Connected Sensors
Building Automation
Systems Guide
www.ti.com/buildingAutomation 2015
Connected Sensors Building Automation Systems Guide
Table of Contents and Sensor Solutions
Introduction
Monitoring devices or nodes in
building control systems, fire safety
systems, lighting control, and other
building automation and Internet
of Things (IoT) applications are
becoming more prevalent in
today’s world.
The use of connected sensors has
a wide range of uses in building
automation applications, from
monitoring human safety and
security, controlling the environment and ambience specified by
the comfort preferences of the end
user, or either periodic or continuous data logging of environmental
and system data to detect irregular
system conditions.
Texas Instruments (TI) has a broad
portfolio of products that cater to
connected sensing in building
automation applications. This
portfolio ranges from innovative
sensor analog front-end products
to low-power wireless connectivity
solutions.
Table of Contents
Sensor Solutions
2 Temperature Sensing
2 Humidity and Temperature Sensing
2 Ambient Light Sensing
3 Inductance Sensing
3 Capacitance Sensing
3 Hall Effect Sensor
Amplifiers and Comparators
4 Low Power Amplifiers
4 General Purpose Amplifiers
4 Comparators
4 Analog-to-Digital Converters
Power Management
8
8
8
9
9
9
9
DC/DC Switching Regulators
Linear Regulators
Voltage Reference
AC/DC Converters
Ultra Low Power Harvester
Power Management IC
System Timer
Load Switches
Haptic Drivers
10 Piezo Drivers
10 Haptic Drivers
Interface and Protection
Wireless Connectivity
11 Integrated ESD Protection
11 High Performance TVs Diodes
11 Peripheral Drivers
11 RS-485
11 eFuses
5 Wi-Fi
5 Sub-1GHz
5 Bluetooth®
5 ZigBee®
5 NFC
Embedded Processing Solutions
7 MSP430 Low Power FRAM MCUs
7 MSP430 Low Power MCUs
7 ARM Based MCUs and MPUs
Sensor Solutions
TI has a rich, five-decade history of sensing innovation and, combined with best-in-class sensing technologies, tools, and
resources, we continue to deliver better solutions today and new possibilities for tomorrow.
Learn more about sensor solutions at: www.ti.com/sensing
Temperature Sensing
Part No.
LMT70/70A
LMT84
Type
Analog
Analog
Local Sensor Accuracy
(Max) At Given Temp
Range (±°C)
±0.2°C from 20 to 90
±2.7°C from –50 to 150
Supply
Current
(Max) (µA)
12
8.1
Supply
Range (V)
2.0 to 5.5
1.5 to 5.5
TMP112
Digital
±0.5°C from 0 to 65
10
1.4 to 3.6
TMP75
Digital
±2°C from –25 to 85
85
2.7 to 5.5
TMP007
Contactless
±1°C from –40 to 125
350
2.2 to 5.5
Interface
Analog Out
Analog Out
I2C, SMBus,
2-wire
I2C, SMBus,
2-wire
I2C, SMBus
Infrared Sensor
Accuracy (Max)
(±°C)
–
–
Operating
Temp.
(°C)
–55 to 150
–50 to 150
Pin / Package
4DSBGA
5SC70
Approx.
Price
(US$ | 1ku)
0.54 / 0.65
0.18
–
–40 to 125
6SOT
0.90
–
–40 to 125
8SOIC, 8VSSOP
0.45
3
–40 to 125
8DSBGA
1.90
Humidity and Temperature Sensing
Part No.
HDC1000/1050
HDC1008
Relative
Humidity
Accuracy
(Typ) (%RH)
±3
±4
RH Operating
Range (Typ)
(%RH)
0 - 100
0 - 100
Temperature
Accuracy
(Typ) (°C)
±0.2
±0.2
Supply
Range
(V)
3 to 5
3 to 5
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars.
2
| Connected Sensors Building Automation Systems Guide 2015
Average
Supply
Current (Typ)
(µA)
1.2 @ 1 sps
1.2 @ 1 sps
Interface
I2C
I2C
Operating
Temp.
(°C)
–40 to 125
–40 to 125
Pin /
Package
8DSBGA, 6DFN
8DSBGA
Approx. Price
(US$ | 1ku)
2.20
1.76
Preview products are listed in bold teal.
