SCAN12100
1228.8 and 614.4 Mbps CPRI SerDes with Auto RE Sync and
Precision Delay Calibration Measurement
■ DCM also measures chip and other delays to ≤ ± 1200 ps
General Description
The SCAN12100 is a 1228.8 and 614.4 Mbps serializer/deseralizer (SerDes) for high-speed bidirectional serial data
transmission over FR-4 printed circuit board backplanes, balanced cables, and optical fiber. The SCAN12100 integrates
precision delay calibration measurement (DCM) circuitry that
measures link delay components to better than ± 800 ps accuracy.
The SCAN12100 features independent transmit and receive
PLLs, on-chip oscillator, and intelligent clock management
circuitry to automatically perform remote radio head synchronization and reduce the cost and complexity of external clock
networks.
The SCAN12100 is programmable though an MDIO interface
as well as through pins, featuring configurable transmitter deemphasis, receiver equalization, speed rate selection, internal pattern generation/verification, and loop back modes. In
addition to at-speed BIST, the SCAN12100 includes IEEE
1149.1 and 1149.6 testability.
Features
■
■
■
■
Exceeds LV and HV CPRI voltage and jitter requirements
1228.8, and 614.4 Mbps operation
Pin and package compatibility with the SCAN25100
Integrated delay calibration measurement (DCM) directly
measures T14 and Toffset delays to ≤ ± 800 ps
■
■
■
■
■
■
■
■
■
■
■
■
■
accuracy
Deterministic chip latency
Independent transmit and receive PLLs for seamless RE
synchronization
Low noise recovered clock output
Requires no jitter cleaning in single-hop applications
>8 kV ESD on the CML IO, >7 kV on all other pins, >2 kV
CDM
Hot plug protection
LOS, LOF, 8b/10b line code violation, comma, and
receiver PLL lock reporting
Programmable hyperframe length and start of hyperframe
character
Programmable transmit de-emphasis and receive
equalization with on-chip termination
Advanced testability features
— IEEE 1149.1 and 1149.6
— At-speed BIST pattern generator/verifier
— Multiple loopback modes
1.8V or 3.3V compatible parallel bus interface
100-pin TQFP package with exposed dap
Industrial –40 to +85° C temperature range
Block Diagram
20209542
© 2008 National Semiconductor Corporation
202095
www.national.com
SCAN12100 1228.8 and 614.4 Mbps CPRI SerDes
May 19, 2008
SCAN12100
Pin Diagram
SCAN12100
20209502
(Top View)
100–Pin TQFP with Exposed Ground Pad
Order Number SCAN12100TYA
See NS Number VXF100B
www.national.com
2
SCAN12100
Pin Descriptions
Pin #
Pin Name
I/O, Type
Description
HIGH SPEED DIFFERENTIAL I/O
12
11
DOUTP
DOUTN
O, CML
Inverting and non-inverting high speed CML differential outputs of the serializer. Onchip termination resistors connect from DO+ and DO− to an internal reference
18
17
RINP
RINN
I, CML
Inverting and non-inverting high speed differential inputs of the deseralizer. On-chip
termination resistors connect from RI+ and RI− to an internal reference. On-chip
termination resistors are configured for AC-coupled applications.
PARALLEL DATA BUS
65
66
67
68
69
70
71
72
73
74
DIN [0]
DIN [1]
DIN [2]
DIN [3]
DIN [4]
DIN [5]
DIN [6]
DIN [7]
DIN [8]
DIN [9]
I, LVTTL or 1.8V Transmit data word.
LVCMOS Internal
pull down
In 10-bit mode, the 10-bit code-group at DIN [0–9] is serialized with the internal 8b/
10b encoder disabled. Bit 9 is the msb.
In 8-bit mode, DIN [0-7] is first converted into 10-bit code-group by the internal 8b/10b
encoder before it is serialized. Bit 7 is the msb. DIN [8] is used as K-code select pin
and DIN[9] should be tied Low. When DIN [8] is low, DIN [0-7] is mapped to the
corresponding 10-bit D-group. When DIN [8] is high, DIN [0-7] is mapped to the
corresponding 10-bit K-group.
The 8B/10B specification is defined in IEEE 802.3-2000 section 36.2.2
53
54
55
56
57
58
59
60
61
62
ROUT [0]
ROUT [1]
ROUT [2]
ROUT [3]
ROUT [4]
ROUT [5]
ROUT [6]
ROUT [7]
ROUT [8]
ROUT [9]
O, LVTTL or 1.8V Deserialized receive data word.
LVCMOS Internal
pull down
In 10-bit mode, ROUT [0-9] is the deserialized received data word in 10-bit code group.
Bit 9 is the msb.
In 8-bit mode, ROUT [0-7] is the deserialized received data byte. Bit 7 is the msb.
ROUT [8] is the K-group indicator. A low at ROUT [8] indicates ROUT [0-7] belongs
to the D-group, while a high indicates it belongs to the K-group. ROUT [9] is the line
code violation (LCV) indicator. ROUT [9] is high for one ROUT cycle when a line code
violation occurs.
