MHz. Since a narrow loop bandwidth should be used for PLL1, the need to operate at high phase detector rate to lower the in-band phase noise becomes unnecessary. PHASE DETECTOR 2 (PD2) Phase Detector 2 in PLL2 (PD2) supports a maximum comparison rate of 100 MHz, though the actual maximum frequency at the input port (PLL2 OSCin/OSCin*) is 250 MHz. Operating at highest possible phase detector rate will ensure low in-band phase noise for PLL2 which in turn produces lower total jitter, as the in-band phase noise from the reference input and PLL are proportional to N2. PLL2 FREQUENCY DOUBLER The PLL2 reference input at the OSCin port may be optionally routed through a frequency doubler function rather than through the PLL2_R counter. The maximum phase comparison frequency of the PLL2 phase detector is 100 MHz, so the input to the frequency doubler is limited to a maximum of 50 MHz. The frequency doubler feature allows the phase comparison frequency to be increased when a relative low frequency oscillator is driving the OSCin port. By doubling the PLL2 phase comparison frequency, the in-band PLL2 noise is reduced by about 3 dB. INPUTS / OUTPUTS PLL1 Reference Inputs (CLKin0 / CLKin0*, CLKin1 / CLKin1*) The reference clock inputs for PLL1 may be selected from either CLKin0 and CLKin1. The user has the capability to manually select one of the two inputs or to configure an automatic switching mode operation. A detailed description of this function is described in the uWire programming section of this data sheet. PLL2 OSCin / OSCin* Port The feedback from the external oscillator being locked with PLL1 is injected to the PLL2 OSCin/OSCin* pins. This input may be driven with either an AC coupled single-ended or AC coupled differential signal. If operated in single ended mode, the unused input should be tied to GND with a 0.1 µF capacitor. Internal to the chip, this signal is routed to the PLL1_N Counter and to the reference input for PLL2. The internal circuitry of the OSCin port also supports the optional implementation of a crystal based oscillator circuit. A crystal, varactor diode and a small number of other external components may be used to implement the oscillator. The internal oscillator circuit is enabled by setting the EN_PLL2_XTAL bit. CPout1 / CPout2 The CPout1 pin provides the charge pump current output to drive the loop filter for PLL1. This loop filter should be configured so that the total loop bandwidth for PLL1 is less than 200 Hz. When combined with an external oscillator that has low phase noise at offsets close to the carrier, PLL1 generates a reference for PLL2 that is frequency locked to the PLL1 reference clock but has the phase noise performance of the oscillator. The CPout2 pin provides the charge pump current output to drive the loop filter for PLL2. This loop filter should be configured so that the total loop bandwidth for PLL2 is in the range of 50 kHz to 200 kHz. See the section on uWire device control for a description of the charge pump current gain control. Fout The buffered output of the internal VCO is available at the Fout pin. This is a single-ended output (sinusoid). Each time the PLL2_N counter value is updated via the uWire interface, an internal algorithm is triggered that optimizes the VCO performance. 20 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 Digital Lock Detect 1 Bypass The VCO coarse tuning algorithm requires a stable OSCin clock (reference clock to PLL2) to frequency calibrate the internal VCO correctly. In order to ensure a stable OSCin clock, the first PLL must achieve lock status. A digital lock detect is used in PLL1 to monitor its lock status. After lock is achieved by PLL1, the coarse tuning circuitry is enabled and frequency calibration for the internal VCO begins. The (DLD_BYP) pin is provided to allow an external bypass cap to be connected to the digital lock detect 1. This capacitor will eliminate potential glitches at initial startup of PLL1 due to unknown phase relationships between the Ncntr1 and Rcntr1. Bias Proper bypassing of this pin by a 1 µF capacitor connected to VCC is important for low noise performance. General Programming Information LMK041xx devices are programmed using several 32-bit registers. Each register consists of a 4-bit address field and 28-bit data field. The address field is formed by bits 0 through 3 (LSBs) and the data field is formed by bits 4 through 31 (MSBs). The contents of each register are clocked in MSB first (bit 31), and the LSB (bit 0) last. During programming, the LE signal should be held LOW. The serial data is clocked in on the rising edge of the CLK signal. After the LSB (bit 0) is clocked in the LE signal should be toggled LOW-to-HIGH-to-LOW to latch the contents into the register selected in the address field. Registers R0-R4, R7, and R8-R15 must be programmed in order to achieve proper device operation. Figure 11 illustrates the serial data timing sequence. MSB DATAuWire D27 LSB D26 D25 D24 D23 D0 A3 A2 A1 A0 CLKuWire tCES tCS tCH tCWH tCWL tES LEuWire tEWH Figure 11. uWire Timing Diagram To achieve proper frequency calibration, the OSCin port must be driven with a valid signal before programming Register 15. Changes to PLL2_R Counter or the OSCin port signal require Register 15 to be reloaded in order to activate the frequency calibration process. RECOMMENDED PROGRAMMING SEQUENCE The recommended programming sequence involves programming R7 with the reset bit set to 1 (Reg. 7, bit 4) to ensure the device is in a default state. If R7 is programmed again, the reset bit should be set to 0. Registers are programmed in order with R15 being the last register programmed. An example programming sequence is shown below: • Program R7 with the RESET bit = 1 (b4 = 1). This ensures that the device is configured with default settings. When RESET = 1, all other R7 bits are ignored. – If R7 is programmed again during the initial configuration of the device, the RESET bit should be cleared (b4 = 0) • Program R0 through R4 as necessary to configure the clock outputs as desired. These registers configure clock channel functions such as the channel multiplexer output selection, divide value, and enable/disable bit. • Program R5 and R6 with the default values shown in the register map on the following pages. • Program R7 with RESET = 0. • Program R8 through R10 with the default values shown in the register map on the following pages. • Program R11 to configure the reference clock inputs (CLKin0 and CLKin1). – type, LOS timeout, LOS type, and mode (manual or auto-switching) • Program R12 to configure PLL1. