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SN65LBC184PG4

SN65LBC184PG4

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    DIP8_300MIL

  • 描述:

    1/1 Transceiver Half RS422, RS485 8-PDIP

  • 数据手册
  • 价格&库存
SN65LBC184PG4 数据手册
Product Folder Sample & Buy Support & Community Tools & Software Technical Documents SN65LBC184, SN75LBC184 SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 SNx5LBC184 Differential Transceiver With Transient Voltage Suppression 1 Features 3 Description • • The SN75LBC184 and SN65LBC184 devices are differential data line transceivers in the trade-standard footprint of the SN75176 with built-in protection against high-energy noise transients. This feature provides a substantial increase in reliability for better immunity to noise transients coupled to the data cable over most existing devices. Use of these circuits provides a reliable low-cost direct-coupled (with no isolation transformer) data line interface without requiring any external components. 1 • • • • • • • • • • Integrated Transient Voltage Suppression ESD Protection for Bus Terminals Exceeds: ±30 kV IEC 61000-4-2, Contact Discharge ±15 kV IEC 61000-4-2, Air-Gap Discharge ±15 kV EIA/JEDEC Human Body Model Circuit Damage Protection of 400-W Peak (Typical) Per IEC 61000-4-5 Controlled Driver Output-Voltage Slew Rates Allow Longer Cable Stub Lengths 250-kbps in Electrically Noisy Environments Open-Circuit Fail-Safe Receiver Design 1/4 Unit Load Allows for 128 Devices Connected on Bus Thermal Shutdown Protection Power-Up and Power-Down Glitch Protection Each Transceiver Meets or Exceeds the Requirements of TIA/EIA-485 (RS-485) and ISO/IEC 8482:1993(E) Standards Low Disabled Supply Current 300 μA Maximum Pin Compatible With SN75176 The SN75LBC184 and SN65LBC184 can withstand overvoltage transients of 400-W peak (typical). The conventional combination wave called out in IEC 61000-4-5 simulates the overvoltage transient and models a unidirectional surge caused by overvoltages from switching and secondary lightning transients. Device Information(1) PART NUMBER SN65LBC184, SN75LBC184 PACKAGE BODY SIZE (NOM) SOIC (8) 4.90 mm × 3.91 mm PDIP (8) 9.81 mm × 6.35 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. 2 Applications • • • Industrial Networks Utility Meters Motor Control Logic Symbol NOTE: This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN65LBC184, SN75LBC184 SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 3 3 4 4 5 5 6 6 6 7 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics: Driver ............................... Electrical Characteristics: Receiver .......................... Driver Switching Characteristics ............................... Receiver Switching Characteristics........................... Dissipation Ratings ................................................... Typical Characteristics ............................................ Parameter Measurement Information .................. 8 Detailed Description ............................................ 12 8.1 8.2 8.3 8.4 9 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 12 12 12 13 Application and Implementation ........................ 15 9.1 Application Information............................................ 15 9.2 Typical Application ................................................. 15 10 Power Supply Recommendations ..................... 19 11 Layout................................................................... 19 11.1 Layout Guidelines ................................................. 19 11.2 Layout Example .................................................... 19 12 Device and Documentation Support ................. 20 12.1 12.2 12.3 12.4 12.5 Related Links ........................................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 20 20 20 20 20 13 Mechanical, Packaging, and Orderable Information ........................................................... 