The 8B/10B specification is defined in IEEE 802.3-2000 section 36.2.2
CLOCK SIGNALS
6
7
REFCLKP
REFCLKN
I, LVDS or
LVPECL
64
TXCLK
I, LVTTL or 1.8V Transmit clock. TXCLK must be synchronous to REFCLK to avoid FIFO under/
LVCMOS Internal overflow though it may differ in phase.
pull down
52
RXCLK
I/O, LVTTL or 1.8V Write mode: RXCLK is recovered clock output pin.
LVCMOS
Read mode: RXCLK is an input pin. ROUT [9:0] are latched out on RXCLK rising and
falling edges. RXCLK must be synchronous to the incoming serial data to avoid FIFO
over/underflow, though it may differ in phase. See RXCLKMODE pin description for
more details.
22
23
SYSCLKP
SYSCLKN
O, LVDS
Inverting and non-inverting differential serializer reference clock. A low jitter clock
source should be connected to REFCLKP & REFCLKN.
30.72 MHz output clock. (OPMODE must be low.)
LINE STATUS
78
LOS
O, LVTTL or 1.8V Receiver CPRI loss of signal (LOS) status (8-bit mode only).
LVCMOS
0 = signal detected (per CPRI standard)
1 = signal lost (per CPRI standard)
See “LOS Detection” under “Functional Description” for more details.
77
LOCKB
O, LVTTL or 1.8V Receiver PLL lock status
LVCMOS
0 = Receiver PLL locked
1 = Receiver PLL not locked
3
www.national.com
SCAN12100
Pin #
79
Pin Name
CDET
I/O, Type
Description
O, LVTTL or 1.8V Comma Detect.
LVCMOS
0 = no comma yet detected in the incoming serial stream or receiver PLL not locked.
1 = the receiver PLL is locked and a positive or negative comma bit sequence detected
in the incoming bit stream. The serial to parallel converter is aligned to the proper 10bit word boundary when comma alignment is enabled (CALIGN_EN = 1).
CONTROL PINS
82
81
88
89
PE [0]
PE [1]
EQ [0]
EQ [1]
I, LVTTL or 1.8V Transmitter de-emphasis configuration.
LVCMOS Internal Pulling both pins low enables MDIO control, default is no de-emphasis.
pull down
PE1
PE0
0
0
No de-emphasis
0
1
Low de-emphasis
1
0
Medium de-emphasis
1
1
Maximum de-emphasis
I, LVTTL or 1.8V Receive input equalization configuration.
LVCMOS Internal Pulling both pins low enables MDIO control, default is no receive equalization.
pull down
EQ1
EQ0
0
0
No receive equalization
0
1
Low receive equalization
1
0
Medium receive equalization
1
1
Maximum receive equalization
90
91
TXPWDNB
RXPWDNB
I, LVTTL or 1.8V Power down control signals.
LVCMOS Internal TXPWDNB
pull down
0 = Transmitter is powered down and DOUT± pins are high impedance.
1 = Transmitter is powered up.
RXPWDNB
0 = Receiver is powered down and ROUT [9:0] as well as LOS, LOCKB, CDET,
RXCLK, and SYSCLK are high impedance.
1 = Receiver is powered up.
92
CALIGN_EN
I, LVTTL or 1.8V Comma alignment enable.
LVCMOS Internal 0 = comma alignment circuitry disabled. Receiver will not realign 10-bit data based on
pull down
incoming comma characters. CDET pin still flags comma detection.
1 = comma detect and alignment circuitry enabled. Receiver aligns 10-bit data to
incoming comma character and flags comma detect through CDET pin.
93
RXCLKMODE
I, LVTTL or 1.8V Receiver recovered clock mode
LVCMOS Internal 0 = Write mode. RXCLK pin is a recovered clock output.
pull down
(RXCLK = output pin)
1 = Read mode. RXCLK pin is ROUT [9:0] bus read input strobe.
(RXCLK = input pin)
80
VSEL
I, LVTTL or 1.8V Selects whether single-ended data and control pins are 3.3V LVTTL or 1.8V LVCMOS.
LVCMOS Internal 0 = 1.8V LVCMOS. Tie VSEL to ground and power IOVDD at 1.8 V.
pull down
1 = 3.3V LVTTL. Tie VSEL to IOVDD supply and power IOVDD at 3.3 V.
94
OPMODE
I, LVTTL or 1.8V Selects SerDes mode.
LVCMOS Internal
pull down
0 = Base station mode
1 = Reserved for future use
95
RESETB
I, LVTTL or 1.8V Hardware SerDes reset. Resets PLLs and MDIO registers.
