SN65LVDS84AQ-Q1
www.ti.com........................................................................................................................................................ SLLS766A – AUGUST 2006 – REVISED APRIL 2008
FlatLink™ TRANSMITTER
FEATURES
1
• 21:3 Data Channel Compression at up to
196 Mbytes/s Throughput
• Suited for SVGA, XGA, or SXGA Data
Transmission From Controller to Display With
Very Low EMI
• 21 Data Channels Plus Clock In Low-Voltage
TTL Inputs and 3 Data Channels Plus Clock
Out Low-Voltage Differential Signaling (LVDS)
Outputs
• Operates From a Single 3.3-V Supply and
89 mW (Typ)
• Packaged in Thin Shrink Small-Outline
Package (TSSOP) With 20-Mil Terminal Pitch
• Consumes Less Than 0.54 mW When Disabled
• Wide Phase-Lock Input Frequency Range:
31 MHz to 75 MHz
• No External Components Required for PLL
• Outputs Meet or Exceed the Requirements of
ANSI EIA/TIA-644 Standard
• SSC Tracking Capability of 3% Center Spread
at 50-kHz Modulation Frequency
• Improved Replacement for SN75LVDS84 and
NSC DS90CF363A 3-V Device
• Qualified for Automotive Applications
2
DGG PACKAGE
(TOP VIEW)
D4
VCC
D5
D6
GND
D7
D8
VCC
D9
D10
GND
D11
D12
NC
D13
D14
GND
D15
D16
D17
VCC
D18
D19
GND
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
D3
D2
GND
D1
D0
NC
LVDSGND
Y0M
Y0P
Y1M
Y1P
LVDSVCC
LVDSGND
Y2M
Y2P
CLKOUTM
CLKOUTP
LVDSGND
PLLGND
PLLVCC
PLLGND
SHTDN
CLKIN
D20
NC − Not Connected
DESCRIPTION/ORDERING INFORMATION
The SN65LVDS84AQ FlatLink™ transmitter contains three 7-bit parallel-load serial-out shift registers, and four
low-voltage differential signaling (LVDS) line drivers in a single integrated circuit. These functions allow 21 bits of
single-ended LVTTL data to be synchronously transmitted over 3 balanced-pair conductors for receipt by a
compatible receiver, such as the SN75LVDS82 or SN75LVDS86/86A.
When transmitting, data bits D0–D20 are each loaded into registers of the SN65LVDS84AQ upon the falling
edge. The internal PLL is frequency-locked to CLKIN and then used to unload the data registers in 7-bit slices.
The three serial streams and a phase-locked clock (CLKOUT) are then output to LVDS output drivers. The
frequency of CLKOUT is the same as the input clock, CLKIN.
The SN65LVDS84AQ requires no external components and little or no control. The data bus appears the same
at the input to the transmitter and output of the receiver with the data transmission transparent to the user(s). The
only user intervention is the possible use of the shutdown/clear (SHTDN) active-low input to inhibit the clock and
shut off the LVDS output drivers for lower power consumption. A low-level on this signal clears all internal
registers to a low level.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
FlatLink is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2008, Texas Instruments Incorporated
SN65LVDS84AQ-Q1
SLLS766A – AUGUST 2006 – REVISED APRIL 2008........................................................................................................................................................ www.ti.com
The SN65LVDS84AQ is characterized for operation over the full automotive temperature range of –40°C to
125°C.
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 125°C
(1)
(2)
TSSOP – DGG
ORDERABLE PART NUMBER
Reel of 2000
SN65LVDS84ADGGRQ1
TOP-SIDE MARKING
65LVDS84AQ
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
FUNCTIONAL BLOCK DIAGRAM
7
D0−D6
Parallel-Load 7-Bit
Shift Register
A,B, ...G
Y0P
Y0M
SHIFT/LOAD
CLK
7
D7−D13
Parallel-Load 7-Bit
Shift Register
A,B, ...G
Y1P
Y1M
SHIFT/LOAD
CLK
7
D14−D20
Parallel-Load 7-Bit
Shift Register
A,B, ...G
Y2P
Y2M
SHIFT/LOAD
CLK
Control Logic
SHTDN
PLL
CLKOUTP
CLKIN
CLKOUTM
CLK
CLKINH
2
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SCHEMATICS OF INPUT AND OUTPUT
EQUIVALENT OF EACH INPUT
EQUIVALENT OF EACH OUTPUT
VCC
VCC
7V
D or
SHTDN
180 Ω
YnP or YnM
5V
7V
Absolute Maximum Ratings (1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
4
V
VO
VI
Input and output voltage range (all terminals)
–0.5
VCC + 0.5
V
Continuous total power dissipation
See Dissipation Rating Table
TJ
Operating virtual junction temperature range
ESD
Electrostatic discharge rating
–40
Machine model
Tstg
(2)
150
°C
200
V
Human-body model
6000
V
Charged-device model
1500
V
150
°C
260
°C
Storage temperature range
–65
Lead temperature 1,6 mm (1/16 in) from case for 10 s
(1)
UNIT
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to the GND terminals.
