LMX2326TM/NOPB

OBSOLETE LMX2306, LMX2316, LMX2326 www.ti.com SNAS016G – MAY 2000 – REVISED APRIL 2013 PLLatinum™ Low Power Frequency Synthesizer for RF Personal Communications LMX2306 550 MHz, LMX2316 1.2 GHz, LMX2326 2.8 GHz Check for Samples: LMX2306, LMX2316, LMX2326 FEATURES DESCRIPTION • • • • The LMX2306/16/26 are monolithic, integrated frequency synthesizers with prescalers that are designed to be used to generate a very stable low noise signal for controlling the local oscillator of an RF transceiver. They are fabricated using TI's ABiC V silicon BiCMOS 0.5μ process. 1 2 • • • • • 2.3V to 5.5V Operation Ultra Low Current Consumption 2.5V VCC JEDEC Standard Compatible Programmable or Logical Power Down Mode: – ICC = 1 μA Typical at 3V Dual Modulus Prescaler: – LMX2306: 8/9 – LMX2316/26: 32/33 Selectable Charge Pump Tri-state Mode Selectable FastLock Mode with Timeout Counter MICROWIRE Interface Digital Lock Detect APPLICATIONS • • • • • Portable Wireless Communications (PCS/PCN, Cordless) Wireless Local Area Networks (WLANs) Cable TV Tuners (CATV) Pagers Other Wireless Communication Systems The LMX2306 contains a 8/9 dual modulus prescaler while the LMX2316 and the LMX2326 have a 32/33 dual modulus prescaler. The LMX2306/16/26 employ a digital phase locked loop technique. When combined with a high quality reference oscillator and loop filter, the LMX2306/16/26 provide the feedback tuning voltage for a voltage controlled oscillator to generate a low phase noise local oscillator signal. Serial data is transferred into the LMX2306/16/26 via a three wire interface (Data, Enable, Clock). Supply voltage can range from 2.3V to 5.5V. The LMX2306/16/26 feature ultra low current consumption; LMX2306 - 1.7 mA at 3V, LMX2316 2.5 mA at 3V, and LMX2326 - 4.7 mA at 3V. The LMX2306/16/26 synthesizers are available in a 16-pin TSSOP surface mount plastic package. Functional Block Diagram 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PLLatinum is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated OBSOLETE LMX2306, LMX2316, LMX2326 SNAS016G – MAY 2000 – REVISED APRIL 2013 www.ti.com Connection Diagrams LMX2306/16/26 LMX2306/16/26 Figure 1. 16-Lead (0.173” Wide) Thin Shrink Small Outline Pkg - TSSOP See Package Number PW Figure 2. 16-pin Chip Scale Package PLGA See Package Number NPG Pin Descriptions 16-Pin 16-Pin TSSOP PLGA 2 Pin Name I/ O Description 1 15 FLo O FastLock Output. For connection of parallel resistor to the loop filter. (See FastLock Modes description.) 2 16 CPo O Charge Pump Output. For connection to a loop filter for driving the input of an external VCO. 3 1 GND 4 2 GND 5 3 fIN I RF Prescaler Complementary Input. A bypass capacitor should be placed as close as possible to this pin and be connected directly to the ground plane. The complementary input can be left unbypassed, with some degradation in RF sensitivity. 6 4 fIN I RF Prescaler Input. Small signal input from the VCO. 7 5 VCC1 8 6 OSCIN 9 7 GND 10 8 CE I Chip Enable. A LOW on CE powers down the device and will tri-state the charge pump output. Taking CE HIGH will power up the device depending on the status of the power down bit F2. (See Powerdown Operation and DEVICE PROGRAMMING AFTER FIRST APPLYING Vcc.) 11 9 Clock I High Impedance CMOS Clock Input. Data for the various counters is clocked in on the rising edge into the 21-bit shift register. 12 10 Data I Binary Serial Data Input. Data entered MSB first. The last two bits are the control bits. High impedance CMOS input. 13 11 LE I Load Enable CMOS Input. When LE goes HIGH, data stored in the shift registers is loaded into one of the 3 appropriate latches (control bit dependent). 14 12 Fo/LD 15 13 VCC2 16 14 VP Charge Pump Ground. Analog Ground. Analog Power Supply Voltage Input. Input may range from 2.3V to 5.5V. Bypass capacitors should be placed as close as possible to this pin and be connected directly to the ground plane. VCC1 must equal VCC2. I Oscillator Input. This input is a CMOS input with a threshold of approximately VCC/2 and an equivalent 100k input resistance. The oscillator input is driven from a reference oscillator. Digital Ground. O Multiplexed Output of the RF Programmable or Reference Dividers and Lock Detect. CMOS output. (See Table 4.) Digital Power Supply Voltage Input. Input may range from 2.3V to 5.5V. Bypass capacitors should be placed as close as possible to this pin and be connected directly to the ground plane. VCC1 must equal VCC2. Power Supply for Charge Pump. Must be ≥ VCC. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LMX2306 LMX2316 LMX2326 OBSOLETE LMX2306, LMX2316, LMX2326 www.ti.com SNAS016G – MAY 2000 – REVISED APRIL 2013 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Power Supply Voltage VCC1 −0.3V to +6.5V VCC2 −0.3V to +6.5V Vp −0.3V to +6.5V −0.3V to VCC + 0.3V Voltage on Any Pin with GND = 0V (VI) −65°C to +150°C Storage Temperature Range (TS) Lead Temperature (TL) (1) (2) (solder, 4 sec.) +260°C Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended operating conditions indicate conditions for which the device is intended to be functional, but do not ensured specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. This device is a high performance RF integrated circuit with an ESD rating < 2 kV and is ESD sensitive. Handling and assembly of this device should only be done at ESD protected work stations. Recommended Operating Conditions Power Supply Voltage Min Max Units VCC1 2.3 5.5 V VCC2 VCC1 VCC1 V Vp VCC 5.5 V −40 +85 °C Operating Temperature (TA) Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LMX2306 LMX2316 LMX2326 Submit Documentation Feedback 3 OBSOLETE LMX2306, LMX2316, LMX2326 SNAS016G – MAY 2000 – REVISED APRIL 2013 www.ti.com Electrical Characteristics VCC = 3.0V, Vp = 3.0V; −40°C < TA < 85°C except as specified Symbol ICC Parameter Power Supply Current ICC-PWDN Powerdown Current fIN RF Input Operating Frequency Values Conditions Min Typ Max Units LMX2306 VCC = 2.3V to 5.5 V 1.7 3.5 mA LMX2316 VCC = 2.3V to 5.5V 2.5 5.0 mA LMX2326 VCC = 2.3V to 5.5V 4.7 7.0 mA VCC = 3.0V μA 1 LMX2306 VCC = 2.3V to 5.5V 25 550 MHz LMX2316 VCC = 2.3V to 5.5V 0.1 1.2 GHz LMX2326 VCC = 2.3V to 5.5V 0.1 2.1 GHz VCC = 3.0V to 5.5V 0.1 2.8 GHz VCC = 2.3V to 5.5V 5 40 MHz VCC = 2.7V to 5.5V 5 100 MHz 10 MHz fosc Maximum Oscillator Frequency fφ Maximum Phase Detector Frequency PfIN RF Input Sensitivity VCC = 2.3V to