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MM74C948N

MM74C948N

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    IC ADC

  • 数据手册
  • 价格&库存
MM74C948N 数据手册
ADC0816, ADC0817 www.ti.com SNAS527B – MAY 2004 – REVISED MARCH 2007 ADC0816/ADC0817 8-Bit μP Compatible A/D Converters with16-Channel Multiplexer Check for Samples: ADC0816, ADC0817 FEATURES 1 • • 23 • • • • Easy interface to all microprocessors Operates ratiometrically or with 5 VDC or analog span adjusted voltage reference 16-channel multiplexer with latched control logic Outputs meet TTL voltage level specifications 0V to 5V analog input voltage range with single5V supply No zero or full-scale adjust required • • • • • • Standard hermetic or molded 40-pin DIP package Temperature range −40°C to +85°Cor −55°C to +125°C Latched TRI-STATE® output Direct access to “comparator in”and “multiplexer out” for signal conditioning ADC0816 equivalent to MM74C948 ADC0817 equivalent to MM74C948-1 DESCRIPTION The ADC0816, ADC0817 data acquisition component is a monolithic CMOS device with an 8-bit analog-to-digital converter,16-channel multiplexer and microprocessor compatible control logic. The 8-bit A/D converter uses successive approximation as the conversion technique. The converter features a high impedance chopper stabilized comparator, a 256R voltage divider with analog switch tree and a successive approximation register. The 16-channel multiplexer can directly access any one of16-single-ended analog signals, and provides the logic for additional channel expansion. Signal conditioning of any analog input signal is eased by direct access to the multiplexer output, and to the input of the 8-bit A/D converter. The device eliminates the need for external zero and full-scale adjustments. Easy interfacing to microprocessors is provided by the latched and decoded multiplexer address inputs and latched TTL TRI-STATE®outputs. The design of the ADC0816, ADC0817 has been optimized by incorporating the most desirable aspects of several A/D conversion techniques. The ADC0816,ADC0817 offers high speed, high accuracy, minimal temperature dependence, excellent long-term accuracy and repeatability, and consumes minima lpower. These features make this device ideally suited to applications from process and machine control to consumer and automotive applications. For similar performance in an 8-channel, 28-pin, 8-bit A/D converter, see the ADC0808, ADC0809 data sheet. (See AN-258 for more information.) Table 1. Key Specifications VALUE UNIT Resolution 8 Bits Total Unadjusted Error ±½ LSB and ±1 LSB Single Supply 5 VDC Low Power 15 Conversion Time 100 μs mW 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. TRI-STATE is a registered trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2007, Texas Instruments Incorporated ADC0816, ADC0817 SNAS527B – MAY 2004 – REVISED MARCH 2007 www.ti.com Block Diagram Connection Diagram Figure 1. Dual-In-Line Package These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Links: ADC0816 ADC0817 ADC0816, ADC0817 www.ti.com SNAS527B – MAY 2004 – REVISED MARCH 2007 Absolute Maximum Ratings Supply Voltage (VCC) (1) (2) (3) 6.5V −0.3V to (VCC+0.3V) Voltage at Any Pin Except Control Inputs −0.3V to 15V Voltage at Control Inputs (START, OE, CLOCK, ALE, EXPANSION CONTROL, ADD A, ADD B, ADD C, ADD D) −65°C to +150°C Storage Temperature Range Package Dissipation at TA = 25°C 875 mW Lead Temp. (Soldering, 10 seconds) Dual-In-Line Package (Plastic) 260°C Molded Chip Carrier Package Vapor Phase (60seconds) 215°C Infrared (15 seconds) 220°C ESD Susceptibility (1) (2) (3) (4) (4) 400V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its specified operating conditions. All voltages are measured with respect to GND, unless otherwise specified. A Zener diode exists, internally, from VCC to GND and has a typical breakdown voltage of 7 VDC. Human body model, 100 pF discharged through a 1.5 kΩ resistor. Operating Conditions Temperature Range (1) (2) (1) TMIN≤TA≤TMAX −40°C≤TA≤+85°C ADC0816CCN, ADC0817CCN Range of VCC (1) 4.5 VDC to 6.0VDC Voltage at Any Pin 0V to VCC Except Control Inputs Voltage at Control Inputs 0V to 15V (START,OE, CLOCK, ALE, EXPANSION CONTROL, ADD A, ADD B, ADD C, ADDD) (1) (2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its specified operating conditions. All voltages are measured with respect to GND, unless otherwise specified. Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Links: ADC0816 ADC0817 Submit Documentation Feedback 3 ADC0816, ADC0817 SNAS527B – MAY 2004 – REVISED MARCH 2007 www.ti.com Electrical Characteristics Converter Specifications: VCC=5 VDC= VREF(+), VREF(−)=GND, VIN=VCOMPARATOR IN,TMIN≤TMAX and fCLK =640 kHz unless otherwise stated. Symbol Parameter Conditions Min Typ Max Units ADC0816 Total Unadjusted Error 25°C ±½ LSB (1) TMIN to TMAX ±¾ LSB Total Unadjusted Error 0°C to 70°C ±1 LSB (1) TMIN to TMAX ±1¼ LSB VCC + 0.1 VDC VCC VCC+0.1 V VCC/2 VCC/2 + 0.1 ADC0817 VREF(+) Input Resistance From Ref(+)to Ref(−) Analog Input Voltage Range (2) Voltage, Top of Ladder Measured at Ref(+) 1.0 GND − 0.1 V(+) or V(−) VCC/2 − 0.1 Voltage, Center of Ladder VREF(−) (1) (2) (3) 4 Voltage, Bottom of Ladder Measured at Ref(−) Comparator Input Current fc=640 kHz, 4.5 (3) −0.1 0 −2 ±0.5 kΩ V V 2 μA Total unadjusted error includes offset, full-scale, and linearity errors. See Figure 4. None of these A/Ds requires a zero or full-scale adjust. However, if an all zero code is desired for an analog input other than 0.0V,or if a narrow full-scale span exists (for example: 0.5V to 4.5V full-scale)the reference voltages can be adjusted to achieve this. See Figure 14. Two on-chip diodes are tied to each analog input which will forward conduct for analog input voltages one diode drop below ground or one diode drop greater than the VCCsupply. The spec allows 100 mV forward bias of either diode. This means that as long as the analog VIN does not exceed the supply voltage by more than 100 mV, the output code will be correct. To achieve an absolute0 VDC to 5 VDC input voltage range will therefore require a minimum supply voltage of 4.900 VDC over temperature variations, initial tolerance and loading. Comparator input current is a bias current into or out of the chopper stabilized comparator. The bias current varies directly with clock frequency and has little temperature dependence (Figure 7). Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Links: ADC0816 ADC0817 ADC0816, ADC0817 www.ti.com SNAS527B – MAY 2004 – REVISED MARCH 2007 Electrical Characteristics Digital Levels and DC Specifications: ADC0816CCN, ADC0817CCN—4.75V≤VCC≤5.25V, −40°C≤TA≤+85°C unless otherwise noted. Symbol Parameter Conditions Min Typ Max Units 1.5 ANALOG MULTIPLEXER (Any Selected Channel) RON ΔRON Analog Multiplexer ON Resistance ΔON Resistance Between Any 2 Channels TA=25°C, RL=10k 3 kΩ TA=85°C 6 kΩ TA=125°C 9 kΩ (Any Selected Channel) RL=10k Ω 75 VCC=5V, VIN=5V, IOFF+ OFF Channel Leakage Current TA=25°C 10 TMIN to TMAX 200 nA 1.0 μA VCC=5V, VIN=0, IOFF(−) OFF Channel Leakage Current TA=25°C −200 nA TMIN to TMax −1.0 μA VCC − 1.5 V CONTROL INPUTS VIN(1) Logical “1”Input Voltage VIN(0) Logical “0”Input Voltage IIN(1) Logical “1”Input Current (The Control Inputs) VIN=15V IIN(0) Logical “0”Input Current (The Control Inputs) VIN=0 ICC Supply Current fCLK=640 kHz 1.5 V 1.0 μA −1.0 μA 0.3 3.0 mA DATA OUTPUTS AND EOC (INTERRUPT) VOUT(1) Logical “1”Output Voltage IO=−360 μA, TA=85°C IO=−300 μA, TA=125°C VOUT(0) Logical “0”Output Voltage IO=1.6 mA 0.45 VOUT(0) Logical “0”Output Voltage EOC IO=1.2 mA 0.45 V VO=VCC 3.0 μA IOUT TRI-STATE Output Current VCC − 0.4 VO=0 Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Links: ADC0816 ADC0817 −3.0 V V μA Submit Documentation Feedback 5 ADC0816, ADC0817 SNAS527B – MAY 2004 – REVISED MARCH 2007 www.ti.com Electrical Characteristics Timing Specifications:VCC=VREF(+)=5V, VREF(−)=GND, tr=tf=20 ns and TA=25°C unless otherwise noted. Symbol Parameter Conditions Min (1) Typ Max Units tWS Minimum Start Pulse Width (Figure 6) 100 200 ns tWALE Minimum ALE Pulse Width (Figure 6) 100 200 ns ts Minimum Address Set-Up Time (Figure 6) 25 50 ns TH Minimum Address Hold Time (Figure 6) 25 50 ns tD Analog MUX Delay Time from ALE RS=OΩ (Figure 6) 1 2.5 μs tH1, tH0 OE Control to Q Logic State CL=50 pF, RL=10k (Figure 9) 125 250 ns t1H, t0H OE Control to Hi-Z CL=10 pF, RL=10k (Figure 9) tC Conversion Time fc=640 kHz, (Figure 6) fc Clock Frequency tEOC EOC Delay Time (Figure 6) CIN Input Capacitance At Control Inputs COUT TRI-STATE Output Capacitance At TRI-STATE Outputs (1) (2) (2) 125 250 ns 90 100 116 μs 10 640 1280 kHz 8 + 2μs Clock Periods 10 15 pF 10 15 pF 0 (2) If start pulse is asynchronous with converter clock or if fc > 640 kHz, the minimum start