Dissipation Rating Table
(1)
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR (1)
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 125°C
POWER RATING
DGG
1637 mW
13.1 mW/°C
1048 mW
327 mW
This is the inverse of the junction-to-ambient thermal resistance when board mounted and with no air flow.
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Recommended Operating Conditions
MIN
NOM
MAX
3.3
3.6
VCC
Supply voltage
3
VIH
High-level input voltage
2
VIL
Low-level input voltage
ZL
Differential load impedance
TA
Operating free-air temperature
UNIT
V
V
0.8
V
90
132
Ω
–40
125
°C
Timing Requirements
tc
Input clock period
tw
Pulse duration, high-level input clock
tt
Transition time, input signal
tsu
Setup time, data, D0–D20 valid before CLKIN↓ (see Figure 2)
th
Hold time, data, D0–D20 valid after CLKIN↓ (see Figure 2)
MIN
NOM
MAX
UNIT
13.3
tc
32.4
ns
0.6 tc
ns
5
ns
0.4 tc
3
ns
1.5
ns
Electrical Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIT
Input threshold voltage
|VOD|
Differential steady-state output voltage
magnitude
Δ|VOD|
Change in the steady-state differential output
voltage magnitude between opposite binary
states
VOC(SS)
Steady-state common-mode output voltage
VOC(PP)
Peak-to-peak common-mode output voltage
IIH
High-level input current
VIH = VCC
IIL
Low-level input current
VIL = 0
IOS
Short-circuit output current
IOZ
High-impedance output current
MIN
RL = 100 Ω, See Figure 3
247
RL = 100 Ω, See Figure 3
1.125
4
454
mV
50
mV
V
150
mV
25
µA
±10
µA
VO(Yn) = 0
–6
±24
VOD = 0
–6
±12
mA
±10
µA
15
170
µA
Enabled,
RL = 100 Ω (4 places),
Gray-scale pattern
(see Figure 4)
f = 65 MHz
27
35
f = 75 MHz
30
38
Enabled,
RL = 100 Ω (4 places),
Worst-case pattern
(see Figure 5)
f = 65 MHz
28
36
f = 75 MHz
31
39
Input capacitance
UNIT
V
1.375
80
VO = 0 to VCC
ICC(AVG) Quiescent supply current (average)
(1)
MAX
1.4
Disabled, All inputs at GND
CI
TYP (1)
2
mA
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
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Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
td0
Delay time, CLKOUT↑ to
serial bit position 0
–0.2
0.2
td1
Delay time, CLKOUT↑ to
serial bit position 1
1 t * 0.2
7 c
1 t ) 0.2
7 c
td2
Delay time, CLKOUT↑ to
serial bit position 2
2 t * 0.2
7 c
2 t ) 0.2
7 c
td3
Delay time, CLKOUT↑ to
serial bit position 3
3 t * 0.2
7 c
3 t ) 0.2
7 c
td4
Delay time, CLKOUT↑ to
serial bit position 4
4 t * 0.2
7 c
4 t ) 0.2
7 c
td5
Delay time, CLKOUT↑ to
serial bit position 5
5 t * 0.2
7 c
5 t ) 0.2
7 c
Delay time, CLKOUT↑ to
serial bit position 6
Output skew, tn * n t c
7
6 t * 0.2
7 c
6 t ) 0.2
7 c
–0.2
0.2
td6
tsk(o)
Delay time, CLKIN↓ to
CLKOUT↑
td7
Δtc(o)
Cycle time, output clock
jitter (3)
tc = 15.38 ns (±0.2%),
|Input clock jitter| < 50 ps (2), See Figure 6
tc = 15.38 ns (±0.2%),
|Input clock jitter| < 50 ps (2),
See Figure 6
tc = 13.33 ns ~ 32.25 ns (±0.2%),
|Input clock jitter| < 50 ps (2),
See Figure 6
tc = 15.38 + 0.308 sin(2π500E3t) ± 0.05 ns,
See Figure 7
tc = 15.38 + 0.308 sin(2π3E6t) ±0.05 ns,
See Figure 7
UNIT
ns
ns
2.7
ns
1
4.5
±62
ps
±121
4t
7 c
tw
Pulse duration, high-level
output clock
tt
Transition time,
differential output voltage
(tr or tf)
See Figure 3
700
ten
Enable time, SHTDN↑ to
phase lock (Yn valid)
See Figure 8
1
ms
tdis
Disable time, SHTDN↓ to
off state (CLKOUT low)
See Figure 9
6.5
ns
(1)
(2)
(3)
ns
1500
ps
All typical values are at VCC = 3.3 V, TA = 25°C.
