SN74F543DWE4

SN74F543 OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SDFS025B – D2942, MARCH 1987 – REVISED OCTOBER 1993 • • • DB, DW, OR NT PACKAGE (TOP VIEW) 3-State True Outputs Back-to-Back Registers for Storage Package Options Include Plastic Small-Outline and Shrink Small-Outline Packages and Standard Plastic 300-mil DIPs LEBA OEBA A1 A2 A3 A4 A5 A6 A7 A8 CEAB GND description The SN74F543 octal transceiver contains two sets of D-type latches for temporary storage of data flowing in either direction. Separate latch-enable (LEAB or LEBA) and output enable (OEAB or OEBA) inputs are provided for each register to permit independent control in either direction of data flow. The A outputs are characterized to sink 24 mA while the B outputs are characterized to sink 64 mA. 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VCC CEBA B1 B2 B3 B4 B5 B6 B7 B8 LEAB OEAB The A-to-B enable (CEAB) input must be low in order to enter data from A or to output data from B. Having CEAB low and LEAB low makes the A-to-B latches transparent; a subsequent low-to-high transition of LEAB puts the A latches in the storage mode. With CEAB and OEAB both low, the 3-state B outputs are active and reflect the data present at the output of the A latches. Data flow from B to A is similar, but requires using the CEBA, LEBA, and OEBA inputs. The SN74F543 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area. The SN74F543 is characterized for operation from 0°C to 70°C. FUNCTION TABLE† INPUTS CEAB LEAB OEAB A OUTPUT B H X X X Z X X H X Z L H L X L L L L B0‡ L L L L H H † A-to-B data flow is shown; B-to-A flow control is the same except that it uses CEBA, LEBA, and OEBA. ‡ Output level before the indicated steady-state input conditions were established. Copyright  1993, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2–1 SN74F543 OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SDFS025B – D2942, MARCH 1987 – REVISED OCTOBER 1993 logic symbol† 2 OEBA 23 CEBA 1 LEBA 13 OEAB 11 CEAB 14 LEAB A1 A2 A3 A4 A5 A6 A7 A8 1EN3 G1 1C5 2EN4 G2 2C6 3 5D 3 4 6D 4 22 21 5 20 6 19 7 18 8 17 9 16 10 15 B1 B2 B3 B4 B5 B6 B7 B8 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) OEBA CEBA LEBA OEAB CEAB LEAB A1 2 23 1 13 11 14 C1 3 1D C1 1D To Seven Other Channels 2–2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 22 B1 SN74F543 OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SDFS025B – D2942, MARCH 1987 – REVISED OCTOBER 1993 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to 7 V Input voltage range, VI (excluding I/O ports) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 1.2 V to 7 V Input current range, IIK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 30 mA to 5 mA Voltage range applied to any output in the disabled or power-off state . . . . . . . . . . . . . . . . . . . . – 0.5 V to 5.5 V Voltage range applied to any output in the high state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.5 V to VCC Current into any output in the low state: A1– A8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 mA B1– B8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Operating free-air temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The input-voltage ratings may be exceeded provided the input-current ratings are observed. recommended operating conditions VCC VIH Supply voltage VIL IIK Low-level input voltage IOH High level output current High-level IOL Low level output current Low-level TA Operating free-air temperature High-level input voltage MIN NOM MAX 4.5 5 5.5 2 Input clamp current POST OFFICE BOX 655303 0.8 V – 18 mA –3 B1 – B8 – 15 A1 – A8 24 B1 – B8 64 • DALLAS, TEXAS 75265 V V A1 – A8 0 UNIT 70 mA mA °C 2–3 SN74F543 OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SDFS025B – D2942, MARCH 1987 – REVISED OCTOBER 1993 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK TEST CONDITIONS VCC = 4.5 V, A1 – A8 VOH VCC = 4 4.5 5V B1 – B8 Any output VOL II IIH‡ IIL‡ IOS§ A1 – A8 B1 – B8 OE, LE, and CE A and B ports OE, LE, and CE A and B ports OE, LE, and CE A and B ports A1 – A8 B1 – B8 ICCH ICCL VCC = 4.75 V, MIN II = – 18 mA IOH = – 1 mA IOH = – 3 mA IOH = – 3 mA IOH = – 15 mA IOH = – 1 mA to – 3 mA VCC = 4 4.5 5V IOL = 24 mA IOL = 64 mA 5V VCC = 5 5.5 VI = 7 V VI = 5.5 V VCC = 5 5.5 5V V, VI = 2 2.7 7V VCC = 5 5.5 5V V, VI = 0 0.5 5V VCC = 5 5.5 5V V, VO = 0 TYP† 2.5 3.4 2.4 3.3 2.4 3.3 2 3.1 MAX UNIT – 1.2 V V 2.7 0.3 0.5 0.42 0.55 0.1 1 20 70 – 1.2 – 0.65 – 60 – 150 – 100 – 225 VCC = 5.5 V VCC = 5.5 V V mA µA mA mA 67 100 mA 83 125 mA 125 mA ICCZ VCC = 5.5 V 83 † All typical values are at VCC = 5 V, TA = 25°C. ‡ For I/O ports, the parameters IIH and IIL include the off-state output current. § Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. timing requirements VCC = 5 V, TA = 25°C MIN tw tsu Pulse duration Setup time, data before latch enable High or low MAX VCC = 4.5 V to 5.5 V, TA = MIN to MAX¶ MIN 5 5 ns 3 3.5 ns th Hold time, data after latch enable High or low 3 3.5 ¶ For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. 2–4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT MAX ns SN74F543 OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SDFS025B – D2942, MARCH 1987 – REVISED OCTOBER 1993 switching characteristics (see Note 2) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B B or A tPLH tPHL LEBA A tPLH tPHL LEAB B tPZH tPZL OE or CE A or B tPHZ tPLZ OE or CE A or B VCC = 5 V, CL = 50 pF, RL = 500 Ω, TA = 25°C VCC = 4.5 V to 5.5 V, CL = 50 pF, RL = 500 Ω, TA = MIN to MAX † MIN TYP MAX MIN MAX 2.2 5.1 7.5 2.2 8.5 2.2 4.6 6.5 2.2 7.5 3.7 8.1 11 4.1 12.5 3.7 8.1 11 4.1 12.5 3.7 8.1 11 4.1 12.5 3.7 8.1 11 4.1 12.5 2.2 6.6 9 2.2 10 3.2 7.1 10.5 3.2 12 1.7 5.6 8 1.7 9 1.7 5.1 7.5 1.7 8.5 UNIT ns ns ns ns ns † For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. NOTE 2: Load circuits and waveforms are shown in Section 1. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 2–5 SN74F543 OCTAL REGISTERED TRANSCEIVER WITH 3-STATE OUTPUTS SDFS025B – D2942, MARCH 1987 – REVISED OCTOBER 1993 2–6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) SN74F543DBLE OBSOLETE SSOP DB 24 TBD Call TI Call TI 0 to 70 SN74F543DBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F543 SN74F543DBRE4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F543 SN74F543DBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F543 SN74F543DW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F543 SN74F543DWE4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F543 SN74F543DWG4 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F543 SN74F543DWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F543 SN74F543DWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F543 SN74F543DWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 F543 SN74F543NT ACTIVE PDIP NT 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74F543NT SN74F543NTE4 ACTIVE PDIP NT 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74F543NT (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74F543DBR SSOP DB 24 2000 330.0 16.4 8.2 8.8 2.5 12.0 16.0 Q1 SN74F543DWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74F543DBR SN74F543DWR SSOP DB 24 2000 367.0 367.0 38.0 SOIC DW 24 2000 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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