Texas Instruments
Sensor Solutions
Ambient Light Sensing
Supply
Range
(Nom) (V)
Part No.
OPT3001
Iq (Max)
(µA)
1.6 to 3.6
Lux
Range
(Nom)
Dark Response @ 0
Lux (Max)
0.01 to
83K
2
Gain
Selection
Interface
Benefits
I2C
Matches photopic response
of the human eye
Rejects > 99% (Typ) of IR
11 Gains with
Auto-ranging
1 Code
Operating
Temp.
(°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
–40 to 85
USON
0.99
Inductance Sensing
L
(Inductance)
Resolution
(Bits)
Supply
Range
Active
State
Current
(mA)
Interface
Sensor
Frequency
(Hz)
Operating
Temp.
(°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
Part No.
Key
Applications
Special Features
Input
Channels
LDC1312/4
• Position
• Sensing
• Angle/Rotation
sensing
• Contactless sensing
• Ultralow cost sensors
(coils, PCB coils)
• Immune to dust, dirt etc.
2/4
12
2.7 to
3.6
2.1
I2C
1k to 10M
–40 to
125
WSON,
WQFN
2.38 /
3.50
LDC1612/4
• Position
Sensing
• Angle/Rotation
sensing
• Contactless sensing
• Ultralow cost sensors
(coils, PCB coils)
• Immune to dust, dirt etc.
2/4
28
2.7 to
3.6
2.1
I 2C
1k to 10M
–40 to
125
WSON,
WQFN
3.25 /
4.75
Operating
Temp.
(°C)
Pin /
Package
Approx.
Price
(US$ | 1ku)
Capacitance Sensing
Shield
Drive
Channels
Special
Features
Supply
Range
Supply
Current
(mA)
Interface
Prog.
Sampling Rate
(Typ) (SPS)
4
• Liquid level sensing
(with interferers)
2
Integrated
Shield Drivers
3 to 3.6
0.75
I2C
100 / 200 / 400
–40 to 125
WSON
2.50
FDC2114/12
4/2
• Proximity Sensing
• Liquid Level Sensing
–
EMI
resistant core
2.7 to
3.6
2.1
I2C
40 to 4080
–40 to 125
WQFN
2.38 / 3.50
FDC2214/12
4/2
• Proximity Sensing
• Liquid Level Sensing
–
EMI
resistant core
2.7 to
3.6
2.1
I2C
40 to 13300
–40 to 125
WQFN
3.25 / 4.75
Part No.
Input
Channels
Special Features
FDC1004
Hall Effect Sensor
Output
Bandwidth
(Typ) (kHz)
Operating
Temp. (°C)
Pin / Package
Approx. Price
(US$ | 1ku)
Type
Type
Supply
Range
DRV5013/23/33
Digital
Latch / Switch / Omnipolar Switch
2.5 to 38
Open Drain
–
–40 to 125
SOT-23, TO-92
0.29
DRV5053
Analog
Analog Bipolar
2.5 to 38
0.2 to 1.8 V
10
–40 to 125
SOT-23, TO-92
0.31
Part No.
Output
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars.
New products are listed in bold red.
Find the Perfect Sensor Reference Design to Get Started
16-Button Keypad using the LDC1314
Inductive-to-Digital Converter
Reference Design - TIDA-00509
Key Features
• Contactless buttons with superior reliability over
electrical/mechanical contact solutions
• Support simultaneous button presses
TI Devices
LDC1314
LP2985-N
MSP430F5528
Backlight and Smart Lighting Control by
Ambient Light and Proximity Sensor
Reference Design - TIDA-00373
Key Features
• Good Human Eye Spectral Matching
• Dynamically Adjusts Backlight Brightness
• UV Filter for Outdoor Using
TI Devices
OPT3001
FDC1004
HDC1000
MSP430FR5969
Spectral Response: The OPT3001 and Human Eye
Ambient Light Sensor with Human Eye Visibility
1
Normalized Response
The OPT3001 is a single-chip lux meter, measuring the intensity of light as
visible by the human eye. The precision spectral response and strong IR
rejection of the device enables the OPT3001 to accurately meter the intensity
of light as seen by the human eye regardless of light source. The strong IR
rejection also aids in maintaining high accuracy when industrial design calls
for mounting the sensor under dark glass for aesthetics.