20 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision H (February 2009) to Revision I • 2 Page Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1 Submit Documentation Feedback Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 SN65LBC184, SN75LBC184 www.ti.com SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 5 Pin Configuration and Functions D Package, P Package 8-Pin SOIC, 8-Pin PDIP Top View Pin Functions PIN NAME I/O NO. DESCRIPTION A 6 Bus input/output Driver output or receiver input (complementary to B) B 7 Bus input/output Driver output or receiver input (complementary to A) D 4 Digital input Driver data input DE 3 Digital input Active-HIGH driver enable GND 5 Reference potential Local device ground R 1 Digital output Receiver data output RE 2 Digital input VCC 8 Supply Active-LOW receiver enable 4.75-V to 5.25-V supply 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN VCC Supply voltage IO Tstg (1) (2) (3) (2) MAX UNIT –0.5 7 V Continuous voltage range at any bus terminal –15 15 V Data input/output voltage –0.3 7 V Receiver output current –20 20 mA Continuous total power dissipation (3) Internally Limited Storage temperature 160 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential input/output bus voltage, are with respect to network ground terminal. The driver shuts down at a junction temperature of approximately 160°C. To operate below this temperature, see the Dissipation Ratings. 6.2 ESD Ratings VALUE Human body model (HBM), per ANSI/ESDA/JEDEC A, B, GND JS-001 (1) All pins V(ESD) (1) (2) Electrostatic discharge UNIT ±15000 ±3000 Contact discharge (IEC61000-4-2) A, B, GND (2) ±30000 Air discharge (IEC61000-4-2) A, B, GND(3) ±15000 All pins (Class 3A) ±8000 All pins (Class 3B) ±200 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. GND and bus pin ESD protection is beyond readily available test equipment capabilities for IEC 61000-4-2, EIA/JEDEC test method A114-A and MIL-STD-883C method 3015. Ratings listed are limits of test equipment; device performance exceeds these limits. Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 Submit Documentation Feedback 3 SN65LBC184, SN75LBC184 SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 www.ti.com 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) VCC Supply voltage VI or VIC Voltage at any bus terminal (separately or common mode) VIH High-level input voltage D, DE, and RE VIL Low-level input voltage D, DE, and RE |VID| Differential input voltage IOH High-level output current IOL Low-level output current TA Operating free-air temperature (1) MIN (1) TYP MAX UNIT 4.75 5 5.25 V 12 V –7 2 Driver V 0.8 V 12 V –60 Receiver mA –8 Driver 60 Receiver 4 SN75LBC184 0 70 SN65LBC184 –40 85 mA °C The algebraic convention, in which the less-positive (more-negative) limit is designated minimum, is used in this data sheet. 6.4 Thermal Information SNx5LBC184 THERMAL METRIC (1) P [PDIP] D [SOIC] UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 108.7 172.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 34.8 42.5 °C/W RθJB Junction-to-board thermal resistance 23.6 41.4 °C/W ψJT Junction-to-top characterization parameter 12 4.6 °C/W ψJB Junction-to-board characterization parameter 23.5 40.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 SN65LBC184, SN75LBC184 www.ti.com SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 6.5 Electrical Characteristics: Driver over recommended operating conditions (unless otherwise noted) PARAMETER ALTERNATE SYMBOLS TEST CONDITIONS MIN DE = RE = 5 V No Load ICC Supply current NA DE = 0 V RE = 5 V IIH High-level input current (D, DE, RE) NA VI = 2.4 V IIL Low-level input current (D, DE, RE) NA VI = 0.4 V –50 VO = –7 V –250 IOS Short-circuit output current OS (2) NA 12 25 mA 175 300 μA 50 μA –120 250 250 VO Output voltage VOC(PP) Peak-to-peak change in common-mode output voltage during state transitions VOC Common-mode output voltage |Vos| See Figure 8 |ΔVOC(SS)| Magnitude of change, common-mode steadystate output voltage |Vos – Vos| See Figure 10 |VOD| Magnitude of differential output voltage |VA – VB| Δ|VOD| Change in differential voltage magnitude between logic states UNIT μA VO = 12 V High-impedance output current (1) (2) MAX VO = VCC IOZ NA No Load TYP (1) See Receiver II Voa, Vob IO = 0 NA mA 0 VCC See Figure 9 and Figure 10 Vo 0.8 1 IO = 0 1.5 RL = 54 Ω, See Figure 8 1.5 V V 3 V 0.1 V 6 V V RL = 54 Ω ||Vt| – |Vt|| mA 0.1 V All typical values are measured with TA = 25°C and VCC = 5 V. This parameter is measured with only one output being driven at a time. 6.6 Electrical Characteristics: Receiver over recommended operation conditions (unless otherwise noted) PARAMETER ICC TEST CONDITIONS Supply current (total package) TYP (1) MAX UNIT DE = RE = 0 V, No Load 3.9 mA RE = 5 V, DE = 0 V, No Load 300 μA VI = 12 V 250 VI = 12 V, VCC = 0 250 II Input current Other input = 0 V IOZ High-impedance-state output current VO = 0.4 V to 2.4 V Vhys Input hysteresis voltage VIT+ Positive-going input threshold voltage VIT– Negative-going input threshold voltage VOH High-level output voltage IOH = –8 mA, See Figure 11 VOL Low-level output voltage IOL = 4 mA, See Figure 11 (1) MIN VI = –7 V –200 VI = –7 V, VCC = 0 –200 ±100 70 μA μA mV 200 –200 V mV 2.8 V 0.4 V All typical values are at VCC = 5 V, TA = 25°C. Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 Submit Documentation Feedback 5 SN65LBC184, SN75LBC184 SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 www.ti.com 6.7 Driver Switching Characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT td(DH) Differential output delay time, low-to-high-level output 1.3 μs td(DL) Differential output delay time, high-to-low-level output 1.3 μs tPLH Propagation delay time, low-to-high-level output 0.5 1.3 μs tPHL Propagation delay time, high-to-low-level output 0.5 1.3 μs tsk(p) Pulse skew (| td(DH) – td(DL)|) 75 150 ns tr Rise time, single-ended 0.25 1.2 μs tf Fall time, single-ended 0.25 1.2 μs tPZH Output enable time to high level RL = 110 Ω See Figure 6 3.5 μs tPZL Output enable time to low level RL = 110 Ω See Figure 7 3.5 μs tPHZ Output disable time from high level RL = 110 Ω See Figure 6 2 μs tPLZ Output disable time from low level RL = 110 Ω See Figure 7 2 μs RL = 54 Ω CL = 50 pF See Figure 9 6.8 Receiver Switching Characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS tPLH Propagation delay time, low-to-high-level output tPHL Propagation delay time, high-to-low-level output tsk(p) Pulse skew (|tPHL– tPLH|) tr Rise time, single-ended tf Fall time, single-ended tPZH Output enable time to high level tPZL Output enable time to low level tPHZ Output disable time from high level tPLZ Output disable time from low level MIN TYP CL = 50 pF, See Figure 11 MAX UNIT 150 ns 150 ns 50 ns 20 See Figure 11 ns 20 See Figure 12 ns 100 ns 100 ns 100 ns 100 ns 6.9 Dissipation Ratings 6 PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR ABOVE TA = 25°C TA = 70°C POWER RATING TA = 85°C POWER RATING D 725 mW 5.8 mW/°C 464 mW 377 mW P 1150 mW 9.2 mW/°C 736 mW 598 mW Submit Documentation Feedback Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 SN65LBC184, SN75LBC184 www.ti.com SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 6.10 Typical Characteristics Figure 1. Driver Differential Output Voltage vs Free-Air Temperature Figure 2. Driver Propagation Delay Time vs Free-Air Temperature Figure 3. Driver Transition Time vs Free-Air Temperature Figure 4. Differential Output Voltage vs Output Current Figure 5. Receiver Input Current vs Input Voltage Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 Submit Documentation Feedback 7 SN65LBC184, SN75LBC184 SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 www.ti.com 7 Parameter Measurement Information A. The input pulse is supplied by a generator having the following characteristics: PRR = 1.25 kHz, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns, ZO = 50 Ω. B. CL includes probe and jig capacitance. Figure 6. Driver tPZH and tPHZ Test Circuit and Voltage Waveforms A. The input pulse is supplied by a generator having the following characteristics: PRR = 1.25 kHz, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns, ZO = 50 Ω. B. CL includes probe and jig capacitance. Figure 7. Driver tPZL and tPLZ Test Circuit and Voltage Waveforms A. Resistance values are in ohms and are 1% tolerance. B. CL includes probe and jig capacitance. Figure 8. Driver Test Circuit, Voltage, and Current Definitions 8 Submit Documentation Feedback Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 SN65LBC184, SN75LBC184 www.ti.com SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 Parameter Measurement Information (continued) Figure 9. Driver Timing, Voltage, and Current Waveforms Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 Submit Documentation Feedback 9 SN65LBC184, SN75LBC184 SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 www.ti.com Parameter Measurement Information (continued) A. Resistance values are in ohms and are 1% tolerance. B. CL includes probe and jig capacitance (±10%). Figure 10. Driver VOC(PP) Test Circuit and Waveforms A. This value includes probe and jig capacitance (±10%). Figure 11. Receiver tPLH and tPHL Test Circuit and