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 21 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 • www.ti.com – Charge pump gain, polarity, R counter and N counter Program R13 through R15 to configure PLL2 parameters, crystal mode options, and certain globally asserted functions. The following table provides the register map for device programming: 22 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 Table 5. Register Map Register 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 1 CLKout0_PECL_LVL R1 0 0 0 0 0 0 0 1 CLKout1_PECL_LVL R2 0 0 0 0 0 0 0 1 CLKout2_PECL_LVL R3 0 0 0 0 0 0 0 1 R4 0 0 0 0 0 0 0 1 R5 0 0 0 0 0 0 0 0 R6 0 0 0 0 1 0 0 0 0 0 0 0 CLKout0_ MUX CLKout1_ MUX [1:0] CLKout2_ MUX [1:0] CLKout3_ MUX [1:0] CLKout4_ MUX [1:0] EN_CLKout0 0 CLKout0_DIV [7:0] 0 0 0 0 0 0 0 0 EN_CLKout1 0 0 A 0 CLKout1_DIV [7:0] 0 0 0 0 0 0 0 1 EN_CLKout2 0 1 A 1 CLKout2_DIV [7:0] 0 0 0 0 0 0 1 0 EN_CLKout3 0 2 A 2 CLKout3_DIV [7:0] 0 0 0 0 0 0 1 1 EN_CLKout4 0 CLKout3A_STATE [1:0] CLKout2A_STATE [1:0] CLKout1A_STATE [1:0] 0 CLKout3B_STATE [1:0] CLKout2B_STATE [1:0] CLKout1B_STATE [1:0] 0 3 A 3 CLKout4_DIV [7:0] 0 0 0 0 0 1 0 0 CLKout4_PECL_LVL R0 CLKout3_PECL_LVL Data [31:4] 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 1 1 0 Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 Submit Documentation Feedback 23 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 R7 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 RESET 0 1 1 1 R8 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 R9 0 0 0 0 0 0 0 0 1 0 1 0 0 0 1 0 0 0 1 0 1 0 1 0 0 0 0 0 1 0 0 1 R10 0 0 RC_DLD1_Start 0 0 0 0 1 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 1 0 R11 0 0 0 0 0 0 0 0 0 1 1 0 0 1 0 1 0 0 0 0 CLKin1_BUFTYPE CLKin0_BUFTYPE 1 0 1 1 R12 1 1 0 0 R13 0 0 0 1 1 0 1 R14 0 0 0 1 1 1 0 R15 0 0 0 1 1 1 1 24 PLL1_CP_ GAIN [2:0] 1 PLL2_CP_GAIN [1:0] OSCin_FREQ [7:0] Submit Documentation Feedback VCO_DIV [3:0] 0 0 PLL_MUX [4:0] PLL1 CP TRI-STATE 0 PLL2 CP TRI-STATE 0 EN_PLL2_REF2X 1 POWER DOWN, default = 0 0 PLL1_N Counter [11:0] EN_CLKout_Global, default=1 1 EN_Fout 0 EN_PLL2_XTAL PLL1_R Counter [11:0] CLKin_SEL [1:0] 29 LOS_TYPE [1:0] 30 LOS_TIMEOUT [1:0] 31 PLL1_CP_POL Table 5. Register Map (continued) Register PLL2_R4_LF [2:0] PLL2_R3_LF [2:0] PLL2_R Counter [11:0] PLL2_N Counter [17:0] PLL2_C3_C4_LF [3:0] Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 DEFAULT DEVICE REGISTER SETTINGS AFTER POWER ON/RESET Table 6 illustrates the default register settings programmed in silicon for the LMK041xx after power on or asserting the reset bit. Table 6. Default Device Register Settings after Power On/Reset Field Name Default Value (decimal) Default State Field Description Register Bit Location (MSB:LSB) CLKoutX_PECL_LVL 0 2VPECL disabled This bit sets LVPECL clock level. Valid when the clock channel is configured as LVPECL/2VPECL; otherwise, not relevant. R0 to R4 23 CLKoutXB_STATE 0 Inverted This field sets the state of output B of an LVCMOS Clock channel. R1 to R3 22:21 CLKoutXA_STATE 1 Non-Inverted This field sets the state of output A of an LVCMOS Clock channel. R1 to R3 20:19 EN_CLKoutX 0 OFF Clock Channel enable bit. Note: The state of CLKout2 is ON by default. R0 to R4 16 R5,R6,R8 R9,R10 NA Forces the VCO tuning algorithm state machine to wait until PLL1 is locked. R10 29 (1) Reserved Registers (1) RC_DLD1_Start 1 Enabled CLKin1_BUFTYPE 1 MOS mode CLKin1 Input Buffer Type R11 11 CLKin0_BUFTYPE 1 MOS mode CLKin0 Input Buffer Type R11 10 LOS_TIMEOUT 1 3 MHz (min.) Selects Lower Reference Clock input frequency for LOS Detection. R11 9:8 LOS_TYPE 3 CMOS Selects LOS output type R11 7:6 CLKin_SEL 0 CLKin0 Selects Reference Clock source R11 5:4 PLL1 CP Polarity 1 Positive polarity Selects the charge pump output polarity, i.e., the tuning slope of the external VCXO R12 31 PLL1_CP_GAIN 6 100 µA Sets the PLL1 Charge Pump Gain R12 30:28 PLL1_R Counter 1 Divide = 1 Sets divide value for PLL1_R Counter R12 27:16 PLL1_N Counter 1 Divide = 1 Sets divide value for PLL1_N Counter R12 15:4 EN_PLL2_REF2X 0 Disabled Enables or disables the OSCin frequency doubler path for the PLL2 reference input R13 16 EN_PLL2_XTAL 0 OFF Enables or Disables internal circuits that support an external crystal driving the OSCin pins R13 21 EN_Fout 0 OFF Enables or disables the VCO output buffer R13 20 CLK Global Enable 1 Enabled Global enable or disable for output clocks R13 18 POWER DOWN 0 R13 17 PLL2 CP TRI-STATE 0 TRI-STATE disabled Enables or disables TRI-STATE for PLL2 Charge Pump R13 15 PLL1 CP TRI-STATE 0 TRI-STATE disabled Enables or disables TRI-STATE for PLL1 Charge Pump R13 14 (2) Disabled (device is Device power down control active) OSCin_FREQ 200 200 MHz Source frequency driving OSCin port R14 28:21 PLL_MUX 31 Reserved Selects output routed to LD pin R14 20:16 PLL2_R Counter 1 Divide = 1 Sets Divide value for PLL2_R Counter R14 15:4 PLL2_CP_GAIN 2 1600 µA Sets PLL2 Charge Pump Gain R15 27:26 VCO_DIV 2 Divide = 2 Sets divide value for VCO output divider R15 25:22 PLL2_N Counter 1 Divide = 1 Sets PLL2_N Counter value R15 21:4 (1) (2) These registers are reserved. The Power On/Reset values for these registers are shown in the register map and should not be changed during programming. If the CLKin_SEL value is set to either [0,0] or [0,1], the LOS_TYPE field should be set to [0,0]. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 25 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com REGISTER R0 TO R4 Registers R0 through R4 control the five clock outputs. Register R0 controls CLKout0, Register R1 controls CLKout1, and so on. Aside from this, the functions of the bits in these registers are identical. The X in CLKoutX_MUX, CLKoutX_DIV, and CLKoutX_EN denote the actual clock output which may be from 0 to 4. CLKoutX_DIV: Clock Channel Divide Registers Each of the five clock output channels (0 though 4) has a dedicated 8-bit divider followed by a fixed divide by 2 that is used to generate even integer related versions of the distribution path clock frequency (VCO Divider output). If the VCO Divider value is even then the Channel Divider may be bypassed (See CLK Output Mux), giving an effective divisor of 1 while preserving a 50% duty cycle output waveform. Table 7. CLKoutX_DIV: Clock Channel Divide Values CLKoutX_DIV [ 7:0 ] Total Divide Value b7 b6 b5 b4 b3 b2 b1 b0 0 0 0 0 0 0 0 0 invalid 0 0 0 0 0 0 0 1 2 0 0 0 0 0 0 1 0 4 0 0 0 0 0 0 1 1 6 0 0 0 0 0 1 0 0 8 0 0 0 0 0 1 0 1 10 - - - - -- - - - - 1 1 1 1 1 1 1 1 510 EN_CLKoutX: Clock Channel Output Enable Each Clock Output Channel may be either enabled or disabled via the Clock Output Enable control bits. Each output enable control bit is gated with the Global Output Enable input pin (GOE) and Global Output Enable bit (EN_CLKout_Global). The GOE pin provides an internal pull-up so that if it is unterminated externally, the clock output states are determined by the Clock Output Enable Register bits. All clock outputs can be set to the low state simultaneously if the GOE pin is pulled low by an external signal. If EN_CLKout_Global is programmed to 0 all outputs are turned off. If both GOE and EN_CLKout_Global are low the clock outputs are turned off. Table 8. EN_CLKoutX: Clock Channel Output Enable Control Bits BIT NAME BIT = 1 BIT = 0 DEFAULT EN_CLKout0 ON OFF OFF EN_CLKout1 ON OFF OFF EN_CLKout2 ON OFF ON EN_CLKout3 ON OFF OFF EN_CLKout4 ON OFF OFF EN_CLKout_Global According to individual channel settings All EN_CLKout X = OFF - Note the default state of CLKout2 is ON after power on or RESET assertion. The nominal frequency is 62 MHz (LMK041x1) or 81 MHz (LMK041x3). This is based on a channel divide value of 12 and default VCO_DIV value of 2. If an active CLKout2 at power on is inappropriate for the user’s application, the following method can be employed to shut off CLKout2 during system initialization: When the device is powered on, holding the GOE pin LOW will disable all clock outputs. The device can be programmed while the GOE is held LOW. The state of CLKout2 can be altered during device programming according to the user’s specific application needs. After device configuration is complete, the GOE pin should be set HIGH to enable the active clock channels. 