SN74AUC16244GQLR

SN74AUC16244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES399E – JULY 2002 – REVISED FEBRUARY 2008 FEATURES 1 DGG OR DGV PACKAGE (TOP VIEW) • Member of the Texas Instruments Widebus™ Family • Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation • Ioff Supports Partial-Power-Down Mode Operation • Sub-1-V Operable • Max tpd of 2 ns at 1.8 V • Low Power Consumption, 20-µA Max ICC • ±8-mA Output Drive at 1.8 V • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) 2 1OE 1Y1 1Y2 GND 1Y3 1Y4 VCC 2Y1 2Y2 GND 2Y3 2Y4 3Y1 3Y2 GND 3Y3 3Y4 VCC 4Y1 4Y2 GND 4Y3 4Y4 4OE DESCRIPTION/ORDERING INFORMATION This 16-bit buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation. The SN74AUC16244 is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 2OE 1A1 1A2 GND 1A3 1A4 VCC 2A1 2A2 GND 2A3 2A4 3A1 3A2 GND 3A3 3A4 VCC 4A1 4A2 GND 4A3 4A4 3OE The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. It provides true outputs and symmetrical active-low output-enable (OE) inputs. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION PACKAGE (1) (2) TA –40C to 85C (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING TSSOP – DGG Tape and reel SN74AUC16244DGGR AUC16244 TVSOP – DGV Tape and reel SN74AUC16244DGVR MH244 VFBGA – GQL Tape and reel SN74AUC16244GQLR MH244 Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2002–2008, Texas Instruments Incorporated SN74AUC16244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES399E – JULY 2002 – REVISED FEBRUARY 2008 GQL PACKAGE (TOP VIEW) 1 2 3 4 5 ABC ABC ABC 6 TERMINAL ASSIGNMENTS (1) A B C 1 2 3 4 5 6 A 1OE NC NC NC NC 2OE B 1Y2 1Y1 GND GND 1A1 1A2 C 1Y4 1Y3 VCC VCC 1A3 1A4 D D 2Y2 2Y1 GND GND 2A1 2A2 E E 2Y4 2Y3 2A3 2A4 F F 3Y1 3Y2 3A2 3A1 G G 3Y3 3Y4 GND GND 3A4 3A3 H H 4Y1 4Y2 VCC VCC 4A2 4A1 J J 4Y3 4Y4 GND GND 4A4 4A3 K 4OE NC NC NC NC 3OE K (1) NC - No internal connection FUNCTION TABLE (EACH 4-BIT BUFFER) INPUTS 2 OE A OUTPUT Y L H H L L L H X Z Submit Documentation Feedback Copyright © 2002–2008, Texas Instruments Incorporated Product Folder Link(s): SN74AUC16244 SN74AUC16244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES399E – JULY 2002 – REVISED FEBRUARY 2008 LOGIC DIAGRAM (POSITIVE LOGIC) 1OE 1A1 1A2 1A3 1A4 2OE 2A1 2A2 2A3 2A4 1 3OE 47 2 46 3 44 5 43 6 1Y1 3A1 1Y2 3A2 1Y3 3A3 1Y4 3A4 48 4OE 41 8 40 9 38 11 37 12 2Y1 4A1 2Y2 4A2 2Y3 4A3 2Y4 4A4 25 36 13 35 14 33 16 32 17 3Y1 3Y2 3Y3 3Y4 24 30 19 29 20 27 22 26 23 4Y1 4Y2 4Y3 4Y4 Pin numbers shown are for the DGG and DGV packages. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range –0.5 3.6 V VI Input voltage range (2) –0.5 3.6 V VO Voltage range applied to any output in the high-impedance or power-off state (2) –0.5 3.6 V –0.5 VCC + 0.5 (2) VO Output voltage range IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current 20 mA 100 mA Continuous current through VCC or GND θJA Package thermal impedance (3) Tstg Storage temperature range DGG package 70 DGV package 58 GQL package (1) (2) (3) V C/W 42 –65 150 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 2002–2008, Texas Instruments Incorporated Product Folder Link(s): SN74AUC16244 3 SN74AUC16244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES399E – JULY 2002 – REVISED FEBRUARY 2008 RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 0.8 V VIH High-level input voltage MIN MAX 0.8 2.7 UNIT V VCC VCC = 1.1 V to 1.95 V VCC = 2.3 V to 2.7 V 0.65 ‫נ‬VCC V 1.7 VCC = 0.8 V 0 0.35 ‫נ‬VCC