PCM2704,, PCM2705
PCM2706, PCM2707
Burr-Brown Audio
www.ti.com....................................................................................................................................................... SLES081F – JUNE 2003 – REVISED JANUARY 2009
STEREO AUDIO DAC WITH USB INTERFACE,
SINGLE-ENDED HEADPHONE OUTPUT AND S/PDIF OUTPUT
FEATURES
1
• On-Chip USB Interface:
– No Need of Dedicated Device Driver
– With Full-Speed Transceivers
– Fully Compliant With USB 1.1 Specification
– Certified by USB-IF
– Partially Programmable Descriptors
– Adaptive Isochronous Transfer for
Playback
– Bus-Powered or Self-Powered Operation
• Sampling Rate: 32, 44.1, 48 kHz
• On-Chip Clock Generator With Single 12-MHz
Clock Source
• Single Power Supply:
– Bus-Powered: 5 V, Typical (VBUS)
– Self-Powered: 3.3 V, Typical
• 16-Bit Delta-Sigma Stereo DAC
– Analog Performance at 5 V (Bus-Powered),
3.3 V (Self-Powered):
– THD+N: 0.006% RL > 10 kΩ,
Self-Powered
– THD+N: 0.025% RL = 32 Ω
– SNR = 98 dB
– Dynamic Range: 98 dB
– PO = 12 mW, RL = 32 Ω
– Oversampling Digital Filter
– Pass-Band Ripple = ±0.04 dB
– Stop-Band Attenuation = –50 dB
– Single-Ended Voltage Output
– Analog LPF Included
• Multiple Functions:
– Up to Eight Human Interface Device (HID)
Interfaces (Depending on Model and
Settings)
– Suspend Flag
– S/PDIF Out With SCMS
2345
•
– External ROM Interface (PCM2704/6)
– Serial Programming Interface (PCM2705/7)
– I2S Interface (Selectable on PCM2706/7)
Package:
– 28-Pin SSOP (PCM2704/5)
– 32-Pin TQFP (PCM2706/7)
APPLICATIONS
•
•
•
•
•
USB Headphones
USB Audio Speaker
USB CRT/LCD Monitor
USB Audio Interface Box
USB-Featured Consumer Audio Product
DESCRIPTION
The PCM2704/5/6/7 is TI's single-chip USB stereo
audio DAC with USB-compliant full-speed protocol
controller and S/PDIF. The USB-protocol controller
works with no software code, but USB descriptors
can be modified in some parts (for example, vendor
ID/product ID) through the use of an external ROM
(PCM2704/6), SPI (PCM2705/7), or on request. (1)
The PCM2704/5/6/7 employs SpAct™ architecture,
TI's unique system that recovers the audio clock from
USB packet data. On-chip analog PLLs with SpAct
enable playback with low clock jitter.
(1)
The modification of the USB descriptor through external ROM
or SPI must comply with USB-IF guidelines, and the vendor
ID must be your own ID as assigned by the USB-IF. The
descriptor also can be modified by changing a mask; contact
your representative for details.
1
2
3
4
5
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SpAct is a trademark of Texas Instruments.
System Two, Audio Precision are trademarks of Audio Precision, Inc.
I2S is a trademark of NXP Semiconductors.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2009, Texas Instruments Incorporated
PCM2704,, PCM2705
PCM2706, PCM2707
SLES081F – JUNE 2003 – REVISED JANUARY 2009....................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
Supply voltage
(1)
VBUS
–0.3 V to 6.5 V
VCCP, VCCL, VCCR, VDD
–0.3 V to 4 V
Supply voltage differences
VCCP, VCCL, VCCR, VDD
±0.1 V
Ground voltage differences
PGND, AGNDL, AGNDR, DGND, ZGND
±0.1 V
HOST
Digital input voltage
Analog input voltage
–0.3 V to 6.5 V
D+, D–, HID0/MS, HID1/MC, HID2/MD, XTI, XTO, DOUT, SSPND, CK, DT,
PSEL, FSEL, TEST, TEST0, TEST1, FUNC0, FUNC1, FUNC2, FUNC3
–0.3 V to (VDD + 0.3) V < 4 V
VCOM
–0.3 V to (VCCP + 0.3) V < 4 V
VOUTR
–0.3 V to (VCCR + 0.3) V < 4 V
VOUTL
–0.3 V to (VCCL + 0.3) V < 4 V
Input current (any pins except supplies)
±10 mA
Ambient temperature under bias
–40°C to 125°C
Storage temperature
–55°C to 150°C
Junction temperature
150°C
Lead temperature (soldering)
260°C, 5 s
Package temperature (IR reflow, peak)
(1)
260°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range
MIN
Supply voltage
VBUS
VCCP, VCCL, VCCR, VDD
NOM
MAX
4.35
5
5.25
3
3.3
3.6
Digital input logic level
V
TTL compatible
Digital input clock frequency
Analog output load resistance
11.994
12
16
32
Analog output load capacitance
Digital output load capacitance
Operating free-air temperature, TA
2
UNIT
–25
Submit Documentation Feedback
12.006
MHz
Ω
100
pF
20
pF
85
C
Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): PCM2704 PCM2705 PCM2706 PCM2707
PCM2704 and PCM2705
Not Recommended For New Designs
PCM2704,, PCM2705
PCM2706, PCM2707
www.ti.com....................................................................................................................................................... SLES081F – JUNE 2003 – REVISED JANUARY 2009
ELECTRICAL CHARACTERISTICS
all specifications at TA = 25°C, VBUS = 5 V, fS = 44.1 kHz, fIN = 1 kHz,16-bit data (unless otherwise noted)
PARAMETER
TEST CONDITIONS
PCM2704DB, PCM2705DB,
PCM2706PJT, PCM2707PJT
MIN
TYP
UNIT
MAX
DIGITAL INPUT/OUTPUT
Host interface
Apply USB revision 1.1, full-speed
Audio data format
USB isochronous data format
INPUT LOGIC
VIH
2
3.3
VIL
–0.3
0.8
2
5.5
VIH (1)
VIL
Input logic level
(1)
IIH
(2)
IIL
(2)
–0.3
Input logic current
IIH
0.8
VIN = 3.3 V
±10
VIN = 0 V
±10
VIN = 3.3 V
IIL
Vdc
65
VIN = 0 V
µA
100
±10
OUTPUT LOGIC
VOH (3)
VOL
IOH = –2 mA
(3)
Output logic level
VOH
2.8
IOL = 2 mA
IOH = –2 mA
VOL
0.3
Vdc
2.4
IOL = 2 mA
0.4
CLOCK FREQUENCY
Input clock frequency, XTI
fs
11.994
Sampling frequency
12
12.006
MHz
32, 44.1, 48
kHz
DAC CHARACTERISTICS
Resolution
Audio data channel
16
Bits
1, 2
Channel
DC ACCURACY
Gain mismatch, channel-to-channel
±2
±8
% of FSR
Gain error
±2
±8
% of FSR
Bipolar zero error
±3
±6
% of FSR
RL > 10 kΩ, self-powered,
VOUT = 0 dB
0.006%
0.01%
RL > 10 kΩ, bus-powered,
VOUT = 0 dB
0.012%
0.02%
RL = 32 Ω, self-/
bus-powered, VOUT = 0 dB
0.025%
DYNAMIC PERFORMANCE
THD+N
(4)
Total harmonic
distortion + noise
Line
(5)
Headphone
THD+N
S/N
Total harmonic distortion + noise
VOUT = –60 dB
Dynamic range
EIAJ, A-weighted
90
98
dB
Signal-to-noise ratio
EIAJ, A-weighted
90
98
dB
60
70
dB
Channel separation
(1)
(2)
(3)
(4)
(5)
2%
HOST
D+, D–, HOST, TEST, TEST0, TEST1, DT, PSEL, FSEL, XTI
FUNC0, FUNC1, FUNC2
fIN = 1 kHz, using the System Two™ Cascade audio measurement system by Audio Precision™ in the RMS mode with a 20-kHz LPF
and 400-Hz HPF.