pulse width is 8clock periods plus 2 μs. For synchronous operation at fc ≤640 kHz take start high within 100 ns of clock going low. The outputs of the data register are updated one clock cycle before the rising edge of EOC. Functional Description Multiplexer: The device contains a 16-channel single-ended analog signal multiplexer. A particular input channel is selected by using the address decoder. Table 2 shows the input states for the address line and the expansion control line to select any channel. The address is latched into the decoder on the low-to-high transition of the address latch enable signal. Table 2. Inputs States for the Address line Address Line (1) Selected AnalogChannel (1) 6 Expansion D C B A Control IN0 L L L L H IN1 L L L H H IN2 L L H L H IN3 L L H H H IN4 L H L L H IN5 L H L H H IN6 L H H L H IN7 L H H H H IN8 H L L L H IN9 H L L H H IN10 H L H L H IN11 H L H H H IN12 H H L L H IN13 H H L H H IN14 H H H L H IN15 H H H H H All Channels OFF X X X X L X=don't care Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Links: ADC0816 ADC0817 ADC0816, ADC0817 www.ti.com SNAS527B – MAY 2004 – REVISED MARCH 2007 Additional single-ended analog signals can be multiplexed to the A/D converter by disabling all the multiplexer inputs using the expansion control. The additional external signals are connected to the comparator input and the device ground. Additional signal conditioning (i.e., prescaling, sample and hold, instrumentation amplification, etc.) may also be added between the analog input signal and the comparator input. CONVERTER CHARACTERISTICS The Converter The heart of this single chip data acquisition system is its8-bit analog-to-digital converter. The converter is designed to give fast, accurate, and repeatable conversions over a wide range of temperatures. The converter is partitioned into 3 major sections: the 256R ladder network, the successive approximation register, and the comparator. The converter's digital outputs are positive true. The 256R ladder network approach Figure 2 was chosen over the conventional R/2R ladder because of its inherent monotonicity, which guarantees no missing digital codes. Monotonicity is particularly important in closed loop feedback control systems. A non-monotonic relationship can cause oscillations that will be catastrophic for the system. Additionally, the 256R network does not cause load variations on the reference voltage. The bottom resistor and the top resistor of the ladder networking Figure 2 are not the same value as the remainder of the network. The difference in these resistors causes the output characteristic to be symmetrical with the zero and full-scale points of the transfer curve. The first output transition occurs when the analog signal has reached + ½ LSB and succeeding output transitions occur every 1 LSB later up to full-scale. Figure 2. Resistor Ladder and Switch Tree Figure 3. 3-Bit A/D Transfer Curve Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Links: ADC0816 ADC0817 Submit Documentation Feedback 7 ADC0816, ADC0817 SNAS527B – MAY 2004 – REVISED MARCH 2007 www.ti.com Figure 4. 3-Bit A/D Absolute Accuracy Curve Figure 5. Typical Error Curve 8 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Links: ADC0816 ADC0817 ADC0816, ADC0817 www.ti.com SNAS527B – MAY 2004 – REVISED MARCH 2007 Timing Diagram Figure 6. The successive approximation register (SAR) performs 8 iterations to approximate the input voltage. For any SAR type converter, n-iterations are required for an n-bit converter. Figure 3 shows a typical example of a 3-bit converter. In the ADC0816,ADC0817, the approximation technique is extended to 8 bits using the 256Rnetwork. The A/D converter's successive approximation register (SAR)is reset on the positive edge of the start conversion (SC) pulse. The conversion is begun on the falling edge of the start conversion pulse. A conversion in process will be interrupted by receipt of a new start conversion pulse. Continuous conversion may be accomplished by tying the end-of-conversion(EOC) output to the SC input. If used in this mode, an external start conversion pulse should be applied after power up. End-of-conversion will go low between 0 and 8 clock pulses after the rising edge of start conversion. The most important section of the A/D converter is the comparator. It is this section which is responsible for the ultimate accuracy