VIL Low-level input voltage VCC = 1.1 V to 1.95 V VI Input voltage 0 3.6 V VO Output voltage 0 VCC V VCC = 2.3 V to 2.7 V IOH High-level output current IOL Low-level output current 0.7 VCC = 0.8 V –0.7 VCC = 1.1 V –3 VCC = 1.4 V –5 VCC = 1.65 V –8 VCC = 2.3 V –9 VCC = 0.8 V 0.7 VCC = 1.1 V 3 VCC = 1.4 V 5 VCC = 1.65 V 8 VCC = 2.3 V Δt/Δv Input transition rise or fall rate TA Operating free-air temperature (1) 4 V mA mA 9 –40 20 ns/V 85 C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright © 2002–2008, Texas Instruments Incorporated Product Folder Link(s): SN74AUC16244 SN74AUC16244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES399E – JULY 2002 – REVISED FEBRUARY 2008 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VOH VOL VCC TYP (1) MIN MAX IOH = –100 µA 0.8 V to 2.7 V IOH = –0.7 mA 0.8 V IOH = –3 mA 1.1 V 0.8 IOH = –5 mA 1.4 V 1 IOH = –8 mA 1.65 V 1.2 IOH = –9 mA 2.3 V 1.8 IOL = 100 µA 0.8 V to 2.7 V IOL = 0.7 mA 0.8 V IOL = 3 mA 1.1 V 0.3 IOL = 5 mA 1.4 V 0.4 IOL = 8 mA 1.65 V 0.45 IOL = 9 mA 2.3 V 0.6 UNIT VCC – 0.1 0.55 V 0.2 0.25 V VI = VCC or GND 0 to 2.7 V 5 µA Ioff VI or VO = 2.7 V 0 10 µA IOZ VO = VCC or GND 2.7 V 10 µA ICC VI = VCC or GND, 20 µA Ci VI = VCC or GND 2.5 V 3.5 4.5 pF Co VO = VCC or GND 2.5 V 6 7.5 pF II (1) A or OE inputs IO = 0 0.8 V to 2.7 V All typical values are at TA = 25C. SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) VCC = 1.2 V 0.1 V VCC = 1.5 V 0.1 V VCC = 1.8 V 0.15 V VCC = 2.5 V 0.2 V FROM (INPUT) TO (OUTPUT) VCC = 0.8 V TYP MIN MAX MIN MAX MIN TYP MAX MIN MAX tpd A Y 5.4 0.8 2.8 0.6 1.9 0.7 1.3 1.8 0.5 1.8 ns ten OE Y 8 1 4.4 0.7 2.6 0.8 1.4 2.5 0.6 1.9 ns tdis OE Y 12 1.9 4.9 1 4.6 1.5 2.6 4 0.5 2 ns PARAMETER UNIT OPERATING CHARACTERISTICS TA = 25C PARAMETER Cpd Power dissipation capacitance Outputs enabled Outputs disabled TEST CONDITIONS VCC = 0.8 V VCC = 1.2 V VCC = 1.5 V VCC = 1.8 V VCC = 2.5 V TYP TYP TYP TYP TYP 21 22 23 25 30 1 1 1 1 1 f = 10 MHz UNIT pF Submit Documentation Feedback Copyright © 2002–2008, Texas Instruments Incorporated Product Folder Link(s): SN74AUC16244 5 SN74AUC16244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES399E – JULY 2002 – REVISED FEBRUARY 2008 PARAMETER MEASUREMENT INFORMATION 2 × VCC S1 RL From Output Under Test GND CL (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND Open RL LOAD CIRCUIT VCC CL RL V∆ 0.8 V 1.2 V ± 0.1 V 1.5 V ± 0.1 V 1.8 V ± 0.15 V 2.5 V ± 0.2 V 15 pF 15 pF 15 pF 30 pF 30 pF 2 kΩ 2 kΩ 2 kΩ 1 kΩ 500 Ω 0.1 V 0.1 V 0.1 V 0.15 V 0.15 V VCC Timing Input VCC/2 0V tw tsu th VCC VCC/2 Input VCC/2 VCC VCC/2 Data Input VCC/2 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VCC VCC/2 Input VCC/2 0V tPHL tPLH VCC/2 VCC/2 VOL tPHL VOH Output tPLZ VCC VCC/2 tPZH VCC/2 VOL VCC/2 0V Output Waveform 1 S1 at 2 × VCC (see Note B) tPLH VCC/2 VCC/2 tPZL VOH Output VCC Output Control Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + V∆ VOL tPHZ VCC/2 VOH − V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 Submit Documentation Feedback Copyright © 2002–2008, Texas Instruments Incorporated Product Folder Link(s): SN74AUC16244 PACKAGE OPTION ADDENDUM www.ti.com 20-Jan-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) SN74AUC16244DGGR ACTIVE TSSOP DGG 48 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AUC16244 SN74AUC16244DGVR ACTIVE TVSOP DGV 48 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MH244 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of