THD+N performance varies slightly, depending on the effective output load, including dummy load R7, R8 in Figure 32.
Copyright © 2003–2009, Texas Instruments Incorporated
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Product Folder Link(s): PCM2704 PCM2705 PCM2706 PCM2707
3
PCM2704,, PCM2705
PCM2706, PCM2707
SLES081F – JUNE 2003 – REVISED JANUARY 2009....................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
all specifications at TA = 25°C, VBUS = 5 V, fS = 44.1 kHz, fIN = 1 kHz,16-bit data (unless otherwise noted)
PARAMETER
TEST CONDITIONS
PCM2704DB, PCM2705DB,
PCM2706PJT, PCM2707PJT
MIN
TYP
UNIT
MAX
ANALOG OUTPUT
Output voltage
0.55 VCCL, 0.55 VCCR
Vp-p
Center voltage
0.5 VCCP
V
Load impedance
Line
AC coupling
10
Headphone
AC coupling
16
LPF frequency response
kΩ
32
Ω
–3 dB
140
kHz
f = 20 kHz
–0.1
dB
DIGITAL FILTER PERFORMANCE
Pass band
0.454 fs
Stop band
0.546 fs
Hz
Pass-band ripple
±0.04
Stop-band attenuation
–50
Delay time
Hz
dB
dB
20/fs
s
POWER SUPPLY REQUIREMENTS
VBUS
Bus-powered
4.35
5
5.25
Voltage range
VCCP, VCCL, VCCR,
VDD
Self-powered
3
3.3
3.6
Line
DAC operation
23
30
Supply current
Headphone
DAC operation RL = 32 Ω)
35
46
Line/headphone
Suspend mode
150
190
Line
DAC operation
Headphone
DAC operation RL = 32 Ω)
Line/headphone
Suspend mode
Line
DAC operation
Headphone
DAC operation RL = 32 Ω)
Line/headphone
Suspend mode
VCCP, VCCL, VCCR,
VDD
Bus-powered
Power dissipation
(self-powered)
Power dissipation
(bus-powered)
Internal power-supply
voltage (7)
(6)
(6)
(6)
3.2
Vdc
mA
µA
76
108
116
166
495
684
115
158
175
242
750
998
µW
3.35
3.5
Vdc
85
°C
mW
µW
mW
TEMPERATURE RANGE
Operating temperature
θJA
(6)
(7)
4
Thermal resistance
–25
28-pin SSOP
(PCM2704/5)
100
32-pin TQFP
(PCM2706/7)
80
°C/W
Under USB suspend state.
VDD, VCCP, VCCL, VCCR. These pins work as output pins of internal power supply for bus-powered operation.
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Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): PCM2704 PCM2705 PCM2706 PCM2707
PCM2704,, PCM2705
PCM2706, PCM2707
www.ti.com....................................................................................................................................................... SLES081F – JUNE 2003 – REVISED JANUARY 2009
PIN ASSIGNMENTS
PCM2704/PCM2705
DB PACKAGE
(TOP VIEW)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
XTI
SSPND
TEST0
TEST1
HID2/MD
HID1/MC
HID0/MS
HOST
VCCP
PGND
VCOM
AGNDR
VCCR
VOUTR
VBUS
D+
D–
VDD
DGND
FUNC1
FUNC2
DOUT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
24 23 22 21 20 19 18 17
ZGND
AGNDL
VCCL
VOUTL
VOUTR
VCCR
AGNDR
VCOM
25
16
26
15
27
14
28
13
29
12
30
11
31
10
32
9
1 2 3
4
5 6 7
PSEL
DT
CK
XTO
XTI
SSPND
TEST
FSEL
8
PGND
VCCP
HOST
FUNC3
FUNC0
HID0/MS
HID1/MC
HID2/MD
XTO
CK
DT
PSEL
DOUT
DGND
VDD
D–
D+
VBUS
ZGND
AGNDL
VCCL
VOUTL
PCM2706/PCM2707
PJT PACKAGE
(TOP VIEW)
P0020-01
Copyright © 2003–2009, Texas Instruments Incorporated
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Product Folder Link(s): PCM2704 PCM2705 PCM2706 PCM2707
5
PCM2704,, PCM2705
PCM2706, PCM2707
SLES081F – JUNE 2003 – REVISED JANUARY 2009....................................................................................................................................................... www.ti.com
Terminal Functions (PCM2704DB/PCM2705DB)
TERMINAL
NAME
NO.
I/O
DESCRIPTION
AGNDL
12
—
Analog ground for headphone amplifier of L-channel
AGNDR
17
—
Analog ground for headphone amplifier of R-channel
CK
2
O
Clock output for external ROM (PCM2704). Must be left open (PCM2705).
D+
9
I/O USB differential input/output plus
D–
8
I/O USB differential input/output minus
DGND
6
—
Digital ground
DOUT
5
O
S/PDIF output
DT
3
I/O Data input/output for external ROM (PCM 2704). Must be left open with pullup resistor (PCM2705).
(1)
(1)
(1)
(2)
HID0/MS
22
I
HID key state input (mute), active HIGH (PCM2704). MS input (PCM2705).
HID1/MC
23
I
HID key state input (volume up), active HIGH (PCM2704). MC input (PCM2705).
HID2/MD
24
I
HID key state input (volume down), active HIGH (PCM2704). MD input (PCM2705).
HOST
21
I
Host detection during self-powered operation (connect to VBUS). Max power select during bus-powered
operation (LOW: 100 mA, HIGH: 500 mA). (3)
PGND
19
—
PSEL
4
I
Power source select (LOW: self-power, HIGH: bus-power)
SSPND
27
O
Suspend flag, active LOW (LOW: suspend, HIGH: operational)
TEST0
26
I
Test pin. Must be set HIGH
(1)
TEST1
25
I
Test pin. Must be set HIGH
(1)
VBUS
10
—
Connect to USB power (VBUS) for bus-powered operation. Connect to VDD for self-powered operation.
VCCL
13
—
Analog power supply for headphone amplifier of L-channel
(1)
(4)
(4)
20
—
Analog power supply for DAC, OSC, and PLL
VCCR
16
—
Analog power supply for headphone amplifier of R-channel
VCOM
18
—
Common voltage for DAC (VCCP/2). Connect decoupling capacitor to PGND.
VDD
7
—
Digital power supply
(4)
(4)
VOUTL
14
O
DAC analog output for L-channel
VOUTR
15
O
DAC analog output for R-channel
XTI
28
I
Crystal oscillator input
(1)
XTO
1
O
Crystal oscillator output
ZGND
11
—
Ground for internal regulator
6
(2)
Analog ground for DAC, OSC, and PLL
VCCP
(1)
(2)
(3)
(4)
(2)
LV-TTL level
LV-TTL level with internal pulldown
LV-TTL level, 5-V tolerant
Connect decoupling capacitor to GND. Supply 3.3 V for self-powered applications.
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Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): PCM2704 PCM2705 PCM2706 PCM2707
PCM2704,, PCM2705
PCM2706, PCM2707
www.ti.com....................................................................................................................................................... SLES081F – JUNE 2003 – REVISED JANUARY 2009
Terminal Functions (PCM2706PJT/PCM2707PJT)
TERMINAL
NAME
NO.
I/O
DESCRIPTION
AGNDL
26
—
Analog ground for headphone amplifier of L-channel
AGNDR
31
—
Analog ground for headphone amplifier of R-channel
CK
14
O
Clock output for external ROM (PCM2706). Must be left open (PCM2707).
D+
23
I/O USB differential input/output plus
D–
22
I/O USB differential input/output minus
DGND
20
—
Digital ground
DOUT
17
O
S/PDIF output/I2S™ data output
DT
15
I/O Data input/output for external ROM (PCM2706). Must be left open with pullup resistor (PCM2707).