of the entire converter. It is also the comparator drift which has the greatest influence on the repeatability of the device. A chopper-stabilized comparator provides the most effective method of satisfying all the converter requirements. The chopper-stabilized comparator converts the DC input signal into an AC signal. This signal is then fed through a high gain AC amplifier and has the DC level restored. This technique limits the drift component of the amplifier since the drift is a DC component which is not passed by the AC amplifier. This makes the entire A/D converter extremely insensitive to temperature, long term drift and input offset errors. Figure 5 shows a typical error curve for the ADC0816 as measured using the procedures outlined in AN-179. Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Links: ADC0816 ADC0817 Submit Documentation Feedback 9 ADC0816, ADC0817 SNAS527B – MAY 2004 – REVISED MARCH 2007 www.ti.com Typical Performance Characteristics Figure 7. Comparator IIN vs. VIN (VCC=VREF=5V) 10 Submit Documentation Feedback Figure 8. Multiplexer RON vs. VIN (VCC=VREF=5V) Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Links: ADC0816 ADC0817 ADC0816, ADC0817 www.ti.com SNAS527B – MAY 2004 – REVISED MARCH 2007 TRI-STATE Test Circuits and Timing Diagrams Figure 9. Applications Information OPERATION Ratiometric Conversion The ADC0816, ADC0817 is designed as a complete Data Acquisition System (DAS) for ratiometric conversion systems. In ratiometric systems, the physical variable being measured is expressed as a percentage of full-scale which is not necessarily related to an absolute standard. The voltage input to the ADC0816 is expressed by the equation (1) Where: VIN = Input voltage into the ADC0816 Vfs = Full-scale voltage VZ = Zero voltage DX = Data point being measured DMAX = Maximum data limit DMIN = Minimum data limit A good example of a ratiometric transducer is a potentiometer used as a position sensor. The position of the wiper is directly proportional to the output voltage which is a ratio of the full-scale voltage across it. Since the data is represented as a proportion of full-scale, reference requirements are greatly reduced, eliminating a large source of error and cost for many applications. A major advantage of the ADC0816, ADC0817 is that the input voltage range is equal to the supply range so the transducers can be connected directly across the supply and their outputs connected directly into the multiplexer inputs, (Figure 10). Ratiometric transducers such as potentiometers, strain gauges, thermistor bridges, pressure transducers, etc., are suitable for measuring proportional relationships; however, many types of measurements must be referred to an absolute standard such as voltage or current. This means a system reference must be used which relates the full-scale voltage to the standard volt. For example, if VCC = VREF =5.12V, then the full-scale range is divided into 256 standard steps. The smallest standard step is 1 LSB which is then 20 mV. Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Links: ADC0816 ADC0817 Submit Documentation Feedback 11 ADC0816, ADC0817 SNAS527B – MAY 2004 – REVISED MARCH 2007 www.ti.com Resistor Ladder Limitations The voltages from the resistor ladder are compared to the selected input 8 times in a conversion. These voltages are coupled to the comparator via an analog switch tree which is referenced to the supply. The voltages at the top, center and bottom of the ladder must be controlled to maintain proper operation. The top of the ladder, Ref(+), should not be more positive than the supply, and the bottom of the ladder, Ref(−), should not be more negative than ground. The center of the ladder voltage must also be near the center of the supply because the analog switch tree changes from N-channel switches to P-channel switches. These limitations are automatically satisfied in ratiometric systems and can be easily met in ground referenced systems. Figure 11 shows a ground referenced system with a separate supply and reference. In this system, the supply must be trimmed to match the reference voltage. For instance, if a5.12V reference is used, the supply should be adjusted to the same voltage within 0.1V. Figure 10. Ratiometric Conversion System The ADC0816 needs less than a milliamp of supply current so developing the supply from the reference is readily