OPA129
OPA
OPA
129
129
SBOS026A – JANUARY 1994 – REVISED APRIL 2007
Ultra-Low Bias Current Difet®
OPERATIONAL AMPLIFIER
FEATURES
APPLICATIONS
●
●
●
●
●
●
●
●
●
●
●
●
ULTRA-LOW BIAS CURRENT: 100fA max
LOW OFFSET: 2mV max
LOW DRIFT: 10µV/°C max
HIGH OPEN-LOOP GAIN: 94dB min
LOW NOISE: 15nV/√Hz at 10kHz
PLASTIC DIP AND SO PACKAGES
PHOTODETECTOR PREAMPS
CHROMATOGRAPHY
ELECTROMETER AMPLIFIERS
MASS SPECTROMETERS
pH PROBE AMPLIFIERS
ION GAGE MEASUREMENT
Substrate
DESCRIPTION
8
The OPA129 is an ultra-low bias current monolithic
operational amplifier offered in an 8-pin PDIP and
SO-8 package. Using advanced geometry
dielectrically-isolated FET (Difet®) inputs, this monolithic
amplifier achieves a high performance level.
Difet fabrication eliminates isolation-junction leakage
current—the main contributor to input bias current with
conventional monolithic FETs. This reduces
input bias current by a factor of 10 to 100. Very low
input bias current can be achieved without resorting to
small-geometry FETs or CMOS designs which can
suffer from much larger offset voltage, voltage noise,
drift, and poor power-supply rejection.
The OPA129 special pinout eliminates leakage current
that occurs with other op amps. Pins 1 and 4 have no
internal connection, allowing circuit board guard traces—
even with the surface-mount package version.
OPA129 is available in 8-pin DIP and SO packages,
specified for operation from –40°C to +85°C.
7
V+
–In
2
3
+In
Noise-Free
Cascode
6
Output
30kΩ
30kΩ
5
V–
Simplified Circuit
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Difet is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
Copyright © 1994–2007, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
SPECIFICATIONS
ELECTRICAL
At VS = ±15V and TA = +25°C, unless otherwise noted. Pin 8 connected to ground.
OPA129PB, UB
PARAMETER
CONDITION
MIN
TYP
OPA129P, U
MAX
MIN
±30
±100
Doubles every 10°C
TYP
MAX
UNITS
*
*
±250
fA
INPUT BIAS CURRENT(1)
vs Temperature
VCM = 0V
INPUT OFFSET CURRENT
VCM = 0V
±30
VCM = 0V
VS = ±5V to ±18V
±0.5
±3
±3
f = 10Hz
f = 100Hz
f = 1kHz
f = 10kHz
fB = 0.1Hz to 10Hz
f = 10kHz
85
28
17
15
4
0.1
*
*
*
*
*
*
nV/√Hz
nV/√Hz
nV/√Hz
nV/√Hz
µVPP
fA/√Hz
1013 || 1
1015 || 2
*
*
Ω || pF
Ω || pF
OFFSET VOLTAGE
Input Offset Voltage
vs Temperature
Supply Rejection
NOISE
Voltage
Current
INPUT IMPEDANCE
Differential
Common-Mode
VOLTAGE RANGE
Common-Mode Input Range
Common-Mode Rejection
OPEN-LOOP GAIN, DC
Open-Loop Voltage Gain
FREQUENCY RESPONSE
Unity Gain, Small Signal
Full Power Response
Slew Rate
Settling Time:
0.1%
0.01%
Overload Recovery, 50% Overdrive(2)
RATED OUTPUT
Voltage Output
Current Output
Load Capacitance Stability
Short-Circuit Current
POWER SUPPLY
Rated Voltage
Voltage Range, Derated Performance
Current, Quiescent
TEMPERATURE
Specification
Operating
Storage
Thermal Resistance
DIP-8
SO-8
*
±2
±10
±100
±1
±5
*
fA
±5
*
mV
µV/°C
µV/V
VIN = ±10V
±10
80
±12
118
*
*
*
*
V
dB
RL ≥ 2kΩ
94
120
*
*
dB
1
1
47
2.5
*
*
*
*
MHz
kHz
V/µs
*
*
*
µs
µs
µs
*
*
*
*
*
V
mA
pF
mA
*
*
V
V
mA
*
*
*
°C
°C
°C
20Vp-p, RL = 2kΩ
VO = ±10V, RL = 2kΩ
G = –1, RL = 2kΩ, 10V Step
5
10
5
G = –1
RL = 2kΩ
VO = ±12V
Gain = +1
±12
±6
±5
IO = 0mA
Ambient Temperature
Ambient Temperature
±13
±10
1000
±35
±15
1.2
–40
–40
–40
*
*
±55
*
±18
1.8
*
+85
+125
+125
*
*
*
*
θJA, Junction-to-Ambient
90
100
*
*
°C/W
°C/W
NOTES: (1) High-speed automated test.