26 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 CLKoutX/CLKoutX* LVCMOS Mode Control For clock outputs that are configured as LVCMOS, the LVCMOS CLKoutX/CLKoutX* outputs can be independently configured by uWire CLKoutXA_STATE and CLKoutXB_STATE bits. The following choices are available for LVCMOS outputs: Table 9. CLKoutXA_STATE, CLKoutXB_STATE Control Bits for LVCMOS Modes CLKoutXA_STATE CLKoutXB_STATE LVCMOS Modes b1 b0 b1 b0 0 0 0 0 Inverted 0 1 0 1 Normal 1 0 1 0 Low 1 1 1 1 TRI-STATE CLKoutX/CLKoutX* LVPECL Mode Control Clock outputs designated as LVPECL can be configured in one of two possible output levels. The default mode is the common LVPECL swing of 800 mVp-p single-ended (1.6 Vp-p differential). A second mode, 2VPECL, can be enabled in which the swing is increased to 1000 mVp-p single-ended (2 Vp-p differential). Table 10. LVPECL Output Format Control CLKoutX_PECL_LVL Output Format 0 LVPECL (800 mVpp) 1 2VPECL (1000 mVpp) CLKoutX_MUX: Clock Output Mux The output of each CLKoutX channel pair is controlled by its' channel multiplexer (mux). The mux can select between several signals: bypassed, divided only. Table 11. CLKoutX_MUX: Clock Channel Multiplexer Control Bits CLKout_MUX Clock Mode 0 Bypassed 1 Divided REGISTERS 5, 6 These registers are reserved. These register values should not be modified from the values shown in the register map. REGISTER 7 RESET bit This bit is only in register R7. The use of this bit is optional and it should be set to '0' if not used. Setting this bit to a '1' forces all registers to their power on reset condition and therefore automatically clears this bit. REGISTERS 8, 9 These registers are reserved. These register values should not be modified from the values shown in the register map. REGISTER 10 RC_DLD1_Start: PLL1 Digital Lock Detect Run Control bit This bit is used to control the state machine for the PLL2 VCO tuning algorithm. The following table describes the function of this bit. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 27 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com Table 12. RC_DLD1_Start bit states RC_DLD1_Start Description 1 The PLL2 VCO tuning algorithm trigger is delayed until PLL1 Digital Lock Detect is valid. 0 The PLL2 VCO tuning algorithm runs immediately after any PLL2_N counter update, despite the state of PLL1 Digital Lock Detect. If the user is unsure of the state of the reference clock input at startup of the LMK041xx device, setting RC_DLD1_Start = 0 will allow PLL2 to tune and lock the internal VCO to the oscillator attached to the OSCin port. This ensures that the active clock outputs will start up at frequencies close to their desired values. The error in clock output frequency will depend on the open loop accuracy of the oscillator driving the OSCin port. The frequency of an active clock output is normally given by: FCLK = N R FOSCin À (VCO_DIV À CLK_DIV) If the open loop frequency accuracy of the external oscillator (either a VCXO or crystal based oscillator) is "X" ppm, then the error in the output clock frequency (FCLK error) will be: FCLK error = N R X À FOSCin À (VCO_DIV À CLK_DIV) Setting this bit to 0 does not prevent PLL1 from locking the external oscillator to the reference clock input after the latter input becomes valid. REGISTER 11 CLKinX_BUFTYPE: PLL1 CLKinX/CLKinX* Buffer Mode Control The user may choose between one of two input buffer modes for the PLL1 reference clock inputs: either bipolar junction differential or MOS. Both CLKinX and CLKinX* input pins must be AC coupled when driven differentially. In single ended mode, the CLKinX* pin must be coupled to ground through a capacitor. The active CLKinX buffer mode is selected by the CLKinX_TYPE bits programmed via the uWire interface. Table 13. PLL1 CLKinX_BUFTYPE Mode Control Bits b1 b0 CLKin1_TYPE CLKin0_TYPE 0 0 BJT Differential BJT Differential 0 1 BJT Differential MOS 1 0 MOS BJT Differential 1 1 MOS MOS CLKin_SEL: PLL1 Reference Clock Selection and Revertive Mode Control Bits This register allows the user to set the reference clock input that is used to lock PLL1, or to select an autoswitching mode. The automatic switching modes are revertive or non-revertive. In either revertive or nonrevertive mode, CLKin0 is the initial default reference source for the auto-switching mode. When revertive mode is active, the switching control logic will always select CLKin0 as the reference if it is active, otherwise it selects CLKin1. When non-revertive mode is active, the switching logic will only switch the reference input if the currently selected input fails. Table 14 illustrates the control modes. Modes [1,0] and [1,1] are the auto-switching modes. The behavior of both modes is tied to the state of the LOS signals for the respective reference clock inputs. 28 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 If the reference clock inputs are active prior to configuration of the device, then the normal programming sequence described under General Programming Information can be used without modification. If it cannot be guaranteed that the reference clocks are active prior to device programming, then the device programming sequence should be modified in order to ensure that CLKin0 is selected as the default. Under this scenario, the device should be programmed as described in "General Programming Information", with CLKin_SEL bits programmed to [0,0] in register R11. The other R11 fields for clock type and LOS timeout should be programmed with the appropriate values for the given application. After the reference clock inputs have started, register R11 should be programmed a second time with the CLKin_SEL field modified to the set the desired mode. The clock type field and LOS field values should remain the same. Table 14. CLKin_SEL: Reference Clock Selection Bits CLKin_SEL [1:0] Function b1 b0 0 0 Force CLKin0 / CLKin0* as PLL1 reference 0 1 Force CLKin1 / CLKin1* as PLL1 reference 1 0 Non-revertive. Auto-switching. CLKin0 is the default reference clock. If CLKin0 fails, CLKin1 is automatically selected if active. If CLKin0 restarts, CLKin1 remains as the selected reference clock unless it fails, then CLKin0 is re-selected. 