|Input clock jitter| is the magnitude of the change in the input clock period.
Output clock jitter is the change in the output clock period from one cycle to the next cycle observed over 15000 cycles.
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SN65LVDS84AQ-Q1
ÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏ
ÏÏÏ
ÏÏÏ
ÏÏÏ
ÏÏÏ
ÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏ
ÏÏ
ÏÏ
ÏÏ
ÏÏ
SLLS766A – AUGUST 2006 – REVISED APRIL 2008........................................................................................................................................................ www.ti.com
D0
CLKIN
CLKOUT
PARAMETER MEASUREMENT INFORMATION
ÎÎ
ÎÎ
ÎÎ
ÎÎ
Previous Cycle
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
Next
Cycle
Current Cycle
Y0
D0−1
D6
D5
D4
D3
D2
D1
D0
D6+1
Y1
D7−1
D13
D12
D11
D10
D9
D8
D7
D13+1
Y2
D14−
1
D20
D19
D18
D17
D16
D15
D14
D20+1
Figure 1. Typical Load and Shift Sequences
Dn
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
tsu
th
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
CLKIN
A.
All input timing is defined at 1.4 V on an input signal with a 10%-to-90% rise or fall time of less than 5 ns.
Figure 2. Setup and Hold Time Definition
6
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PARAMETER MEASUREMENT INFORMATION (continued)
49.9 Ω ± 1% (2 Places)
YP
VOD
VOC
YM
CL = 10 pF Max
(2 Places)
NOTE A: The lumped instrumentation capacitance for any single-ended voltage measurement is less than or equal to 10 pF. When making
measurements at YP or YM, the complementary output is similarly loaded.
(a) SCHEMATIC
100%
80%
VOD(H)
0V
VOD(L)
20%
0%
tf
tr
VOC(PP)
VOC(SS)
VOC(SS)
0V
(b) WAVEFORMS
Figure 3. Test Load and Voltage Definitions for LVDS Outputs
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PARAMETER MEASUREMENT INFORMATION (continued)
CLKIN
D0, 6, 12
D1, 7, 13
D2, 8, 14
D3, 9, 15
D18, 19, 20
All others
A.
The 16-grayscale test-pattern test device power consumption for a typical display pattern.
B.
VIH = 2 V and VIL = 0.8 V
Figure 4. 16-Grayscale Test-Pattern Waveforms
tc
CLKIN
Even Dn
Odd Dn
A.
The worst-case test pattern produces nearly the maximum switching frequency for all of the LVDS outputs.
B.