(2) Overload recovery is defined as the time required for the output to return from saturation to linear operation following the removal of a 50% input
overdrive.
2
OPA129
www.ti.com
SBOS026A
PACKAGE INFORMATION(1)
ABSOLUTE MAXIMUM RATINGS
Power Supply Voltage ...................................................................... ±18V
Differential Input Voltage ............................................................ V– to V+
Input Voltage Range .................................................................... V– to V+
Storage Temperature Range ......................................... –40°C to +125°C
Operating Temperature Range ...................................... –40°C to +125°C
Output Short Circuit Duration(1) .................................................................. Continuous
Junction Temperature (TJ) ............................................................ +150°C
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
OPA129P
OPA129PB
OPA129U
OPA129UB
DIP-8
DIP-8
SO-8
SO-8
P
P
D
D
NOTE: (1) For the most current package and ordering information, see the
Package Option Addendum at the end of this data sheet, or see the TI website
at www.ti.com.
NOTE: (1) Short circuit may be to power supply common at +25°C ambient.
CONNECTION DIAGRAM
ELECTROSTATIC
DISCHARGE SENSITIVITY
Top View
Any integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe proper handling and installation procedures can
cause damage.
DIP/SO
NC
1
–In
2
8
Substrate
7
V+
OPA
+In
3
6
Output
NC
4
5
V–
NC: No internal connection.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage
because very small parametric changes could cause
the device not to meet published specifications.
TYPICAL PERFORMANCE CURVES
At TA = +25°C, +15VDC, unless otherwise noted.
OPEN-LOOP FREQUENCY RESPONSE
POWER SUPPLY REJECTION vs FREQUENCY
140
45
Gain
100
θ
80
Phase
Margin
≈90°
60
40
90
135
20
0
Pulse Shift (degrees)
Voltage Gain (dB)
120
Power Supply Rejection (dB)
140
180
1
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
100
80
+PSRR
60
–PSRR
40
20
0
1
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
OPA129
SBOS026A
120
www.ti.com
3
TYPICAL PERFORMANCE CURVES (Cont.)
At TA = +25°C, +15VDC, unless otherwise noted.
COMMON-MODE REJECTION
vs INPUT COMMON-MODE VOLTAGE
COMMON-MODE REJECTION vs FREQUENCY
140
Common-Mode Rejection (dB)
Common-Mode Rejection (dB)
120
110
100
90
80
120
100
80
60
40
20
0
70
15
10
5
0
10
5
1
15
10k
100k
1M
BIAS AND OFFSET CURRENT
vs INPUT COMMON-MODE VOLTAGE
10M
10
Normalized Bias and Offset Current
Bias and Offset Current (fA)
1k
BIAS AND OFFSET CURRENT vs TEMPERATURE
10pA
1pA
IB and IOS
100
10
1
1
0.1
0.01
–50
–25
0
25
50
75
100
125
–15
Ambient Temperature (°C)
–10
–5
5
0
10
15
Common-Mode Voltage (V)
FULL-POWER OUTPUT vs FREQUENCY
INPUT VOLTAGE NOISE SPECTRAL DENSITY
30
Output Voltage (VPP)
1k
Voltage Density (nV/√Hz)
100
Frequency (Hz)
100pA
100
20
10
0
10
1
10
100
1k
10k
100k
1k
10k
100k
1M
Frequency (Hz)
Frequency (Hz)
4
10
Common-Mode Voltage (V)
OPA129
www.ti.com
SBOS026A
TYPICAL PERFORMANCE CURVES (Cont.)