FSEL
9
FUNC0
5
FUNC1
19
FUNC2
18
FUNC3
4
I
(1)
(1)
2
Function select (LOW: I S DATA output, HIGH: S/PDIF output)
I/O HID key state input (next track), active HIGH (FSEL = 1). I2S LR clock output (FSEL = 0).
(2)
2
I/O HID key state input (previous track), active HIGH (FSEL = 1). I S bit clock output (FSEL = 0).
2
I/O HID key state input (stop), active HIGH (FSEL = 1). I S system clock output (FSEL = 0).
I
(1)
(1)
HID key state input (play/pause), active HIGH (FSEL = 1). I2S data input (FSEL = 0).
(2)
(2)
(2)
(2)
HID0/MS
6
I
HID key state input (mute), active HIGH (PCM2706). MS input (PCM2707)
HID1/MC
7
I
HID key state input (volume up), active HIGH (PCM2706). MC input (PCM2707)
HID2/MD
8
I
HID key state input (volume down), active HIGH (PCM2706). MD input (PCM2707)
HOST
3
I
Host detection during self-powered operation (connect to VBUS). Max power select during bus-powered
operation. (LOW: 100 mA, HIGH: 500 mA). (3)
PGND
1
—
PSEL
16
I
Power source select (LOW: self-power, HIGH: bus-power)
SSPND
11
O
Suspend flag, active LOW (LOW: suspend, HIGH: operational)
TEST
10
I
Test pin. Must be set HIGH
VBUS
24
—
Connect to USB power (VBUS) for bus-powered operation. Connect to VDD for self-powered operation.
VCCL
27
—
Analog power supply for headphone amplifier of L-channel
(2)
Analog ground for DAC, OSC, and PLL
(1)
(1)
(4)
(4)
VCCP
2
—
Analog power supply for DAC, OSC, and PLL
VCCR
30
—
Analog power supply for headphone amplifier of R-channel
VCOM
32
—
Common voltage for DAC (VCCP/2). Connect decoupling capacitor to PGND.
VDD
21
—
Digital power supply
(4)
(4)
VOUTL
28
O
DAC analog output for L-channel
VOUTR
29
O
DAC analog output for R-channel
XTI
12
I
Crystal oscillator input
XTO
13
O
Crystal oscillator output
ZGND
25
—
Ground for internal regulator
(1)
(2)
(3)
(4)
(2)
(1)
LV-TTL level
LV-TTL level with internal pulldown
LV-TTL level, 5-V tolerant
Connect decoupling capacitor to GND. Supply 3.3 V for self-powered applications.
Copyright © 2003–2009, Texas Instruments Incorporated
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Product Folder Link(s): PCM2704 PCM2705 PCM2706 PCM2707
7
PCM2704,, PCM2705
PCM2706, PCM2707
SLES081F – JUNE 2003 – REVISED JANUARY 2009....................................................................................................................................................... www.ti.com
BLOCK DIAGRAM (PCM2704DB/PCM2705DB)
VCCP
VCCL
VCCR
VDD
PGND
AGNDL
AGNDR
DGND
ZGND
Power
Manager
SSPND
5-V to 3.3-V
Voltage Regulator
VBUS
VOUTL
USB
Protocol
Controller
DAC
Control
Endpoint
VOUTR
XCVR
Analog
PLL
USB SIE
VCOM
D+
D–
S/PDIF Encoder
DOUT
FIFO
EEPROM
Interface (1)
ISO-Out
Endpoint
HID
Endpoint
PSEL
SPI
Interface (2)
CK
DT
HOST
HID0/MS
HID1/MC
HID2/MD
TEST0
TEST1
PLL (×8)
XTI
96 MHz
Tracker
(SpAct)
12 MHz XTO
B0054-01
8
(1)
Applies to PCM2704DB
(2)
Applies to PCM2705DB
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Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): PCM2704 PCM2705 PCM2706 PCM2707
PCM2704,, PCM2705
PCM2706, PCM2707
www.ti.com....................................................................................................................................................... SLES081F – JUNE 2003 – REVISED JANUARY 2009
BLOCK DIAGRAM (PCM2706PJT/PCM2707PJT)
VCCP
VCCL
VCCR
VDD
PGND
AGNDL
AGNDR
DGND
ZGND
Power
Manager
SSPND
5-V to 3.3-V
Voltage Regulator
VBUS
Analog
PLL
VOUTL
USB
Protocol
Controller
USB SIE
DAC
Control
Endpoint
VOUTR
XCVR
VCOM
D+
D–
S/PDIF
Encoder
DOUT
DOUT
LRCK
BCK
SYSCK
DIN
FSEL
FUNC0
FUNC1
FUNC2
FUNC3
I2S I/F
FIFO
EEPROM
Interface (1)
ISO-Out
Endpoint
CK
DT
HOST
HID3: Next Track (1)
HID4: Previous Track (1)
HID5: Stop (1)
HID6:
HID
Endpoint
Play/Pause (1)
SPI
Interface (2)
HID0/MS
HID1/MC
HID2/MD
PSEL
TEST
PLL (×8)
XTI 12 MHz
96 MHz
Tracker
(SpAct)
XTO
B0055-01
(1)
Applies to PCM2706PJT
(2)
Applies to PCM2707PJT
Copyright © 2003–2009, Texas Instruments Incorporated
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Product Folder Link(s): PCM2704 PCM2705 PCM2706 PCM2707
9
PCM2704,, PCM2705
PCM2706, PCM2707
SLES081F – JUNE 2003 – REVISED JANUARY 2009....................................................................................................................................................... www.ti.com
TYPICAL PERFORMANCE CURVES OF INTERNAL FILTER
All specifications at TA = 25°C, VBUS = 5 V, fS = 44.1 kHz, fIN = 1 kHz, 16-bit data (unless otherwise noted).
DAC Digital Interpolation Filter Frequency Response
AMPLITUDE
vs
FREQUENCY
AMPLITUDE
vs
FREQUENCY
0
0.05
0.04
−20
0.03
0.02
Amplitude – dB
Amplitude – dB
−40
−60
−80
0.01
0.00
−0.01
−0.02
−100
−0.03
−120
−0.04
−140
0
1
2
3
f – Frequency [× fS]
−0.05
0.0
4
0.1
0.2
0.3
0.4
f – Frequency [× fS]
G001
Figure 1. Frequency Response
0.5
G002
Figure 2. Pass-Band Ripple
DAC Analog Low-Pass Filter Frequency Response
AMPLITUDE
vs
FREQUENCY
0.0
0
−0.5
−20
Amplitude – dB
Amplitude – dB
AMPLITUDE
vs
FREQUENCY
−1.0
−1.5
−2.0
0.01
−40
−60
−80
0.1
1
10
100
f – Frequency – kHz
1
10
100
1k
f – Frequency – kHz
G003
Figure 3. Pass-Band Characteristics
10
Submit Documentation Feedback
10k
G004
Figure 4. Stop-Band Characteristics
Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): PCM2704 PCM2705 PCM2706 PCM2707
PCM2704,, PCM2705
PCM2706, PCM2707
www.ti.com....................................................................................................................................................... SLES081F – JUNE 2003 – REVISED JANUARY 2009
TYPICAL PERFORMANCE CURVES
All specifications at TA = 25°C, VBUS = 5 V, fS = 44.1 kHz, fIN = 1 kHz, 16-bit data (unless otherwise noted).
TOTAL HARMONIC DISTORTION + NOISE
vs
FREE-AIR TEMPERATURE
TOTAL HARMONIC DISTORTION + NOISE
vs
FREE-AIR TEMPERATURE
0.05
THD+N – Total Harmonic Distortion + Noise – %
THD+N – Total Harmonic Distortion + Noise – %
0.05
Bus-Powered
VOUT = 0 dB
0.04
0.03
32 Ω
0.02
10 kΩ
0.01
0.00
−50
−25
0
25
50
75
TA – Free-Air Temperature – °C
0.03
32 Ω
0.02
0.01
10 kΩ
−25
0
25
50
75
TA – Free-Air Temperature – °C
G005
Figure 5.