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
300
400
500
600
700
800
900
1000
Wavelength (nm)
Texas Instruments
Connected Sensors Building Automation Systems Guide 2015
|
3
Amplifier and Comparator Solutions
Texas Instruments delivers a broad portfolio of amplifier and linear solutions including precision and high speed op amps,
instrumentation and differential amplifers along with comparators. TI has an amplifier suited for any application.
Learn more about Amplifier solutions at: www.ti.com/amplifier
Low Power Amplifiers
Slew Rate
(Typ) (V/µs)
CMRR
(Typ)
(dB)
Offset
Voltage @
25°C (Max)
(mV)
Offset
Drift
(Typ)
(µV/°C)
Part No.
Supply
Range (V)
Channels
Iq per
ch. (Max)
(mA)
LMV611/2/4
1.8 to 5.5
1/2/4
0.21
1.5
0.42
60
4
LPV521
1.6 to 5.5
1
0.0004
0.0062
0.0024
102
GBW (Typ)
(MHz)
Rail-Rail
Operating
Temp.
(°C)
Approx.
Price
(US$ | 1ku)
5.5
RRIO
–40 to 125
0.22 / 0.25 /
0.30
1
0.4
RRIO
–40 to 125
0.49
OPA369
1.8 to 5.5
1
0.0012
0.012
0.005
100
0.75
0.4
RRIO
–40 to 85
0.65
OPA349
1.8 to 5.5
1
0.002
0.065
0.02
52
10
15
RRIO
0 to 70
0.50
Offset
Voltage @
25°C (Max)
(mV)
Offset
Drift
(Typ)
(µV/°C)
General Purpose Amplifiers
Supply
Range (V)
Channels
Iq per
ch. (Max)
(mA)
TLC271/2/4
3 to 16
1/2/4
1.6
1.7
3.6
65
10
1.8
LM2904
3 to 26
2
0.6
0.7
0.3
50
7
7
–40 to 125
0.07
LM358
3 to 32
2
0.6
0.7
0.3
65
7
7
0 to 70
0.07
OPAx313
1.8 to 5.5
1, 2, 4
0.06
1
0.5
70
2.5
2
-40 to 125
0.26 / 0.38 / 0.55
OPAx314
1.8 to 5.5
1, 2, 4
0.21
3
1.5
75
2.5
1
-40 to 125
0.30 / 0.45 / 0.65
OPAx316
1.8 to 5.5
1, 2, 4
0.5
10
6
76
2.5
2
-40 to 125
0.48 / 0.72 / 1.08
OPAx170
2.7 to 36
1, 2, 4
0.145
1.2
0.5
104
1.8
0.3
-40 to 125
0.40 / 0.60 / 0.90
OPAx171
2.7 to 36
1, 2, 4
0.595
3
1.5
104
1.8
0.3
-40 to 125
0.40 / 0.60 / 0.90
OPAx172
2.7 to 36
1, 2, 4
1.8
10
10
90
1
0.3
-40 to 125
0.65 / 0.99 / 1.49
Input
Bias
Current
(±) (Max)
(nA)
VICR (V)
Offset
Voltage
@ 25°C
(Max)
(mV)
Operating
Temp.
(°C)
Approx. Price
(US$ | 1ku)
Part No.
GBW (Typ)
(MHz)
Slew Rate
(Typ) (V/µs)
CMRR
(Typ)
(dB)
Operating
Temp.
(°C)
–40 to 85
Approx. Price
(US$ | 1ku)
0.31 / 0.41 / 0.60
Comparators
Part No.
Type
Supply
Range (V)
Channels
tRESP
Low-toHigh (µs)
Iq per
ch. (Max)
(mA)
TLV3691
Push-Pull
0.9 to 6.5
1
24
0.00015
0.1
-0.1 to 6.6
15
–40 to 85
0.40
TLV3012
Push-Pull
1.8 to 5.5
1
6
0.005
0.01
-0.2 to 5.7
12
–40 to 85
0.75
TLC3702
Push-Pull
3 to 16
2
1.1
0.02
0.03
0 to 15
5
–40 to 85
0.36
TLV1701/2/4
Open
Collector
2.2 to 36
1, 2, 4
0.56
0.075
15
2.2 to 36
2.5
-40 to 125
0.38 / 0.61 / 0.97
Analog-to-Digital Converters
Sample
Rate
(SPS)
Input
Channels
Interface
Supply
Range
(V)
Features
Operating
Temp.