At TA = +25°C, +15VDC, unless otherwise noted.
3
3
2
2
1
Gain Bandwidth (MHz)
4
Slew Rate (V/µs)
Gain Bandwidth (MHz)
4
1
0
–50
–25
0
25
50
75
100
6
2
4
+Slew
–Slew
1
0
0
125
5
10
Ambient Temperature (°C)
15
20
Supply Voltage (±VCC)
SUPPLY CURRENT vs TEMPERATURE
OPEN-LOOP GAIN, PSR AND CMR vs TEMPERATURE
2.0
130
PSR, CMR, Voltage Gain (dB)
Supply Current (mA)
2
GBW
0
0
–75
3
Slew Rate (v/µs)
GAIN BANDWIDTH AND SLEW RATE
vs SUPPLY VOLTAGE
GAIN BANDWIDTH AND SLEW RATE
vs TEMPERATURE
1.5
1.0
0.5
0
120
A OL
CMR
110
100
PSR
90
–75
–50
–25
0
25
50
75
100
125
–75
–50
Ambient Temperature (°C)
–25
0
25
50
75
100
125
Ambient Temperature (°C)
SMALL SIGNAL TRANSIENT RESPONSE
LARGE SIGNAL TRANSIENT RESPONSE
10
Output Voltage (mV)
Output Voltage (V)
80
0
–10
5V
0
5µs
25
0
–40
0
50
1µs
20mV
–80
2
4
6
8
10
Time (µs)
Time (µs)
OPA129
SBOS026A
40
www.ti.com
5
TYPICAL PERFORMANCE CURVES (CONT)
TA = +25°C, +15VDC, unless otherwise noted.
COMMON-MODE INPUT RANGE vs SUPPLY VOLTAGE
BIAS CURRENT vs ADDITIONAL POWER DISSIPATION
100pA
10pA
Bias Current (fA)
Common-Mode Voltage (+V)
15
10
5
100
10
0
1
0
5
10
15
20
0
APPLICATIONS INFORMATION
NON-STANDARD PINOUT
The OPA129 uses a non-standard pinout to achieve lowest
possible input bias current. The negative power supply is
connected to pin 5—see Figure 1. This is done to reduce the
leakage current from the V- supply (pin 4 on conventional
op amps) to the op amp input terminals. With this new
pinout, sensitive inputs are separated from both power
supply pins.
RF
V+
RIN
VIN
2
3
7
OPA129
6
VOUT
5
V+
V–
470kΩ
220Ω
50
100
150
200
250
300
350
Additional Power Dissipation (mW)
Supply Voltage (±VCC)
470kΩ
0.1µF
V–
FIGURE 1. Offset Adjust Circuit.
OFFSET VOLTAGE TRIM
The OPA129 has no conventional offset trim connections.
Pin 1, next to the critical inverting input, has no internal
connection. This eliminates a source of leakage current and
allows guarding of the input terminals. Pin 1 and pin 4, next
to the two input pins, have no internal connection. This
allows an optimized circuit board layout with guarding—see
the Circuit Board Layout section.
6
1pA
Due to its laser-trimmed input stage, most applications do
not require external offset voltage trimming. If trimming is
required, the circuit shown in Figure 1 can be used. Power
supply voltages are divided down, filtered and applied to the
non-inverting input. The circuit shown is sensitive to variation in the supply voltages. Regulation can be added, if
needed.
GUARDING AND SHIELDING
Ultra-low input bias current op amps require precautions to
achieve best performance. Leakage current on the surface of
circuit board can exceed the input bias current of the amplifier. For example, a circuit board resistance of 1012Ω from
a power supply pin to an input pin produces a current of
15pA—more than 100 times the input bias current of the op
amp.
To minimize surface leakage, a guard trace should completely surround the input terminals and other circuitry
connecting to the inputs of the op amp. The DIP package
should have a guard trace on both sides of the circuit board.