Figure 6.
TOTAL HARMONIC DISTORTION + NOISE
vs
SUPPLY VOLTAGE
TOTAL HARMONIC DISTORTION + NOISE
vs
SUPPLY VOLTAGE
100
G006
0.05
THD+N – Total Harmonic Distortion + Noise – %
THD+N – Total Harmonic Distortion + Noise – %
0.04
0.00
−50
100
0.05
Bus-Powered
VOUT = 0 dB
0.04
0.03
32 Ω
0.02
10 kΩ
0.01
0.00
4.0
Self-Powered
VOUT = 0 dB
4.5
5.0
VCC – Supply Voltage – V
5.5
G007
Self-Powered
VOUT = 0 dB
0.04
0.03
32 Ω
0.02
0.01
0.00
3.0
10 kΩ
3.1
3.2
Figure 7.
Copyright © 2003–2009, Texas Instruments Incorporated
3.3
3.4
3.5
VCC – Supply Voltage – V
3.6
G008
Figure 8.
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TYPICAL PERFORMANCE CURVES (continued)
All specifications at TA = 25°C, VBUS = 5 V, fS = 44.1 kHz, fIN = 1 kHz, 16-bit data (unless otherwise noted).
TOTAL HARMONIC DISTORTION + NOISE
vs
SAMPLING FREQUENCY
TOTAL HARMONIC DISTORTION + NOISE
vs
SAMPLING FREQUENCY
0.05
THD+N – Total Harmonic Distortion + Noise – %
THD+N – Total Harmonic Distortion + Noise – %
0.05
Bus-Powered
VOUT = 0 dB
0.04
32 Ω
0.03
0.02
10 kΩ
0.01
0.00
Self-Powered
VOUT = 0 dB
0.04
0.03
32 Ω
0.02
0.01
10 kΩ
0.00
30
35
40
45
50
fS – Sampling Frequency – kHz
30
G009
DYNAMIC RANGE and SNR
vs
FREE-AIR TEMPERATURE
DYNAMIC RANGE and SNR
vs
FREE-AIR TEMPERATURE
50
G010
105
Self-Powered
Dynamic Range and SNR – dB
103
101
99
Dynamic Range
97
103
101
99
Dynamic Range
97
SNR
SNR
−25
0
25
50
TA – Free-Air Temperature – °C
75
100
G011
95
−50
−25
0
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25
50
TA – Free-Air Temperature – °C
Figure 11.
12
45
Figure 10.
Bus-Powered
95
−50
40
Figure 9.
105
Dynamic Range and SNR – dB
35
fS – Sampling Frequency – kHz
75
100
G012
Figure 12.
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TYPICAL PERFORMANCE CURVES (continued)
All specifications at TA = 25°C, VBUS = 5 V, fS = 44.1 kHz, fIN = 1 kHz, 16-bit data (unless otherwise noted).
DYNAMIC RANGE and SNR
vs
SUPPLY VOLTAGE
DYNAMIC RANGE and SNR
vs
SUPPLY VOLTAGE
105
105
Self-Powered
103
Dynamic Range and SNR – dB
Dynamic Range and SNR – dB
Bus-Powered
101
99
Dynamic Range
SNR
97
95
4.0
4.5
5.0
101
99
Dynamic Range
SNR
97
95
3.0
5.5
VCC – Supply Voltage – V
103
3.2
3.3
3.4
3.5
VCC – Supply Voltage – V
G013
Figure 13.
Figure 14.
DYNAMIC RANGE and SNR
vs
SAMPLING FREQUENCY
DYNAMIC RANGE and SNR
vs
SAMPLING FREQUENCY
105
3.6
G014
105
Bus-Powered
Self-Powered
103
Dynamic Range and SNR – dB
Dynamic Range and SNR – dB
3.1
101
99
Dynamic Range
SNR
97
95
103
101
Dynamic Range
99
SNR
97
95
30
35
40
45
fS – Sampling Frequency – kHz
50
G015
30
35
40
fS – Sampling Frequency – kHz
Figure 15.
Copyright © 2003–2009, Texas Instruments Incorporated
45
50
G016
Figure 16.
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TYPICAL PERFORMANCE CURVES (continued)
All specifications at TA = 25°C, VBUS = 5 V, fS = 44.1 kHz, fIN = 1 kHz, 16-bit data (unless otherwise noted).
SUSPEND CURRENT
vs
FREE-AIR TEMPERATURE
200
200
150
150
Suspend Current – µA
Suspend Current – µA
SUSPEND CURRENT
vs
SUPPLY VOLTAGE
100
50
50
0
4.0
4.5
5.0
0
−50
5.5
VBUS – Supply Voltage – V
−25
0
25
G017
Figure 17.
Figure 18.
AMPLITUDE
vs
FREQUENCY
AMPLITUDE
vs
FREQUENCY
0
0
−20
−20
−40
−40
−60
−80
75
100
G018
−60
−80
−100
−100
−120
−120
−140
50
TA – Free-Air Temperature – °C
Amplitude – dB
Amplitude – dB
100
−140
0
5
10
15
20
f – Frequency – kHz
0
20
40
60
80
100
120
f – Frequency – kHz
G019
Figure 19. Output Spectrum (–60 dB, N = 8192)
14
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G020
Figure 20. Output Spectrum (–60 dB, N = 8192)
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DETAILED DESCRIPTION
Clock and Reset
For both USB and audio functions, the PCM2704/5/6/7 requires a 12-MHz (±500 ppm) clock, which can be
generated by the built-in oscillator using a 12-MHz crystal resonator. The 12-MHz crystal resonator must be
connected to XTI (pin 28 for PCM2704/5, pin 12 for PCM2706/7) and XTO (pin 1 for PCM2704/5, pin 13 for
PCM2706/7) with one large (1-MΩ) resistor and two small capacitors, the capacitance of which depends on the
specified load capacitance of the crystal resonator. An external clock can be supplied from XTI (pin 28 for
PCM2704/5, pin 12 for PCM2706/7). If an external clock is supplied, XTO (pin 1 for PCM2704/5, pin 13 for
PCM2706/7) must be left open. Because no clock disabling pin is provided, it is not recommended to use the
external clock supply. SSPND (pin 27 for PCM2704/5, pin 11 for PCM2706/7) is unable to use clock disabling.
The PCM2704/5/6/7 has an internal power-on reset circuit, and it works automatically when VDD (pin 7 for
PCM2704/5, pin 21 for PCM2706/7) exceeds 2 V typical (1.6 V–2.4 V), which is equivalent to VBUS (pin 10 for
PCM2704/5, pin 24 for PCM2706/7) exceeding 3 V typical for bus-powered applications. Approximately 700 µs is
required until internal reset release.
Operation Mode Selection
The PCM2704/5/6/7 has the following mode-select pins.
Power Configuration Select/Host Detection
PSEL (pin 4 for PCM2704/5, pin 16 for PCM2706/7) is dedicated to selecting the power source. This selection
affects the configuration descriptor. While in bus-powered operation, maximum power consumption from VBUS is
determined by HOST (pin 21 for PCM2704/5, pin 3 for PCM2706/7). For self-powered operation, HOST must be
connected to VBUS of the USB bus with a pulldown resistor to detect attach and detach. (To avoid excessive
suspend current, the pulldown should be a high-value resistor.)
Table 1. Power Configuration Select
PSEL
DESCRIPTION
0
Self-powered
1
Bus-powered
HOST
DESCRIPTION
0
Detached from USB (self-powered)/100 mA (bus-powered)
1
Attached to USB (self-powered)/500 mA (bus-powered)
Function Select (PCM2706/7)
FSEL (pin 9) determines the function of FUNC0–FUNC3 (pins 4, 5, 18, and 19) and DOUT (pin17). When the I2S
interface is required, FSEL must be set to LOW. Otherwise, FSEL must be set to HIGH.