Voltage Waveforms 10 Submit Documentation Feedback Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 SN65LBC184, SN75LBC184 www.ti.com SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 Parameter Measurement Information (continued) A. This value includes probe and jig capacitance (±10%). Figure 12. Receiver tPZL, tPLZ, tPZH, and tPHZ Test Circuit and Voltage Waveforms Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 Submit Documentation Feedback 11 SN65LBC184, SN75LBC184 SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 www.ti.com 8 Detailed Description 8.1 Overview The SNx5LBC184 device is a 5-V, half-duplex, RS-485 transceiver with integrated transient voltage suppressors that prevent circuit damage in the presence of high-energy transients of up to 400-W peak power. This transceiver has an active-HIGH driver enable and active-LOW receiver enable. The differential driver is suitable for data transmission up to 250 kbps. 8.2 Functional Block Diagram VCC R /RE A DE B D GND Figure 13. Functional Logic Diagram 8.3 Feature Description Integrated transient voltage suppressors protect the transceiver against Electrostatic Discharges (ESD) according to IEC 61000-4-2 of up to ±30 kV and surge transients according to IEC 61000-4-5 of up to 400-W peak. The differential driver incorporates slew-rate controlled outputs sufficient to transmit data up to 250 kbps. Slewrate control allows for longer unterminated cable runs and longer stub lengths from the main cable trunk than with faster voltage transitions. A unique receiver design provides a high level failsafe output when the inputs are left floating. The SN65LBC184 is characterized from –40°C to 85°C and the SN75LBC184 is characterized from 0°C to 70°C. 12 Submit Documentation Feedback Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 SN65LBC184, SN75LBC184 www.ti.com SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 8.4 Device Functional Modes When the driver enable pin (DE) is logic high, the differential outputs A and B follow the logic states at data input D. A logic high at D causes A to turn high and B to turn low. In this case, the differential output voltage defined as VOD = VA – VB is positive. When D is low, the output states reverse, B turns high, A becomes low, and VOD is negative. When DE is low, both outputs turn high-impedance. In this condition, the logic state at D is irrelevant. Table 1. Driver Functions (1) (1) INPUT ENABLE OUTPUTS D DE A B H H H L Actively drive bus High L H L H Actively drive bus Low X L Z Z Driver disabled FUNCTION H = high level, L = low level, ? = indeterminate, X = irrelevant, Z = high impedance (off) When the receiver enable pin, RE, is logic low, the receiver is enabled. When the differential input voltage defined as VID = VA – VB is positive and higher than the positive input threshold, VIT+, the receiver output (R) turns high. When VID is negative and lower than the negative input threshold, VIT–, the receiver output turns low. If VID is between VIT+ and VIT–, the output is indeterminate. When RE is logic high, the receiver output is high-impedance and the magnitude and polarity of VID are irrelevant. When the transceiver is disconnected from the bus, the receiver provides a failsafe high output. Table 2. Receiver Functions (1) (1) DIFFERENTIAL INPUT ENABLE OUTPUT VID = VA – VB RE R VID > VIT+ L H Receive valid bus High VIT– < VID < VIT+ L ? Indeterminate bus state VID < VIT– L L Receive valid bus Low X H Z Receiver disabled OPEN L H Receiver failsafe High FUNCTION H = high level, L = low level, ? = indeterminate, X = irrelevant, Z = high impedance (off) Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 Submit Documentation Feedback 13 SN65LBC184, SN75LBC184 SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 www.ti.com Figure 14. Schematic of Inputs and Outputs 14 Submit Documentation Feedback Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 SN65LBC184, SN75LBC184 www.ti.com SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The SN65LBC184 and SN75LBC184 devices are half-duplex, RS-485 transceivers commonly used for asynchronous data transmissions. The driver and receiver enable pins allow for the configuration of different operating modes. R R R R R R RE A RE A RE A DE B DE B DE B D D D a) Independent driver and receiver enable signals D b) Combined enable signals for use as directional control