accomplished. In Figure 12 a ground references system is shown which generates the supply from the reference. The buffer shown can be an op amp of sufficient drive to supply the milliamp of supply current and the desired bus drive, or if a capacitive bus is driven by the outputs a large capacitor will supply the transient supply current as seen in Figure 13. The LM301 is overcompensated to insure stability when loaded by the 10 μF output capacitor. The top and bottom ladder voltages cannot exceed VCCand ground, respectively, but they can be symmetrically less than VCC and greater than ground. The center of the ladder voltage should always be near the center of the supply. The sensitivity of the converter can be increased, (i.e., size of the LSB steps decreased) by using a symmetrical reference system. In Figure 14, a2.5V reference is symmetrically centered about VCC/2 since the same current flows in identical resistors. This system with a 2.5V reference allows the LSB to be half the size of the LSB in a 5V reference system. Figure 11. Ground Referenced Conversion System Using Trimmed Supply 12 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Links: ADC0816 ADC0817 ADC0816, ADC0817 www.ti.com SNAS527B – MAY 2004 – REVISED MARCH 2007 Figure 12. Ground Referenced Conversion System with Reference Generating VCC Supply Figure 13. Typical Reference and Supply Circuit Figure 14. Symmetrically Centered Reference Converter Equations The transition between adjacent codes N and N + 1 is given by: (2) The center of an output code N is given by: Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Links: ADC0816 ADC0817 Submit Documentation Feedback 13 ADC0816, ADC0817 SNAS527B – MAY 2004 – REVISED MARCH 2007 www.ti.com (3) The output code N for an arbitrary input are the integers within the range: (4) where: VIN = Voltage at comparator input VREF = Voltage at Ref(+) VREF = Voltage at Ref(−) VTUE = Total unadjusted error voltage(typically VREF(+) ÷512) Analog Comparator Inputs The dynamic comparator input current is caused by the periodic switching of on-chip stray capacitances These are connected alternately to the output of the resistor ladder/switch tree network and to the comparator input as part of the operation of the chopper stabilized comparator. The average value of the comparator input current varies directly with clock frequency and with VIN as shown in Figure 7. If no filter capacitors are used at the analog or comparator inputs and the signal source impedances are low, the comparator input current should not introduce converter errors, as the transient created by the capacitance discharge will die out before the comparator output is strobed. If input filter capacitors are desired for noise reduction and signal conditioning they will tend to average out the dynamic comparator input current. It will then take on the characteristics of a DC bias current whose effect can be predicted conventionally. See AN-258 for further discussion. Typical Application *Address latches needed for 8085 and SC/MP interfacing theADC0816, 17 to a microprocessor Microprocessor Interface Table PROCESSOR READ WRITE INTERRUPT(COMMENT) 8080 MEMR MEMW INTR (Thru RST Circuit) 8085 RD WR INTR (Thru RST Circuit) Z-80 RD WR INT (Thru RST Circuit, Mode 0) 14 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Links: ADC0816 ADC0817 ADC0816, ADC0817 www.ti.com SNAS527B – MAY 2004 – REVISED MARCH 2007 PROCESSOR READ WRITE INTERRUPT(COMMENT) SC/MP NRDS NWDS SA (Thru Sense A) 6800 VMA•φ2•R/W VMA•Q2•R/W IRQA or IRQB (Thru PIA) Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Links: ADC0816 ADC0817 Submit Documentation Feedback 15 PACKAGE OPTION ADDENDUM www.ti.com 17-Nov-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Samples (3) (Requires Login) ADC0816CCN ACTIVE PDIP NFJ 40 9 TBD Call TI Level-1-NA-UNLIM ADC0816CCN/NOPB ACTIVE PDIP NFJ 40 9 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM ADC0817CCN ACTIVE PDIP NFJ 40 9 TBD Call TI Level-1-NA-UNLIM ADC0817CCN/NOPB ACTIVE PDIP NFJ 40 9 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM INS8292N ACTIVE PDIP NFJ 40 9 TBD Call TI Level-1-NA-UNLIM MM74C948N ACTIVE PDIP NFJ 40 9 TBD Call TI Level-1-NA-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA NFJ0040A N0040A N40A (Rev E) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. 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