(°C)
Approx. Price
(US$ | 1ku)
Part No.
Type
Resolution
(bits)
ADS7040/1/2/3/4
SAR
8 to 12
1000
1
SPI
0 to 3.6
Nanowatt Power Consumption
-40 to 125
1.00 / 1.60 / 2.10
ADS1018
ΣΔ
12
3300
4
SPI
2 to 5.5
Temp. Sensor (0.5°C accurate)
-40 to 125
1.15
SPI
2.3 to
5.5
Single cycle setting, sensor, IDACs
-40 to 125
3.15 / 3.95
ADS1120/1220
ΣΔ
16, 24
2000
4
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars.
4
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Connected Sensors Building Automation Systems Guide 2015
Texas Instruments
Li-Ion
Wireless Connectivity
Smallest Power Source
Required
AAA
With the industry’s broadest wireless connectivity portfolio
TI offers cost-effective, low-power solutions for short-range,
long-range, mesh, and IP networks
No
Battery
Coin
Cell
Learn more about Wireless Connectivity solutions at:
www.ti.com/wireless
Wi-Fi
BLE/ANT
ZigBee
BLE/ANT
Sub-1 GHz RF4CE
2.4 GHz 6LoWPAN
2.4 GHz
NFC/RFID Proprietary
Wi-Fi
Part No.
Technology
Benefits
TI Designs and Development Tools
CC3200
SimpleLink Wi-Fi Wireless MCU with ARM Cortex®-M4, Integrated Wi-Fi Connectivity, security, low power,
ease of use: Certified Wi-Fi modules available
CC3200MODLAUNCHXL, TIDA-00372,
TIDC-CC3200SMARTPLUG,
TIDC-CC3200CAMBOOST
CC3100
SimpleLink Wi-Fi Wireless Network Processor: provides easy Wi-Fi connectivity for building automation
applications. Fully integrated 802.11 b/b/n radio, baseband, and MAC. Connect serialy Interface to
any 8, 16, or 32-bit micro-controllers. Certified Wi-Fi modules available
CC3100MODBOOST
WL1837MOD
High performance, low power, certified combo modules integrating Wi-Fi + Bluetooth + Bluetooth Low
Energy. Connects to any Linux Processor with SDIO interface, available up to 85°C, 2.4GHz and 5GHz
WL1837MODCOM8I
Part No.
Benefits
TI Designs and Development Tools
CC1200
High performance, long distance, low power radio transceiver: optimized for wide band applications
CC1200DK, CC1200EMK-868-930, TIDC-CHN
CC1120
High performance, long distance, low power radio transceiver: optimized for Narrowband
CC1120DK, CC1120EMK-169,
CC1120EMK-420-470, CC1120EMK-868-915,
TIDC-MULTIBAND-WMBUS
CC1101
Ultra-low power radio transceiver
CC1101DK433, CC1101DK868-915,
TIDM-SUB1GHZ-MESH-NETWORK
CC1310
SimpleLink Ultra-low power ARM® Cortex®-M Based Wireless MCU
TIDA-00484
Sub-1GHz
Bluetooth®
Part No.
Benefits
TI Designs and Development Tools
CC2650
SimpleLink Wi-Fi Ultra-Low power ARM® Cortex®-M Based Wireless MCU: multi-standard supported
Bluetooth Low-Energy, 6LowPAN and ZigBee. Ideal for end point sensors
CC2650DK, CC2650STK,
TIDA-00374
CC2640
SimpleLink Wi-Fi Ultra-Low power ARM® Cortex®-M Based Wireless MCU supporting Bluetooth LowEnergy: ultra-low power, small size and ease of use. Ideal for end point sensors
CC2650DK, CC2650STK,
TIDA-00374
CC2540T
Extreme temperature Bluetooth Low Energy (up to 125 degree C) wireless MCU combined with low power
and ease of use
CC2541DK-MINI,
TIDC-BLUETOOTH-LOW-ENERGY-LONG-RANGE,
TIDC-BLUETOOTH-SMART-TO-RS-485-GATEWAY
CC2564MODA
Dual Mode Bluetooth (Bluetooth Low energy + Bluetooth Classic) transceivers module with antenna integrated: low-power, stable and robust SW stack
CC256XQFNEM
CC2564MODAEM (RTM September)
Part No.