Table 2. Function Select
(1)
FSEL
DOUT
FUNC0
FUNC1
FUNC2
FUNC3
0
Data out (I2S)
LRCK (I2S)
BCK (I2S)
SYSCK (I2S)
Data in (I2S)
1
S/PDIF data
Next track (HID)
(1)
Previous track (HID)
(1)
Stop (HID)
(1)
Play/pause (HID)
(1)
Valid on the PCM2706; no function assigned on the PCM2707.
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USB Interface
Control data and audio data are transferred to the PCM2704/5/6/7 via D+ (pin 9 for PCM2704/5, pin 23 for
PCM2706/7) and D– (pin 8 for PCM2704/5, pin 22 for PCM2706/7). D+ should be pulled up with a 1.5-kΩ (±5%)
resistor. To avoid back voltage in self-powered operation, the device must not provide power to the pullup
resistor on D+ while VBUS of the USB port is inactive.
All data to/from the PCM2704/5/6/7 are transferred at full speed. The following information is provided in the
device descriptor. Some parts of the device descriptor can be modified through external ROM (PCM2704/6), SPI
(PCM2705/7), or internal mask ROM on request.
Table 3. Device Descriptor
DEVICE DESCRIPTOR
DESCRIPTION
USB revision
1.1 compliant
Device class
0x00 (device defined interface level)
Device subclass
0x00 (not specified)
Device protocol
0x00 (not specified)
Max packet size for endpoint 0
8 bytes
Vendor ID
0x08BB (default value, can be modified)
Product ID
0x2704/0x2705/0x2706/0x2707 (These values correspond to the model number, and the value can be
modified.)
Device release number
1.0 (0x0100)
Number of configurations
1
Vendor strings
Burr-Brown from TI (default value, can be modified)
Product strings
USB Audio DAC (default value, can be modified)
Serial number
Not supported
The following information is contained in the configuration descriptor. Some parts of the configuration descriptor
can be modified through external ROM (PCM2704/6), SPI (PCM2705/7), or internal mask ROM on request.
Table 4. Configuration Descriptor
CONFIGURATION DESCRIPTOR
DESCRIPTION
Interface
Three interfaces
Power attribute
0x80 or 0xC0 (bus-powered or self-powered, depending on PSEL; no remote wake up. This value can
be modified.)
Max power
0x0A, 0x32 or 0xFA (20 mA for self-powered, 100 mA or 500 mA for bus-powered, depending on
PSEL and HOST. This value can be modified.)
The following information is contained in the string descriptor. Some parts of the string descriptor can be modified
through external ROM (PCM2704/6), SPI (PCM2705/7), or internal mask ROM on request.
Table 5. String Descriptor
STRING DESCRIPTOR
16
DESCRIPTION
#0
0x0409
#1
Burr-Brown from TI (default value, can be modified)
#2
USB Audio DAC (default value, can be modified)
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Device Configuration
Figure 21 illustrates the USB audio function topology. The PCM2704/5/6/7 has three interfaces. Each interface is
enabled by some alternative settings.
Endpoint #0
Default
Endpoint
FU
Endpoint #2
(IF #1)
OT
TID2
IT
TID1
Audio Streaming
Interface
Analog Out
UID3
Standard Audio Control Interface (IF #0)
Endpoint #5
(IF #2)
HID Interface
PCM2704/5/6/7
M0024-01
Figure 21. USB Audio Function Topology
Interface #0 (Default/Control Interface)
Interface #0 is the control interface. Setting #0 is the only possible setting for interface #0. Setting #0 describes
the standard audio control interface. Audio control interface consists of a terminal. The PCM2704/5/6/7 has three
terminals:
• Input terminal (IT #1) for isochronous-out stream
• Output terminal (OT #2) for audio analog output
• Feature unit (FU #3) for DAC digital attenuator
Input terminal #1 is defined as a USB stream (terminal type 0x0101). Input terminal #1 can accept two-channel
audio streams constructed of left and right channels. Output terminal #2 is defined as a speaker (terminal type
0x0301). Feature unit #3 supports the following sound control features:
• Volume control
• Mute control
The built-in digital volume controller can be manipulated by an audio-class-specific request from 0 dB to –64 dB
in steps of 1 dB. Changes are made by incrementing or decrementing one step (1 dB) for every 1/fS time interval,
until the volume level reaches the requested value. Each channel can be set to a separate value. The master
volume control is not supported. A request to the master volume is stalled and ignored. The built-in digital mute
controller can be manipulated by an audio-class-specific request. A master mute control request is acceptable. A
mute control request to an individual channel is stalled and ignored. The digital volume control does not affect
the S/PDIF and I2S outputs (PCM2706/7).
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Interface #1 (Isochronous-Out Interface)
Interface #1 is for the audio-streaming data-out interface. Interface #1 has the following three alternative settings.
Alternative setting #0 is the zero-bandwidth setting. All other alternative settings are operational settings.
ALTERNATIVE
SETTING
DATA FORMAT
00
TRANSFER
MODE
SAMPLING RATE
(kHz)
Zero bandwidth
01
16-bit
Stereo
2s complement (PCM)
Adaptive
32, 44.1, 48
02
16-bit
Mono
2s complement (PCM)
Adaptive
32, 44.1, 48
Interface #2 (HID Interface)
Interface #2 is the interrupt-data-in interface. Interface #2 comprises the HID consumer control device.
Alternative setting #0 is the only possible setting for interface #2.
On the HID device descriptor, eight HID items are reported as follows for any model, in any configuration.
Basic HID Operation
Interface #2 can report the following three key statuses for any model. These statuses can be set by the
HID0–HID2 pins (PCM2704/6) or the SPI port (PCM2705/7).
• Mute (0xE2)
• Volume up (0xE9)
• Volume down (0xEA)
Extended HID Operation (PCM2705/6/7)
By using the FUNC0–FUNC3 pins (PCM2706) or the SPI port (PCM2705/7), the following additional conditions
can be reported to the host.
• Play/Pause (0xCD)
• Stop (0xB7)
• Previous (0xB6)
• Next (0xB5)
Auxiliary HID Status Report (PCM2705/7)
One additional HID status can be reported to the host though the SPI port. This status flag is defined by SPI
command or external ROM. This definition must be described as on the report descriptor with a three-byte usage
ID. AL A/V Capture (0x0193) is assigned as the default for this status flag.
Endpoints
The PCM2704/5/6/7 has three endpoints:
• Control endpoint (EP #0)
• Isochronous-out audio data-stream endpoint (EP #2)
• HID endpoint (EP #5)
The control endpoint is a default endpoint. The control endpoint is used to control all functions of the
PCM2704/5/6/7 by standard USB request and USB audio-class-specific request from the host. The
isochronous-out audio data-stream endpoint is an audio sink endpoint that receives the PCM audio data. The
isochronous-out audio data-stream endpoint accepts the adaptive transfer mode. The HID endpoint is an
interrupt-in endpoint. The HID endpoint reports HID status every 10 ms.
The HID endpoint is defined as a consumer-control device. The HID function is designed as an independent
endpoint from the isochronous-out endpoint. This means that the effect of HID operation depends on host
software. Typically, the HID function is used to control the primary audio-out device.
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DAC
The PCM2704/5/6/7 has a DAC that uses an oversampling technique with 128-fS second-order multibit noise
shaping. This technique provides extremely low quantization noise in the audio band, and the built-in analog
low-pass filter removes the high-frequency components of the noise-shaping signal. DAC outputs through the
headphone amplifier VOUTL and VOUTR can provide 12 mW at 32 Ω, as well as 1.8 VPP into a 10-kΩ load.
Digital Audio Interface—S/PDIF Output
The PCM2704/5/6/7 employs S/PDIF output. Isochronous-out data from the host are encoded to S/PDIF output
DOUT, as well as to DAC analog outputs VOUTL and VOUTR. Interface format and timing follow the IEC-60958
standard. Monaural data are converted to the stereo format at the same data rate. S/PDIF output is not
supported in the I2S I/F enable mode. The implementation of this feature is optional. Note that it is your
responsibility to determin whether to implement this feature in your product or not.