1 1 Revertive. Auto-switching. CLKin0 is the preferred reference clock and is selected when active. CLKinX_LOS The CLKin0_LOS and CLKin1_LOS pins indicate the state of the respective PLL1 CLKinX reference input when the CLKin_SEL bits are set set to either [1,0] or [1,1]. The detection logic that determines the state of the reference inputs is sensitive to the frequency of the reference inputs and must be configured to operate with the appropriate frequency range of the reference inputs, as described in the next section. PLL1 Reference Clock LOS Timeout Control This register is used to tune the LOS timeout based upon the frequency of the reference clock input(s). The register value controls the timeout setting for both CLKin0 and CLKin1. The value programmed in the LOS_TIMEOUT register represents the minimum input frequency for which loss of signal can be detected. For example, if the reference input frequency is 12.288 MHz, then either register values (0,0) or (0,1) will result in valid loss of signal detection. If the reference input frequency is 1 MHz, then only the register value (0,0) will result in valid detection of signal loss. Table 15. Reference Clock LOS Timeout Control Bits b1 b0 0 0 Corresponding Minimum Input Frequency 1 MHz 0 1 3.0 MHz 1 0 13 MHz 1 1 32 MHz LOS Output Type Control The output format of the LOS pins may be selected as active CMOS, open drain NMOS and open drain PMOS, as shown in the following table. Table 16. Loss of Signal (LOS) Output Pin Format Type LOS_TYPE [1:0] Functional Description b1 b0 0 0 Reserved 0 1 NMOS open drain 1 0 PMOS open drain 1 1 Active CMOS Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 29 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com The LOS output signal is valid only when CLKin_SEL bits are set to either [1,0] or [1,1]. If the CLKin_SEL field is programmed to either of the fixed inputs, [0,0] or [0,1], the LOS_TYPE bits should be set to [0,0]. REGISTER 12 PLL1_N: PLL1_N Counter The size of the PLL1_N counter is 12 bits. This counter will support a maximum divide ratio of 4095 and minimum divide ratio of 1. The 12 bit resolution is sufficient to support minimum phase detector frequency resolution of approximately 50 kHz when the VCXO frequency is 200 MHz. For a 200 MHz external VCXO, the minimum phase detector rate will be PDmin = 200 MHz/4095 = 48.84 kHz Table 17. PLL1_N Counter Values N [17:0] b11 b10 0 VALUE b6 b5 b4 b3 b2 b1 b0 0 0 0 0 0 0 0 0 Not Valid 0 0 0 0 0 0 0 0 1 1 0 0 0 0 0 0 0 1 0 2 . . . . . . . ... 1 ... 1 1 4095 PLL1_R: PLL1_R Counter The size of the PLL1_R counter is 12 bits. This counter will support a maximum divide ratio of 4095 and minimum divide ratio of 1. Table 18. PLL1_R Counter Values R [11:0] VALUE b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 . . . . . . . . . . . . ... 1 1 1 1 1 1 1 1 1 1 1 1 4095 Not Valid PLL1 Charge Pump Current Gain (PLL1_CP_GAIN) and Polarity Control (PLL1_CP_POL) The Loop Band Width (LBW) on PLL1 should be narrow to suppress the noise from the system or input clocks at CLKinX/CLKinX* port. This configuration allows the noise of the external VCXO to dominate at low offset frequencies. Given that the noise of the external VCXO is far superior than the noise of PLL1, this setting produces a very clean reference clock to PLL2 at the OSCin port. In order to achieve a LBW as low as 10 Hz at the supported VCXO frequency (1 MHz to 200 MHz), a range of charge pump currents in PLL1 is provided. The table below shows the available current gains. A small charge pump current is required to obtain a narrow LBW at high phase detector rate (small N value). 30 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 Table 19. PLL1 Charge Pump Current Selections (PLL1_CP_GAIN) PLL1_CP_GAIN [2:0] PLL1 Charge Pump Current Magnitude (µA) b2 b1 b0 0 0 0 RESERVED 0 0 1 RESERVED 0 1 0 20 0 1 1 80 1 0 0 25 1 0 1 50 1 1 0 100 1 1 1 400 The PLL1_CP_POL bit sets the PLL1 charge pump for operation with a positive or negative slope VCO/VCXO. A positive slope VCO/VCXO increases frequency with increased tuning voltage. A negative slope VCO/VCXO increases frequency with decreased tuning voltage. Table 20. PLL1 Charge Pump Polarity Control Bits (PLL1_CP_POL) PLL1_CP_POL DESCRIPTION 0 Negative Slope VCO/VCXO 1 Positive Slope VCO/VCXO REGISTER 13 EN_PLL2_XTAL: Crystal Oscillator Option Enable If an external crystal is being used to implement a discrete VCXO, the internal feedback amplifier must be enabled in order to complete the oscillator circuit. Table 21. EN_PLL2_XTAL: External Crystal Option EN_PLL2_XTAL Oscillator Amplifier State 0 OFF 1 ON EN_Fout: Fout Power Down Bit The EN_Fout bit allows the Fout port to be enabled or disabled. By default EN_Fout = 0. CLK Global Enable: Clock Global enable bit In addition to the external GOE pin, an internal Register 13 bit (b18) can be used to globally enable/disable the clock outputs via the uWire programming interface. The default value is 1. When CLK Global Enable = 1, the active output clocks are enabled. The active output clocks are disabled if this bit is 0. POWERDOWN Bit -- Device Power Down This bit can power down the entire device. Enabling this bit powers down the entire device and all functional blocks, regardless of the state of any of the other bits or pins. Table 22. Power Down Bit Values POWERDOWN Bit Mode 0 Normal Operation 1 Entire device powered down Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 31 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com EN_PLL2 REF2X: PLL2 Frequency Doubler control bit When FOSCin is below 50 MHz, the PLL2 frequency doubler can be enabled by setting EN_PLL2_REF2X = 1. The default value is 0. When EN_PLL2_REF2X = 1, the signal at the OSCin port bypasses the PLL2_R counter and is passed through a frequency doubler circuit. The output of this circuit is then input to the PLL2 phase comparator block. This feature allows the phase comparison frequency to be increased for lower frequency OSCin sources (< 50 MHz), and can be used with either VXCOs or crystals. For instance, when using a pullable crystal of 12.288 MHz to drive the OSCin port, the PLL2 phase comparison frequency is 24.576 MHz when EN_PLL2_REF2X = 1. A higher PLL phase comparison frequency reduces PLL2 in-band phase noise and RMS jitter. The PLL in-band phase noise can be reduced by approximately 2 to 3 dB. The on-chip loop filter typically is enabled to reduce PLL2 reference spurs when EN_PLL2_REF2X is enabled. Suggested values in this case are: R3 = 600 Ω, C3 = 50 pF, R4 = 10 kΩ, C4 = 60 pF. PLL2 Internal Loop Filter Component Values Internal loop filter components are available for PLL2, enabling the user to implement either 3rd or 4th order loop filters without requiring external components. The user may select from a fixed set of values for both the resistors and capacitors. Internal loop filter resistance values for R3 and R4 can be set individually according to Table 20 and Table 21. 