Benefits
TI Designs and Development Tools
CC2630
SimpleLink Wi-Fi Ultra-Low power ARM® Cortex®-M Based Wireless MCU : ideal for end point sensors
CC2650DK, CC2650STK,
TIDA-00374
CC2530
ZigBee Wireless MCU: enables robust network nodes to be built with very low total bill-of-material costs
CC2530DK, CC2530EMK,
CC2531EM-IOT-HOME-GATEWAY-RD,
CC2530-CC2592EM-RD
CC2538
512kB ARM® Cortex®-M Based Wireless MCU: handle complex network stacks with security, demanding
applications, and over-the-air download
CC2538DK, CC2538EMK,
TIDC-ZNP-HOST-SW3
Benefits
TI Designs and Development Tools
ZigBee®
NFC
Part No.
transponder chip with a programmable 16-bit MSP430 low-power microcontroller. Optimized
RF430FRL152H 13.56-MHz
for operation in fully passive (battery-less) or single-cell battery-powered (semi-active) mode.
RF430CL330H
NFC Tag Type 4 device which combines a wireless NFC interface and a wired SPI/I2C interface to connect
the device to a host
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars.
Texas Instruments
TIDM-RF430-TEMPSENSE,
TIDM-RF430FRLSENSE
TIDA-00217
New products are listed in bold red.
Connected Sensors Building Automation Systems Guide 2015
|
5
Wireless Connectivity
Find the Perfect Connectivity Reference Design to Get Started
SimpleLink™ Bluetooth Smart®/
Multi-Standard SensorTag
Reference Design - CC2650STK-RD
Key Features
• More Sensors! 10 Sensors including light, humidity,
pressure, magnetic, accelerometer, gyroscope, and others
• Flexibility for IoT applications; Enable ZigBee or 6LoWPAN through a firmware upgrade
TI Devices
CC2650
TMP007
OPT3001
HDC1000
Wired (UART or RS-485) to Wi-Fi®
Bridge with 24-VAC Power
Reference Design - TIDA-00375,
TIDA-00485, TIDA-00486
Key Features
• Add Wi-Fi® Connectivity to an existing wired network
• Wide Input Voltage Range of 18- to 30-VAC, 12- to 48-VDC
• Galvanically Isolated or Non-Isolated variations
TI Devices
CC3200MOD
CC3100MOD
LM5160
LMR16006
Battery-less NFC/RFID
Temperature Sensing Patch
Reference Design TIDM-RF430-TEMPSENSE
Key Features
• No batteries required
• “Over the air” configuration of the ADC
• Different antenna configurations allow many form factors
TI Devices
RF430FRL152H
Dynamic Field Powered NFC Reference
Design for Data Logging and Security
Applications
Reference Design - TIDA-00217
Key Features
• User can receive updated information
from a field unit
• Battery-less sensor interface; NFC reader provides
TI Devices
TMP103
RF430CL330H
MSP430FR5969
SimpleLink™ Wi-Fi® CC3200 Smart Plug
Reference Design TIDC-CC3200SMARTPLUG
Key Features
• Single-Phase energy measurement that calculates Current, Voltage, Power, and Energy
• SimpleLink™ Wi-Fi® connectivity over 802.11 b/g/n networks from any mobile device
• Isolated flyback power supply to provide Constant-Voltage and Constant-Current output
regulation without optical coupler”
TI Devices
CC3200
UCC28910
TPS61097A-33
Embedded Processing Solutions
Microcontrollers and processors from Texas Instruments offer a broad range of performance and power consumption options.
From MSP430 MCU with ultra-low power consumption to the Sitara™ AM335x family with integrated multi-protocol industrial
communications support to connect various kinds of sensors in real-time for better automation; TI is tailored to meet your
design challenges.
Learn more about Microcontroller solutions at: www.ti.com/msp430 and www.ti.com/msp432.