pin D D c) Receiver always on Figure 15. Half-Duplex Transceiver Configurations a. Using independent enable lines provides the most flexible control as it allows for the driver and the receiver to be turned on and off individually. While this configuration requires two control lines, it allows for selective listening into the bus traffic, whether the driver is transmitting data or not. b. Combining the enable signals simplifies the interface to the controller by forming a single direction-control signal. In this configuration, the transceiver operates as a driver when the direction-control line is high, and as a receiver when the direction-control line is low. c. Only one line is required when connecting the receiver-enable input to ground and controlling only the driverenable input. In this configuration, a node not only receives the data from the bus, but also the data it sends and can verify that the correct data have been transmitted. 9.2 Typical Application An RS-485 bus consists of multiple transceivers connected in parallel to a bus cable. To eliminate line reflections, each cable end is terminated with a termination resistor, RT, whose value matches the characteristic impedance, Z0, of the cable. This method, known as parallel termination, allows for higher data rates over a longer cable length. Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 Submit Documentation Feedback 15 SN65LBC184, SN75LBC184 SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 www.ti.com Typical Application (continued) R R RE B DE D R A R A RT RT D A B R A R D R RE DE D RE B DE D B D D R RE DE D Figure 16. Typical RS-485 Network With Half-Duplex Transceivers 9.2.1 Design Requirements RS-485 is a robust electrical standard suitable for long-distance networking that may be used in a wide range of applications with varying requirements, such as distance, data rate, and number of nodes. 9.2.1.1 Data Rate and Bus Length There is an inverse relationship between data rate and bus length, meaning the higher the data rate, the shorter the cable length; and conversely, the lower the data rate, the longer the cable may be without introducing data errors. While most RS-485 systems use data rates between 10 kbps and 100 kbps, some applications require data rates up to 250 kbps at distances of 4000 feet and longer. Longer distances are possible by allowing for small signal jitter of up to 5 or 10%. 10000 Cable Length (ft) 5%, 10%, and 20% Jitter 1000 Conservative Characteristics 100 10 100 1k 10k 100k 1M 10M 100M Data Rate (bps) Figure 17. Cable Length vs Data Rate Characteristic 16 Submit Documentation Feedback Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 SN65LBC184, SN75LBC184 www.ti.com SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 Typical Application (continued) 9.2.1.2 Stub Length When connecting a node to the bus, the distance between the transceiver inputs and the cable trunk, known as the stub, should be as short as possible. Stubs present a nonterminated piece of bus line which can introduce reflections as the length of the stub increases. As a general guideline, the electrical length, or round-trip delay, of a stub should be less than one-tenth of the rise time of the driver, thus giving a maximum physical stub length as shown in Equation 1. L(STUB) ≤ 0.1 × tr × v × c where • • • tr is the 10/90 rise time of the driver v is the signal velocity of the cable or trace as a factor of c c is the speed of light (3 × 108 m/s) (1) Per Equation 1, cable-stub lengths when using the SN65LBC184 driver must be not greater than 5.85 meters (19 feet) for a signal velocity of 78% and minimum driver output rise or fall time of 250 ns. 9.2.1.3 Bus Loading The RS-485 standard specifies that a compliant driver must be able to driver 32 unit loads (UL), where 1 unit load represents a load impedance of approximately 12 kΩ. Because the SN65LBC184 is a 1/4 UL transceiver, it is possible to connect up to 128 receivers to the bus. 9.2.2 Detailed Design Procedure 9.2.2.1 SN65LBC184 Test Description 1.0 1.0 0.8 0.8 0.6 0.6 I(t) / IP V(t) / VP The SN65LBC184 is tested against the IEC 61000-4-5 recommended transient identified as the combination wave. The combination wave provides a 1.2-/50-μs open-circuit voltage waveform and a 8-/20-μs short-circuit current waveform shown in Figure 18. The testing is performed with a combination/hybrid pulse generator with an effective output impedance of 2 Ω. The setup for the overvoltage stress is shown in Figure 19 with all testing performed with power applied to the SN65LBC184 circuit. 