32 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 Table 23. PLL2 Internal Loop Filter Resistor Values, PLL2_R3_LF PLL2_R3_LF [2:0] RESISTANCE b2 b1 b0 0 0 0 < 600 Ω 0 0 1 10 kΩ 0 1 0 20 kΩ 0 1 1 30 kΩ 1 0 0 40 kΩ 1 0 1 Invalid 1 1 0 Invalid 1 1 1 Invalid Table 24. PLL2 Internal Loop Filter Resistor Values, PLL2_R4_LF PLL2_R4_LF [2:0] RESISTANCE b2 b1 b0 0 0 0 < 200 Ω 0 0 1 10 kΩ 0 1 0 20 kΩ 0 1 1 30 kΩ 1 0 0 40 kΩ 1 0 1 Invalid 1 1 0 Invalid 1 1 1 Invalid Internal loop filter capacitors for C3 and C4 can be set individually according to the following table. Table 25. PLL2 Internal Loop Filter Capacitor Values PLL2_C3_C4_LF [3:0] Loop Filter Capacitance(pF) b3 b2 b1 b0 0 0 0 0 0 0 0 1 C3 = 0, C4 = 60 0 0 1 0 C3 = 50, C4 = 10 0 0 1 1 C3 = 0, C4 = 110 0 1 0 0 C3 = 50, C4 = 110 0 1 0 1 C3 = 100, C4 = 110 0 1 1 0 C3 = 0, C4 = 160 0 1 1 1 C3 = 50, C4 = 160 1 0 0 0 C3 = 100, C4 = 10 1 0 0 1 C3 = 100, C4 = 60 1 0 1 0 C3 = 150, C4 = 110 1 0 1 1 C3 = 150, C4 = 60 1 1 0 0 Reserved 1 1 0 1 Reserved 1 1 1 0 Reserved 1 1 1 1 Reserved Copyright © 2011–2012, Texas Instruments Incorporated C3 = 0, C4 = 10 Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 33 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com PLL1 CP TRI-STATE and PLL2 CP TRI-STATE The charge pump output of either CPout1 or CPout2 may be placed in a TRI-STATE mode by setting the appropriate PLLx CP TRI-STATE bit. Table 26. PLL1 Charge Pump TRI-STATE bit values PLL1 CP TRI-STATE Description 1 PLL1 CPout1 is at TRI-STATE 0 PLL1 CPout1 is active Table 27. PLL2 Charge Pump TRI-STATE bit values PLL2 CP TRI-STATE Description 1 PLL2 CPout2 is at TRI-STATE 0 PLL2 CPout2 is active REGISTER 14 OSCin_FREQ: PLL2 Oscillator Input Frequency Register The frequency of the PLL2 reference input to the PLL2 Phase Detector (OSCin/OSCin* port) must be programmed in order to support proper operation of the internal VCO tuning algorithm. This is an 8-bit register that sets the frequency to the nearest 1-MHz increment. Table 28. OSCin_FREQ Register Values OSCin_FREQ [7:0] VALUE b7 b6 b5 b4 b3 b2 b1 b0 0 0 0 0 0 0 0 0 Not Valid 0 0 0 0 0 0 0 1 1 MHz 0 0 0 0 0 0 1 0 2 MHz . . . . . . . ... 1 1 1 1 1 0 1 0 250 MHz 1 1 0 0 1 0 0 1 Not Valid . . . . . . . . . 1 1 1 1 1 1 1 1 Not Valid PLL2_R: PLL2_R Counter The PLL2 R Counter is 12 bits wide. It divides the PLL2 OSCin/OSCin* clock and is connected to the PLL2 Phase Detector. Table 29. PLL2_R: PLL2_R Counter Values R [11:0] VALUE b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 . . . . . . . . . . ... 1 1 1 1 1 1 1 1 1 1 4095 1 1 Not Valid PLL_MUX: LD Pin Selectable Output The signal appearing on the LD pin is programmable via the uWire interface and provides access to several internal signals which may be valuable for either status monitoring during normal operation or for debugging during the hardware development phase. This pin may be forced to either a HIGH or LOW state, and may also be configured as specified in Table 27. 34 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 Table 30. PLL_MUX: LD Pin Selectable Outputs PLL_MUX [4:0] LD Output b4 b3 b2 b1 b0 0 0 0 0 0 HiZ 0 0 0 0 1 Logic High 0 0 0 1 0 Logic Low 0 0 0 1 1 PLL2 Digital Lock Detect Active High 0 0 1 0 0 PLL2 Digital Lock Detect Active Low 0 0 1 0 1 PLL2 Analog Lock Detect Push Pull 0 0 1 1 0 PLL2 Analog Lock Detect Open Drain NMOS 0 0 1 1 1 PLL2 Analog Lock Detect Open Drain PMOS 0 1 0 0 0 Reserved 0 1 0 0 1 PLL2_N Divider Output / 2 0 1 0 1 0 Reserved 0 1 0 1 1 PLL2_R Divider Output / 2 0 1 1 0 0 Reserved 0 1 1 0 1 Reserved 0 1 1 1 0 PLL1 Digital Lock Detect Active HIGH 0 1 1 1 1 PLL1 Digital Lock Detect Active LOW 1 0 0 0 0 Reserved 1 0 0 0 1 Reserved 1 0 0 1 0 Reserved 1 0 0 1 1 Reserved 1 0 1 0 0 PLL1_N Divider Output / 2 1 0 1 0 1 Reserved 1 0 1 1 0 PLL1_R Divider Output / 2 1 0 1 1 1 PLL1 and PLL2 Digital Lock Detect 1 1 0 0 0 Inverted PLL1 and PLL2 Digital Lock Detect 1 1 0 0 1 Reserved 1 1 0 1 0 Reserved 1 1 0 1 1 Reserved 1 1 1 0 0 Reserved 1 1 1 0 1 Reserved 1 1 1 1 0 Reserved 1 1 1 1 1 Reserved Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 35 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com REGISTER 15 PLL2_N: PLL2_N Counter The PLL2_N Counter is 18 bits wide. It divides the output of the VCO Divider and is connected to the PLL2 Phase Detector. Each time the PLL2_N Counter value is updated via the uWire interface, an internal algorithm is triggered that optimizes the VCO performance. Table 31. PLL2_N: PLL2_N Counter Values N [17:0] VALUE b17 b16 ... b6 b5 b4 b3 b2 b1 b0 0 0 ... 0 0 0 0 0 0 0 Not Valid 0 0 0 0 0 0 0 0 1 1 0 0 0 0 0 0 0 1 0 2 . . . . . . . ... 1 1 1 1 1 1 1 262143 1 1 PLL2_CP_GAIN: PLL2 Charge Pump Current and Output Control The PLL2 charge pump output current level is controlled with the PLL2_CP_GAIN register. The following table presents the charge pump current control values. Table 32. PLL2_CP_GAIN: PLL2 Charge Pump Current Selections PLL2_CP_GAIN [1:0] CP_TRI Charge Pump Current (µA) X 1 Hi-Z 0 0 100 0 1 0 400 1 0 0 1600 1 1 0 3200 b1 b0 X 0 VCO_DIV: PLL2 VCO Divide Register A divider is provided on the output of the PLL2 VCO to enable a wide range of output clock frequencies. The output of this divider is placed on the input path for the clock distribution section, which feeds each of the individual clock channels. The divider provides integer divide ratios from 2 to 8. Table 33. VCO_DIV: PLL2 VCO Divider Values VCO_DIV [3:0] 36 Divide Value b3 b2 b1 b0 0 0 0 0 Invalid 0 0 0 1 Invalid 0 0 1 0 2 0 0 1 1 3 0 1 0 0 4 0 1 0 1 5 0 1 1 0 6 0 1 1 1 7 1 0 0 0 8 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 APPLICATION INFORMATION SYSTEM LEVEL DIAGRAM The following diagram illustrates the typical interconnection of the LMK041xx in a clocking application. 0.1 PF 120: To System To System 0.1 PF 120Ö 120: 0.1 PF To System 100 pF 100 pF To System CLKout1* CLKout1 CLKout2B CLKout2A CLKout3* CLKout3 CLKout4* CLKout4 To System 0.1 PF 120: Vcc 1 PF Fout Bias PLL2 Loop Filter CPout2 51: LD (optional) GOE To Host 0.1 PF OSCin* LEuWire OSCin LMK041xx CLKuWire 0.1 PF 33 pF 33 pF 33 pF DATAuWire VCXO SYNC* To Host CLKin1* LDObyp1 CLKin1 Rterm 0.1 PF 100: LDObyp2 CPout1 CLKin0* DLD_BYP CLKout0 CLKout0* 0.1 PF CLKin0 0.1 PF 10 PF Reference Clock #2 (Secondary) PLL1 Loop Filter 0.1 PF 0.1 PF 0.47 PF 100: To System Reference Clock #1 (Primary) Figure 12. Typical Application Figure 12 shows an LMK04100 family device with external circuitry. The primary reference clock input is at CLKin0/0*. A secondary reference clock is driving CLKin1/1*. Both clocks are depicted as AC coupled differential drivers. The VCXO attached to the OSCin/OSCin* port is configured as an AC coupled single-ended driver. Any of the input ports (CLKin0/0*, CLKin1/1*, or OSCin/OSCin*) may be configured as either differential or singleended. These options are discussed later in the data sheet. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 37 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com The diagram shows an optional connection between the LD pin and GOE. With this arrangement, the LD pin can be programmed to output a lock detect signal that is active HIGH (see Table 27 for optional LD pin outputs). If lock is lost, the LD pin will transition to a LOW, pulling GOE low and causing all clock outputs to be disabled. This scheme should be used only if disabling the clock outputs is desirable when lock is lost. The loop filter for PLL2 consists of three external components that implement two lower order poles, plus optional internal integrated components if 3rd or 4th order poles are needed. The loop filter components for PLL1 must be external components. The VCO output buffer signal that appears at the Fout pin when enabled (EN_Fout = 1) should be AC coupled using a 100 pF capacitor. This output is a single-ended signal by default. If a differential signal is required, a 50 Ω balun may be connected to this pin to convert it to differential. The clock outputs are all AC coupled with 0.1 µF capacitors. CLKout1 and CLKout3 are depicted as LVPECL, with 120 Ω emitter resistors as source termination. However, the output format of the clock channels will vary by device part number, so the designer should use the appropriate source termination for each channel. Later sections of this data sheet illustrate alternative methods for AC coupling, DC coupling and terminating the clock outputs. LDO BYPASS AND BIAS PIN The LDObyp1 and LDObyp2 pins should be connected to GND through external capacitors, as shown in the diagram. Furthermore, the Bias pin should be connected to VCC through a 1 µF capacitor in series. LOOP FILTER Each PLL of the LMK04100 family requires a dedicated loop filter. The loop filter for PLL1 must be connected to the CPout1 pin. Figure 13 shows a simple 2-pole loop filter. The output of the filter drives an external VCXO module or discrete implementation of a VCXO using a crystal resonator. Higher order loop filters may be implemented using additional external R and C components. It is recommended the loop filter for PLL1 result in a total closed loop bandwidth in the range of 10 Hz to 200 Hz. The design of the loop filter is application specific and highly dependent on parameters such as the phase noise of the reference clock, VCXO phase noise, and phase detector frequency for PLL1. TI's Clock Conditioner Owner’s Manual covers this topic in detail and TI's Clock Design Tool can be used to simulate loop filter designs for both PLLs. These resources may be found: http://www.ti.com/lsds/ti/analog/clocksandtimers/clocks_and_timers.page. As shown in the diagram, the charge pump for PLL2 is directly connected to the optional internal loop filter components, which are normally used only if either a third or fourth pole is needed. The first and second poles are implemented with external components. The loop must be designed to be stable over the entire applicationspecific tuning range of the VCO. The designer should note the range of KVCO listed in the table of Electrical Characteristics and how this value can change over the expected range of VCO tuning frequencies. Because loop bandwidth is directly proportional to KVCO, the designer should model and simulate the loop at the expected extremes of the desired tuning range, using the appropriate values for KVCO. When designing with the integrated loop filter of the LMK04100 family, considerations for minimum resistor thermal noise often lead one to the decision to design for the minimum value for integrated resistors, R3 and R4. Both the integrated loop filter resistors and capacitors (C3 and C4) also restrict the maximum loop bandwidth. However, these integrated components do have the advantage that they are closer to the VCO and can therefore filter out some noise and spurs better than external components. For this reason, a common strategy is to minimize the internal loop filter resistors and then design for the largest internal capacitor values that permit a wide enough loop bandwidth. In situations where spurs requirements are very stringent and there is margin on phase noise, it might make sense to design for a loop filter with integrated resistor values larger than their minimum value. 38 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 LMK041xx PLL2 Internal Loop Filter R3 R4 PLL2 Phase Detector C4 CPout2 C3 Internal VCO C2 PLL2 External Loop Filter C1 R2 LMK041xx External VCXO PLL1 Phase Detector CPout1 C2 C1 R2 PLL1 External Loop Filter Figure 13. Loop Filter Table 34. Typical Current Consumption for Selected Functional Blocks Typical ICC (Temp = 25 °C, VCC = 3.3 V) (mA) Power Dissipated in device (mW) Power Dissipated in LVPECL/2VPECL Emitter Resistors (mW) Block Condition Entire device, core current Single input clock (CLKIN_SEL = 0 or 1); LOS disabled; PLL1 and PLL2 locked; All CLKouts are off; No LVPECL emitter resistors connected 115 380 - REFMUX Enable auto-switch mode (CLKIN_SEL = 2 or 3) 4.3 14 - LOS Enable LOS (LOS_TYPE = 1, or 2, or 3) 3.6 12 - Low Channel Internal Buffer The low channel internal buffer is enabled when CLKout0 is enabled 10 33 - High Channel Internal Buffer The high channel internal buffer is enabled when one of CLKout1 through CLKout4 is enabled 10 33 - Divider bypassed (CLKout_MUX = 0, 2) 0 0 - Divider enabled, divide = 2 (CLKout_MUX = 1, 3) 5.3 17 - Divider enabled, divide > 2 (CLKout_MUX = 1, 3) 8.5 28 - Divide circuitry per output Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 39 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com Table 34. Typical Current Consumption for Selected Functional Blocks (continued) Typical ICC (Temp = 25 °C, VCC = 3.3 V) (mA) Power Dissipated in device (mW) Power Dissipated in LVPECL/2VPECL Emitter Resistors (mW) Block Condition Fout Buffer EN_Fout = 1 14.5 48 - LVDS Buffer LVDS buffer, enabled 19.3 64 - LVPECL/2VPECL buffer (enabled and with 120 Ω emitter resistors) 40 82 50 LVPECL/2VPECL buffer (disabled and with 120 Ω emitter resistors) 21.7 47 25 0 0 - LVPECL/2VPECL Buffer LVPECL/2VPECL (disabled and with no emitter resistors) LVCMOS buffer static ICC, CL = 5 pF 4.5 15 - (1) LVCMOS buffer dynamic ICC, CL = 5 pF, CLKout = 100 MHz 16 53 - Entire device (Single input clock (CLKIN_SEL = 0 or 1); LOS disabled; PLL1 and PLL2 locked; Fout disabled; All CLKouts are on); Divide > 2 on each output. LMK0410x (2) (3) 379.5 1102 150 LMK0411x (2) (3) 377.5 996 250 LMK0413x (2) (3) 337.1 1012 100 LVCMOS Buffer (1) (2) (3) Dynamic power dissipation of LVCMOS buffer varies with output frequency and can be found in the LVCMOS dynamic ICC vs frequency plot, as shown in CLOCK OUTPUT AC CHARACTERISTICS. Total power dissipation of the LVCMOS buffer is the sum of static and dynamic power dissipation. CLKoutXa and CLKoutXb are each considered an LVCMOS buffer. Assuming ThetaJ = 27.4 °C/W, the total power dissipated on chip must be less than 40/27.4 = 1450 mW to guarantee a junction temperature is less than 125 °C. Worst case power dissipation can be estimated by multiplying typical power dissipation with a factor of 1.2. CURRENT CONSUMPTION / POWER DISSIPATION CALCULATIONS Due to the myriad of possible configurations the following table serves to provide enough information to allow the user to calculate estimated current consumption of the device. Unless otherwise noted VCC = 3.3 V, TA = 25 °C. From Table 34 the current consumption can be calculated in any configuration. For example, the current for the entire device with 1 LVDS (CLKout0) & 1 LVPECL (CLKout1) output in bypassed mode can be calculated by adding up the following blocks: core current, clock buffer, one LVDS output buffer current, and one LVPECL output buffer current. There will also be one LVPECL output drawing emitter current, but some of the power from the current draw is dissipated in the external 120 Ω resistors which doesn't add to the power dissipation budget for the device. If divides are switched in, then the additional current for these stages needs to be added as well. For power dissipated by the device, the total current entering the device is multiplied by the voltage at the device minus the power dissipated in any emitter resistors connected to any of the LVPECL outputs. If no emitter resistors are connected to the LVPECL outputs, this power will be 0 watts. For example, in the case of 1 LVDS (CLKout0) & 1 LVPECL (CLKout1) operating at 3.3 V, we calculate 3.3 V × (115 + 10 + 10 + 19.3 + 40) mA = 3.3 V × 194.3 mA = 641.2 mW. Because the LVPECL output (CLKout1) has the emitter resistors hooked up and the power dissipated by these resistors is 50 mW, the total device power dissipation is 641.2 mW - 50 mW = 591.2 mW. When the LVPECL output is active, ~1.7 V is the average voltage on each output as calculated from the LVPECL VOH & VOL typical specification. Therefore the power dissipated in each emitter resistor is approximately (1.7 V)2 / 120 Ω = 25 mW. When the LVPECL output is disabled, the emitter resistor voltage is ~1.07 V. Therefore the power dissipated in each emitter resistor is approximately (1.07 V)2 / 120 Ω = 9.5 mW. 40 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 POWER SUPPLY CONDITIONING The recommended technique for power supply management is to connect the power pins for the clock outputs (pins 13, 37, 40, 43, and 46) to a dedicated power plane and connect all other power pins on the device (pins 3, 8, 18, 19, 22, 24, 30, 31, and 33) to a second power plane. Note: the LMK04100 family has internal voltage regulators for the PLL and VCO blocks to provide noise immunity. THERMAL MANAGEMENT Power consumption of the LMK04100 family of devices can be high enough to require attention to thermal management. For reliability and performance reasons the die temperature should be limited to a maximum of 125 °C. That is, as an estimate, TA (ambient temperature) plus device power consumption times θJA should not exceed 125 °C. The package of the device has an exposed pad that provides the primary heat removal path as well as excellent electrical grounding to a printed circuit board. To maximize the removal of heat from the package a thermal land pattern including multiple vias to a ground plane must be incorporated on the PCB within the footprint of the package. The exposed pad must be soldered down to ensure adequate heat conduction out of the package. A recommended land and via pattern is shown in Figure 14. More information on soldering WQFN packages can be obtained: http://www.ti.com/packaging. 5.0 mm, min 0.33 mm, typ 1.2 mm, typ Figure 14. Recommended Land and Via Pattern To minimize junction temperature it is recommended that a simple heat sink be built into the PCB (if the ground plane layer is not exposed). This is done by including a copper area of about 2 square inches on the opposite side of the PCB from the device. This copper area may be plated or solder coated to prevent corrosion but should not have conformal coating (if possible), which could provide thermal insulation. The vias shown in Figure 14 should connect these top and bottom copper layers and to the ground layer. These vias act as “heat pipes” to carry the thermal energy away from the device side of the board to where it can be more effectively dissipated. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 41 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com OSCin* Copt CC1 = 2.2 nF R1 = 4.7k SMV1249-074LF R3 = 10k LMK041xx XTAL 1 nF R2 = 4.7k CC2 = 2.2 nF OSCin CPout1 Copt PLL1 Loop Filter Figure 15. Reference Design Circuit for Crystal Oscillator Option OPTIONAL CRYSTAL OSCILLATOR IMPLEMENTATION (OSCin/OSCin*) The LMK04100 family features supporting circuitry for a discretely implemented oscillator driving the OSCin port pins. Figure 15 illustrates a reference design circuit for a crystal oscillator: This circuit topology represents a parallel resonant mode oscillator design. When selecting a crystal for parallel resonance, the total load capacitance, CL, must be specified. The load capacitance is the sum of the tuning capacitance (CTUNE), the capacitance seen looking into the OSCin port (CIN), and stray capacitance due to PCB parasitics (CSTRAY), and is given by: CSTRAY CL = CTUNE + CIN + (1) 2 CTUNE is provided by the varactor diode shown in Figure 15, Skyworks model SMV1249-074. A dual diode package with common cathode provides the variable capacitance for tuning. The single diode capacitance ranges from approximately 31 pF at 0.3 V to 3.4 pF at 3 V. The capacitance range of the dual package (anode to anode) is approximately 15.5 pF at 3 V to 1.7 pF at 0.3 V. The desired value of VTUNE applied to the diode should be VCC/2, or 1.65 V for VCC = 3.3 V. The typical performance curve from the data sheet for the SMV1249-074 indicates that the capacitance at this voltage is approximately 6 pF (12 pF/2). 42 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 The nominal input capacitance (CIN) of the LMK04100 family OSCin pins is 6 pF. The stray capacitance (CSTRAY) of the PCB should be minimized by arranging the oscillator circuit layout to achieve trace lengths as short as possible and as narrow as possible trace width (50 Ω characteristic impedance is not required). As an example, assume that CSTRAY is 4 pF. The total load capacitance is nominally: 4 CL = 6 + 6 + = 14 pF 2 (2) Consequently the load capacitance specification for the crystal in this case should be nominally 14 pF. The 2.2 nF capacitors shown in the circuit are coupling capacitors that block the DC tuning voltage applied by the 4.7 k and 10 k resistors. The value of these coupling capacitors should be large, relative to the value of CTUNE (CC1 = CC2 >> CTUNE), so that CTUNE becomes the dominant capacitance. For a specific value of CL, the corresponding resonant frequency (FL) of the parallel resonant mode circuit is: 1 FL = FS À C1 2(C0 + CL1) + 1 = FS À §C0 2¨ © C1 + CL · +1 ¸ C1 ¹ (3) FS = Series resonant frequency C1 = Motional capacitance of the crystal CL = Load capacitance C0 = Shunt capacitance of the crystal, specified on the crystal datasheet The normalized tuning range of the circuit is closely approximated by: 1 'F = F FCL1 - FCL2 FFCL1 = C1 2 À 1 1 1 = (C0 + CL1) (C0 + CL2) 2 À §C0 ¨ C1 © + 1 - §C0 ¨ ¸ C1 ¹ © C1 CL1· + CL2· ¸ C1 ¹ (4) CL1, CL2 = The endpoints of the circuit’s load capacitance range, assuming a variable capacitance element is one component of the load. FCL1, FCL2 = parallel resonant frequencies at the extremes of the circuit’s load capacitance range. A common range for the pullability ratio, C0/C1, is 250 to 280. The ratio of the load capacitance to the shunt capacitance is ~(n * 1000), n < 10. Hence, picking a crystal with a smaller pullability ratio supports a wider tuning range because this allows the scale factors related to the load capacitance to dominate. Example crystal specifications are presented in Table 35. Table 35. Example Crystal Specifications Parameter Value Nominal Frequency (MHz) 12.288 Frequency Stability, T = 25 °C ± 10 ppm Operating temperature range -40 °C to +85 °C Frequency Stability, -40 °C to +85 °C ± 15 ppm Load Capacitance 14 pF Shunt Capacitance (C0) 5 pF Maximum Motional Capacitance (C1) 20 fF ± 30% Equivalent Series Resistance 25 Ω Maximum Drive level 2 mWatts Maximum C0/C1 ratio 225 typical, 250 Maximum Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 43 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 www.ti.com ppm See Figure 16 for a representative tuning curve. 