Learn more about processor solutions at: www.ti.com/processors.
Non-volatile
Memory (KB)
SRAM (KB)
GPIO
I2C
SPI
UART
DMA
ADC
Comparator
(Channels)
Timers
16-Bit
Multipliers
AES
Additional
Features
Operating
Temp. (°C)
Package
MSP430FR4133
16
15.5
2
60
1
2
1
0
ADC10-10ch
0
2
N/A
N/A
LCD, RTC, BOR,
Temp Sensor
–40 to 85
LQFP,
TSSOP
1.55
MSP430FR5969
16
64
2
40
1
3
2
3
ADC12-16ch
16
5
32x32
AES256
RTC, BOR, IrDA,
Temp Sensor
–40 to 85
VQFN
2.35
MSP430FR6972
16
64
2
51
2
4
2
3
ADC12-8ch
8
5
32x32
AES256
LCD, RTD, BOR,
IrDA, Temp
Sensor
–40 to 85
LQFP
2.55
MSP430FR6989
16
128
2
83
2
4
2
3
ADC12-16ch
16
5
32x32
AES256
LCD, RTC, Scan
I/F, BOR, IrDA,
Temp Sensor
–40 to 85
LQFP
4.50
Part No.
*Quantities of 1,000 begin at this suggested resale price in U.S. dollars.
6
| Connected Sensors Building Automation Systems Guide 2015
Approx.Price
(US$ | 1ku)
Frequency
(MHz)
MSP430 Low Power FRAM MCUs
New products are listed in bold red.
Texas Instruments
Embedded Processing Solutions
Non-volatile
Memory (KB)
SRAM (KB)
GPIO
I2C
SPI
UART
ADC
Comparator
(Channels)
Timers
16-Bit
Multipliers
Additional
Features
Operating
Temp. (°C)
Package
MSP430G2553
16
16
0.5
24
1
1
1
ADC10-8ch
8
2
N/A
Temp Sensor, BOR, IrDA
–40 to 85
TSSOP,
VQFN
0.90
MSP430G2955
16
56
4
32
1
2
1
ADC10-12ch
8
3
N/A
Temp Sensor, BOR, IrDA
–40 to 85
TSSOP,
VQFN
1.30
MSP430F2274
16
32
1
32
1
1
1
ADC10-12ch
0
2
N/A
Temp Sensor, BOR,
OpAmp
–40 to 105
–40 to 85
DSBGA,
TSSOP,
VQFN
1.80
MSP430I2041
16
32
2
16
1
2
1
SigmaDelta
24-4ch
0
2
16 x16
Temp Sensor, BOR, IrDA
-40 to 105
TSSOP,
VQFN
1.75
Part No.
Approx.Price
(US$ | 1ku)
Frequency
(MHz)
MSP430 Low Power MCUs
ARM Based MCUs and MPUs
Part No.
MSP432P401R
AM3352
ARM CPU
Benefits
TI Designs and Dev. Tools
ARM Cortex-M4F
MSP432P4x microcontrollers are the ideal combination of TI's MSP430 low-power DNA, advanced mixed-signal
features, and the high-performance processing capabilities of ARM®'s 32-bit Cortex®-M4F RISC engine.
MSP-EXP432P401R
ARM Cortex-A8
Sitara™ AM335x ARM Cortex-A8 Processors deliver the right balance of performance (300 MHz to 1 GHz of
processing power), Interfaces (DDR3, LCD, Touch Screen Controller), and Connectivity (UART and Industrial
Protocols)
Beaglebk, TMDXEVM3358
New products are listed in bold red.
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Find the Perfect MCU Reference Design to Get Started
Thermostat Implementation with
FRAM Microcontroller
Reference Design - TIDM-FRAM-THERMOSTAT
Key Features
• 0°C to 35°C Temperature Measurement with 0.1°C Resolution
• 3.4 inch LCD Display
• Ultra-Low Power: 1.8 µA Standby Current
TI Devices
MSP430FR4133
SN65HVD75
TPS782
Smoke Detector with Ultra Low Power MCU
Reference Design - TIDM-G2xxSMOKEDETECTOR
Key Features
• Passive infrared (PIR) smoke chamber with discrete
Amplification circuitry to ADC input
• Low power (2.07 µA) and small code size (