Channel Status Information
The channel status information is fixed as consumer application, PCM mode, copyright, and digital/digital
converter. All other bits are fixed as 0s, except for the sample frequency, which is set automatically according to
the data received through the USB.
Copyright Management
Digital audio data output always is encoded as original with SCMS control. Only one generation of digital
duplication is allowed.
Digital Audio Interface—I2S Interface Output (PCM2706/7)
The PCM2706 and PCM2707 can support the I2S interface, which is enabled by FSEL (pin 9). In the I2S interface
enabled mode, pins 4, 18, 19, 5, and 17 are assigned as DIN, SYSCK, BCK, LRCK, and DOUT, respectively.
They provide digital output/input data in the 16-bit I2S format, which also is accepted by the internal DAC. I2S
interface format and timing are shown in Figure 22, Figure 23, and Figure 24.
SYSCK
(256 fS)
1/fS
LRCK
R-Channel
L-Channel
BCK
(64 fS)
DOUT
1
2
3
14
MSB
DIN
1
2
15
16
1
LSB
3
14
15
2
3
14
MSB
16
1
2
15
16
1
LSB
3
14
15
2
MSB
16
1
2
T0009-04
Figure 22. Audio Data Interface Format
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50% of VDD
LRCK (Output)
t(BCL)
t(BCH)
t(BL)
50% of VDD
BCK (Output)
t(BCY)
t(BD)
t(LD)
DOUT (Output)
50% of VDD
t(DS)
t(DH)
DIN (Input)
50% of VDD
T0010-05
SYMBOL
PARAMETER
MIN
MAX
UNIT
t(BCY)
BCK pulse cycle time
300
ns
t(BCH)
BCK pulse duration, HIGH
100
ns
t(BCL)
BCK pulse duration, LOW
100
t(BL)
LRCK delay time from BCK falling edge
–20
40
ns
t(BD)
DOUT delay time from BCK falling edge
–20
40
ns
–20
40
ns
ns
t(LD)
DOUT delay time from LRCK edge
t(DS)
DIN setup time
20
ns
t(DH)
DIN hold time
20
ns
NOTE: Load capacitance of LRCK, BCK, and DOUT is 20 pF.
Figure 23. Audio Interface Timing
SYSCK
(Output)
t(SLL)
t(SLH)
LRCK
(Output)
t(SBL)
t(SBH)
BCK
(Output)
T0196-01
SYMBOL
PARAMETER
MIN
MAX
UNIT
t(SLL), t(SLH)
LRCK delay time from SYSCK rising edge
–5
10
ns
t(SBL), t(SBH)
BCK delay time from SYSCK rising edge
–5
10
ns
NOTE: Load capacitance is 20 pF.
Figure 24. Audio Clock Timing
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DESCRIPTOR DATA MODIFICATION
The descriptor data can be modified through I2C port by external ROM (PCM2704/6) or through our SPI port by
an SPI host such as an MCU (PCM2705/7) under a particular condition of PSEL pin and HOST pin. A condition
of PSEL pin = High and HOST pin = High is needed to modify the descriptor data, and D+ pull-up must not be
activated before completion of programming the descriptor data through external ROM or SPI port. The
descriptor data have to be sent from external ROM to PCM2704/6 or or from SPI host to PCM2705/7 in LSB first
with specified byte order. Also, the content of the power attribute and max power must be consistent with PSEL
setting and power usage from USB VBUS of actual application. Therefore, the descriptor data modification in
self-powered configuration (PSEL = Low) is not supported.
External ROM Descriptor (PCM2704/6)
The PCM2704/6 supports an external ROM interface to override internal descriptors. Pin 3 (for PCM2704)/pin 15
(for PCM2706) is assigned as DT (serial data) and pin 2 (for PCM2704)/pin 14 (for PCM2706) is assigned as CK
(serial clock) of the I2C interface when using the external ROM descriptor. Descriptor data is transferred from the
external ROM to the PCM2704/6 through the I2C interface the first time when the device activates after power-on
reset. Before completing a read of the external ROM, the PCM2704/6 replies with NACK for any USB command
request from the host to the device itself. The descriptor data, which can be in external ROM, are as follows.
String descriptors must be described in ANSI ASCII code (1 byte for each character). String descriptors are
converted automatically to unicode strings for transmission to the host. The device address of the external ROM
is fixed as 0xA0. The data must be stored from address 0x00 and must consist of 57 bytes, as described in the
following items. The data bits must be sent from LSB to MSB on the I2C bus. This means that each byte of data
must be stored with its bits in reverse order. Read operation is performed at a frequency of XTI/384
(approximately 30 kHz). The content of power attribute and max power must be consistent with actual application
circuit configuration (PSEL setting and actual power usage from VBUS of USB connector); otherwise, it may
cause improper or unexpected PCM2704/6 operation.
• Vendor ID (2 bytes)
• Product ID (2 bytes)
• Product string (16 bytes in ANSI ASCII code)
• Vendor string (32 bytes in ANSI ASCII code)
• Power attribute (1 byte)
• Max power (1 byte)
• Auxiliary HID usage ID in report descriptor (3 bytes)
DT
CK
1−7
8
9
1−8
9
1−8
9
9
Device Address
R/W
ACK
DATA
ACK
DATA
ACK
NACK
S
Start Condition
P
Stop Condition
R/W: Read Operation if 1; Otherwise, Write Operation
ACK: Acknowledgment of a Byte if 0
DATA: 8 Bits (Byte)
NACK: Not Acknowledgment if 1
T0049-02
M
M
M
S
S
M
S
M
S
M
M
S
Device address
R/W
ACK
DATA
ACK
DATA
ACK
...
NACK
P
Figure 25. External ROM Read Operation
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Repeated Start
Start
Stop
t(DT-F)
t(D-HD)
t(BUF)
t(D-SU)
t(DT-R)
t(P-SU)
DT
t(CK-R)
t(RS-HD)
t(LOW)
CK
t(S-HD)
t(HI)
t(RS-SU)
t(CK-F)
T0050-02
SYMBOL
PARAMETER
MIN
MAX
f(CK)
CK clock frequency
t(BUF)
Bus free time between a STOP and a START condition
4.7
µs
t(LOW)
Low period of the CK clock
4.7
µs
t(HI)
High period of the CK clock
t(RS-SU)
Setup time for START/repeated START condition
t(S-HD)
t(RS-HD)
Hold time for START/repeated START condition
t(D-SU)
Data setup time
t(D-HD)
Data hold time
t(CK-R)
100
UNIT
kHz
4
µs
4.7
µs
4
µs
250
0
ns
900
ns
Rise time of CK signal
20 + 0.1 CB 1000
ns
t(CK-F)
Fall time of CK signal
20 + 0.1 CB 1000
ns
t(DT-R)
Rise time of DT signal
20 + 0.1 CB 1000
ns
t(DT-F)
Fall time of DT signal
20 + 0.1 CB 1000
ns
t(P-SU)
Setup time for STOP condition
µs
4
CB
Capacitive load for DT and CK lines
400
VNH
Noise margin at HIGH level for each connected device (including hysteresis)
0.2 VDD
pF
V
Figure 26. External ROM Read Interface Timing Requirements
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External ROM Example
Here is an example of external ROM data, with an explanation of the example following the data.
0xBB,
0x50,
0x56,
0x72,
0x80,
0x7D,
0x0A,
0x08,
0x72,
0x65,
0x65,
0x04,
0x6F,
0x6E,
0x20,
0x27,
0x64, 0x75, 0x63, 0x74, 0x20, 0x73, 0x74, 0x72, 0x69, 0x6E, 0x67, 0x73, 0x2E,
0x64, 0x6F, 0x72, 0x20, 0x73, 0x74, 0x72, 0x69, 0x6E, 0x67, 0x73, 0x20, 0x61,
0x70, 0x6C, 0x61, 0x63, 0x65, 0x64, 0x20, 0x68, 0x65, 0x72, 0x65, 0x2E, 0x20,
0x93, 0x01
The data are stored beginning at address 0x00.