180 140 100 60 20 -20 -60 -100 -140 -180 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 VTUNE (VDC) Figure 16. Example Tuning Curve, 12.288 MHz Crystal The tuning curve achieved in the user's application may differ from the curve shown above due to differences in PCB layout and component selection. This data is measured on the bench with the crystal integrated with the LMK04100 family. Using a voltmeter to monitor the VTUNE node for the crystal, the PLL1 reference clock input frequency is swept in frequency and the resulting tuning voltage generated by PLL1 is measured at each frequency. At each value of the reference clock frequency, the lock state of PLL1 should be monitored to ensure that the tuning voltage applied to the crystal is valid. The curve shows over the tuning voltage range of 0.17 VDC to 3.0 VDC, the frequency range is ± 163 ppm; or equivalently, a tuning range of ± 2000 Hz. The measured tuning voltage at the nominal crystal frequency (12.288 MHz) is 1.4 V. Using the diode data sheet tuning characteristics, this voltage results in a tuning capacitance of approximately 6.5 pF. The tuning curve data can be used to calculate the gain of the oscillator (KVCO). The data used in the calculations is taken from the most linear portion of the curve, a region centered on the crossover point at the nominal frequency (12.288 MHz). For a well designed circuit, this is the most likely operating range. In this case, the tuning range used for the calculations is ± 1000 Hz (± 0.001 MHz), or ± 81.4 ppm. The simplest method is to calculate the ratio: KVCO = 'F = 'V § 'F2 - 'F1 · MHz ¨ VTUNE2 - VTUNE1¸ , V © ¹ (5) ΔF2 and ΔF1 are in units of MHz. Using data from the curve this becomes: 0.001 - (-0.001) MHz = 0.00164 2.03 - 0.814 V (6) A second method uses the tuning data in units of ppm: FNOM À ('ppm2 - 'ppm1) KVCO = 6 'V À 10 (7) FNOM is the nominal frequency of the crystal and is in units of MHz. Using the data, this becomes: 12.288 À (81.4 - (-81.4)) (2.03 - 0.814) À 10 44 6 = 0.00164, Submit Documentation Feedback MHz V (8) Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 LMK04100, LMK04101, LMK04102, LMK04110 LMK04111, LMK04131, LMK04133 www.ti.com SNAS516B – APRIL 2011 – REVISED NOVEMBER 2012 In order to ensure startup of the oscillator circuit, the equivalent series resistance (ESR) of the selected crystal should conform to the specifications listed in the table of Electrical Characteristics. It is also important to select a crystal with adequate power dissipation capability, or drive level. If the drive level supplied by the oscillator exceeds the maximum specified by the crystal manufacturer, the crystal will undergo excessive aging and possibly become damaged. Drive level is directly proportional to resonant frequency, capacitive load seen by the crystal, voltage and equivalent series resistance (ESR). For more complete coverage of crystal oscillator design, see Application Note AN-1939: SNAA065. ADDITIONAL OUTPUTS WITH AN LMK04100 FAMILY DEVICE The number of outputs on a LMK04100 family device can be expanded in many ways. The first method is to use the differential outputs as two single-ended outputs. For CMOS outputs, both the positive and negative outputs can be programmed to be in phase, or 180 degrees out of phase. LVDS/LVPECL positive and negative outputs are always 180 degrees out of phase. LVDS single-ended is not recommended. In addition to this technique, the number of outputs can be expanded with a LMK01000 family device. To do this, one of the clock outputs of a LMK04100 can drive the LMK01000 device. For more information on phase synchronization with multiple devices, please refer to application note AN-1864: SNAA060. Copyright © 2011–2012, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LMK04100 LMK04101 LMK04102 LMK04110 LMK04111 LMK04131 LMK04133 45 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LMK04100SQ/NOPB ACTIVE WQFN RHS 48 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04100 LMK04100SQE/NOPB ACTIVE WQFN RHS 48 250 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04100 LMK04100SQX/NOPB ACTIVE WQFN RHS 48 2500 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04100 LMK04101SQ/NOPB ACTIVE WQFN RHS 48 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04101 LMK04101SQE/NOPB ACTIVE WQFN RHS 48 250 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04101 LMK04101SQX/NOPB ACTIVE WQFN RHS 48 2500 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04101 LMK04102SQ/NOPB ACTIVE WQFN RHS 48 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04102 LMK04102SQE/NOPB ACTIVE WQFN RHS 48 250 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04102 LMK04102SQX/NOPB ACTIVE WQFN RHS 48 2500 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04102 LMK04110SQ/NOPB ACTIVE WQFN RHS 48 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04110 LMK04110SQE/NOPB ACTIVE WQFN RHS 48 250 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04110 LMK04110SQX/NOPB ACTIVE WQFN RHS 48 2500 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04110 LMK04111SQ/NOPB ACTIVE WQFN RHS 48 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04111 LMK04111SQE/NOPB ACTIVE WQFN RHS 48 250 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04111 LMK04111SQX/NOPB ACTIVE WQFN RHS 48 2500 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04111 LMK04131SQ/NOPB ACTIVE WQFN RHS 48 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04131 LMK04131SQE/NOPB ACTIVE WQFN RHS 48 250 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04131 LMK04131SQX/NOPB ACTIVE WQFN RHS 48 2500 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04131 LMK04133SQ/NOPB ACTIVE WQFN RHS 48 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04133 LMK04133SQE/NOPB ACTIVE WQFN RHS 48 250 RoHS & Green SN Level-3-260C-168 HR -40 to 85 LMK04133 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 10-Dec-2020 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material RoHS & Green SN MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LMK04133SQX/NOPB ACTIVE WQFN RHS 48 2500 Level-3-260C-168 HR -40 to 85 LMK04133 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of