The guard ring should be driven by a circuit node equal in
potential to the op amp inputs—see Figure 2. The substrate,
pin 8, should also be connected to the circuit board guard to
assure that the amplifier is fully surrounded by the guard
potential. This minimizes leakage current and noise pick-up.
Careful shielding is required to reduce noise pickup. Shielding near feedback components may also help reduce noise
pick-up.
Triboelectric effects (friction-generated charge) can be a
troublesome source of errors. Vibration of the circuit board,
input connectors and input cables can cause noise and drift.
Make the assembly as rigid as possible. Attach cables to
avoid motion and vibration. Special low noise or low leakage cables may help reduce noise and leakage current. Keep
all input connections as short possible. Surface-mount components may reduce circuit board size and allow a more rigid
assembly.
OPA129
www.ti.com
SBOS026A
CIRCUIT BOARD LAYOUT
The OPA129 uses a new pinout for ultra low input bias
current. Pin 1 and pin 4 have no internal connection. This
allows ample circuit board space for a guard ring surrounding the op amp input pins—even with the tiny SO-8 surfacemount package. Figure 3 shows suggested circuit board
layouts. The guard ring should be connected to pin 8 (substrate) as shown. It should be driven by a circuit node equal
in potential to the input terminals of the op amp—see Figure
2 for common circuit configurations.
TESTING
Accurately testing the OPA129 is extremely difficult due to
its high performance. Ordinary test equipment may not be
able to resolve the amplifier’s extremely low bias current.
Inaccurate bias current measurements can be due to:
1. Test socket leakage.
2. Unclean package.
3. Humidity or dew point condensations.
4. Circuit contamination from fingerprints or anti-static
treatment chemicals.
5. Test ambient temperature.
6. Load power dissipation.
7. Mechanical stress.
8. Electrostatic and electromagnetic interference.
(A) Non-Inverting
RF
2
6 Out
2
Current
Input
3
7
6
OPA129
Output
5
8
VO = –IIN • RF
VO = –10V/nA
V–
FIGURE 4. Current-to-Voltage Converter.
500Ω
9.5kΩ
V+
Guard
8
2
7
6
OPA129
3
1VDC
Output
5
V–
pH Probe
RS ≈ 500MΩ
50mV Out
FIGURE 5. High Impedance (1015Ω) Amplifier.
1011Ω
RF
8
3
V+
Out
8
2
In
In
18kΩ
CF 10pF
6
3
2kΩ
V+
IIN
(B) Buffer
8
2
1000MΩ
(C) Inverting
∆Q
3
7
Output
6
OPA129
VOUT
5
In
Low frequency cutoff =
V– 1/(2πR C ) = 0.16Hz
F F
2
6 Out
3
VOUT = –∆Q/CF
8
FIGURE 6. Piezoelectric Transducer Charge Amplifier.
Guard top and bottom of board.
~1pF to prevent gain peaking
FIGURE 2. Connection of Input Guard.
1
8
V+
V0
1010 Ω
Connect to proper circuit
node, depending on circuit
configuration (see Figure 2).
4
5
2
(A) DIP package
1
8
V0
5
3
Connect to proper circuit
node, depending on circuit
configuration (see Figure 2).
0.1µF
V–
FIGURE 3. Suggested Board Layout for Input Guard.
OPA129
6
5 0.1µF
Output
5 x 109V/W
–15V
(B) SOIC package
Circuit must be well shielded.
FIGURE 7. Sensitive Photodiode Amplifier.
OPA129
SBOS026A
8
7
V+
4
+15V
Guard
Pin photodiode
HP 5082-4204
V–
www.ti.com
7
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
OPA129U
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
OPA
129U
OPA129UB
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
OPA
129U
B
OPA129UB/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
OPA
129U
B
OPA129UBE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
OPA
129U
B
OPA129UBG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
OPA
129U
B
OPA129UE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
OPA
129U
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2017
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
OPA129UB/2K5
Package Package Pins
Type Drawing
SOIC
D
8
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
12.4
Pack Materials-Page 1
6.4
B0
(mm)
K0
(mm)
P1
(mm)
5.2
2.1
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPA129UB/2K5
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
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