0.4 0.4 0.2 0.2 0.0 0.0 0 20 40 60 80 100 0 10 Time - µs 20 30 40 50 Time - µs Figure 18. Open-Circuit Voltage and Short-Circuit Current Waveforms The SN65LBC184 is tested and evaluated for both maximum (single pulse) as well as life test (multiple pulse) capabilities. The SN65LBC184 is evaluated against transients of both positive and negative polarity and all testing is performed with the worst-case transient polarity. Transient pulses are applied to the bus pins (A and B) across ground as shown in Figure 19. Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 Submit Documentation Feedback 17 SN65LBC184, SN75LBC184 SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 www.ti.com Typical Application (continued) Key Tech 1.2/50 – 8/20 Combination Pulse Generator IP 41.9 Ω HIGH A/B 3Ω LOW 2Ω Internal Impedance SN75LBC184 VP GND Impedance Matching And Wave Shaping Figure 19. Overvoltage Stress Test Circuit 9.2.3 Application Curve An example waveform as seen by the SN65LBC184 is shown in Figure 20. The bottom trace is current, the middle trace shows the clamping voltage of the device and the top trace is power as calculated from the voltage and current waveforms. This example shows a peak clamping voltage of 33.6 V and peak current of 16 A, thus yielding an absorbed peak power of 538 W. Figure 20. Typical Surge Waveform Measured at Pins 5 and 7 18 Submit Documentation Feedback Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 SN65LBC184, SN75LBC184 www.ti.com SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 10 Power Supply Recommendations To assure reliable operation at all data rates and supply voltages, each supply should be buffered with a 100-nF ceramic capacitor located as close to the supply pins as possible. The TPS76350 is a linear voltage regulator suitable for the 5-V supply. 11 Layout 11.1 Layout Guidelines Because ESD transients have a wide frequency bandwidth from approximately 3 MHz to 3 GHz, high-frequency layout techniques must be applied during PCB design. • Use VCC and ground planes to provide low inductance. High frequency currents follow the path of least inductance and not the path of least impedance. • Apply 100-nF to 220-nF bypass capacitors as close as possible to the VCC pins of transceiver, UART, or controller ICs on the board. • Use at least two vias for VCC and ground connections of bypass capacitors to minimize effective viainductance. • Use 1-kΩ to 10-kΩ pullup or pulldown resistors for enable lines to limit noise currents in these lines during transient events. 11.2 Layout Example Via to ground R Via to VCC 3 C 2 JMP 4 R MCU 4 R LBC184 3 Figure 21. Layout Schematic Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 Submit Documentation Feedback 19 SN65LBC184, SN75LBC184 SLLS236I – OCTOBER 1996 – REVISED JUNE 2015 www.ti.com 12 Device and Documentation Support 12.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 3. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY SN65LBC184 Click here Click here Click here Click here Click here SN75LBC184 Click here Click here Click here Click here Click here 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 20 Submit Documentation Feedback Copyright © 1996–2015, Texas Instruments Incorporated Product Folder Links: SN65LBC184 SN75LBC184 PACKAGE OPTION ADDENDUM www.ti.com 13-Aug-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) SN65LBC184D ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 6LB184 SN65LBC184DG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 6LB184 SN65LBC184DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 6LB184 SN65LBC184DRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 6LB184 SN65LBC184P ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 65LBC184 SN75LBC184D ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7LB184 SN75LBC184DG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7LB184 SN75LBC184DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7LB184 SN75LBC184DRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7LB184 SN75LBC184P ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 75LBC184 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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