Vendor ID: 0x08BB
Product ID: 0x2704
Product string: Product strings (16 bytes).
Vendor string: Vendor strings are placed here (32 bytes, 31 visible characters are followed by 1 space).
Power attribute (bmAttribute): 0x80 (Bus-powered).
Max power (maxPower): 0x7D (250 mA).
Auxiliary HID usage ID: 0x0A, 0x93, 0x01 (AL A/V capture).
Note that the data bits must be sent from LSB to MSB on the I2C bus. This means that each data byte must be
stored with its bits in reverse order.
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Serial Programming Interface (PCM2705/7)
The PCM2705/7 supports the serial programming interface (SPI) to program the descriptor and to set the HID
state. Descriptor data are described in the SubSec1 8.8External ROM Descriptor section.
t(MHH)
MS
50% of VDD
t(MLS)
t(MCL)
t(MCH)
t(MLH)
MC
50% of VDD
t(MCY)
LSB
MD
50% of VDD
t(MDS)
t(MDH)
T0013-04
SYMBOL
PARAMETER
t(MCY)
MC pulse cycle time
t(MCL)
t(MCH)
MIN
TYP
MAX
UNIT
100
ns
MC low-level time
50
ns
MC high-level time
50
ns
t(MHH)
MS high-level time
100
ns
t(MLS)
MS falling edge to MC rising edge
20
ns
t(MLH)
MS hold time
20
ns
t(MDH)
MD hold time
15
ns
t(MDS)
MD setup time
20
ns
Figure 27. SPI Timing Diagram
(1) Single Write Operation
16 Bits
MS
MC
MD
MSB
LSB
MSB
(2) Continuous Write Operation
16 Bits y N Frames
MS
MC
MD
MSB
LSB
MSB
LSB
MSB
LSB
N Frames
T0012-02
Figure 28. SPI Write Operation
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SPI Register (PCM2705/7)
B15
B14
B13
B12
B11
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
0
0
0
0
ST
0
ADDR
0
D0
D1
D2
D3
D4
D5
D6
D7
D[7:0]
Function of the lower 8 bits depends on the value of the ST (B11) bit.
ST = 0 (HID status write)
D7
Reports MUTE HID status to the host (active high)
D6
Reports volume-up HID status to the host (active high)
D5
Reports volume-down HID status to the host (active high)
D4
Reports next-track HID status to the host (active high)
D3
Reports previous-track HID status to the host (active high)
D2
Reports stop HID status to the host (active high)
D1
Reports play/pause HID status to the host (active high)
D0
Reports extended command status to the host (active high)
ST = 1 (ROM data write)
D[7:0] Internal descriptor ROM data, D0:LSB, D7:MSB
The content of power attribute and max power must be consistent with the actual application circuit
configuration (PSEL setting and actual power usage from VBUS of USB connector); otherwise, it may cause
improper or unexpected PCM2705/7 operation.
ADDR
Starts write operation for internal descriptor reprogramming (active high)
This bit resets descriptor ROM address counter and indicates following words should be ROM data (described
in the External ROM Example section). 456 bits of ROM data must be continuously followed after this bit has
been asserted. The data bits must be sent from LSB (D0) to MSB (D7).
To set ADDR high, ST must be set low. Note that the lower 8 bits are still active as an HID status write when
ST is set low.
ST
Determines the function of the lower 8-bit data as follows:
0: HID status write
1: Descriptor ROM data write
Table 6. Functionality of ST and ADDR Bit Combinations
ST
ADDR
0
0
HID status write
0
1
HID status write and descriptor ROM address reset
1
0
Descriptor ROM data write
1
1
Reserved
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USB Host Interface Sequence
Power-On, Attach, and Playback Sequence
The PCM2704/5/6/7 is ready for setup when the reset sequence has finished and the USB bus is attached. After
a connection has been established by setup, the PCM2704/5/6/7 is ready to accept USB audio data. While
waiting for the audio data (idle state), the analog output is set to bipolar zero (BPZ).
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
When receiving the audio data, the PCM2704/5/6/7 stores the first audio packet, which contains 1 ms of audio
data, into the internal storage buffer. The PCM2704/5/6/7 starts playing the audio data after detecting the next
subsequent start-of-frame (SOF) packet.
VDD
0V
ÎÎ
ÎÎ
Bus Reset
Bus Idle
D+/D−
SSPND
VOUTL
VOUTR
3.3 V
(Typ.)
2.0 V (Typ.)
Î
Î
Î
Î
Î
Î
Î
Î
Set Configuration
Î
ÎÎÎ
Î
ÎÎÎ
Î
ÎÎÎ
ÎÎÎÎ
Î
ÎÎÎ
ÎÎ
ÎÎÎ
Î
ÎÎÎ
ÎÎ
ÎÎÎ
Î
ÎÎÎ
ÎÎ
ÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎ
1st Audio Data
SOF
SOF
2nd Audio Data
SOF
BPZ
700 µs
Device Setup
1 ms
Internal Reset
Ready for Setup
Ready for Playback
T0055-01
Figure 29. Initial Sequence
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Play, Stop, and Detach Sequence
When the host finishes or aborts the playback, the PCM2704/5/6/7 stops playing after completing the output of
the last audio data.
VBUS
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎÎÎ
Audio Data
D+/D–
SOF
Î
ÎÎÎ
ÎÎ
ÎÎÎ
ÎÎ
Î
ÎÎÎ
ÎÎ
ÎÎÎ
ÎÎ
Î
ÎÎÎ
ÎÎ
ÎÎÎ
ÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
Audio Data
SOF
Last Audio Data
SOF
SOF
ÎÎ
ÎÎ
ÎÎ
ÎÎ
SOF
VOUTL
VOUTR
Detach
1 ms
T0056-01
Figure 30. Play, Stop, and Detach
Suspend and Resume Sequence
Î
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
The PCM2704/5/6/7 enters the suspend state after the USB bus has been in a constant idle state for
approximately 5 ms. While the PCM2704/5/6/7 is in the suspend state, SSPND flag (pin 27 for PCM2704/5,
pin 11 for PCM2706/7) is asserted. The PCM2704/5/6/7 wakes up immediately when detecting the non-idle state
on the USB bus.
D+/D−
SSPND
Idle
5 ms
Suspend
VOUTL
VOUTR
Active
Active
2.5 ms
T0057-01
Figure 31. Suspend and Resume
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Typical Circuit Connection 1 (Example of USB Speaker)
Figure 32 illustrates a typical circuit connection for an internal-descriptor, bus-powered, 500-mA application.
X1
C1
C2
R1
PCM2704DB
(3)
External ROM
(Optional)
1 XTO
XTI
28
SSPND
27
TEST0
26
4 PSEL
TEST1
25
5 DOUT
HID2/MD
24
6 DGND
HID1/MC
23
7 VDD
HID0/MS
22
8 D–
HOST
SUSPEND
2 CK
SCL
3 DT
SDA
(2)
R9
S/PDIF OUT
VOLUME–
USB ’B’
Connector
C7
R2
R3
D–
VOLUME+
(2)
R4
D+
VBUS
C3
GND
MUTE
21
9 D+
VCCP(3)
20
10 VBUS
PGND
19
11 ZGND
VCOM
18
AGNDR
17
VCCR
16
12 AGNDL
C6
C4
+
C8
C5
13 VCCL
(1)
14 VOUT L
VOUTR
(1)
C9
+
15
C13
+
C11
C12
R5
C10
R6 R7
+
+
C14
R8
TPA200X
Power
Amp
NOTE: X1: 12-MHz crystal resonator. C1, C2: 10-pF to 33-pF capacitor (depending on load capacitance of crystal resonator). C3-C7: 1-µF
ceramic capacitor. C8: 10-µF electrolytic capacitor. C9, C10: 100-µF electrolytic capacitor (depending on tradeoff between required frequency
response and discharge time for resume). C11, C12: 0.022-µF ceramic capacitor. C13, C14: 1-µF electrolytic capacitor. R1: 1 MΩ resistor. R2,
R9: 1.5 kΩ resistors. R3, R4: 22 Ω resistors. R5, R6: 16 Ω resistors. R7, R8: 330 Ω resistors (depending on tradeoff between required THD
performance and pop-noise level for suspend).
