LP3917RLX-Q/NOPB

LP3917 www.ti.com SNVS425A – DECEMBER 2006 – REVISED MARCH 2007 LP3917 CDMA Cellular Phone Power Management Unit Check for Samples: LP3917 FEATURES 1 • 2 • • • • Two High Efficiency Synchronous Magnetic Buck Regulators, IOUT 800 mA and 600 mA – High Efficiency PFM Mode @ Low IOUT – Auto Mode PFM/PWM Switch Low Inductance 2.2 uH @ 2 MHz Clock 9 Low Noise LDOs – 3 x 300 mA – 5 x 150 mA – 1 x 80 mA SW Controllable LDO Outputs USB 2.0 Compatible Transceiver (12 Mbps) • • • • • Thermal Shutdown with Early Warning Alarm Very Low Sleep Mode Current Battery Voltage Monitor Output Interrupt Request for Reducing SW Polling Ultra Small 3.5x3.5 mm Micro SMDxt 49 Bump Package APPLICATIONS • CDMA Handsets Please contact NSC Sales for a full datasheet for the device. DESCRIPTION LP3917 is a complete Power Management Unit designed for CDMA cellular phones. LP3917 PMU contains 9 low noise low dropout voltage regulators, 2 buck regulators, an USB Transceiver, two comparators and a high speed serial interface to program on/off conditions and output voltages of individual regulators, and to read status information of the PMU. Buck regulators have an automatic switch to PFM mode at low load conditions allowing very good efficiency also at low output currents. LDO regulators provide very low noise, 35 uV typ, ideally suited for supplying voltage to RF section. Two comparators can be used for detecting external accessories like ear plug etc. LP3917 can use interrupt for alerting BB processor of status changes instead of using inefficient status polling. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Table 1. Key Specifications VALUE UNIT 3.0–5.5 V Noise on LDOs 35 µV Buck regulators with 3% (typ) 800/600 mA Input Voltage Range 170 mV typ Dropout Voltage on LDOs @ 300 mA 2% (typ) Output Voltage accuracy on LDOs Accuracy and up to 90% efficiency 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2007, Texas Instruments Incorporated LP3917 SNVS425A – DECEMBER 2006 – REVISED MARCH 2007 www.ti.com SYSTEM DIAGRAM I/O Interface of Baseband Processor Support 2 x DC/DC Power Domains of Baseband Processor Control 9 x LDO Memory USB Transceiver RF 2 x Comparator Peripheral Devices LP3917 2 Submit Documentation Feedback Connector Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Links: LP3917 LP3917 www.ti.com SNVS425A – DECEMBER 2006 – REVISED MARCH 2007 TYPICAL APPLICATION DIAGRAM VIN1 VIN2 - CREF 0.1 PF BMON + Battery VINBATT VBATT 10 PF 10 PF VBATT MSMC 1.375V/1.875V @800 mA SEL1 SW_B1 2.2 PH Buck Regulator #1 R1 C1 FB_B1 10 PF R2 VBATT GND_B1 Voltage Monitor Voltage Reference Thermal Shutdown LDO1 UVLO LDO2 LDO1 4.7 PF VBATT SEL2 LDO2 LCD 4.7 PF 2.6/2.8/2.85V @300 mA VIN_BUCK 10 PF MSME 1.8V @600 mA MSMP 1.8/1.875/2.6V @300 mA RX_EN FB_B2 2.2 PH 10 PF Buck Regulator #2 SW_B2 LDO3 LDO3 RX/SYNTH 2.85V @150 mA 2.2 PF LP3917 GND_B2 LDO4 MSMA 2.6V @150 mA 2.2 PF LDO4 VBATT TCXO_EN B2_EN LDO1 LDO5 VBATT LDO1 1.5k 1.5k 10k IRQ_N O/D output SDA O/D output LDO6 TX 2.85V @150 mA 2.2 PF LDO6 SCL PS_HOLD RESET_N LDO7 LDO7 Serial Interface and Control PON_N VBAT LDO5 TCXO 2.85V @80 mA 1 PF 2.2 PF LDO8 VIBRA 2.85V @150 mA 2.2 PF LDO8 HF_PWR T PWR_ON LDO9 CAM/KP 2.85V @300 mA 4.7 PF LDO9 200k Options S, M 500k Options Q, QL, N, NL 200k UIM 2.85V @150 mA 1.5k LDO1 VBATT VBUS VBATT LDO1 CMP2 GNDD + GNDA INP2 INP1 D+ CMP1 V1.6 10: D- PGM REF 10: VM SUSPEND VP 1 PF OE_N 1 PF USB Transceiver RCV VTRM LDO1 + - Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Links: LP3917 3 LP3917 SNVS425A – DECEMBER 2006 – REVISED MARCH 2007 www.ti.com DEVICE PIN DIAGRAM 7 LDO3 LDO1 LDO2 LDO4 CREF PS_ HOLD GND_ B1 6 VIN1 RX_EN TCXO_ EN SEL1 BMON FB_B1 SW_B1 5 LDO5 SCL CMP1 IRQ_N SEL2 B2_EN VIN_ BUCK 4 LDO6 SDA INP1 GNDD SUS PEND FB_B2 SW_B2 3 LDO7 RESET _N INP2 PON_N RCV VM GND_ B2 2 LDO8 VIN BATT CMP2 HF_ PWR OE_N VP VTRM 1 LDO9 VIN2 GNDA PWR_ ON VBUS D- D+ A B C D E F G Figure 1. TOP VIEW PACKAGE MARKING INFORMATION XYTT V0x 4 XY = 2 Digit Date Code TT = Die Traceability V0x = LP3917 Product ID = Pin 1A Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Links: LP3917 PACKAGE OPTION ADDENDUM www.ti.com 29-Aug-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LP3917RL-M/NOPB ACTIVE DSBGA YPG 49 TBD Call TI Call TI V05 LP3917RL-N/NOPB ACTIVE DSBGA YPG 49 TBD Call TI Call TI V03 LP3917RL-Q/NOPB ACTIVE DSBGA YPG 49 TBD Call TI Call TI V04 LP3917RL-S/NOPB ACTIVE DSBGA YPG 49 TBD Call TI Call TI V01 LP3917RLX-M/NOPB ACTIVE DSBGA YPG 49 TBD Call TI Call TI V05 LP3917RLX-N/NOPB ACTIVE DSBGA YPG 49 TBD Call TI Call TI V03 LP3917RLX-Q/NOPB ACTIVE DSBGA YPG 49 TBD Call TI Call TI V04 LP3917RLX-S/NOPB ACTIVE DSBGA YPG 49 TBD Call TI Call TI V01 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 29-Aug-2015 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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