LVCMOS Internal
pull down
0 = Hardware SerDes reset
1 = Normal operation
www.national.com
4
96
97
Pin Name
SPMODE [0]
SPMODE [1]
I/O, Type
SCAN12100
Pin #
Description
I, LVTTL or 1.8V Speed mode configuration. (OPMODE must be low)
LVCMOS Internal Pulling both pins low enables MDIO control.
pull down
SPMODE [1]
SPMODE [0]
0
0
Rate selected via MDIO
0
1
614.4 Mbps rate mode
1
0
1228.8 Mbps rate mode
1
1
Reserved
98
TENBMODE
I, LVTTL or 1.8V Enable 10-bit mode
LVCMOS, Internal
The 8B/10B specification is defined in IEEE 802.3-2000 section 36.2.2
pull down
0 = Selects 8-bit mode. Enables the internal 8b/10b encoder and decoder.
1 = Selects 10-bit mode. Bypasses internal 8b/10b encoder and decoder.
99
100
LOOP [0]
LOOP [1]
I, LVTTL or 1.8V Loop back configuration.
LVCMOS, Internal Pulling both pins low enables MDIO control.
pull down
Note: During Special line (remote) loop back mode, the output de-emphasis control
is disabled.
LOOP [1]
LOOP [0]
0
0
Normal mode—no loop back
0
1
Line (remote) loop back mode
1
0
Local loop back mode
1
1
Special line (remote) loop back mode
MDC/MDIO
30
31
37
36
35
34
33
MDC
MDIO
ADD0
ADD1
ADD2
ADD3
ADD4
3.3V LVTTL
MDC/MDIO configuration bus.
Internal pull up on Protocol per IEEE 802.2ae-2002 MDC/MDIO Clause 45. These pins are 3.3V LVTTL
ADDR pins
compatible, not 1.2V signal compatible.
IEEE 1149.1 (JTAG)
45
41
44
43
46
TDI
TDO
TMS
TCK
TRSTB
3.3V LVTTL
JTAG test bus for IEEE 1149.1 and 1149.6 support.
Internal pull up on
TDI, TMS, and
TRSTB
RESERVED PINS
83
84
RES1
RES2
I
Reserved.
Tie with 5 KΩ resistor to ground.
POWER
9, 15, 20, AVDD18
32, 38, 47,
85
I, Power
1.8V analog supply.
8, 14, 21, AVDD33
42
I, Power
3.3V analog supply.
1, 2, 28, 29 PVDD33
I, Power
3.3V PLL supply (minimize supply noise to < 100 mV peak-to-peak).
50, 51, 76, IOVDD
87
I, Power
1.8V or 3.3V parallel I/O bus and control pin supply.
See VSEL pin description for additional information.
I, Ground
Device ground.
GROUND
3, 4, 5, 10, GND
13, 16, 19,
24, 25, 26,
27, 39, 40,
48, 49, 63,
75, 86
5
www.national.com
SCAN12100
Pin #
Pin Name
I/O, Type
Description
I, Ground
Device ground. Pad must be soldered and contected to GND plane with a minimum
of 8 thermal vias to achieve specified thermal performance.
GROUND DAP
101
GND
Note: I= input
resistor
www.national.com
O = output
Internal pull down = input pin is pulled low by an internal resistor
6
Internal pull up = input pin is pulled high by an internal
Derating above 25°C
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (AVDD18)
Supply Voltage (PVDD, IOVDD)
Supply Voltage (AVDD33)
LVCMOS Input Voltage
−0.3V to +2.0V
−0.3V to +3.6V
−0.3V to +3.6V
−0.3V to (IOVDD +
0.5V)
LVCMOS Output Voltage
−0.3V to (IOVDD +
0.5V)
MDC/MDIO/ADD[0:4],VSEL Input Voltage
−0.3V to (AVDD33 + 0.5V)
MDIO Output Voltage
−0.3V to (AVDD33 +
0.5V)
CML Receiver Input Voltage
−0.3V to (AVDD +
0.3V)
CML Receiver Output Voltage
−0.3V to (AVDD +
0.3V)
Junction Temperature
+125°C
Storage Temperature
−65°C to +150°C
Lead Temperature
Soldering, 10–20 sec
235 °C
Lead-free +260°C flow is available
Maximum Package Power Dissipation at 25°C
100-pin TQFP with Exposed Pad
4.16 W
Note: This is the maximum TQFP-100 package power
dissipation capability. For SCAN12100 power dissipation,
see the information in the Electrical Characteristics section.
Electrical Characteristics
Symbol
41.6 mW/°C
24.0°C/W
Thermal Resistance , θJA (0 airflow)
ESD Rating
CML RIN/DOUT Pins
HBM, 1.5 kΩ, 100 pF
>8 kV
EIAJ, 0Ω, 200 pF
CDM
All Other Pins
>250V
>2 kV
HBM, 1.5 kΩ, 100 pF
>7 kV
EIAJ, 0Ω, 200 pF
CDM
>250V
>2 kV
Recommended Operating
Conditions
Supply Voltage
AVDD18
AVDD33, PVDD33
IOVDD (1.8V Mode)
IOVDD (3.3V Mode)
Temperature
Junction temperature
Supply Noise
(Peak-to-Peak)
Min
Typ
Max
Unit
1.7
3.135
1.7
3.135
-40
1.8
3.3
1.8
3.3
25
1.9
3.465
1.9
3.465
85
125
V
V
V
V
°C
°C