VIH = 2 V and VIL = 0.8 V
Figure 5. Worst-Case Test-Pattern Waveforms
8
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PARAMETER MEASUREMENT INFORMATION (continued)
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎ
ÎÎÎ
ÎÎ
ÎÎ
ÎÎ
CLKIN
CLKOUT
Yn
td7
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
td0
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÏÏ
ÏÏ
ÏÏ
ÏÏÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎ
ÎÎÎ
ÎÎ
ÎÎ
ÎÎÎ
ÎÎ
ÎÎÎ
ÎÎ
ÎÎÎ ÎÎ
td1
td2
td3
td4
td5
td6
VOD(H)
CLKIN
CLKOUT
or
Yn
1.4 V
0V
VOD(L)
td7
td0 − td6
Figure 6. Timing Definitions
+
Reference
∑
Device
Under
Test
VCO
+
Modulation
V(t) = A sin (2 π f(mod) t)
HP8665A
Synthesized
Signal Generator
0.1 MHz − 4200 MHz
HP8133A
Pulse Generator
OUTPUT
RF Output
Device Under Test
CLKIN
CLKOUT
Tek TDS794D
Digital Scope
Input
Ext. Input
Figure 7. Clock Jitter Test Setup
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TYPICAL CHARACTERISTICS
CLKIN
Dn
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ten
SHTDN
Yn
Invalid
Valid
Figure 8. Enable Time Waveforms
CLKIN
tdis
SHTDN
CLKOUT
Figure 9. Disable Time Waveforms
PEAK-TO-PEAK OUTPUT JITTER (NORMALIZED)
vs
MODULATION FREQUENCY
AVERAGE SUPPLY CURRENT
vs
CLOCK FREQUENCY
10
Peak-To-Peak OutpuT Jitter (Normalized)
I CC − Average Supply Current − mA
31
29
VCC = 3.6 V
27
25
VCC = 3.3 V
23
VCC = 3 V
21
19
17
15
30
10
35
40
45
50
55
60
65
70
75
1
0.1
0.1
1
10
fc − Clock Frequency − MHz
f(mod) − Modulation Frequency − MHz
Figure 10. Grayscale Input Pattern
Figure 11. Output Period Jitter vs Modulation Frequency
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APPLICATION INFORMATION
Host
Graphics Controller
12-BIT
RED0
RED1
RED2
RED3
NA
NA
GREEN0
GREEN1
GREEN2
GREEN3
NA
NA
BLUE0
BLUE1
BLUE2
BLUE3
NA
NA
H_SYNC
V_SYNC
ENABLE
CLOCK
18-BIT
RED0
RED1
RED2
RED3
RED4
RED5
GREEN0
GREEN1
GREEN2
GREEN3
GREEN4
GREEN5
BLUE0
BLUE1
BLUE2
BLUE3
BLUE4
BLUE5
H_SYNC
V_SYNC
ENABLE
CLOCK
44
45
47
48
1
3
4
6
7
9
10
12
13
15
16
18
19
20
22
23
25
26
SN75LVDS84A/
SN65LVDS84AQ
D0
Y0M
D1
D2
D3
Y0P
D4
D5
D6
Y1M
D7
D8
D9
Y1P
D10
D11
D12
Y2M
D13
D14
D15
Y2P
D16
D17
D18
CLKOUTM
D19
D20
CLKIN
CLKOUTP
Cable
Flat Panel Display
SN75LVDS86/86A
41
8
A0M
100 Ω
40
9
39
10
A0P
A1M
100 Ω
38
11
35
14
A1P
A2M
100 Ω
34
15
33
16
A2P
CLKINM
100 Ω
32
A.
The five 100-Ω terminating resistors are recommended to be 0603 types.
B.
NA – not applicable, these unused inputs should be left open.
17
CLKINP
Figure 12. Color Host to LCD Panel Application
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Host
Graphics Controller
12-BIT
RED0
RED1
RED2
RED3
NA
NA
GREEN0
GREEN1
GREEN2
GREEN3
NA
NA
BLUE0
BLUE1
BLUE2
BLUE3
NA
NA
H_SYNC
V_SYNC
ENABLE
CLOCK
18-BIT
RED0
RED1
RED2
RED3
RED4
RED5
GREEN0
GREEN1
GREEN2
GREEN3
GREEN4
GREEN5
BLUE0
BLUE1
BLUE2
BLUE3
BLUE4
BLUE5
H_SYNC
V_SYNC
ENABLE
CLOCK
44
45
47
48
1
3
4
6
7
9
10
12
13
15
16
18
19
20
22
23
25
26
SN75LVDS84A/
SN65LVDS84AQ
D0
Y0M
D1
D2
D3
Y0P
D4
D5
D6
Y1M
D7
D8
D9
Y1P
D10
D11
D12
Y2M
D13
D14
D15
Y2P
D16
D17
D18
CLKOUTM
D19
D20
CLKIN
CLKOUTP
Cable
Flat Panel Display
SN75LVDS82
41
9
A0M
100 Ω
40
10
39
11
A0P
A1M
100 Ω
38
12
35
15
A1P
A2M
100 Ω
34
16
33
A2P
CLKINM
100 Ω
32
CLKINP
A3M
100 Ω
A3P
A.
The four 100-Ω terminating resistors are recommended to be 0603 types.
B.
NA – not applicable, these unused inputs should be left open.
Figure 13. 18-Bit Color Host to 24-Bit LCD Display Panel Application
12
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
(4/5)
(6)
SN65LVDS84AQDGGRQ1
ACTIVE
TSSOP
DGG
48
2000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
65LVDS84AQ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of