(1) Output impedance of VOUTL and VOUTR during suspend mode or lack of power supply is 26 kΩ ±20%, which is the discharge path for C9
and C10.
(2) Descriptor programming through external ROM is only available when PSEL and HOST are high.
(3) External ROM power can be supplied from VCCP, but any other active component must not use VCCP, VCCL, VCCR, or VDD as a power
source.
Figure 32. Bus-Powered Application
NOTE:
The circuit illustrated in Figure 32 is for information only. The entire board design
should be considered to meet the USB specification as a USB-compliant product.
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Typical Circuit Connection 2 (Example of Remote Headphone)
Figure 33 illustrates a typical circuit connection for a bus-powered, 100-mA headphone with seven HIDs.
C9
+
Headphone
+
C6
+
PLAY/PAUSE
NEXT TRACK
MUTE
VOLUME+
27
26
25
AGNDL
ZGND
(1)
28
VCCL
VCCR
29
VOUT L
30
(1)
31
VOUT R
32
VCOM
C4
AGNDR
C5
C3
C11
C12
R5
R6
PGND
2
VCCP
VBUS 24
3
HOST
4
FUNC3
5
FUNC0
R9
6
HID0/MS
FUNC1 19
7
HID1/MC
FUNC2 18
8
HID2/MD
VBUS
D+
D–
R4
VDD 21
C7
PREVIOUS TRACK
STOP
SSPND
XTI
XTO
CK
DT
PSEL
DOUT 17
TEST
(2)
GND
C8
DGND 20
VOLUME–
R10
USB ’B’
Connector
D– 22
PCM2706PJT
91 10
11
12
13
14
5
16
FSEL
R8
R3
D+ 23
(2)
R7
R2
1
(3)
C10
External ROM
(Optional)
(3)
SDA
SUSPEND
R1
R11
SCL
X1
C1
C2
NOTE: X1: 12-MHz crystal resonator. C1, C2: 10-pF to 33-pF capacitors (depending on load capacitance of crystal resonator). C3-C5, C7, C8:
1-µF ceramic capacitors. C6: 10-µF electrolytic capacitor. C9, C10: 100-µF electrolytic capacitors (depending on required frequency response).
C11, C12: 0.022-µF ceramic capacitors. R1: 1 MΩ resistor. R2, R11: 1.5 kΩ resistors. R3, R4: 22 Ω resistors. R5, R6: 16 Ω resistors. R7-R10: 3.3
kΩ resistors.
(1) Output impedance of VOUTL and VOUTR during suspend mode or lack of power supply is 26 kΩ ±20%, which is the discharge path for C9
and C10.
(2) Descriptor programming through external ROM is only available when PSEL and HOST are high.
(3) External ROM power can be supplied from VCCP, but any other active component must not use VCCP, VCCL, VCCR, or VDD as a power
source.
Figure 33. Bus-Powered Application
NOTE:
The circuit illustrated in Figure 33 is for information only. The entire board design
should be considered to meet the USB specification as a USB-compliant product.
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Typical Circuit Connection 3 (Example of DSP Surround Processing Amp)
Figure 34 illustrates a typical circuit connection for an I2S- and SPI-enabled self-powered application.
+
C8
+
C6
+
VCCL
AGNDL
ZGND
VCCR
VOUT L
VCOM
2
VCCP
3
HOST
R6
R7
VBUS 24
D– 22
4
FUNC3
VDD 21
5
FUNC0
PCM2707PJT
HID0/MS
FUNC1 19
7
HID1/MC
FUNC2 18
8
HID2/MD
11
12
13
14
51
R9
R10
R11
USB ’B’
Connector
(3)
VBUS(3)
D+
D–
+
DOUT 17
R12
GND
C7
BCK
SYSTEM CLOCK
DOUT
PSEL
(2)
6
91 10
R8
R4
(3)
DGND 20
(4)
C9
R3
D+ 23
(2)
FSEL
MD
PGND
DT
MC
C11
R2
1
CK
MS
25
XTO
LRCK
26
XTI
DIN
27
SSPND
+
28
TEST
T AS300X
I2S I/F Audio Device
29
(1)
30
(1)
31
VOUT R
32
C5
(4)
C4
AGNDR
C3
C10
Headphone
6
R5
SUSPEND
R1
X1
C1
Power
3.3 V
C2
GND
NOTE: X1: 12-MHz crystal resonator. C1, C2: 10-pF to 33-pF capacitors (depending on load capacitance of crystal resonator). C3, C4: 1-µF
ceramic capacitors. C5, C7: 0.1-µF ceramic capacitor and 10-µF electrolytic capacitor. C6: 10-µF electrolytic capacitors. C8, C9: 100-µF
electrolytic capacitors (depending on required frequency response). C10, C11: 0.022-µF ceramic capacitors. R1, R12: 1 MΩ resistors. R2, R5:
1.5 kΩ resistors. R3, R4: 22 Ω resistors. R6, R7: 16 Ω resistors. R8-R11: 3.3 kΩ resistors.
(1) Output impedance of VOUTL and VOUTR during suspend mode or lack of power supply is 26 kΩ ±20%, which is the discharge path for C8
and C9.
(2) Descriptor programming through SPI is only available when PSEL and HOST are high.
(3) D+ pull-up must not be activated (HIGH: 3.3V) while the device is detached from USB or power supply is not applied on VDD and VCCx.
VBUS of USB (5V) can be used to detect USB power status.
(4) MS must be high until the PCM2707 power supply is ready and the SPI host (DSP) is ready to send data. Also, the SPI host must handle
the D+ pull-up if the descriptor is programmed through the SPI. D+ pull-up must not be activated (HIGH = 3.3 V) before programming of the
PCM2707 through the SPI is complete.
Figure 34. Self-Powered Application
NOTE:
The circuit illustrated in Figure 34 is for information only. The entire board design
should be considered to meet the USB specification as a USB-compliant product.
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APPENDIX
Operating Environment
For current information on the PCM2704/2705/2706/2707 operating environment, see the Updated Operating
Environments for PCM270X, PCM290X Applications application report, SLAA374, available through the TI web
site at www.ti.com.
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REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (November 2007) to Revision F ............................................................................................ Page
•
•
•
•
•
•
Added new feature................................................................................................................................................................. 1
Moved text to end of Digital Audio Interface-S/PDIF Output section................................................................................... 19
Added Descriptor Data Modification paragraph................................................................................................................... 21
Deleted HOST from list of circuit configuration terms.......................................................................................................... 21
Deleted HOST from list of circuit configuration terms.......................................................................................................... 25
Added notes to Figure 32, Figure 33, and Figure 34 for clarifying requirement of descriptor programing.......................... 28
Changes from Revision D (December 2006) to Revision E ........................................................................................... Page
•
32
Deleted operating environment information from data sheet and added reference to application report ........................... 31
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PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
PCM2704DB
ACTIVE
SSOP
DB
28
47
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-25 to 85
PCM2704
Samples
PCM2704DBR
ACTIVE
SSOP
DB
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-25 to 85
PCM2704
Samples
PCM2705DB
ACTIVE
SSOP
DB
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-25 to 85
PCM2705
Samples
PCM2705DBG4
ACTIVE
SSOP
DB
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-25 to 85
PCM2705
Samples
PCM2705DBR
ACTIVE
SSOP
DB
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-25 to 85
PCM2705
Samples
PCM2706PJT
ACTIVE
TQFP
PJT
32
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-25 to 85
PCM2706
Samples
PCM2706PJTR
ACTIVE
TQFP
PJT
32
1000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-25 to 85
PCM2706
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of